CN209045618U - Thin-film packing structure - Google Patents
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- CN209045618U CN209045618U CN201821922366.4U CN201821922366U CN209045618U CN 209045618 U CN209045618 U CN 209045618U CN 201821922366 U CN201821922366 U CN 201821922366U CN 209045618 U CN209045618 U CN 209045618U
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Abstract
The utility model relates to a kind of thin-film packing structures, the thin-film packing structure includes: the first inorganic encapsulated layer, it is set on organic light emitting diode device, and cover Organic Light Emitting Diode, first inorganic encapsulated layer includes hydrophilic section and hydrophobic section, the position of hydrophilic section be it is corresponding with Organic Light Emitting Diode position, hydrophobic section be arranged in hydrophilic section two sides；Organic encapsulation layer is set on the first inorganic encapsulated layer, and organic encapsulation layer is the microlens structure that upper surface is curved surface；And the second inorganic encapsulated layer, it is set on the first inorganic encapsulated layer and organic encapsulation layer.The utility model is by carrying out UV radiation modification to the first inorganic encapsulated layer in thin-film packing structure, it is arranged in pairs or groups using hydrophilic section and hydrophobic section, it is finally the microlens structure that upper surface is curved surface in the organic encapsulation layer that the light emitting region of Organic Light Emitting Diode is formed, and then improves the luminance of Organic Light Emitting Diode.
Description
Technical field
The utility model relates to thin film encapsulation technology fields, are applied to organic light emitting diode device more particularly to one kind
Thin-film package, to improve the film seal structure of the light emission rate of Organic Light Emitting Diode.
Background technique
After the completion of the preparation of Organic Light Emitting Diode (OLED) device, to prevent the steam and oxygen intrusion device in external environment
Inside part, its service life is influenced, usually also needs to be packaged OLED device, thin-film package (TFE) is common at present
One of OLED encapsulation technology uses inorganic layer/organic layer/inorganic layer stack manner mainly to form the encapsulation of OLED device
Layer, wherein the inorganic thin film can by plasma enhanced chemical vapor deposition (PECVD), atomic layer deposition (ALD), splash
Penetrate the methods of (Sputter) or pulse laser deposition (PLD) preparation.
With continually developing for new material and new process, the theoretical internal quantum efficiency of Organic Light Emitting Diode (OLED) is
Close to 100%, but its light efficiency that is harmonious is still very low.Because of substrate and the inorganic layer of stacking/organic layer/inorganic layer refractive index
Difference, the luminous flux that OLED is issued mainly have following three whereabouts: waveguide mode, substrate mode and air mode, and usually only
There is 20% or so luminous energy to be emitted to outside device.
In order to improve the light emission rate of OLED, usually used by method include reduce not light-emitting mode, reduce total reflection and
Waveguiding effect is reduced, wherein reducing total reflection can be by the roughness of increase coating, coated microsphere grain and covering lenticule
To realize.Usually used way is after the completion of thin-film package (TFE), in thin-film package (TFE) structure in the prior art
On the second inorganic encapsulated layer on be laid with one layer of hydrophobic film, and it is micro- to form on hydrophobic film several spherical shapes being arranged in array
Lens improve the light emission rate of OLED by the grade spherical micro-lens array of formation.
But there are certain interval between two adjacent spherical microlens, water oxygen can be saturating from the gap of spherical microlens
It crosses, it is unobvious to Organic Light Emitting Diode (OLED) device encapsulation reinforcing effect.Simultaneously as hydrophobic film in the prior art
Light transmission rate can not reach 100%, therefore, one layer of hydrophobic film is added in thin-film package (TFE) structure, to OLED's
There is certain influence in light emission rate, not only improve production cost, but also be unable to reach the effect of the ideal light emission rate for improving OLED
Fruit.
Utility model content
The technical problem to be solved by the utility model is to provide a kind of thin-film packing structures, are asked with solving above-mentioned technology
Topic, specific technical solution are as follows:
A kind of thin-film packing structure, applied to the thin-film package of organic light emitting diode device, to improve organic light emission two
The light emission rate of pole pipe, wherein thin-film packing structure includes: the first inorganic encapsulated layer, is set on organic light emitting diode device,
And Organic Light Emitting Diode is covered, the first inorganic encapsulated layer includes hydrophilic section and hydrophobic section, and the position of hydrophilic section is and organic hair
Photodiode position is corresponding, and hydrophobic section is arranged in hydrophilic section two sides；Organic encapsulation layer is set on the first inorganic encapsulated layer,
Organic encapsulation layer is the microlens structure that upper surface is curved surface；And the second inorganic encapsulated layer, it is set to the first inorganic encapsulated layer
And on organic encapsulation layer.
In a kind of possible design, organic light emitting diode device further includes substrate, pixel confining layer and gap control
Layer, Organic Light Emitting Diode are set on substrate, and pixel confining layer is set on substrate, and pixel confining layer is located at organic light emission two
Pole pipe two sides, gap control layer are set in pixel confining layer.
In a kind of possible design, the first inorganic encapsulated layer is set on substrate, and the first inorganic encapsulated layer covers
Organic Light Emitting Diode, pixel confining layer and gap control layer.
In a kind of possible design, the material of the first inorganic encapsulated layer is titania-based material or silica-base material.
In a kind of possible design, organic encapsulation layer is to be applied using organic inks as material by spin-coating method or spray coating method
Cloth forms microlens structure on the first inorganic encapsulated layer.
In a kind of possible design, the upper surface of microlens structure is semicircle curved surface, and semicircle curved surface is straight
Diameter is corresponding with the width of Organic Light Emitting Diode.
The utility model has had the advantage that compared with prior art:
1, the utility model utilizes parent by carrying out UV radiation modification to the first inorganic encapsulated layer in thin-film packing structure
Water section and hydrophobic section are arranged in pairs or groups, and are finally that upper surface is in the organic encapsulation layer that the light emitting region of Organic Light Emitting Diode is formed
The microlens structure of curved surface, and then improve the luminance of Organic Light Emitting Diode；
2, the light emitting region of the Organic Light Emitting Diode in the thin-film packing structure of the utility model is hydrophily, and two sides are
Hydrophobicity, so that the microlens structure formed is the semicircle microlens structure of an entirety, due to semicircle lenticule
The thickness of structure is thicker than the organic encapsulation layer in the thin-film packing structure of the prior art, and then packaging effect is more preferable.
Detailed description of the invention
Using attached drawing, the utility model is described in further detail, but the content in attached drawing does not constitute and appoints to the utility model
What is limited.
Fig. 1 is the structure that the thin-film packing structure of an embodiment of the present invention is encapsulated on organic light emitting diode device
Schematic diagram.
Fig. 2 is the structural schematic diagram of the organic light emitting diode device of an embodiment of the present invention.
Fig. 3 is that the first inorganic encapsulated layer of an embodiment of the present invention is formed in the knot on organic light emitting diode device
Structure schematic diagram.
Structural schematic diagram when Fig. 4 is ultraviolet light the first inorganic encapsulated layer of an embodiment of the present invention.
Fig. 5 is the structural schematic diagram after ultraviolet light the first inorganic encapsulated layer of an embodiment of the present invention.
Fig. 6 is the structural representation that the organic encapsulation layer of an embodiment of the present invention is formed on the first inorganic encapsulated layer
Figure.
Fig. 7 is the flow diagram of the film encapsulation method of an embodiment of the present invention.
Specific embodiment
About its " first " used herein, " second " etc., the meaning of order or cis-position is not especially censured, also non-use
The component described with limiting the application just for the sake of difference with same technique term or operation.
A kind of thin-film packing structure 1 is disclosed in one embodiment of the utility model, is please referred to shown in Fig. 1-6, is applied to
The thin-film package of organic light emitting diode device 2, to improve the light emission rate of Organic Light Emitting Diode 21, thin-film packing structure 1 is wrapped
Include the first inorganic encapsulated layer 11, organic encapsulation layer 12 and the second inorganic encapsulated layer 13, in which:
It please refers to shown in Fig. 5, the first inorganic encapsulated layer 11 is set on organic light emitting diode device 2, and is covered organic
Light emitting diode 21, the first inorganic encapsulated layer 11 include hydrophilic section 111 and hydrophobic section 112, are please referred to shown in Fig. 4, the present embodiment
The disclosed mode that hydrophilic section 111 and hydrophobic section 112 are formed on the first inorganic encapsulated layer 11 is to provide one in hydrophilic the
Then one inorganic encapsulated layer 11 irradiates the first inorganic encapsulated layer 11 with ultraviolet light 4, makes the illuminated part of the first inorganic encapsulated layer 11
Hydrophobicity is become from hydrophily, and then forms hydrophilic section 111 and hydrophobic section 112 on the first inorganic encapsulated layer 11, but not with
This is limited, and those skilled in the art can the other generation types of introduction selection according to the present utility model.
The position of hydrophilic section 111 be it is corresponding with 21 position of Organic Light Emitting Diode, hydrophobic section 112 be arranged in hydrophilic section
111 two sides so that the microlens structure formed is located at the top of Organic Light Emitting Diode 21, and have by microlens structure convergence
The light that machine light emitting diode 21 issues, and then improve the light emission rate of Organic Light Emitting Diode 21.
In a preferred embodiment, it please refers to shown in Fig. 2, organic light emitting diode device 2 further includes substrate 22, pixel limit
Given layer 23 and gap control layer 24, Organic Light Emitting Diode 21 are set on substrate 22, and pixel confining layer 23 is set to substrate 22
On, pixel confining layer 23 is located at 21 two sides of Organic Light Emitting Diode, and gap control layer 24 is set in pixel confining layer 23, so has
The structure of machine LED device 2 is not limited thereto, and those skilled in the art can introduction choosing according to the present utility model
Select the organic light emitting diode device 2 of other structures.
In a preferred embodiment, it please referring to shown in Fig. 3 and Fig. 5, the first inorganic encapsulated layer 11 is set on substrate 22, and
And first inorganic encapsulated layer 11 cover Organic Light Emitting Diode 21, pixel confining layer 23 and gap control layer 24, to realize to having
The encapsulation of machine light emitting diode 21 prevents water oxygen from invading Organic Light Emitting Diode 21, and then improves organic light emitting diode device 2
Service life.
In a preferred embodiment, the material of the first inorganic encapsulated layer 11 be titania-based material or silica-base material, two
The spheric granules of based material or silica-base material by crystal grain less than 10nm forms, and surface is uniform, compact structure, has flat
Whole institutional framework can significantly reduce the contact angle of the film made of titania-based material or silica-base material, enhanced film
Hydrophily, and then make the first inorganic encapsulated layer 11 made of titania-based material or silica-base material have it is stronger hydrophilic
Property.Meanwhile titanium dioxide, under the irradiation of ultraviolet light 4, easy in inactivation, cohesion cause its crystal grain to become larger, to increase the contact of film
Angle makes to be become hydrophobicity from hydrophily at 4 irradiation of ultraviolet light.Therefore, made of titania-based material or silica-base material
First inorganic encapsulated layer 11 can be irradiated by ultraviolet light 4, make to form hydrophilic section 111 and hydrophobic section on the first inorganic encapsulated layer 11
112, the material of right first inorganic encapsulated layer 11 is not limited thereto, and those skilled in the art according to the present utility model can teach
It leads and selects other that suitably there is the irradiation of ultraviolet light 4 to change material of the material of its hydrophilicity as the first inorganic encapsulated layer 11
Matter.
It please refers to shown in Fig. 6, organic encapsulation layer 12 is set on the first inorganic encapsulated layer 11, organic disclosed in the present embodiment
Encapsulated layer 12 be using organic inks as material, be coated on the first inorganic encapsulated layer 11 by spin-coating method or spray coating method formed it is micro-
Mirror structure, but be not limited thereto.No particular/special requirement is selected to the material of organic inks in the present invention, referring to ability
Domain conventional selection, such as acrylate.
It please refers to shown in Fig. 6, organic encapsulation layer 12 is the microlens structure that upper surface is curved surface, preferably semicircle curved surface
Microlens structure, and the diameter of semicircle curved surface is corresponding with the width of Organic Light Emitting Diode 21, so that formation has
Machine encapsulated layer thickness is thicker than the organic encapsulation layer in the thin-film packing structure of the prior art, and then improves the leakproofness of encapsulation,
But it is not limited thereto.
It please referring to shown in Fig. 1, the second inorganic encapsulated layer 13 is set on the first inorganic encapsulated layer 11 and organic encapsulation layer 12,
In the present invention for the no particular/special requirement of selection of the material of the second inorganic encapsulated layer 13, referring to this field conventional selection
, for example, silicon nitride film.
In a preferred embodiment, the second inorganic encapsulated layer 13 and the first inorganic encapsulated layer 11 coat organic encapsulation layer jointly
12, to prevent water oxygen from invading organic encapsulation layer 12, improve the reliability of encapsulation.
12 upper surface of organic encapsulation layer of the utility model is the microlens structure of curved surface, and is located at organic light-emitting diodes
The light that Organic Light Emitting Diode 21 issues is converged by microlens structure, and then improves organic light-emitting diodes in the top of pipe 21
The luminance of pipe 21, meanwhile, which is curved surface (semicircle) microlens structure of an entirety, and thickness is than existing
Organic encapsulation layer in the thin-film packing structure of technology wants thick, so packaging effect is more preferable.
Correspondingly, it please refers to shown in Fig. 7 and Fig. 1-6, is disclosed in another embodiment of the utility model in a kind of realization
The film encapsulation method 3 for stating thin-film packing structure 1, it is organic to improve applied to the thin-film package of organic light emitting diode device 2
The light emission rate of light emitting diode 21, wherein film encapsulation method 3 includes the following steps 301~304.
Step 301: forming the first inorganic encapsulated layer 11.It please refers to shown in Fig. 3, in shape on organic light emitting diode device 2
It is shaped to the first inorganic encapsulated layer 11, and the first inorganic encapsulated layer 11 is made to cover Organic Light Emitting Diode 21.
In a preferred embodiment, it please refers to shown in Fig. 2, organic light emitting diode device 2 further includes substrate 22, pixel limit
Given layer 23 and gap control layer 24, Organic Light Emitting Diode 21 are set on substrate 22, and pixel confining layer 23 is set to substrate 22
On, pixel confining layer 23 is located at 21 two sides of Organic Light Emitting Diode, and gap control layer 24 is set in pixel confining layer 23, so has
The structure of machine LED device 2 is not limited thereto, and those skilled in the art can introduction choosing according to the present utility model
Select the organic light emitting diode device 2 of other structures.
In a preferred embodiment, it please refers to shown in Fig. 3, the first inorganic encapsulated layer 11 covering Organic Light Emitting Diode 21,
Pixel confining layer 23 and gap control layer 24, and the first inorganic encapsulated layer 11 and pixel confining layer 23 and gap control layer 24 are right
The height at position is answered to be greater than the height of the first inorganic encapsulated layer 11 and 21 corresponding position of Organic Light Emitting Diode, so that first
Inorganic encapsulated layer 11 forms intermediate inside recess, to facilitate organic inks to flow into depressed area, i.e. Organic Light Emitting Diode 21
The hydrophilic section 111 of top.
In a preferred embodiment, the first inorganic encapsulated layer 11 be using titania-based material or silica-base material as raw material,
By atomic layer deposition method or chemical vapour deposition technique or physical vaporous deposition by titanium dioxide and silicon dioxide composite material
It being formed on organic light emitting diode device 2, the material and generation type of right first inorganic encapsulated layer 11 are not limited thereto, this
Field technical staff can introduction according to the present utility model to select other suitable raw materials and generation type to form first inorganic
Encapsulated layer 11.
Step 302: the first inorganic encapsulated layer 11 is modified.It please refers to shown in Fig. 4, irradiates the first nothing with ultraviolet light 4
Machine encapsulated layer 11, and blocked by mask plate 5 in the top of the first inorganic encapsulated layer 11 position corresponding with Organic Light Emitting Diode 21
Place is set, to prevent ultraviolet light 4 to be radiated on Organic Light Emitting Diode 21, influences the small organic molecule on Organic Light Emitting Diode 21
Activity asked the problem of destroying small organic molecule, so that small molecule scission of link is occurred, and then influence 21 brightness of Organic Light Emitting Diode
Refering to what is shown in Fig. 5, and make on the first inorganic encapsulated layer 11 to form hydrophobic section 112 in hydrophobicity by 4 illumination section of ultraviolet light,
Hydrophilic section 111, and the first inorganic encapsulated are formed in hydrophily not by 4 illumination section of ultraviolet light on first inorganic encapsulated layer 11
Layer 11 in hydrophilic position be corresponding with the position of Organic Light Emitting Diode 21.
In a preferred embodiment, the material of the first inorganic encapsulated layer 11 be titania-based material or silica-base material, two
The spheric granules of based material or silica-base material by crystal grain less than 10nm forms, and surface is uniform, compact structure, has flat
Whole institutional framework can significantly reduce the contact angle of the film made of titania-based material or silica-base material, enhanced film
Hydrophily, and then make the first inorganic encapsulated layer 11 made of titania-based material or silica-base material have it is stronger hydrophilic
Property.Meanwhile titanium dioxide, under the irradiation of ultraviolet light 4, easy in inactivation, cohesion cause its crystal grain to become larger, to increase the contact of film
Angle makes to be become hydrophobicity from hydrophily at 4 irradiation of ultraviolet light.Therefore, made of titania-based material or silica-base material
First inorganic encapsulated layer 11 can be irradiated by ultraviolet light 4, make to form hydrophilic section 111 and hydrophobic section on the first inorganic encapsulated layer 11
112, the material of right first inorganic encapsulated layer 11 is not limited thereto, and those skilled in the art according to the present utility model can teach
It leads and selects other that suitably there is the irradiation of ultraviolet light 4 to change material of the material of its hydrophilicity as the first inorganic encapsulated layer 11
Matter.
Step 303: forming organic encapsulation layer 12.It please refers to shown in Fig. 6, organic inks is coated on the first inorganic encapsulated layer
Organic encapsulation layer 12 is formed on 11, and the organic encapsulation layer 12 formed is the microlens structure that upper surface is curved surface.
In a preferred embodiment, it please refers to shown in Fig. 6, since the first inorganic encapsulated layer 11 is intermediate inside recess
Shape, organic inks can flow into the sunk area of the first inorganic encapsulated layer 11, simultaneously because sunk area is and organic light-emitting diodes
Pipe 21 is corresponding, is in hydrophily, and it is in hydrophobicity that sunk area two sides, which are corresponding with pixel confining layer 23 and gap control layer 24,
Force organic inks in the sunk area of the first inorganic encapsulated layer 11, i.e., forming upper surface above Organic Light Emitting Diode 21 is song
The microlens structure in face.
In a preferred embodiment, organic inks are by printing or spraying or spin coating mode is coated on the first inorganic encapsulated
On layer 11, but it is not limited thereto.No particular/special requirement is selected to the material of organic inks in the present invention, referring to ability
Domain conventional selection, such as acrylate.
In a preferred embodiment, organic inks are coated on the step on the first inorganic encapsulated layer 11 further include: stand or
Organic inks are shaken, uniformity of the organic inks on the first inorganic encapsulated layer 11 is provided, organic inks is made to form upper surface
The liquid microlens structure of curved surface after forming liquid microlens structure, reheats solidification liquid microlens structure, keeps liquid micro-
Mirror structure forms solid-state microlens structure, converges the light that Organic Light Emitting Diode 21 issues, Jin Erti by solid-state lenticule
The light emission rate of high Organic Light Emitting Diode 21.
In a preferred embodiment, the upper surface of microlens structure is semicircle curved surface, and the diameter of semicircle curved surface
It is corresponding with the width of Organic Light Emitting Diode 21, due to semicircle microlens structure thickness than the prior art thin-film package
Organic encapsulation layer in structure wants thick, and then packaging effect is more preferable.
Step 304: forming the second inorganic encapsulated layer 13.It please refers to shown in Fig. 1, in the first inorganic encapsulated layer 11 and organic envelope
The second inorganic encapsulated layer 13 is formed on dress layer 12.
In a preferred embodiment, the second inorganic encapsulated layer 13 is silicon nitride film, but is not limited thereto, this field skill
Art personnel can select other suitable materials as the second inorganic encapsulated layer 4 according to actual production demand.
In a preferred embodiment, it please refers to shown in Fig. 1, the second inorganic encapsulated layer 13 and the first inorganic encapsulated layer 11 are common
Organic encapsulation layer 12 is coated, to prevent water oxygen from invading organic encapsulation layer 3, improves the reliability of encapsulation.
The utility model is modified by carrying out ultraviolet light 4 to the first inorganic encapsulated layer 11 in thin-film packing structure 1, i.e., sharp
The first inorganic encapsulated layer 11 is irradiated with ultraviolet light 4, makes to form hydrophilic section 111 and hydrophobic section 112 on the first inorganic encapsulated layer 11, make
Organic inks are in the lenticule that the organic encapsulation layer 12 that the light emitting region of Organic Light Emitting Diode 21 is formed is that upper surface is curved surface
Structure, and then improve the luminance of Organic Light Emitting Diode 21.Simultaneously as the thickness of surface micro lens structure compares the prior art
Thin-film packing structure in organic encapsulation layer want thick, and then packaging effect is more preferable.
Claims (6)
1. a kind of thin-film packing structure, applied to the thin-film package of organic light emitting diode device, to improve organic light-emitting diodes
The light emission rate of pipe, which is characterized in that the thin-film packing structure includes:
First inorganic encapsulated layer, is set on the organic light emitting diode device, and covers the Organic Light Emitting Diode, institute
Stating the first inorganic encapsulated layer includes hydrophilic section and hydrophobic section, and the position of the hydrophilic section is and the Organic Light Emitting Diode position
Corresponding, the hydrophobic section is arranged in the hydrophilic section two sides；
Organic encapsulation layer is set on the first inorganic encapsulated layer, and the organic encapsulation layer is that upper surface is the micro- of curved surface
Mirror structure；And
Second inorganic encapsulated layer is set on the first inorganic encapsulated layer and the organic encapsulation layer.
2. thin-film packing structure according to claim 1, which is characterized in that the organic light emitting diode device further includes
Substrate, pixel confining layer and gap control layer, the Organic Light Emitting Diode are set on the substrate, the pixel confining layer
It is set on the substrate, the pixel confining layer is located at the Organic Light Emitting Diode two sides, the gap control layer setting
In in the pixel confining layer.
3. thin-film packing structure according to claim 2, which is characterized in that the first inorganic encapsulated layer is set to substrate
On, and the first inorganic encapsulated layer covers the Organic Light Emitting Diode, the pixel confining layer and the gap control layer.
4. thin-film packing structure according to claim 1, which is characterized in that the material of the first inorganic encapsulated layer is two
Based material or silica-base material.
5. thin-film packing structure according to claim 1, which is characterized in that the organic encapsulation layer is to be with organic inks
Material is coated on the first inorganic encapsulated layer by spin-coating method or spray coating method and forms the microlens structure.
6. thin-film packing structure according to claim 1, which is characterized in that the upper surface of the microlens structure is semicircle
Shape curved surface, and the diameter of the semicircle curved surface is corresponding with the width of the Organic Light Emitting Diode.
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| CN201821922366.4U CN209045618U (en) | 2018-11-21 | 2018-11-21 | Thin-film packing structure |
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| CN201821922366.4U CN209045618U (en) | 2018-11-21 | 2018-11-21 | Thin-film packing structure |
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| CN110444691A (en) * | 2019-08-28 | 2019-11-12 | 京东方科技集团股份有限公司 | Color membrane substrates, display panel and preparation method thereof and display device |
| CN111653689A (en) * | 2020-06-15 | 2020-09-11 | 京东方科技集团股份有限公司 | Preparation method of lens array, display device and preparation method thereof |
| CN112420968A (en) * | 2019-08-21 | 2021-02-26 | 咸阳彩虹光电科技有限公司 | Display panel manufacturing method, display panel and display device |
| CN112420967A (en) * | 2019-08-21 | 2021-02-26 | 咸阳彩虹光电科技有限公司 | Preparation method of display panel, display panel and display device |
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| CN112420968A (en) * | 2019-08-21 | 2021-02-26 | 咸阳彩虹光电科技有限公司 | Display panel manufacturing method, display panel and display device |
| CN112420967A (en) * | 2019-08-21 | 2021-02-26 | 咸阳彩虹光电科技有限公司 | Preparation method of display panel, display panel and display device |
| CN112420968B (en) * | 2019-08-21 | 2023-02-03 | 咸阳彩虹光电科技有限公司 | Display panel manufacturing method, display panel and display device |
| CN110444691A (en) * | 2019-08-28 | 2019-11-12 | 京东方科技集团股份有限公司 | Color membrane substrates, display panel and preparation method thereof and display device |
| CN111653689A (en) * | 2020-06-15 | 2020-09-11 | 京东方科技集团股份有限公司 | Preparation method of lens array, display device and preparation method thereof |
| WO2021254219A1 (en) * | 2020-06-15 | 2021-12-23 | 京东方科技集团股份有限公司 | Preparation method for lens array, and display device and preparation method therefor |
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