CN209045515U - A kind of wafer cassette that can be reduced wafer transport and scrap - Google Patents

A kind of wafer cassette that can be reduced wafer transport and scrap Download PDF

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Publication number
CN209045515U
CN209045515U CN201821859026.1U CN201821859026U CN209045515U CN 209045515 U CN209045515 U CN 209045515U CN 201821859026 U CN201821859026 U CN 201821859026U CN 209045515 U CN209045515 U CN 209045515U
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CN
China
Prior art keywords
wafer
box
cassette
wafer cassette
main body
Prior art date
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Active
Application number
CN201821859026.1U
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Chinese (zh)
Inventor
黄金成
姜舜
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Shanghai Huali Microelectronics Corp
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Shanghai Huali Microelectronics Corp
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Priority to CN201821859026.1U priority Critical patent/CN209045515U/en
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Abstract

A kind of wafer cassette that can be reduced wafer transport and scrap, it is characterized in that, including wafer box main body, inner wall is equipped with the box inner card cage of several groups at left and right sides of the inside of the wafer box main body, the front side insertion of the wafer cassette is equipped with wafer box cover, the inside of the wafer box cover is equipped with wafer box cover card slot, and three side inner wall of described wafer cassette body interior or so bottom is equipped with box inner card cage fixing groove, and the wafer cassette body interior is additionally provided with partition.The utility model is by designing a kind of wafer cassette that can be reduced wafer transport and scrap, when wafer cassette is underfilled with, the removable pluggable partition of wafer box main body can substitute the position for placing wafer, space in wafer cassette is separated into multiple spaces of physical isolation, to effectively prevention " in wafer transportational process; when wafer is damaged or more wafers breakage is scrapped, the fragment or clast of damaged wafer pollute unbroken wafer in wafer cassette, so as to cause wafer loss whole in this wafer cassette ".

Description

A kind of wafer cassette that can be reduced wafer transport and scrap
Technical field
The utility model relates to a kind of wafer storage transport wafer cassette more particularly to it is a kind of can reduce wafer transport scrap Wafer cassette.
Background technique
In practical wafer transportational process, wafer cassette occurred is caused wafer damaged or multi-disc crystalline substance by external impacts The damaged event of circle.The fragment and clast of these damaged wafers can pollute unbroken whole wafer in wafer cassette.Due to integrated Circuit manufacturing process is complicated, therefore not damaged contaminated wafer cannot do over again, and can only all scrap.With IC manufacturing Technology is increasingly advanced, and the size of wafer is also increasing, and price is also more and more expensive.Delivery date of the client for wafer It increasingly pays close attention to, especially client captures the advanced field of technology and the engineering experiment wafer that carries out to seize market.Cause This, how to reduce wafer loss quantity just in wafer transportational process becomes the important class that IC manufacturing enterprise is faced Topic.
Utility model content
The purpose of the utility model is to provide a kind of wafers that can reduce to transport the wafer cassette scrapped, and solves the above technology Problem.
The technical issues of the utility model is solved can be realized using following technical scheme:
A kind of wafer cassette that can be reduced wafer transport and scrap, which is characterized in that, including wafer box main body, the wafer cassette Inner wall is equipped with the box inner card cage of several groups at left and right sides of the inside of main body, and the front side insertion of the wafer cassette is equipped with wafer cassette The inside of lid, the wafer box cover is equipped with wafer box cover card slot, and three side inner wall of described wafer cassette body interior or so bottom is equipped with Box inner card cage fixing groove, the wafer cassette body interior are additionally provided with partition.
Preferably, the box inner card cage is arc and material is elastoplastic.
Preferably, the card slot fixing groove that three side inner wall of inside of the wafer box main body or so bottom is equipped with several groups is used to Fixed bin inner card cage.
Preferably, the partition can be inserted into box inner card cage and be bonded close.
Preferably, the box inner card cage is bonded with wafer box main body card slot fixing groove inner tight.
Preferably, wafer box main body can be separated into multiple spaces of physical isolation by the partition shape.
Preferably, the inside of the box inner card cage is greater than intermediate height in " V " type both sides height.
The beneficial effect of above-mentioned technical proposal is:
The utility model is brilliant when wafer cassette is underfilled with by designing a kind of wafer cassette that can be reduced wafer transport and scrap The circle removable pluggable partition of box main body can substitute the position for placing wafer, and space in wafer cassette is separated into physical isolation Multiple spaces, so that effectively prevention is " damaged when wafer is damaged or more wafers breakage is scrapped in wafer transportational process Unbroken wafer in fragment or clast the pollution wafer cassette of wafer, so as to cause wafer loss whole in this wafer cassette ".
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram that can reduce the wafer storage box that wafer transport is scrapped.
Fig. 2 partition schematic diagram
Appended drawing reference indicates explanation in description above:
1, wafer box main body;2, box inner card cage;3, wafer box cover;
4, wafer box cover card slot;5, partition;6, wafer box main body card slot fixing groove.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are in the premise for not making creative work Under every other embodiment obtained, fall within the protection scope of the utility model.
It should be noted that in the absence of conflict, the feature in the embodiments of the present invention and embodiment can To be combined with each other.
The utility model is described in further detail in the following with reference to the drawings and specific embodiments, but not as the utility model It limits.
As depicted in figs. 1 and 2, it in the utility model preferred embodiment, according to problem of the existing technology, now provides A kind of wafer cassette that can be reduced wafer transport and scrap, including wafer box main body 1, the inside left and right sides inner wall of wafer box main body 1 It is equipped with the box inner card cage 2 of several groups, the front side insertion of wafer cassette 1 is equipped with wafer box cover 3, and the inside of wafer box cover 3 is equipped with Wafer box cover card slot 4,1 inside left and right bottom of wafer box main body, three side inner wall are equipped with box inner card cage fixing groove 6, wafer box main body 1 Inside is additionally provided with partition 5.
In the utility model preferred embodiment, box inner card cage 2 is arc and material is elastoplastic, and with wafer cassette master The fitting of 6 inner tight of body card slot fixing groove.
In the utility model preferred embodiment, three side inner wall of inside of wafer box main body 1 or so bottom is equipped with several groups Card slot fixing groove 6 be used to fixed bin inner card cage 2.
In the utility model preferred embodiment, partition 5 can be inserted into box inner card cage 2 and be bonded close.
In the utility model preferred embodiment, wafer and partition 5 are carried out using the wafer box cover card slot 4 of wafer box cover 3 Fixed limit.
In the utility model preferred embodiment, wafer box main body 1 can be separated into the more of physical isolation by 5 shape of partition A space prevents in wafer transportational process, when wafer is damaged or more wafers breakage is scrapped, the fragment of damaged wafer or Clast pollutes the not damaged wafer of other physical isolations in wafer cassette.
In the utility model preferred embodiment, the inside of box inner card cage 2 is greater than intermediate height in " V " type both sides height Degree, to play the role of fixed damping in wafer transportational process.
The foregoing is merely the utility model preferred embodiment, be not intended to limit the embodiments of the present invention and Protection scope should can appreciate that all in the utility model specification and diagram to those skilled in the art Hold made equivalent replacement and obviously change obtained scheme, the protection model of the utility model should all be included in In enclosing.

Claims (7)

1. a kind of wafer that can reduce transports the wafer cassette scrapped, which is characterized in that including wafer box main body, the wafer box main body Inside at left and right sides of inner wall be equipped with several groups box inner card cage, the wafer cassette front side insertion wafer box cover is installed, The inside of the wafer box cover is equipped with wafer box cover card slot, and three side inner wall of described wafer cassette body interior or so bottom is equipped in box Card slot fixing groove, the wafer cassette body interior are additionally provided with partition.
2. a kind of wafer that can reduce according to claim 1 transports the wafer cassette scrapped, which is characterized in that card in the box Slot is arc and material is elastoplastic.
3. a kind of wafer that can reduce according to claim 1 transports the wafer cassette scrapped, which is characterized in that the wafer cassette The card slot fixing groove that three side inner wall of inside of main body or so bottom is equipped with several groups is used to fixed bin inner card cage.
4. a kind of wafer that can reduce according to claim 1 transports the wafer cassette scrapped, which is characterized in that the partition can It is inserted into box inner card cage and is bonded close.
5. a kind of wafer that can reduce according to claim 1 transports the wafer cassette scrapped, which is characterized in that card in the box Slot is bonded with wafer box main body card slot fixing groove inner tight.
6. a kind of wafer that can reduce according to claim 1 transports the wafer cassette scrapped, which is characterized in that the partition shape Wafer box main body can be separated into multiple spaces of physical isolation by shape.
7. a kind of wafer that can reduce according to claim 1 transports the wafer cassette scrapped, which is characterized in that card in the box The inside of slot is greater than intermediate height in " V " type both sides height.
CN201821859026.1U 2018-11-12 2018-11-12 A kind of wafer cassette that can be reduced wafer transport and scrap Active CN209045515U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821859026.1U CN209045515U (en) 2018-11-12 2018-11-12 A kind of wafer cassette that can be reduced wafer transport and scrap

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821859026.1U CN209045515U (en) 2018-11-12 2018-11-12 A kind of wafer cassette that can be reduced wafer transport and scrap

Publications (1)

Publication Number Publication Date
CN209045515U true CN209045515U (en) 2019-06-28

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821859026.1U Active CN209045515U (en) 2018-11-12 2018-11-12 A kind of wafer cassette that can be reduced wafer transport and scrap

Country Status (1)

Country Link
CN (1) CN209045515U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110379750A (en) * 2019-07-21 2019-10-25 常州时创能源科技有限公司 It is a kind of for carrying the quartz boat of silicon wafer
CN111092038A (en) * 2019-12-10 2020-05-01 许正根 Combined wafer box

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110379750A (en) * 2019-07-21 2019-10-25 常州时创能源科技有限公司 It is a kind of for carrying the quartz boat of silicon wafer
CN110379750B (en) * 2019-07-21 2024-05-31 常州时创能源股份有限公司 Quartz boat for bearing silicon wafers
CN111092038A (en) * 2019-12-10 2020-05-01 许正根 Combined wafer box

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