CN209045328U - A kind of SMT Inductor - Google Patents

A kind of SMT Inductor Download PDF

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Publication number
CN209045328U
CN209045328U CN201821836738.1U CN201821836738U CN209045328U CN 209045328 U CN209045328 U CN 209045328U CN 201821836738 U CN201821836738 U CN 201821836738U CN 209045328 U CN209045328 U CN 209045328U
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China
Prior art keywords
electrode
ceramic substrate
wire
magnet
coil
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CN201821836738.1U
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Chinese (zh)
Inventor
李军飞
孙爱平
杨渝
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Guizhou Bo Yu Electronic Technology Co Ltd
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Guizhou Bo Yu Electronic Technology Co Ltd
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Priority to CN201821836738.1U priority Critical patent/CN209045328U/en
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Abstract

The utility model discloses a kind of SMT Inductors, including lower ceramic substrate, magnet-wire column is provided at the center of lower ceramic substrate, coil is wound on the surface of magnet-wire column, one end of coil is provided with the first lead-out wire, the end of first lead-out wire is provided with the first scolding tin end, the other end of coil is provided with the second lead-out wire, the end of second lead-out wire is provided with the second scolding tin end, the surface of coil is nested with magnet-wire set, the end of magnet-wire set is provided with ceramic substrate, a layer hole is provided in the plate face of upper ceramic substrate, the two sides of lower ceramic substrate are fixedly connected with electrode A and electrode B respectively, threaded hole is provided in electrode A and electrode B.The utility model it is simple, safe and convenient to use, the threaded hole being arranged in electrode A and electrode B and the layer hole being arranged in the plate face of upper ceramic substrate are fixedly connected by sunk screw, are readily disassembled maintenance.

Description

A kind of SMT Inductor
Technical field
The utility model relates to a kind of inductance, and in particular to a kind of SMT Inductor.
Background technique
SMT Inductor is also known as power inductance, heavy-current inductor and surface mount high power inductance, has miniaturization, high The characteristics such as quality, high energy storage and low resistance, the inductance in general electronic circuit is air core coil, or the line with magnetic core Circle, can only bear lower voltage by lesser electric current, and power inductance also has air core coil, also have with magnetic core, main Wanting feature is to use heavy gauge wire coiling, can bear tens of peaces, hundreds of, thousands of, even tens of thousands of peaces, power SMT Inductor is a point band Magnetic cover and without two kinds of magnetic cover, is mainly made of magnetic core and copper wire, main in circuit to play filtering and oscillation action.Existing market On the assembly and connection mode of ceramic substrate up and down of SMT Inductor pass through gluing fixed form or other Hard link sides mostly Formula is fixed, and such assembling mode when quality problems occurs in chip inductor, just directly scrap after disassembly by maintenance not easy to disassemble , can not analyze and cause the undesirable concrete reason of quality.Therefore, it when quality problems occurs in existing chip inductor, cannot dismantle It repairs and the analysis of causes.
Utility model content
The purpose of the utility model is to provide a kind of SMT Inductor, this SMT Inductor has quick detachable maintenance The characteristics of generating quality problems with easy analysis.
The technical solution of the utility model includes: a kind of SMT Inductor, including lower ceramic substrate, at the center of lower ceramic substrate It is provided with magnet-wire column, coil is wound on the surface of magnet-wire column, one end of coil is provided with the first lead-out wire, the first lead-out wire End is provided with the first scolding tin end, and the other end of coil is provided with the second lead-out wire, and the end of the second lead-out wire is provided with second Scolding tin end, the surface of coil are nested with magnet-wire set, and the end of magnet-wire set is provided with ceramic substrate, in the plate face of upper ceramic substrate It is provided with a layer hole, the two sides of lower ceramic substrate are fixedly connected with electrode A and electrode B respectively, are provided with spiral shell in electrode A and electrode B Pit.
SMT Inductor above-mentioned is respectively arranged with electrode A solder bath and electrode B scolding tin in the electrode A and electrode B Slot.
SMT Inductor above-mentioned, first scolding tin end are connect with electrode A solder bath soldering.
SMT Inductor above-mentioned, second scolding tin end are connect with electrode B solder bath soldering.
SMT Inductor above-mentioned, the magnet-wire set include the fixing arm extended and the circle through magnet-wire set middle part Hole.
The utility model has the beneficial effects that compared with prior art, simple, safe and convenient to use, the electricity of the utility model The layer hole being arranged on the threaded hole and the plate face of upper ceramic substrate being arranged in pole A and electrode B is fixedly connected by sunk screw, easily In detachable maintaining, by the way that pin slot is arranged on the electrode, pin weld part is set in pin slot, is conducive to fixed pin, It is not easily shifted;Simultaneously when welding, scolding tin is full of pin slot, and the appearance of obtained solder joint answers smooth, cleaning, uniform, symmetrical, whole Together, beautiful;It is less prone to rosin joint, dry joint phenomenon, stablizes the function of SMT Inductor, quality is stablized.Therefore, the SMT Inductor Have the function of being readily disassembled maintenance, be easy to find the reason of leading to the problem of analysis and stablizing SMT Inductor, quality stability Good feature.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model;
Fig. 2 is the structural schematic diagram of upper ceramic substrate in Fig. 1;
Fig. 3 is the structural schematic diagram that magnet-wire covers in Fig. 1;
Fig. 4 is the structural schematic diagram of Fig. 1 coil;
Fig. 5 is the structural schematic diagram of lower ceramic substrate and electrode in Fig. 1.
The label in accompanying drawing is: 1- magnet-wire set, 101- circular hole, 102- fixing arm, 2- coil, the first lead-out wire of 201-, The first scolding tin of 202- end, the second lead-out wire of 203-, the second scolding tin of 204- end, ceramic substrate under 3-, 301- magnet-wire column, 4- electrode A, 401- electrode A solder bath, 5- electrode B, 501- electrode B molten tin bath, 6- threaded hole, the upper ceramic substrate of 7-, 701- counterbore.
Specific embodiment
The utility model is further described with reference to the accompanying drawings and examples, but is not intended as to the utility model The foundation of limitation.
Embodiment.A kind of SMT Inductor is constituted as shown in Fig. 1~5, including lower ceramic substrate 3, lower ceramic substrate 3 It is provided with magnet-wire column 301 at center, coil 2 is wound on the surface of magnet-wire column 301, one end of coil 2 is provided with the first extraction Line 201, the end of the first lead-out wire 201 are provided with the first scolding tin end 202, and the other end of coil 2 is provided with the second lead-out wire 203, the end of the second lead-out wire 203 is provided with the second scolding tin end 204, and the surface of coil 2 is nested with magnet-wire set 1, magnet-wire set 1 End is provided with ceramic substrate 7, and layer hole 701, the two sides difference of lower ceramic substrate 3 are provided in the plate face of upper ceramic substrate 7 It is fixedly connected with electrode A 4 and electrode B 5, is provided with threaded hole 6 in electrode A 4 and electrode B 5.It is arranged in electrode A 4 and electrode B 5 The layer hole 701 being arranged on threaded hole 6 and the plate face of upper ceramic substrate 7 is fixedly connected by sunk screw, is readily disassembled maintenance.
Electrode A solder bath 401 and electrode B solder bath 501 are respectively arranged in the electrode A 4 and electrode B 5.
First scolding tin end 202 is connect with 401 soldering of electrode A solder bath.
Second scolding tin end 204 is connect with 501 soldering of electrode B solder bath.
The magnet-wire set 1 includes the fixing arm 102 extended and the circular hole 101 through 1 middle part of magnet-wire set.
The working principle of the utility model are as follows: the utility model mainly includes lower ceramic substrate 3, in lower ceramic substrate 3 It is provided with magnet-wire column 301 at the heart, coil 2 is wound on the surface of magnet-wire column 301, one end of coil 2 is provided with the first lead-out wire 201, the end of the first lead-out wire 201 is provided with the first scolding tin end 202, and the other end of coil 2 is provided with the second lead-out wire 203, The end of second lead-out wire 203 is provided with the second scolding tin end 204, and the surface of coil 2 is nested with magnet-wire set 1, the end of magnet-wire set 1 Be provided with ceramic substrate 7, be provided with layer hole 7 in the plate face of upper ceramic substrate 7, the two sides of lower ceramic substrate 3 respectively with electrode A4 is fixedly connected with electrode B 5, is provided with threaded hole 6 in electrode A 4 and electrode B 5.
By lower ceramic substrate 3 respectively and after 5 assembly and connection of electrode A 4 and electrode B, successively assemble magnet-wire column 301, coil 2, Magnet-wire set 1, when welding, by the first scolding tin end 202 and the second scolding tin end 204 respectively with electrode A solder bath 401 and electrode B solder bath 501 carries out scolding tin connection, according to electric iron welding process requirement, adjusts welding temperature, is welded, fill solder joint In full electrode A solder bath 402 and electrode B solder bath 502, guarantee that solder joint appearance answers smooth, cleaning, uniform, symmetrical, neat, beauty It sees, upper ceramic substrate 7 and lower ceramic substrate 3 is subjected to assembly and connection finally by sunk screw.

Claims (5)

1. a kind of SMT Inductor, it is characterised in that: including lower ceramic substrate (3), be provided at the center of lower ceramic substrate (3) Magnet-wire column (301) is wound with coil (2) on the surface of magnet-wire column (301), and one end of coil (2) is provided with the first lead-out wire (201), the end of the first lead-out wire (201) is provided with the first scolding tin end (202), and the other end of coil (2) is provided with second and draws Outlet (203), the end of the second lead-out wire (203) are provided with the second scolding tin end (204), and the surface of coil (2) is nested with magnet-wire It covers (1), the end of magnet-wire set (1) is provided with ceramic substrate (7), is provided with a layer hole in the plate face of upper ceramic substrate (7) (701), the two sides of lower ceramic substrate (3) are fixedly connected with electrode A (4) and electrode B (5) respectively, electrode A (4) and electrode B (5) On be provided with threaded hole (6).
2. SMT Inductor according to claim 1, it is characterised in that: set respectively in the electrode A (4) and electrode B (5) It is equipped with electrode A solder bath (401) and electrode B solder bath (501).
3. SMT Inductor according to claim 1, it is characterised in that: first scolding tin end (202) and electrode A scolding tin Slot (401) soldering connection.
4. SMT Inductor according to claim 1, it is characterised in that: second scolding tin end (204) and electrode B scolding tin Slot (501) soldering connection.
5. SMT Inductor according to claim 1, it is characterised in that: the magnet-wire set (1) includes consolidating of extending Gripping arm (102) and the circular hole (101) in the middle part of magnet-wire set (1).
CN201821836738.1U 2018-11-08 2018-11-08 A kind of SMT Inductor Active CN209045328U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821836738.1U CN209045328U (en) 2018-11-08 2018-11-08 A kind of SMT Inductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821836738.1U CN209045328U (en) 2018-11-08 2018-11-08 A kind of SMT Inductor

Publications (1)

Publication Number Publication Date
CN209045328U true CN209045328U (en) 2019-06-28

Family

ID=67041235

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821836738.1U Active CN209045328U (en) 2018-11-08 2018-11-08 A kind of SMT Inductor

Country Status (1)

Country Link
CN (1) CN209045328U (en)

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