CN209045324U - The embedded copper band of solderless and bending mold for winding - Google Patents
The embedded copper band of solderless and bending mold for winding Download PDFInfo
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- CN209045324U CN209045324U CN201822189801.3U CN201822189801U CN209045324U CN 209045324 U CN209045324 U CN 209045324U CN 201822189801 U CN201822189801 U CN 201822189801U CN 209045324 U CN209045324 U CN 209045324U
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Abstract
The utility model discloses a kind of embedded copper band of solderless for winding and bending molds, the embedded copper band of solderless includes copper sheet ontology, the copper sheet ontology has a through-hole, bayonet used for positioning is equipped with positioned at bore periphery, the copper sheet ontology has the first pin and second pin, the copper sheet ontology is by the first rotation copper sheet and the second rotation copper sheet alternative ring around overlapping, make its dedicated bending mold, including upper die holder, upper padding plate, lower template, first lower bolster, second lower bolster and lower die holder, the upper die holder, upper padding plate, lower template, first lower bolster, second lower bolster and lower die holder are set gradually from top to bottom；The utility model is for fields such as inductance, transformers, it can save frame design, it is welded on by way of grafting on the circuit board in power supply, conducive to wiring, the inductance stabilization made of the copper band of the utility model is fine, since the flat copper bar resistance of strip is small, rapid heat dissipation, the linearity of inductance value is good, and loss is small, and leakage field is small.
Description
Technical field
It is specifically a kind of for inductance, the solderless insertion of transformer winding the utility model relates to inductance, field transformer
Formula copper band and bending mold.
Background technique
Inductance is an attribute of closed circuit.After coil passes through electric current, magnetic field induction is formed in coil, incudes magnetic
Field can generate induced current again to resist through the electric current in coil.The interaction relationship of this electric current and coil is known as electricity
Induction reactance, that is, inductance, unit are " Henry (H) ".
Inductance is the physical quantity that coil gauge generates electromagnetic induction ability.When coil is passed through unstable state electric current, surrounding is just
Changing magnetic field can be generated.The power for being passed through coil is bigger, and it is higher to motivate the magnetic field strength come, on the contrary then small (magnetic induction is strong
Degree reaches before saturation).Inductance is generally divided into hollow inductance and two kinds of core inductance.The inductance of hollow inductance is a definite value
Constant, using simple.Large-scale core inductance is applied more in the industry, inductance value it is accurate whether be critical problem,
No matter great meaning theoretically or in practical application is had.
It is analyzed by formula L=μ × Ae*N2/l.L indicates that inductance, μ indicate that the magnetic conductivity of magnetic core, Ae indicate
Sectional area, the N of magnetic core indicate that the number of turns of coil, lm indicate the length of magnetic path of magnetic core.It follows that when the production molding of some inductance
Afterwards, Ae, N, lm are definite value, then influence inductance factory after magnitude just only magnetic permeability μ.[1]
Inductance is an attribute of closed circuit, i.e., when being changed by the electric current of closed circuit, inductance will appear electronic
Gesture resists the change of electric current.This inductance is known as self-induction (self-inductance), is the category of closed circuit oneself itself
Property.Assuming that the electric current of closed circuit changes, electromotive force is generated due to induction effect in another closed circuit, it is this
Inductance is known as mutual inductance (mutual inductance).
Inductance can be made of conducting material wound around magnetic cores, and typical such as copper wire, inductance can also remove magnetic core or use iron
Magnetic material replaces.The core material higher than the magnetic conductivity of air can constrain in around inductance element magnetic field is closer, because
And increase inductance.There are many kinds of inductance, mostly with outer layer enamel coil (enamel coated wire) around ferrite
(ferrite) spool is made, and some protection inductance are completely disposed at coil in ferrite.The core of some inductance elements can be with
It adjusts.It is possible thereby to change inductance size.Small inductor can be directly etched on pcb board, with a kind of method for being laid with helical trajectory.
Small value inductance also can be used to manufacture the same technique manufacture of transistor in integrated circuits.In such applications, aluminum interconnecting quilt
Often it is used as conductive material.Which kind of ineffective method is called " gyrator " based on the most still one kind of actual constraint application
Circuit, it shows characteristic identical with inductance element with a capacitor and active member.For the inductance element every high frequency
The wire for passing through magnetic pole or magnetic bead through common one is constituted.
The existing embedded copper band of solderless uses copper wire winding, and volume is larger, and in addition different Winding Designs need different bones
Frame cooperation, causes cost of manufacture high efficiency low.
Utility model content
The purpose of this utility model is to provide a kind of embedded copper band of solderless for winding and bending molds, to solve
The problems mentioned above in the background art.
To achieve the above object, the utility model provides the following technical solutions:
A kind of embedded copper band of solderless for winding, including copper sheet ontology, the copper sheet ontology have a through-hole, are located at
Bore periphery be equipped with bayonet used for positioning, the copper sheet ontology have the first pin and second pin, the copper sheet ontology by
First rotation copper sheet and the second rotation copper sheet alternative ring are around overlapping.
Wherein, the first rotation copper sheet and the second rotation copper sheet join end to end, the first rotation copper sheet and the second rotation copper
Piece free end each extends over the first pin and second pin, the first rotation copper sheet and the stamped molding copper sheet folding of the second rotation copper sheet
Bending is at spiral iterative structure.
Wherein, the first rotation copper sheet and the second rotation copper sheet section are in Ω type counterclockwise and clockwise respectively.
It is a kind of manufacture for winding the embedded copper band of solderless bending mold, including upper die holder, upper padding plate, lower template,
First lower bolster, the second lower bolster and lower die holder, the upper die holder, upper padding plate, lower template, the first lower bolster, the second lower bolster
It is set gradually from top to bottom with lower die holder；Upper padding plate, the rear end of upper padding plate are fixedly connected with by screw below the upper die holder
It is fixedly connected with the first bending punching pin, the lower template, the first lower bolster, the second lower bolster and lower die holder connect by the way that screw is fixed
Connect, the first bending sliding block and the second bending sliding block be additionally provided in lower template, be additionally provided in lower template the first block and the second gasket,
Fourth gear block, the lower template inside are equipped with the second guide post and third block, and the second guide post is located at the side of the first bending punching pin,
Third block is located at the rear side of the first bending punching pin, and the first bending sliding block is located at the top of the second lower bolster, and the first bending is slided
Block is located at the inside of lower template and the first lower bolster, and the side of the first bending sliding block is equipped with the second bending sliding block, and the first bending is slided
Block and the second bending sliding block are correspondingly arranged on the second bending punching pin, third bending punching pin, and the lower template is additionally provided with the first limit
High block and the second limit for height block.
A kind of manufacturing method of the embedded copper band of solderless for winding, specifically includes the following steps:
S1. it stocks up:
S2. blanking: by copper sheet material punching press is in a symmetrical arrangement and end to end first rotation copper sheet and the second rotation copper sheet；
S3. punching: the punching on the first pin and second pin；
S4. bending is integrally formed: using bending mold by the first rotation copper sheet and the second rotation copper sheet bending, forming spiral
The copper sheet ontology of iterative structure；
S5. the copper sheet ontology of spiral iterative structure pressing and shaping: is flattened and is adjusted shape using aerostatic press；
S6. bayonet is rushed, the embedded copper band of solderless for inductance, transformer winding is made.
The manufacturing method of the embedded copper band of a kind of solderless for inductance, transformer winding, specifically includes the following steps: tool
Body the following steps are included:
S1. it stocks up；
S2. copper sheet material blanking: is struck out into predetermined flat copper strip；
S3. first time bending: using bending mold by flat copper bar through bending clockwise；
S4. flat copper bar second of bending: is formed through bending counterclockwise by the copper of spiral iterative structure using bending mold
Piece ontology；
S5. it flattens；The copper sheet ontology of spiral iterative structure is flattened and is adjusted shape using aerostatic press；
S6. notch, shaping are rushed.
Wherein, further include following steps after step 6:
S7. it is electroplated；
S8. with the combination of adhesive tape；
S9. rubberizing；
S10. Chong Jiao ﹔
S11. product examine is packed.
Compared with prior art, the utility model is for inductance, power supply unit, uninterruptible power supply (UPS), transformer etc.
Field uses copper wire as winding relative to existing, the utility model have the characteristics that it is small in size, in addition, the utility model
Copper band is formed using the punching of copper material, it can save frame design, is suitable for any inductance, transformer framework, copper band tool
There is pin, can be welded by way of grafting, be conducive to wiring, is integrally formed the electricity of copper band production through bending using the utility model
Sense stability is fine, and since flat copper sheet resistance is small, the linearity of rapid heat dissipation, inductance value is good, and loss is small, and leakage field is small.
Detailed description of the invention
Fig. 1 is a certain example structure figure of the utility model.
Fig. 2 is the non-bending expanded schematic diagram of Fig. 1 product.
The structural schematic diagram of the embedded copper band bending mold of Fig. 3 solderless.
Fig. 4 is the structural schematic diagram of upper die holder in the embedded copper band bending mold of solderless.
Fig. 5 is the side view of upper die holder in the embedded copper band bending mold of solderless.
Fig. 6 is the structural schematic diagram of upper padding plate in the embedded copper band bending mold of solderless.
Fig. 7 is the side view of upper padding plate in the embedded copper band bending mold of solderless.
Fig. 8 is the structural schematic diagram of lower template in the embedded copper band bending mold of solderless.
Fig. 9 is the front view of lower template in the embedded copper band bending mold of solderless.
Figure 10 is the side view of lower template in the embedded copper band bending mold of solderless.
Figure 11 is the structural schematic diagram of the first lower bolster in the embedded copper band bending mold of solderless.
Figure 12 is the side view of the first lower bolster in the embedded copper band bending mold of solderless.
Figure 13 is the structural schematic diagram of the second lower bolster in the embedded copper band bending mold of solderless.
Figure 14 is the side view of the second lower bolster in the embedded copper band bending mold of solderless.
Figure 15 is the structural schematic diagram of lower template in the embedded copper band bending mold of solderless.
Figure 16 is the front view of lower template in the embedded copper band bending mold of solderless.
Figure 17 is the front view of the first block in the embedded copper band bending mold of solderless.
Figure 18 is the front view of the second guide post in the embedded copper band bending mold of solderless.
Figure 19 is the front view of the first bending sliding block in the embedded copper band bending mold of solderless.
Figure 20 is the side view of the first bending sliding block in the embedded copper band bending mold of solderless.
Figure 21 is the front view of the second bending sliding block in the embedded copper band bending mold of solderless.
Figure 22 is the side view of the second bending sliding block in the embedded copper band bending mold of solderless.
Figure 23 is the side view of third block in the embedded copper band bending mold of solderless.
Figure 24 is the structural schematic diagram of fourth gear block in the embedded copper band bending mold of solderless.
Figure 25 is the structural schematic diagram of the second gasket in the embedded copper band bending mold of solderless.
Figure 26 is the front view of the first bending punching pin in the embedded copper band bending mold of solderless.
Figure 27 is the side view of the first bending punching pin in the embedded copper band bending mold of solderless.
Figure 28 is the structural schematic diagram of the second bending punching pin in the embedded copper band bending mold of solderless.
Figure 29 is the structural schematic diagram that third bends punching pin in the embedded copper band bending mold of solderless.
Figure 30 is the front view of the first limit for height block in the embedded copper band bending mold of solderless.
Figure 31 is the side view of the first limit for height block in the embedded copper band bending mold of solderless.
Figure 32 is the front view of the second limit for height block in the embedded copper band bending mold of solderless.
Figure 33 is the side view of the second limit for height block in the embedded copper band bending mold of solderless.
Figure 34 is the vertical view of the embedded copper band bending mold of solderless.
Figure 35 is the side view of the embedded copper band bending mold of solderless.
Figure 36 is the schematic diagram of process 1 in the production method of the embedded copper band of one solderless of embodiment.
Figure 37 is the schematic diagram of process 2 in the production method of the embedded copper band of one solderless of embodiment.
Figure 38 is the schematic diagram of process 3 in the production method of the embedded copper band of one solderless of embodiment.
Figure 39 is the schematic diagram of process 4 in the production method of the embedded copper band of one solderless of embodiment.
Figure 40 is another visual angle schematic diagram of Figure 39.
Figure 41 is the schematic diagram of process 5 in the production method of the embedded copper band of one solderless of embodiment.
Figure 42 is the schematic diagram of process 6 in the production method of the embedded copper band of one solderless of embodiment.
Figure 43 is the schematic diagram of process 7 in the production method of the embedded copper band of one solderless of embodiment.
Figure 44 is the schematic diagram of process 9 in the production method of the embedded copper band of one solderless of embodiment.
Figure 45 is another visual angle schematic diagram of Figure 44.
Figure 46 is the schematic diagram of the structure of the embedded copper band of one solderless of embodiment.
Figure 47 is the schematic diagram of process 1 in the production method of the embedded copper band of two solderless of embodiment.
Figure 48 is the schematic diagram of the structure of the embedded copper band of two solderless of embodiment.
Figure 49 is the schematic diagram of process 1 in the production method of the embedded copper band of three solderless of embodiment.
Figure 50 is the schematic diagram of process 6 in the production method of the embedded copper band of three solderless of embodiment.
Figure 51 is the schematic diagram of process 8 in the production method of the embedded copper band of three solderless of embodiment.
Figure 52 is the schematic diagram of process 10 in the production method of the embedded copper band of three solderless of embodiment.
Figure 53 is the schematic diagram of the structure of the embedded copper band of three solderless of embodiment.
Figure 54 is the schematic diagram of process 1 in the production method of the embedded copper band of example IV solderless.
Figure 55 is the schematic diagram of process 2 in the production method of the embedded copper band of example IV solderless.
Figure 56 is the schematic diagram of process 3 in the production method of the embedded copper band of example IV solderless.
Figure 57 is the schematic diagram of process 4 in the production method of the embedded copper band of example IV solderless.
Figure 58 is the schematic diagram of process 5 in the production method of the embedded copper band of example IV solderless.
Figure 59 is the schematic diagram of process 7 in the production method of the embedded copper band of example IV solderless.
Figure 60 is another visual angle figure of Figure 59.
Figure 61 is the schematic diagram of process 8 in the production method of the embedded copper band of example IV solderless.
Figure 62 is another visual angle figure of Figure 61.
Figure 63 is the schematic diagram of the structure of the embedded copper band of example IV solderless.
Specific embodiment
The technical solution of the patent is explained in further detail With reference to embodiment.
The embedded copper band of a kind of solderless for inductance, transformer winding referring to FIG. 1-2, including copper sheet ontology, it is described
Copper sheet ontology has a through-hole 104, is located at 104 periphery of through-hole and is equipped with bayonet 103 used for positioning, the copper sheet ontology has the
One pin 105 and second pin 106, the copper sheet ontology is by the first rotation copper sheet 101 and the second rotation 102 alternative ring of copper sheet
Around overlapping.
Wherein, the first rotation copper sheet 101 and the second rotation copper sheet 102 join end to end, the first rotation copper sheet 101 and the
Two rotation 102 free ends of copper sheet each extend over the first pin 105 and second pin 106, the first rotation copper sheet 101 and the second rotation
The stamped molding copper sheet bending of copper sheet 102 forms spiral iterative structure.
Wherein, the first rotation copper sheet 101 and the second rotation 102 section of copper sheet are in Ω counterclockwise and clockwise respectively
Type.
Please refer to Fig. 1-35, a kind of embedded copper band bending mold of solderless, including upper die holder 1, upper padding plate 2, lower template 3,
First lower bolster 4, the second lower bolster 5 and lower die holder 6, the upper die holder 1, upper padding plate 2, lower template 3, the first lower bolster 4, second
Lower bolster 5 and lower die holder 6 are set gradually from top to bottom；Upper padding plate 2 is fixedly connected with by screw below the upper die holder 1, on
The rear end of backing plate 2 is fixedly connected with the first bending punching pin 10, the lower template 3, the first lower bolster 4, the second lower bolster 5 and lower die
Seat 6 is fixedly connected by screw, is additionally provided with the first bending sliding block 11 and the second bending sliding block 12 in lower template 3, in lower template 3
It is additionally provided with the first block 13 and the second gasket 14, fourth gear block 15, is equipped with the second guide post 16 and third gear inside the lower template 3
Block 17, the second guide post 16 are located at the side of the first bending punching pin 10, and third block 17 is located at the rear side of the first bending punching pin 10, the
One bending sliding block 18 is located at the top of the second lower bolster 5, and first bends sliding block 18 and be located at lower template 3 and the first lower bolster 4
Inside, the side of the first bending sliding block 18 are equipped with the second bending sliding block 19, and the first bending sliding block 18 and the second bending sliding block 19 are equal
It is correspondingly arranged on the second bending punching pin 20, third bending punching pin 21, the lower template 3 is additionally provided with the first limit for height block 22 and the second limit
High block 23.
The size of the upper die holder 1 is 120x150x54mm, opens up that there are two M8 screw counter sink, M8 spiral shells on upper die holder 1
The specification of silk countersunk head is φ 9.0mm drilling, φ 14.0mm countersunk head, depth 12.0mm；
The size of the upper padding plate 2 is 25x150x54mm, and M8 screw is offered on upper die holder 1, attacks deep 20；
The size of the lower template 3 is 30x150.0x100.0mm, is machined in lower template 3:
M:2-M4 screw thread, drills, and front attacks deep 15.0；
9.0 via hole of M1:2- φ, drills；
(φ 9.0 is drilled M2:4-M8 countersunk head, the positive facing cut of φ 14.0, deeply 15.0)；
The side M3:2-M12 tapping deep 20；
The front M4:1-M10 tapping deep 17；
The size of first lower bolster 4 is 10x150.0x100.0mm, is machined on the first lower bolster 4:
8.00 dowel pin of L:2- φ cuts 1 and repairs 1, single+0.005；
M:6-φ9.0；
W1:1- cuts 1 and repairs 1, single+0.01；
The size of second lower bolster 5 is 510x150.0x100.0mm, is machined on the second lower bolster 5:
9.0 via hole of M:6- φ, drills；
8.00 dowel pin of L:2- φ cuts 1 and repairs 1, single+0.005；
W1:1- cuts 1 and repairs 1, single+0.005；
The size of the lower die holder 6 is 620x200.0x100.0mm；It is machined on lower die holder 6:
8.00 dowel pin of L:2- φ, hinge；
M:4-M8 screw thread, attacks and wears；
(φ 9.0 is drilled M1:2-M8 counter sink, the milling of 14.0 back side φ, deeply 10.0)；
It further, further include having the first block, the second guide post, the first bending sliding block, the second bending sliding block, third gear
Block, fourth gear block, the second gasket, the first bending punching pin, the second bending punching pin, third bend punching pin, the first limit for height block and second
Limit for height block.
Please refer to Fig. 1-63, embodiment one, a kind of production method of the embedded copper band of solderless, specifically includes the following steps:
S1. it stocks up, prepares copper sheet material, the copper bar specification of needs is portrayed on copper sheet material；
S2. blanking；Punching is carried out to copper sheet using press machine and goes out flat copper bar；Press machine 45T or more；
S3. bending 1；Using bending mold by flat copper bar through bending clockwise；
S4. bending 2；Flat copper bar is formed through bending counterclockwise by the copper sheet sheet of spiral iterative structure using bending mold
Body；S5. pressing+shaping；Copper sheet ontology is flattened using press machine, is adjacent to the first rotation copper sheet and the second rotation copper sheet, and
Correct outer ring size；
S6. notch is rushed；Bayonet will be gone out at copper sheet body through-holes edge using press machine；
S7. small angle is rolled over；Using press machine by a certain pin bending；
S8. it is electroplated；
S9. rubberizing；It will be inserted into a thickness of 0.06MM adhesive tape 110 between first rotation copper sheet and the second rotation copper sheet；
S10. glue is rushed；Use She Bei ﹕ aerostatic press
S11. glue is drawn；
S12. product examine is packed.
Wherein 2 ﹕ 1. of process examines emphasis size as schemed；2. overstriking position B flash≤0.05mm, other shape position flashes
Under the microscope, section is smooth without raised or sunken for ten times of amplifications at≤0.1mm, B；3. noticing that product appearance is bad；4. usage amount
Zhi Ju ﹕ slide calliper rule；5. putting neatly, prevent from deforming；6. initial workpiece and sampling observation when to have tried all bendings without fracture can just enter it is next
Process.
Wherein 3 ﹕ 1. of process examines emphasis size as schemed；2. noticing that product appearance is bad；3. putting neatly, prevent from deforming；
4. this process initial workpiece and sampling observation, size determines after process 5 of being subject to flattens；5. frame mould go into operation when bending and flatten must simultaneously into
Row.
Wherein 4 ﹕ 1. of process examines emphasis size as schemed；2. noticing that product appearance is bad；3. putting neatly, prevent from deforming；
4. this process initial workpiece and sampling observation, size determines after process 5 of being subject to flattens；5. frame mould go into operation when bending and flatten must simultaneously into
Row.
Wherein process 5:1. examines emphasis size as schemed；2. noticing that product appearance is bad；3. usage amount Zhi Ju ﹕ slide calliper rule；4.
It puts neatly, prevents from deforming；5. size A range clutches under state≤1.4mm between 1.4 to 1.6 under free state；6. small
Foot pitch-row was subject to detecting tool.
Wherein process 6:1. examines emphasis size as schemed；2. noticing that product appearance is bad；3. usage amount Zhi Ju ﹕ slide calliper rule, are controlled
Tool；4. putting neatly, prevent from deforming.
Wherein process 7:1. examines emphasis size as schemed；2. noticing that product appearance is bad；3. usage amount Zhi Ju ﹕ slide calliper rule；4.
It puts neatly, prevents from deforming.
Wherein process 8:1. Wei Wai manufacturer is electroplated；2. plating requires are as follows: plating mist tin 5uMMIN.；3. usage amount Zhi Ju ﹕ card
Ruler；It puts neatly, prevents from deforming.
Wherein process 9:1. examines emphasis size as schemed；2. specific rubberizing position is as schemed；3. there must not be bubble in rubberizing, lose
The bad phenomenons such as glue and corrugation；4. tape format: 3M#92 T=0.16MM semi-finished product code: 2；5. usage amount Zhi Ju ﹕ slide calliper rule,
Jig；6. putting neatly, prevent from deforming.
Wherein process 10:1. examines emphasis size as schemed；2. noticing that product appearance is bad；3. after adhesive tape punching, product glue
Band portion must not have the phenomenon that dew copper；4. usage amount Zhi Ju ﹕ slide calliper rule, jig；5. putting neatly, prevent from deforming.
Wherein process 11:1. examines emphasis size as schemed；2. noticing that product appearance is bad；3. usage amount Zhi Ju ﹕ slide calliper rule,
Jig；4. putting neatly, prevent from deforming.
Wherein process 12:1. notices that a procedure is bad on product；2. noticing that product appearance is bad；3. product adhesive tape portion
Copper must not be revealed；4. usage amount jig: slide calliper rule, detecting tool；5. manner of packing: being placed in PE bags, sealing is placed in case；6. pendulum
It puts neatly, prevents from deforming.
Embodiment two, a kind of production method of the embedded copper band of solderless, specifically includes the following steps:
S1. it stocks up；Prepare copper sheet material, the copper bar specification of needs is portrayed on copper sheet material；
S2. blanking；Punching is carried out to copper sheet using press machine and goes out flat copper bar；
S3. it punches, beats MARK and (use She Bei ﹕ press machine for stage die) ﹔
S4. bending 1；Using bending mold by flat copper bar through bending clockwise；
S5. bending 2；Flat copper bar is formed through bending counterclockwise by the copper sheet sheet of spiral iterative structure using bending mold
Body；
S6. it flattens；Copper sheet ontology is flattened using press machine, is adjacent to the first rotation copper sheet and the second rotation copper sheet,
S7. notch, shaping are rushed；Bayonet will be gone out at copper sheet body through-holes edge using press machine；
S8. it is electroplated；
S9. with the combination of adhesive tape；Use She Bei ﹕ jig
S10. glue is rushed；Use She Bei ﹕ aerostatic press
S11. product examine is packed.
Wherein 2 ﹕ 1. of process examines emphasis size as schemed；2. overstriking position A flash≤0.05mm, other shape position flashes
≤0.1mm；Under the microscope, section is smooth without raised or sunken at A for ten times of amplifications；3. noticing that product appearance is bad；4. usage amount
Zhi Ju ﹕ slide calliper rule；5. putting neatly, prevent from deforming；6. initial workpiece and sampling observation when to have tried all bendings without fracture can just enter it is next
Process；7.X.XX tolerance+0.08mm；8.MARK053.
Wherein process 3:1. examines emphasis size as schemed；2. noticing that product appearance is bad；3. usage amount Zhi Ju ﹕ slide calliper rule, are controlled
Tool；4. putting neatly, prevent from deforming；5.MARK053
Wherein process 4:1. examines emphasis size as schemed；2. noticing that product appearance is bad；3. putting neatly, prevent from deforming；
4. this process initial workpiece and sampling observation, size determines after process 6 of being subject to flattens；5. frame mould go into operation when bending and flatten must simultaneously into
Row
Wherein process 5:1. examines emphasis size as schemed；2. noticing that product appearance is bad；3. putting neatly, prevent from deforming；
4. this process initial workpiece and sampling observation, size determines after process 6 of being subject to flattens；5. frame mould go into operation when bending and flatten must simultaneously into
Row.
Wherein process 6:1. examines emphasis size as schemed；2. noticing that product appearance is bad；3. usage amount Zhi Ju ﹕ slide calliper rule；4.
It puts neatly, prevents from deforming；5. size B≤1.6mm under free state clutches under state≤1.3mm；6. bound feet pitch-row and interior
Outer diameter was subject to detecting tool.
Wherein process 7:1. examines emphasis size as schemed；2. noticing that product appearance is bad；3. usage amount Zhi Ju ﹕ slide calliper rule, are controlled
Tool；4. putting neatly, prevent from deforming.
Wherein process 8:1. Wei Wai manufacturer is electroplated；2. plating requires are as follows: plating mist tin 5uMMIN.；3. usage amount Zhi Ju ﹕ card
Ruler；4. putting neatly, prevent from deforming.
Wherein process 9:1. examines emphasis size as schemed；2. specific rubberizing position is as schemed；3. there must not be bubble in rubberizing, lose
The bad phenomenons such as glue and corrugation；4. tape format: 3M92# T=0.16MM, semi-finished product code: 2；5. usage amount Zhi Ju ﹕ slide calliper rule,
Jig；6. putting neatly, prevent from deforming.
Wherein process 10:1. examines emphasis size as schemed；2. noticing that product appearance is bad；3. after adhesive tape punching, product glue
Band portion must not have the phenomenon that dew copper；4. usage amount Zhi Ju ﹕ slide calliper rule, jig；5. putting neatly, prevent from deforming；6. under free state
Size C≤2.0mm clutches under state≤1.5mm.
Wherein process 11:1. notices that a procedure is bad on product；2. noticing that product appearance is bad；3. product adhesive tape portion
Copper must not be revealed；4. usage amount jig: slide calliper rule, detecting tool；5. manner of packing: being placed in PE bags, sealing is placed in case；6. pendulum
It puts neatly, prevents from deforming.
Embodiment three, a kind of production method of the embedded copper band of solderless, specifically includes the following steps:
S1. it stocks up；Prepare copper sheet material, the copper bar specification of needs is portrayed on copper sheet material；
S2. blanking；Punching is carried out to copper sheet using press machine and goes out flat copper bar；
S3. bending 1；Using bending mold by flat copper bar through bending clockwise；
S4. bending 2；Flat copper bar is formed through bending counterclockwise by the copper sheet sheet of spiral iterative structure using bending mold
Body；
S5. it flattens, rushes bayonet；Copper sheet ontology is flattened using press machine, the first rotation copper sheet and second is made to rotate copper sheet
It is adjacent to, while going out bayonet in copper sheet ontology；
S6. it is electroplated；
S7. with the combination of adhesive tape；It will be posted respectively with a thickness of 0.06MM adhesive tape 110 in the first rotation copper sheet and the second rotation
Copper sheet surface；
S8. rubberizing；Reflexed adhesive tape；
S9. extra waste tape is punched using table press and is removed by Chong Jiao ﹔；
S10. product examine is packed.
Wherein process 2:1. examines emphasis size as schemed；2. overstriking position A flash≤0.05mm, other shape position flashes
≤0.1mm.Under the microscope, section is smooth without raised or sunken at A for ten times of amplifications；3. noticing that product appearance is bad；4. usage amount
Zhi Ju ﹕ slide calliper rule；5. putting neatly, prevent from deforming；6. initial workpiece and sampling observation when to have tried all bendings without fracture can just enter it is next
Process；7.X.XX tolerance+0.08.
Wherein process 3:1. examines emphasis size as schemed；2. noticing that product appearance is bad；3. putting neatly, prevent from deforming；
4. this process initial workpiece and sampling observation, size determines after process 6 of being subject to flattens；5. frame mould go into operation when bending and flatten must simultaneously into
Row.
Wherein process 4:1. examines emphasis size as schemed；2. noticing that product appearance is bad；3. putting neatly, prevent from deforming；
4. this process initial workpiece and sampling observation, size determines after process 6 of being subject to flattens；5. frame mould go into operation when bending and flatten must simultaneously into
Row
Wherein process 5:1. examines emphasis size as schemed；2. noticing that product appearance is bad；3. usage amount Zhi Ju ﹕ slide calliper rule；4.
It puts neatly, prevents from deforming；5. size B≤1.4mm under free state clutches under state≤1.2mm；6. bound feet pitch-row and interior
Outer diameter was subject to detecting tool.
Wherein process 6:1. Wei Wai manufacturer is electroplated；2. plating requires are as follows: plating mist tin 5uMMIN.；3. usage amount Zhi Ju ﹕ card
Ruler；4. putting neatly, prevent from deforming.
Wherein process 7:1. examines emphasis size as schemed；2. specific rubberizing position is as schemed；3. must not have something lost glue, gas in rubberizing
The bad phenomenons such as bubble and corrugation；4. the specification of adhesive tape are as follows: PB416F W=30mm (2PCS)；Semi-finished product code: 3；5. usage amount
Zhi Ju ﹕ slide calliper rule, jig；6. putting neatly, prevent from deforming.
Wherein process 8:1. examines emphasis size as schemed；2. specific rubberizing position is as schemed；3. must not have something lost glue, gas in rubberizing
The bad phenomenons such as bubble and corrugation；4. the specification of adhesive tape are as follows: PB416F T=0.065mm；Semi-finished product code: 4；5. usage amount is controlled
Ju ﹕ slide calliper rule, jig；6. putting neatly, prevent from deforming.
Wherein process 9:1. examines emphasis size as schemed；2. noticing that product appearance is bad；3. after adhesive tape punching, product adhesive tape
Portion must not have the phenomenon that dew copper；4. usage amount Zhi Ju ﹕ slide calliper rule, jig；5. putting neatly, prevent from deforming；6. ruler under free state
Very little C≤1.7mm clutches under state≤1.5mm
Wherein process 10:1. notices that a procedure is bad on product；2. noticing that product appearance is bad；3. product adhesive tape portion
Copper must not be revealed；4. usage amount jig: slide calliper rule, detecting tool；5. manner of packing: being placed in PE bags, sealing is placed in case；6. pendulum
It puts neatly, prevents from deforming.
Example IV, a kind of production method of the embedded copper band of solderless, specifically includes the following steps:
S1. it stocks up: preparing copper sheet material, the copper sheet specification of needs is portrayed on copper sheet material；
S2. blanking: using press machine to copper sheet carry out punching go out to be arranged symmetrically and end to end first rotation copper sheet and
Second rotation copper sheet；
S3. punching, cutting: the first pin and second pin are punched out and are cut off using press machine；
S4. bending: using bending mold by the first rotation copper sheet and the second rotation copper sheet bending, spiral iterative structure is formed
's
Copper sheet ontology；
S5. it flattens: being flattened copper sheet ontology using press machine, be adjacent to the first rotation copper sheet and the second rotation copper sheet；
S6. it is electroplated；
S7. it rubberizing 1: will be inserted into a thickness of 0.06MM adhesive tape 110 between first rotation copper sheet and the second rotation copper sheet；
S8. rubberizing 2: second pin will be attached to a thickness of 0.06MM adhesive tape 110；
S9. it rushes glue: extra waste tape being punched using table press and is removed；
S10. product examine is packed.
Wherein, process 2:1. examines emphasis size as schemed；2. overstriking position A flash≤0.05mm, other shape positions hair
Side≤0.1mm；Under the microscope, section is smooth without raised or sunken for ten times of amplifications；3. noticing that product appearance is bad；4. usage amount is controlled
Ju ﹕ slide calliper rule；5. putting neatly, prevent from deforming；6. to have tried all bendings when initial workpiece and sampling observation；Next work can just be entered without fracture
Sequence；7.X.XX tolerance+0.08mm；8. marking " * " is that emphasis manages size.
Wherein, process 3:1. examines emphasis size as schemed；2. shape position flash≤0.05t；3. paying attention to product appearance not
It is good；4. usage amount Zhi Ju ﹕ slide calliper rule；5. putting neatly, prevent from deforming.
Wherein, process 4:1. examines emphasis size as schemed；2. noticing that product appearance is bad；3. putting neatly, prevent from becoming
Shape；4. this process initial workpiece and sampling observation, size determines after process 7 of being subject to flattens；5. bending and pressing must be same when frame mould is gone into operation
Shi Jinhang
Wherein, process 5:1. examines emphasis size as schemed；2. noticing that product appearance is bad；3. usage amount Zhi Ju ﹕ slide calliper rule；
4. putting neatly, prevent from deforming；5. clutching under state≤1.3mm under free state between size B≤1.6
Wherein, process 6:1. Wei Wai manufacturer is electroplated；2. plating requires are as follows: plating mist tin 5uMMIN.；3. usage amount Zhi Ju ﹕ card
Ruler；4. putting neatly, prevent from deforming.
Wherein, process 7:1. examines emphasis size as schemed；2. specific rubberizing position is as schemed；3. there must not be bubble in rubberizing,
Lose the bad phenomenons such as glue and corrugation；4. combined product are as follows: PB416F T=0.06MM；5. usage amount Zhi Ju ﹕ slide calliper rule, jig；
6. putting neatly, prevent from deforming.
Wherein, process 8:1. examines emphasis size as schemed；2. specific rubberizing position is as schemed；3. there must not be bubble in rubberizing,
Lose the bad phenomenons such as glue and corrugation；4. combined product are as follows: PB416F T=0.06MM；5. usage amount Zhi Ju ﹕ slide calliper rule, jig；
6. putting neatly, prevent from deforming；7. tape format is 10*20.
Wherein, process 9:1. examines emphasis size as schemed；2. noticing that product appearance is bad；3. usage amount Zhi Ju ﹕ slide calliper rule,
Jig；4. putting neatly, prevent from deforming；5. clutching under state≤1.5mm under free state between size C≤2.0；6. rushing glue
Copper band can not have breakage afterwards.
Wherein, process 10:1. notices that a procedure is bad on product；2. noticing that product appearance is bad；3. usage amount jig:
Slide calliper rule；4. manner of packing: being placed in PE bags, sealing is placed in case；5. putting neatly, prevent from deforming.
The preferred embodiment of the patent is described in detail above, but this patent is not limited to above-mentioned embodiment party
Formula within the knowledge of one of ordinary skill in the art can also be under the premise of not departing from this patent objective
It makes a variety of changes.
Claims (4)
1. a kind of embedded copper band of solderless for winding, including copper sheet ontology, the copper sheet ontology has a through-hole, is located at logical
Hole periphery is equipped with bayonet used for positioning, and the copper sheet ontology has the first pin and second pin, and the copper sheet ontology is by the
One rotation copper sheet and the second rotation copper sheet alternative ring are around overlapping.
2. the embedded copper band of a kind of solderless for winding according to claim 1, which is characterized in that first rotation
Copper sheet and second rotation copper sheet join end to end, first rotation copper sheet and second rotation copper sheet free end each extend over the first pin and
Second pin, the first rotation copper sheet and the second stamped molding copper sheet bending of rotation copper sheet form spiral iterative structure.
3. the embedded copper band of a kind of solderless for winding according to claim 1, which is characterized in that first rotation
Copper sheet and the second rotation copper sheet section are in Ω type counterclockwise and clockwise respectively.
4. the bending mold described in a kind of manufacturing claims 1-3 for the embedded copper band of solderless of winding, which is characterized in that
Including upper die holder, upper padding plate, lower template, the first lower bolster, the second lower bolster and lower die holder, the upper die holder, upper padding plate, lower die
Plate, the first lower bolster, the second lower bolster and lower die holder are set gradually from top to bottom；Connect below the upper die holder by the way that screw is fixed
It is connected to upper padding plate, the rear end of upper padding plate is fixedly connected with the first bending punching pin, the lower template, the first lower bolster, the second underlay
Plate is fixedly connected with lower die holder by screw, the first bending sliding block and the second bending sliding block is additionally provided in lower template, in lower template
It is additionally provided with the first block and the second gasket, fourth gear block, is equipped with the second guide post and third block inside the lower template, second leads
Column is located at the side of the first bending punching pin, and third block is located at the rear side of the first bending punching pin, and the first bending sliding block is located at second
The top of lower bolster, and the first bending sliding block is located at the inside of lower template and the first lower bolster, the side of the first bending sliding block is set
There is the second bending sliding block, the first bending sliding block and the second bending sliding block are correspondingly arranged on the second bending punching pin, third bending stamping
Son, the lower template are additionally provided with the first limit for height block and the second limit for height block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822189801.3U CN209045324U (en) | 2018-12-25 | 2018-12-25 | The embedded copper band of solderless and bending mold for winding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822189801.3U CN209045324U (en) | 2018-12-25 | 2018-12-25 | The embedded copper band of solderless and bending mold for winding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209045324U true CN209045324U (en) | 2019-06-28 |
Family
ID=67044865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822189801.3U Active CN209045324U (en) | 2018-12-25 | 2018-12-25 | The embedded copper band of solderless and bending mold for winding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209045324U (en) |
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2018
- 2018-12-25 CN CN201822189801.3U patent/CN209045324U/en active Active
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