CN209045054U - A kind of backlight module and electronic equipment - Google Patents

A kind of backlight module and electronic equipment Download PDF

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Publication number
CN209045054U
CN209045054U CN201821797169.4U CN201821797169U CN209045054U CN 209045054 U CN209045054 U CN 209045054U CN 201821797169 U CN201821797169 U CN 201821797169U CN 209045054 U CN209045054 U CN 209045054U
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China
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backlight module
body part
far
accommodating space
roof
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CN201821797169.4U
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Chinese (zh)
Inventor
陆忠恒
张文真
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Abstract

This application provides a kind of backlight module and electronic equipment, which includes: back frame, including roof, side wall and bottom wall, and roof, side wall and bottom wall bend connection successively to form an accommodating space;Backlight is set in accommodating space and including flexible circuit board and the lamp source being set on flexible circuit board;First radiating piece, including body part and the first extension, body part is set to side of the roof far from accommodating space, first extension and body part bending connect and are attached at side of the side wall far from accommodating space, so that body part receives at least partly heat that lamp source generates, to be transferred to the side wall of back frame by the first extension, and then it is transferred to entire back frame, the radiating efficiency for improving lamp source, prevents lamp source temperature is excessively high from leading to the risks such as quick-fried lamp.

Description

A kind of backlight module and electronic equipment
Technical field
This application involves the technical field of electronic equipment, it is specifically related to a kind of backlight module and electronic equipment.
Background technique
Backlight provides brightness light source, backlight as part and parcel in backlight module, for the normal display of electronic equipment Lamp source in source can generate a large amount of heat at work, if these heats exclude not in time, will lead to lamp source and quick-fried lamp, electronics occur The excessively high risk of the display screen temperature of equipment.
Utility model content
On the one hand the embodiment of the present application provides a kind of backlight module, the backlight module includes: back frame, including roof, Side wall and bottom wall, the roof, side wall and bottom wall bend connection successively to form an accommodating space;Backlight is set to described In accommodating space and including flexible circuit board and the lamp source being set on the flexible circuit board;First radiating piece, including ontology Portion and the first extension, the body part are set to side of the roof far from the accommodating space, first extension Connection is bent with the body part and is attached at side of the side wall far from the accommodating space.
On the other hand the embodiment of the present application also provides a kind of electronic equipment, the electronic equipment includes backlight module and display Mould group, the display module are stacked with the backlight module, wherein and the backlight module includes: back frame, including roof, Side wall and bottom wall, the roof, side wall and bottom wall bend connection successively to form an accommodating space;Backlight is set to described In accommodating space and including flexible circuit board and the lamp source being set on the flexible circuit board;First radiating piece, including ontology Portion and the first extension, the body part are set to side of the roof far from the accommodating space, first extension Connection is bent with the body part and is attached at side of the side wall far from the accommodating space.
Backlight module provided by the embodiments of the present application is generated by the lamp source that the body part of the first radiating piece receives backlight At least partly heat, to be transferred to the side wall of back frame by the first extension of the first radiating piece, and then be transferred to entire Back frame improves the radiating efficiency of lamp source, prevents lamp source temperature is excessively high from leading to the risks such as quick-fried lamp.
Detailed description of the invention
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment Attached drawing is briefly described, it should be apparent that, the drawings in the following description are only some examples of the present application, for For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other Attached drawing.
Fig. 1 is the structural schematic diagram of backlight module embodiment provided by the present application;
Fig. 2 is the structural schematic diagram of back frame in Fig. 1;
Fig. 3 is the structural schematic diagram of another embodiment of backlight module in Fig. 1;
Fig. 4 is the structural schematic diagram of the another embodiment of backlight module in Fig. 1;
Fig. 5 is the structural schematic diagram of electronic equipment embodiment provided by the present application;
Fig. 6 is the structural schematic diagram of another embodiment of electronic equipment in Fig. 5.
Specific embodiment
With reference to the accompanying drawings and examples, the application is described in further detail.It is emphasized that following implement Example is merely to illustrate the application, but is not defined to scope of the present application.Likewise, following embodiment is only the portion of the application Point embodiment and not all embodiments, institute obtained by those of ordinary skill in the art without making creative efforts There are other embodiments, shall fall in the protection scope of this application.
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments It is contained at least one embodiment of the application.Each position in the description occur the phrase might not each mean it is identical Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and Implicitly understand, embodiment described herein can be combined with other embodiments.
Referring to Fig. 1, Fig. 1 is the structural schematic diagram of 10 embodiment of backlight module provided by the present application, in the present embodiment Backlight module 10 includes back frame 11, backlight 12 and the first radiating piece 13.
Term " includes " in the application, it is intended that cover and non-exclusive include.Such as it contains equipment and does not limit In listed structure, but optionally further comprising the structure that do not list, or optionally further comprising its intrinsic for equipment Its structure.
Jointly refering to fig. 1 and Fig. 2, Fig. 2 be back frame 11 in Fig. 1 structural schematic diagram, wherein back frame 11 include roof 111, Side wall 112 and bottom wall 113, roof 111, side wall 112 and bottom wall 113 bend connection successively to form an accommodating space 101.
Wherein, roof 111 is equipped with the opening 1011 of connection accommodating space 101.
Optionally, back frame 11 is metal back frame.
Backlight 12 is set in accommodating space 101 and including flexible circuit board 121 and is set to flexible circuit board 121 Lamp source 122.
Optionally, flexible circuit board 121 is set on bottom wall 113, and lamp source 122 is set to flexible circuit board 121 bottom of far from The side of wall 113, in the present embodiment, flexible circuit board 121 can be adhered on bottom wall 113 by the first double-sided adhesive 123, certainly Other modes can also be used, herein with no restrictions.
Optionally, lamp source 122 is LED (light emitting diode) lamp bar.
It is the structural schematic diagram of another embodiment of backlight module 10 in Fig. 1 refering to Fig. 3, Fig. 3, in another embodiment In, one end of flexible circuit board 121 is set to side of the roof 111 far from accommodating space 101, soft in another embodiment Property circuit board 121 can be adhered to roof 111 by the second double-sided adhesive 124, and lamp source 122 is set to flexible circuit board 121 bottom of close to The side of wall 113 is carried one end of flexible circuit board 121 by roof 111, eliminates existing skill in another embodiment For carrying the glue frame of one end of flexible circuit board 121 in art, accommodating space 101 is occupied so as to avoid glue frame, is realized narrow Frame.
Fig. 1 is further regarded to, the first radiating piece 13 includes body part 131 and the first extension 132, and body part 131 is arranged In side of the roof 111 far from accommodating space 101, the first extension 132 connects with the bending of body part 131 and is attached at side wall 112 sides far from accommodating space 101 so that body part 131 receives at least partly heat that lamp source 122 generates, and pass through First extension 132 is transferred to side wall 112, and then is transferred to back frame 11, improves the radiating efficiency of lamp source 122, prevents lamp source 122 Temperature is excessively high to lead to the risks such as quick-fried lamp.
Specifically, body part 131 protrudes from roof 111 towards the one of opening 1011 far from one end of the first extension 132 Side, so that the part that body part 131 protrudes from side wall 111 towards the side of opening 1011, which receives lamp source 122, results from accommodating Space 101 and at least partly heat to shed from opening 1011.
Optionally, the first radiating piece 13 in the present embodiment further includes the second extension 133, the second extension 133 and The bending of one extension 132 connects and extends to side of the bottom wall 113 far from accommodating space 101.
Optionally, the second extension 133 is at least partly attached at bottom wall 113, to increase the first radiating piece 13 and back frame 11 fitting area, to increase the heat dissipation area of the first radiating piece 13 and back frame 11, to improve radiating efficiency.
Optionally, graphite, the foam etc. for including but is not limited to can be selected in the material of the first radiating piece 13.
Term " first ", " second " in the application are used for description purposes only, and are not understood to indicate or imply opposite Importance or the quantity for implicitly indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be bright Show or implicitly include at least one this feature.
It is the structural schematic diagram of the another embodiment of backlight module 10 in Fig. 1 refering to Fig. 4, Fig. 4, in the another embodiment In, backlight module 10 further includes the second radiating piece 14, and the second radiating piece 14 is at least partly attached at bottom wall 113 far from accommodating space 101 side, the second above-mentioned extension 133 are at least partly stacked with the second radiating piece 14, so that second extends The received heat in portion 133 can be transferred to the second radiating piece 14, and then be transferred to bottom wall 113 by the second radiating piece 14, further Improve radiating efficiency.
Optionally, in the present embodiment, the part that the second extension 133 is laminated with radiating piece 14 is successively far from bottom wall It is laminated on 113 direction, it is possible to understand that, it is also possible to part that radiating piece 14 is laminated with the second extension 133 successively remote It is laminated on direction from bottom wall 113.
It should be understood that can also be improved by the second above-mentioned radiating piece 14 in another embodiment as shown in Figure 3 Radiating efficiency, principle is identical as above-mentioned another embodiment, and details are not described herein.
Optionally, graphite, the foam etc. for including but is not limited to can be selected in the material of the second radiating piece 14
Fig. 1 is further regarded to, backlight module 10 further includes light guide plate 15 in the present embodiment, and light guide plate 15 is to utilize optical grade Acrylic or polycarbonate plate, then with having high reflectivity and not hitech materials of extinction, in the Asia of optical grade Gram force plate bottom surface laser engraving, V-type cross grid engraving, UV screen printing technology stamp light guiding points.Utilize optical grade Asia Gram force plate draws the light that issues from lamp in the stop on optical grade acryl plates surface, when light is mapped to each light guiding points When, reflected light can be spread toward all angles, then destroyed conditioned reflex and projected by light guide plate front, so that from the line of lamp bar Light source is converted to area source.
Wherein, light guide plate 15 is set in accommodating space 101 and including incidence surface and light-emitting surface, and above-mentioned lamp source 122 is set It is placed in the side of the incidence surface of light guide plate 15, so that light guide plate 15 receives the light that lamp source 122 issues by incidence surface.
Optionally, in the present embodiment, 121 part of flexible circuit board being set on bottom wall 113 and light guide plate 15 are laminated Setting, to increase the bond area of flexible circuit board 121 Yu bottom wall 113, thus the steady fastness of the connection for increasing flexible circuit board.
Optionally, in the present embodiment, the flexible circuit board 121 being set on bottom wall 113 can be by third double-sided adhesive 125 It is adhered to light guide plate 15, flexible circuit board 121 to be adhered to and is led on the basis of flexible circuit board 121 is adhered to bottom wall 113 Tabula rasa 15, to further increase the connectivity robustness of flexible circuit board 121.
Fig. 3 is further regarded to, in another embodiment, the other end of flexible circuit board 121 is set to light guide plate 15 The side of light-emitting surface, so that flexible circuit board 121 is overlapped in side and the roof 111 of the light-emitting surface of light guide plate 15.
Optionally, in another embodiment, the other end of flexible circuit board 121 can be bonded by the 4th double-sided adhesive 126 In the light-emitting surface of light guide plate 15.
Fig. 1 is further regarded to, light guide plate 15 is additionally provided with reflector plate 16 close to the side of bottom wall 113, and reflector plate 16 is set to On bottom wall 113, the light that light guide plate 15 projects is reflexed into light guide plate 15, to increase the light source utilization rate of light guide plate 15.
Optionally, reflector plate 16 is silvery reflective piece, to increase reflection efficiency.
Optionally, the backlight module 10 in the present embodiment further includes optical diaphragm group 17, and optical diaphragm group 17, which is set to, to be led The side of the light-emitting surface of the light-emitting surface of tabula rasa 15, to receive the light that light guide plate 15 is issued from light-emitting surface.
Wherein, optical diaphragm group 17 include far from light guide plate 15 direction on be cascading diffusion barrier 171, under Anti-reflection film 172 and upper anti-reflection film 173.
Optionally, diffusion barrier 171 includes diffusion 1711 and interconnecting piece 1712, diffusion 1711 and lower anti-reflection film 172 are stacked, to carry out optics diffusion, 1712 self-diffusion main body of interconnecting piece to the light issued from the light-emitting surface of light guide plate 15 1711 extend to the direction far from light guide plate 15.
Wherein, interconnecting piece 1712 can be structure as a whole with diffusion 1711, or different structures, for example connect Socket part 1712 is the double-sided adhesive for stickup.
Optionally, the backlight module 10 in the present embodiment further includes shading rubber belt 18, and one end of shading rubber belt 18 is set to Side of the roof 111 far from accommodating space 101, the other end are set to side of the optical diaphragm group 17 far from light guide plate 15, with When optical diaphragm group 17 shines, 17 light leakage of optical diaphragm group is prevented, the body part 131 of above-mentioned first radiating piece 13 is set to shading Side of the adhesive tape 18 far from roof 111.
Specifically, in the present embodiment, one end of shading rubber belt 18 is attached at one of roof 111 far from accommodating space 101 Side, the other end are pasted on anti-reflection film 173.
Fig. 3 is further regarded to, in another embodiment, when flexible circuit board 121 is overlapped in the light-emitting surface of light guide plate 15 Side and when roof 111, one end of shading rubber belt 18 is attached at side of the flexible circuit board 121 far from roof 111, body part 131 are set to side of the shading rubber belt 18 far from flexible circuit board 121.
Optionally, shading rubber belt 18 is adhered to the interconnecting piece 1712 of diffusion barrier 171, specifically, self-diffusion main body 1711 to The interconnecting piece 1712 namely 1712 self-diffusion main body 1711 of interconnecting piece that direction far from light guide plate 15 extends prolong to shading rubber belt 18 It stretches, to be pasted on shading rubber belt 18.
It is the structural schematic diagram of 20 embodiment of electronic equipment provided by the present application refering to Fig. 5, Fig. 5, the electricity in the present embodiment Sub- equipment 20 includes the backlight module 10 in display module 21 and any of the above-described embodiment, with institute in above-mentioned Fig. 1 in the present embodiment For the backlight module 10 shown, display module 21 is stacked with backlight module 10.
Jointly refering to fig. 1 and Fig. 5, display module 21 includes array substrate 211 and driving chip 212, the first radiating piece 13 Body part 131 be attached at array substrate 211, driving chip 121 is set to side of the array substrate 211 far from body part 131, So that body part 131 receives at least partly heat of the generation of driving chip 121 by array substrate 211, and by at least portion Point heat transfer improves the radiating efficiency of driving chip 212 to back frame 11, prevent 212 temperature of driving chip excessively high and cause by The problem of damage or the speed of service decline, this can prevent the display screen temperature of electronic equipment 20 excessively high.
It is the structural schematic diagram of another embodiment of electronic equipment 20 in Fig. 5 refering to Fig. 6, Fig. 6, in another embodiment In, bond 213 is additionally provided between body part 131 and array substrate 211, body part 131 is pasted on array by bond 213 Substrate 211, to increase the connectivity robustness of the first radiating piece 13 and array substrate 211, to increase the entirety of electronic equipment 20 Stability.
Optionally, bond 213 can be double-sided adhesive or strong and weak glue.
Fig. 1 and Fig. 5 is further regarded to, array substrate 211 is equipped with down polaroid 214, ontology close to the side of body part 131 Side of side of the portion 131 far from array substrate 211 with down polaroid 214 far from array substrate 211 is concordant, to pass through body part The gap that 131 fillings are formed due to down polaroid 214, in the present embodiment, namely filling array substrate 211 and shading rubber belt Gap between 18, to improve the structural stability of electronic equipment 20.
Backlight module provided by the embodiments of the present application is generated by the lamp source that the body part of the first radiating piece receives backlight At least partly heat, to be transferred to the side wall of back frame by the first extension of the first radiating piece, and then be transferred to entire Back frame improves the radiating efficiency of lamp source, prevents lamp source temperature is excessively high from leading to the risks such as quick-fried lamp.
The foregoing is merely the section Examples of the application, are not intended to limit the protection scope of the application, all utilizations Equivalent device made by present specification and accompanying drawing content or equivalent process transformation are applied directly or indirectly in other correlations Technical field, similarly include in the scope of patent protection of the application.

Claims (15)

1. a kind of backlight module, which is characterized in that the backlight module includes:
Back frame, including roof, side wall and bottom wall, the roof, side wall and bottom wall bend connection successively to form an accommodating space;
Backlight is arranged in the accommodating space and including flexible circuit board and the lamp being set on the flexible circuit board Source;
First radiating piece, including body part and the first extension, it is empty far from the accommodating that the body part is set to the roof Between side, first extension and the body part bending connection and be attached at the side wall far from the accommodating space Side.
2. backlight module according to claim 1, which is characterized in that the roof, which is equipped with, is connected to opening for the accommodating space Mouthful, the body part protrudes from the roof towards the side of the opening far from one end of first extension.
3. backlight module according to claim 1 or 2, which is characterized in that first radiating piece further includes the second extension Portion, second extension and first extension bending connect and extend to one of the bottom wall far from the accommodating space Side.
4. backlight module according to claim 3, which is characterized in that the backlight module further includes the second radiating piece, institute It states the second radiating piece and is at least partly attached at side of the bottom wall far from the accommodating space, and second extension is at least Part is stacked with second radiating piece.
5. backlight module according to claim 1, which is characterized in that the flexible circuit board is set on the bottom wall.
6. backlight module according to claim 1, which is characterized in that the backlight module further includes light guide plate, described to lead Tabula rasa is arranged in the accommodating space and including incidence surface and light-emitting surface, and the lamp source is set to the side of the incidence surface.
7. backlight module according to claim 6, which is characterized in that the flexible circuit board is overlapped in the light guide plate The side of light-emitting surface and the roof.
8. backlight module according to claim 6, which is characterized in that the backlight module further includes shading rubber belt, described One end of shading rubber belt is set to side of the roof far from the accommodating space, and the body part is set to the shading glue Side of the band far from the roof.
9. backlight module according to claim 8, which is characterized in that the backlight module further includes optical diaphragm group, institute The side that optical diaphragm group is set to the light-emitting surface of the light guide plate is stated, the other end of the shading rubber belt is set to the optics Side of the diaphragm group far from the light guide plate.
10. backlight module according to claim 9, which is characterized in that the optical diaphragm group is included in be led far from described The other end of diffusion barrier, lower anti-reflection film and the upper anti-reflection film being cascading on the direction of tabula rasa, the shading rubber belt is pasted In the upper anti-reflection film.
11. backlight module according to claim 10, which is characterized in that the diffusion barrier includes diffusion and connection Portion, the diffusion are stacked with the lower anti-reflection film, and the interconnecting piece is from the diffusion to the shading rubber belt Extend, and is pasted on the shading rubber belt.
12. a kind of electronic equipment, which is characterized in that the electronic equipment includes backlight module and display module, the display mould Group is stacked with the backlight module, wherein the backlight module includes:
Back frame, including roof, side wall and bottom wall, the roof, side wall and bottom wall bend connection successively to form an accommodating space;
Backlight is arranged in the accommodating space and including flexible circuit board and the lamp being set on the flexible circuit board Source;
First radiating piece, including body part and the first extension, it is empty far from the accommodating that the body part is set to the roof Between side, first extension and the body part bending connection and be attached at the side wall far from the accommodating space Side.
13. electronic equipment according to claim 12, which is characterized in that the display module includes array substrate and driving Chip, the body part are attached at the array substrate, and the driving chip is set to the array substrate far from the ontology The side in portion.
14. electronic equipment according to claim 13, which is characterized in that the array substrate close to the body part one Side is equipped with down polaroid, and side of the body part far from the array substrate and the down polaroid are far from the array substrate Side it is concordant.
15. electronic equipment described in 3 or 14 according to claim 1, which is characterized in that the body part and the array substrate it Between be additionally provided with bond, the body part is pasted on the array substrate by the bond.
CN201821797169.4U 2018-11-01 2018-11-01 A kind of backlight module and electronic equipment Active CN209045054U (en)

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Application Number Priority Date Filing Date Title
CN201821797169.4U CN209045054U (en) 2018-11-01 2018-11-01 A kind of backlight module and electronic equipment

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Application Number Priority Date Filing Date Title
CN201821797169.4U CN209045054U (en) 2018-11-01 2018-11-01 A kind of backlight module and electronic equipment

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CN209045054U true CN209045054U (en) 2019-06-28

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110361807A (en) * 2019-07-05 2019-10-22 Oppo(重庆)智能科技有限公司 The preparation method of electronic equipment, backlight module and backlight module
CN112180632A (en) * 2020-10-22 2021-01-05 武汉华星光电技术有限公司 Chip heat radiation structure and liquid crystal display device
WO2022104553A1 (en) * 2020-11-17 2022-05-27 京东方科技集团股份有限公司 Backlight module and display device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110361807A (en) * 2019-07-05 2019-10-22 Oppo(重庆)智能科技有限公司 The preparation method of electronic equipment, backlight module and backlight module
CN110361807B (en) * 2019-07-05 2021-04-13 Oppo(重庆)智能科技有限公司 Electronic equipment, backlight module and preparation method of backlight module
CN112180632A (en) * 2020-10-22 2021-01-05 武汉华星光电技术有限公司 Chip heat radiation structure and liquid crystal display device
CN112180632B (en) * 2020-10-22 2021-10-08 武汉华星光电技术有限公司 Chip heat radiation structure and liquid crystal display device
WO2022082849A1 (en) * 2020-10-22 2022-04-28 武汉华星光电技术有限公司 Chip heat dissipation structure and liquid crystal display device
US11789199B2 (en) 2020-10-22 2023-10-17 Wuhan China Star Optoelectronics Technology Co., Ltd. Chip heat dissipation structure and liquid crystal display device
WO2022104553A1 (en) * 2020-11-17 2022-05-27 京东方科技集团股份有限公司 Backlight module and display device
CN114830022A (en) * 2020-11-17 2022-07-29 京东方科技集团股份有限公司 Backlight module and display device

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