CN209029338U - Semiconductor manufacturing equipment - Google Patents
Semiconductor manufacturing equipment Download PDFInfo
- Publication number
- CN209029338U CN209029338U CN201821987973.9U CN201821987973U CN209029338U CN 209029338 U CN209029338 U CN 209029338U CN 201821987973 U CN201821987973 U CN 201821987973U CN 209029338 U CN209029338 U CN 209029338U
- Authority
- CN
- China
- Prior art keywords
- cavity
- power part
- semiconductor manufacturing
- manufacturing equipment
- valve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model relates to a kind of semiconductor manufacturing equipments, comprising: cavity；Bearing structure, the bearing structure include a carrying platform for being located at the inside cavity and are connected and extend to the elevating lever of the containment portion with the carrying platform；Power part, the power part connect with the cavity and accommodate the part that the elevating lever extends to the containment portion, have gap between the power part and the elevating lever；Wherein, the power part and the cavity junction are provided with a valve, so that the power part is connected to or separates with the cavity.Carried object in the utility model in bearing structure carries out rise and fall campaign by power part in the cavity；The utility model is also provided with a valve in power part and cavity junction, powder impurity is prevented to fall into power part by control valve, to prevent powder impurity from forming granule foreign pollution sources in power part, the quality of product is made to be greatly improved.
Description
Technical field
The utility model relates to field of semiconductor devices more particularly to a kind of semiconductor manufacturing equipments.
Background technique
In recent years, higher and higher to the integrated level and performance requirement of element with the development of semiconductor fabrication process, chemistry
Vapor deposition (Chemical Vapor Deposition, abbreviation CVD) plays very important work in the art of semiconductor manufacturing
With.Usually, chemical vapor deposition is the life that reacted in gas phase or gas-solid interface using the substance of gaseous state or steam-like
At the process of solid deposited object, to realize the deposition of film.However, deposition film can also adhere to after 10 use of cavity
On 10 inner wall of cavity, so in next reaction process, the by-product of these attachments can become the dirt of pollution wafer etc.
Dye source.Therefore, the yield to improve the stability and product reacted, it will usually use such as In-Situ Cleaning (In-situ
Clean) or dystopy cleans means such as (Remote Plasma Source clean, RPS) and carries out clearly to 10 inner wall of cavity
It is clean.
As shown in FIG. 1, FIG. 1 is existing semiconductor technology cavity structure charts.Current line is in the industry in semiconductor technology cavity 10
Common design provides power for motor and drives the up and down motion of bearing structure 20, and it is flat that wafer or glass wait processing object to be placed in carrying
On platform 21, processing object is waited to carry out wafer or glass under specific condition (such as vacuum or/and temperature appropriate etc.)
Processing.In the process of processing, it is possible to powder impurity can be generated, which can drop to 21 lower section of carrying platform, into
And it is attached to that there are 40 inner wall of power part of a large amount of folds and bottoms.
But the powder impurity being attached on power part 40 is difficult clean by the cleaning mode of current mainstream, and powder is miscellaneous
The accumulation of matter can become granule foreign pollution sources, influence board running or even product quality.
Utility model content
The purpose of this utility model is to provide a kind of semiconductor manufacturing equipments, semiconductor technology cavity is reduced or avoided
Interior granule foreign falls to power part and forms particle contamination source, causes to influence board running or even product quality.
In order to achieve the above object, the utility model provides a kind of semiconductor manufacturing equipment, comprising: cavity；
Bearing structure, the bearing structure include one be located at the inside cavity carrying platform and with the carrying platform
It is connected and extends to the elevating lever of the containment portion；
Power part, the power part, which connect with the cavity and accommodates the elevating lever, extends to the containment portion
Part, between the power part and the elevating lever have gap；
Wherein, the power part and the cavity junction are provided with a valve, so that the power part and institute
State cavity connection or partition.
Optionally, in the semiconductor manufacturing equipment, the cavity and the power part pass through two groups of flange seals
Connection, flange described in two groups are respectively arranged on the cavity on the power part, and the valve is set to described in two groups
Between flange.
Optionally, in the semiconductor manufacturing equipment, the valve include the first valve block and the second valve block, described first
Valve block and second valve block, which have, closes up the rear notch to match with section of the bearing structure at the valve, works as institute
State the first valve block and when second valve block is closed up, the cavity and the power part separated, when first valve block and
When second valve block separates, the cavity is connected to the power part.
Optionally, in the semiconductor manufacturing equipment, first valve block and second valve block are opening direction
The half-annuli of the elevating lever.
Optionally, in the semiconductor manufacturing equipment, the power part includes compression piece.
Optionally, in the semiconductor manufacturing equipment, the elevating lever is connect with the compression piece, and the compression piece exists
Compression movement on the extending direction of the elevating lever drives the bearing structure to rise or fall.
Optionally, in the semiconductor manufacturing equipment, the cavity has air inlet and exhaust outlet, the carrying platform
With the loading end towards the air inlet, loading end of the air inlet towards the carrying platform, the exhaust outlet direction
The side of the carrying platform.
Optionally, in the semiconductor manufacturing equipment, the elevating lever is located on the center vertical line of the loading end.
Optionally, it in the semiconductor manufacturing equipment, is provided in the technological cavities of semiconductor body and the air inlet
The gas distribution component of connection, so that reaction gas enters the semiconductor technology cavity by the gas distribution component.
Optionally, in the semiconductor manufacturing equipment, the semiconductor manufacturing equipment is chemical vapor depsotition equipment, object
Physical vapor deposition equipment, atomic layer deposition apparatus or dry etching equipment.
In semiconductor manufacturing equipment provided by the utility model, the carried object in the bearing structure can be by described
Power part carries out rise and fall campaign in the cavity, so as to adjust the position of the carried object；The utility model is also
The power part and the cavity junction are provided with a valve, by the switch in different step control valve to prevent
Powder impurity is fallen into the power part, to prevent powder impurity from forming granule foreign pollution in the power part
Source, and the quality of product is made also to be greatly improved.
Detailed description of the invention
Fig. 1 is existing semiconductor technology cavity structure chart.
Fig. 2 a and Fig. 2 b are semiconductor technology cavity structure chart provided by the embodiment of the utility model；Wherein, valve in Fig. 2 a
Door is in close state, and valve is in the open state in Fig. 2 b.
Fig. 3 a and Fig. 3 b are semiconductor technology cavity valve side view provided by the embodiment of the utility model；Wherein, Fig. 3 a
It is schematic diagram when valve is closed and the first valve block and the second valve block are in closed configuration, Fig. 3 b is valve opening and the first valve
Block and the second valve block are in schematic diagram when discrete state.
Fig. 4 a and Fig. 4 b are semiconductor technology cavity valve top view provided by the embodiment of the utility model；Wherein, Fig. 4 a
It is schematic diagram when valve is closed and the first valve block and the second valve block are in closed configuration, Fig. 4 b is valve opening and the first valve
Block and the second valve block are in schematic diagram when discrete state.
Wherein, 10- cavity；11- air inlet；12- exhaust outlet；13- gas distribution component；20- bearing structure；21- carrying
Platform；22- elevating lever；30- valve；40- power part；41- compression piece；411- metal object；412- shell；The bottom 42- knot
Structure；43- flange.
Specific embodiment
It is carried out below in conjunction with specific embodiment of the schematic diagram to the semiconductor manufacturing equipment of the utility model more detailed
Description.According to following description, will be become apparent from the advantages of semiconductor manufacturing equipment with feature in the utility model.It should be noted
It is that attached drawing is all made of very simplified form and using non-accurate ratio, only to facilitate, lucidly aid in illustrating this reality
With the purpose of new embodiment.
Fig. 2 a and Fig. 2 b is please referred to, the utility model provides a kind of semiconductor manufacturing equipment, comprising: cavity 10；
Bearing structure 20, the bearing structure 20 include one be located at the cavity 10 inside carrying platform 21 and with institute
Carrying platform 21 is stated to be connected and extend to the elevating lever 22 outside the cavity 10；
Power part 40, the power part 40 connect with the cavity 10 and accommodate the elevating lever 22 extend to it is described
Part outside cavity 10 has gap between the power part 40 and the elevating lever 22；
Wherein, 10 junction of cavity is provided with a valve 30 in the power part 40, so that the power part
Part 40 is connected to or separates with the cavity 10.
In semiconductor manufacturing equipment provided by the utility model, the carried object in the bearing structure 20 can pass through institute
It states power part 40 and carries out rise and fall campaign in the cavity 10, so as to adjust the position of the carried object；This is practical
It is novel also by the switch in different step control valve 30 to prevent powder impurity from falling into the power part 40, thus anti-
Only powder impurity forms granule foreign pollution sources in the power part 40, and the quality of product is made also to have obtained biggish mention
It is high.
Common, the cavity 10 is connected to the power part 40 by two groups of sealings of flange 43, and two groups of flanges 43 divide
Be not set on the cavity 10 and the power part 40 on.
Further, the valve 30 is set between the utility model flange 43 described in two groups, the valve 30 includes
First valve block and the second valve block, as shown in Fig. 3 a and Fig. 3 b and Fig. 4 a and Fig. 4 b, first valve block and second valve block tool
Have and close up the rear notch to match with section of the bearing structure 20 at the valve 30, when first valve block and described
When second valve block is closed up, the cavity 10 and the power part 40 are separated, when first valve block and second valve block
When separation, the cavity 10 is connected to the power part 40.Specifically, please refer to Fig. 3 a and Fig. 4 a, the valve 30 is in work
Closing when skill carries out, first valve block and second valve block separate the cavity 10 and the power part 40 after closing up,
The bearing structure 20 remains stationary, and the impurity powder of generation is fallen on the valve 30, and Fig. 2 a is shown in gas flow.Described
After 10 inner wall of cavity is cleaned, as shown in Fig. 3 b and 4b, the valve 30 is opened, Fig. 2 b is shown in gas flow, described in holding
40 inside of power part is consistent with 10 internal pressure of cavity, so that the bearing structure 20 is moved, to avoid
The powder impurity generated when reaction is fallen into the power part 40.
Preferably, first valve block and second valve block are half-annuli of the opening towards the elevating lever 22.
The valve 30 may include multiple valve blocks in one embodiment, and multiple a valve blocks are identical or different fan-shaped ring
Body, multiple valve blocks, which have, closes up the rear notch to match with section of the bearing structure 20 at the valve 30, when
When multiple valve blocks are closed up, the cavity 10 and the power part 40 are separated, described when the separation of multiple valve blocks
Cavity 10 is connected to the power part 40.
In one embodiment, the power part 40 can be compression piece 41, and the compression piece 41 includes ring cylinder, can
Think circle ring column or rectangular ring cylinder.The compression piece 41 and 42 seal combination of bottom structure.The compression piece 41 can wrap
The shell 412 of internal metal object 411 and appearance is included, the metal object 411 is set in the shell 412, the metal object
411 and the shell 412 can compress.The upper and lower displacement of the bottom structure 42 is realized by the compression piece 41.It is common,
The shell 412 of the compression piece 41 is fold, and the powder impurity for reacting generation is easy in the fold of insertion shell 412, and
Powder impurity in this fold is not easy to be removed, thus in the application when technique is carried out by the power part 40 and institute
The partition of cavity 10 is stated, the powder impurity that can be generated to avoid reaction enters in the power part 40.Further, the elevating lever
22 connect with the compression piece 41, and compression movement of the compression piece 41 on the extending direction of the elevating lever 22 drives institute
It states bearing structure 20 to rise or fall, and then changes the upper and lower displacement of carried object (such as wafer) in the bearing structure 20,
To adapt to reaction requirement.
Common, the bearing structure 20 is made of carrying platform 21 and elevating lever 22, and the carrying platform 21 is set to
On the elevating lever 22, the elevating lever 22 is located on the center vertical line of the loading end.
In semiconductor technology cavity provided by the utility model, air inlet 11 is provided on the body wall of the cavity 10
With exhaust outlet 12, the carrying platform 21 has the loading end towards the air inlet 11；The air inlet 11 is held towards described
The loading end of carrying platform 21, the exhaust outlet 12 is towards 21 side of carrying platform.
Further, the gas distribution portion connecting with the air inlet 11 is additionally provided in the semiconductor technology cavity 10
Part 13, reaction gas enter the semiconductor technology cavity 10 by the gas distribution component 13.
Common, the semiconductor manufacturing equipment can be chemical vapor depsotition equipment, Pvd equipment, atom
Layer depositing device or dry etching equipment.
30 control process of valve is as follows in the utility model: as shown in Figure 2 a, when valve 30 is closed, reaction gas is from institute
The entrance of air inlet 11 is stated, then reaction gas is scatter by the gas distribution component 13, reaches the bearing structure 20
Carrying platform 21 then leaves from the surrounding of the carrying platform 21 respectively, and the gas close to the exhaust outlet 12 is directly taken out
It walks, the gas far from the exhaust outlet 12 is surrounded after 21 bottom line of carrying platform takes a round and is pumped.As shown in Figure 2 b, when
When valve 30 is opened, reaction gas enters from the air inlet 11, is then divided reaction gas by the gas distribution component 13
It scatters, reaches the carrying platform 21 of the bearing structure 20, then left respectively from the surrounding of the carrying platform 21, close to institute
The gas for stating exhaust outlet 12 is directly pumped, and the gas far from the exhaust outlet 12 surrounds the carrying platform 21 and the lifting
22 row of bar is pumped after taking a round.
To sum up, in semiconductor manufacturing equipment provided by the utility model, the carried object in the bearing structure can lead to
It crosses the power part and carries out rise and fall campaign in the cavity, so as to adjust the position of the carried object；This is practical
It is novel that the power part and the cavity junction are also provided with a valve, pass through the switch in different step control valve
To prevent powder impurity from falling into the power part, to prevent powder impurity from forming granule foreign in the power part
Pollution sources, and the quality of product is made also to be greatly improved.
Illustrate the principle and effect of the utility model to being given for example only property of above-described embodiment, not for limiting this reality
With novel.Any person of ordinary skill in the field can be to this reality under the spirit and scope without prejudice to the utility model
Any type of equivalent replacement or modification etc. are made with the technical solution of novel exposure and technology contents to change, and are still fallen within practical
Within novel protection scope.
Claims (10)
1. a kind of semiconductor manufacturing equipment characterized by comprising
Cavity；
Bearing structure, the bearing structure include a carrying platform for being located at the inside cavity and are connected with the carrying platform
And extend to the elevating lever of the containment portion；
Power part, the power part connect with the cavity and accommodate the portion that the elevating lever extends to the containment portion
Point, there is gap between the power part and the elevating lever；
Wherein, the power part and the cavity junction are provided with a valve, so that the power part and the chamber
Body connection or partition.
2. semiconductor manufacturing equipment as described in claim 1, which is characterized in that the cavity and the power part pass through two
Group flange seal connection, flange described in two groups are respectively arranged on the cavity on the power part, and the valve is arranged
Between the flange described in two groups.
3. semiconductor manufacturing equipment as described in claim 1, which is characterized in that the valve includes the first valve block and the second valve
Block, first valve block and second valve block have to close up rear to match with section of the bearing structure at the valve
Notch, when first valve block and second valve block are closed up, the cavity and the power part are separated, when described
When first valve block and second valve block separate, the cavity is connected to the power part.
4. semiconductor manufacturing equipment as claimed in claim 3, which is characterized in that first valve block and second valve block are equal
For the half-annuli towards the elevating lever that is open.
5. semiconductor manufacturing equipment as described in claim 1, which is characterized in that the power part includes compression piece.
6. semiconductor manufacturing equipment as claimed in claim 5, which is characterized in that the elevating lever is connect with the compression piece,
Compression movement of the compression piece on the extending direction of the elevating lever drives the bearing structure to rise or fall.
7. such as semiconductor manufacturing equipment as claimed in any one of claims 1 to 6, which is characterized in that the cavity has air inlet
And exhaust outlet, the carrying platform have the loading end towards the air inlet, the air inlet is towards the carrying platform
Loading end, the exhaust outlet is towards the side of the carrying platform.
8. semiconductor manufacturing equipment as claimed in claim 7, which is characterized in that the elevating lever is located in the loading end
On heart vertical line.
9. semiconductor manufacturing equipment as claimed in claim 7, which is characterized in that be provided in the technological cavities of semiconductor body with
The gas distribution component of the air inlet connection, so that reaction gas enters the semiconductor work by the gas distribution component
Skill cavity.
10. such as semiconductor manufacturing equipment as claimed in any one of claims 1 to 6, which is characterized in that the semiconductor manufacturing equipment
For chemical vapor depsotition equipment, Pvd equipment, atomic layer deposition apparatus or dry etching equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821987973.9U CN209029338U (en) | 2018-11-29 | 2018-11-29 | Semiconductor manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821987973.9U CN209029338U (en) | 2018-11-29 | 2018-11-29 | Semiconductor manufacturing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209029338U true CN209029338U (en) | 2019-06-25 |
Family
ID=66910718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821987973.9U Active CN209029338U (en) | 2018-11-29 | 2018-11-29 | Semiconductor manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209029338U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112144112A (en) * | 2020-09-22 | 2020-12-29 | 北京北方华创微电子装备有限公司 | Semiconductor process equipment |
-
2018
- 2018-11-29 CN CN201821987973.9U patent/CN209029338U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112144112A (en) * | 2020-09-22 | 2020-12-29 | 北京北方华创微电子装备有限公司 | Semiconductor process equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10727100B2 (en) | Load port and EFEM | |
| CN103620757B (en) | Cleaning systems and method | |
| US6575178B1 (en) | Cleaning and drying method and apparatus | |
| CN105765103B (en) | Method and apparatus for In-Situ Cleaning processing chamber | |
| US7892320B2 (en) | Automatically replaceable apparatus for collecting byproducts and the controlling method thereof in equipment producing semiconductor | |
| CN209029338U (en) | Semiconductor manufacturing equipment | |
| KR100799377B1 (en) | Method of cleaning substrate-processing device and substrate-processing device | |
| KR20180049289A (en) | Substrate transferring apparatus | |
| KR20130105317A (en) | Valve purge assembly for semiconductor manufacturing tools | |
| US8794896B2 (en) | Vacuum processing apparatus and zonal airflow generating unit | |
| JP2023520507A (en) | Dual gate and single actuator system | |
| JPH09134952A (en) | Carrying container of wafer-form material body | |
| KR20100109762A (en) | Aapparatus for collecting remaining chemicals and by-products in semiconductor processing using particle inertia | |
| CN107533998B (en) | Substrate processing apparatus and method of cleaning chamber | |
| KR101480237B1 (en) | Equipment for gathering particle | |
| CN109326508A (en) | A method of for wet-treating crystal round fringes | |
| TW201234935A (en) | Plasma processing apparatus | |
| KR102510761B1 (en) | Semiconductor wafer inspection apparatus | |
| WO2012002125A1 (en) | Metal-film forming device | |
| KR102442451B1 (en) | Cleaning apparatus for powder trap of semiconductor manufacturing facility and cleaning method of powder trap using the same | |
| JP7473635B2 (en) | Clean isolation valve for reduced dead volume | |
| CN114618852A (en) | Glue removing machine and glue removing method for semiconductor processing | |
| CN209292474U (en) | Cavity cleaning device | |
| KR100614656B1 (en) | Valve assembly, apparatus for manufacturing semiconductor devices with this, and method for cleaning trap | |
| CN109003913B (en) | Vacuum system and semiconductor device having the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |