CN209016095U - A kind of SMD patch support facilitating splicing - Google Patents
A kind of SMD patch support facilitating splicing Download PDFInfo
- Publication number
- CN209016095U CN209016095U CN201822187313.9U CN201822187313U CN209016095U CN 209016095 U CN209016095 U CN 209016095U CN 201822187313 U CN201822187313 U CN 201822187313U CN 209016095 U CN209016095 U CN 209016095U
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- China
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- conductive sheet
- cup
- cup body
- smd patch
- card slot
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Abstract
The utility model discloses a kind of SMD patch supports for facilitating splicing, including cup body and bottom of a cup, the first conductive sheet is fixed on the right side of the cup body, and first offers the first card slot on the inside of conductive sheet, and the first protrusion is provided with above the first conductive sheet, the second conductive sheet is fixed on the left of the cup body, and second the inside of conductive sheet offer the second card slot, and the second protrusion is provided with above the second conductive sheet, the bottom of cup body is arranged in the bottom of a cup, rim of a cup is provided in the middle part of the cup body, and connecting spring is fixed on the inner wall of rim of a cup, and one end of connecting spring is connected with connection copper sheet.This facilitates the SMD patch support of splicing, it is provided with the first conductive sheet and the second conductive sheet, it can be fastened by first protrusion on the first conductive sheet surface of cup body one end and the second card slot of the second conductive sheet of another cup body, and then 2 cup body engagings are conveniently made to be stitched together, and then facilitate the using effect of the SMD patch support.
Description
Technical field
The utility model relates to SMD mount technology field, specially a kind of SMD patch support for facilitating splicing.
Background technique
SMD patch support is the encapsulation cavity for storing SMD patch, helps to improve the service efficiency of SMD patch, and for
For SMD patch support currently on the market, or there is very big a part of problem, just such as SMD patch support is inconvenient
Splicing, the heat dissipation effect of SMD patch support is bad, it has not been convenient to the fixation of SMD patch, therefore it is proposed that a kind of facilitate splicing
SMD patch support, to solve the problems of among the above.
Utility model content
The purpose of this utility model is to provide a kind of SMD patch supports for facilitating splicing, to solve above-mentioned background technique
It is proposed that SMD patch support is inconvenient to splice, the heat dissipation effect of SMD patch support is bad, it has not been convenient to which the fixation of SMD patch is asked
Topic.
To achieve the above object, the utility model provides the following technical solutions: a kind of SMD patch support facilitating splicing,
Including cup body and bottom of a cup, the first conductive sheet is fixed on the right side of the cup body, and the first card is offered on the inside of the first conductive sheet
Slot, and the first protrusion is provided with above the first conductive sheet, it is fixed with the second conductive sheet on the left of the cup body, and second leads
The inside of electric piece offers the second card slot, and the second protrusion is provided with above the second conductive sheet, and the bottom of a cup is arranged in cup
The bottom of body, and heat dissipation silk screen is provided with above bottom of a cup, rim of a cup is provided in the middle part of the cup body, and solid on the inner wall of rim of a cup
Surely there is connecting spring, and one end of connecting spring is connected with connection copper sheet.
Preferably, first conductive sheet is made of the first card slot and the first protrusion, and the first conductive sheet and cup body are weldering
It connects in succession, and there are two the settings of the first conductive sheet.
Preferably, second conductive sheet is made of the second card slot and the second protrusion, and the second conductive sheet and the first conduction
Piece is to be connected together.
Preferably, the connecting spring is to be fixedly connected, and the outer surface for connecting copper sheet is serrated knot with copper sheet is connect
Structure, and connect there are four copper sheet settings.
Preferably, the heat dissipation silk screen is to be fixedly connected, and radiating is not connect between silk screen and bottom of a cup with the inner wall of cup body
Touching connection.
Compared with prior art, the utility model has the beneficial effects that this facilitates the SMD patch support of splicing,
(1) it is provided with the first conductive sheet and the second conductive sheet, the of the first conductive sheet surface of cup body one end can be passed through
One protrusion and the second card slot of the second conductive sheet of another cup body fasten, and then 2 cup body engagings is conveniently made to be stitched together,
And then facilitate the using effect of the SMD patch support；
(2) it is provided with heat dissipation silk screen, heat dissipation silk screen is not contacted with bottom of a cup, while bottom of a cup is in engraved structure, and then convenient logical
It crosses heat dissipation silk screen the heat that the work of SMD patch generates sheds, improves the heat dissipation effect of the device；
(3) it is set to the connection copper sheet of connecting spring, and there are four connecting spring settings, the work of connecting spring can be passed through
It is fixed with by the device extruding on SMD patch, improves the fixed effect of device on SMD patch, improve the SMD patch support
Practicability.
Detailed description of the invention
Fig. 1 is the utility model positive structure diagram；
Fig. 2 is the utility model entirety splicing construction schematic diagram；
Fig. 3 is the utility model overlooking structure diagram；
Fig. 4 is the first conductive sheet of the utility model and the second conductive sheet attachment structure schematic diagram.
In figure: 1, cup body；2, the first conductive sheet；3, the first card slot；4, the first protrusion；5, the second conductive sheet；6, the second card
Slot；7, the second protrusion；8, rim of a cup；9, connecting spring；10, copper sheet is connected；11, radiate silk screen；12, bottom of a cup.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-4 is please referred to, the utility model provides a kind of technical solution: a kind of SMD patch support facilitating splicing, including
Cup body 1, the first conductive sheet 2, the first card slot 3, the first protrusion 4, the second conductive sheet 5, the second card slot 6, the second protrusion 7, rim of a cup 8,
Connecting spring 9, connection copper sheet 10, heat dissipation silk screen 11 and bottom of a cup 12, the right side of cup body 1 is fixed with the first conductive sheet 2, and first leads
The inside of electric piece 2 offers the first card slot 3, and the top of the first conductive sheet 2 is provided with the first protrusion 4, and the left side of cup body 1 is solid
Surely there is the second conductive sheet 5, and the inside of the second conductive sheet 5 offers the second card slot 6, and the top setting of the second conductive sheet 5
There is the second protrusion 7, bottom of a cup 12 is arranged in the bottom of cup body 1, and the top of bottom of a cup 12 is provided with heat dissipation silk screen 11, in cup body 1
Portion is provided with rim of a cup 8, and connecting spring 9 is fixed on the inner wall of rim of a cup 8, and one end of connecting spring 9 is connected with connection copper sheet
10。
First conductive sheet 2 of this example is made of the first card slot 3 and the first protrusion 4, and the first conductive sheet 2 and cup body 1 are weldering
It connects in succession, and there are two the settings of the first conductive sheet 2, facilitates the first card slot 3 and the second conductive sheet 5 inside the first conductive sheet 2
Second protrusion 7 of top combines.
Second conductive sheet 5 is made of the second card slot 6 and the second protrusion 7, and the second conductive sheet 5 and the first conductive sheet 2 are card
Connection is closed, the second conductive sheet 5 is mutually clamped with the first conductive sheet 2, splices 2 cup bodies 1, improve the bracket
Using effect.
Connecting spring 9 with connect copper sheet 10 be fixedly connected, and the outer surface for connecting copper sheet 10 is serrated structure, and
It connects there are four the settings of copper sheet 10, copper sheet 10 can be connected by 9 surface of connecting spring and the device inside cup body 1 is consolidated
It is fixed, improve the device fixed effect.
Heat dissipation silk screen 11 is to be fixedly connected, and radiate between silk screen 11 and bottom of a cup 12 for the not company of contact with the inner wall of cup body 1
It connects, the heat that the work of 1 internal components of cup body generates can be shed by heat dissipation silk screen 11 by the bottom of a cup 12 of engraved structure, be mentioned
The heat dissipation effect of the high device.
Working principle: firstly, according to Fig. 1-4, when using the device, need to device to be used be put into cup body 1
Rim of a cup 8 in, make 1 inner surface of cup body by connecting spring 9 connect connection copper sheet 10 connecting spring 9 effect squeezer
Part, and then it is fixed on it by device, and connect there are four the settings of copper sheet 10, and then improve the fixed effect of the bracket,
In SMD patch support in use, 8 internal components of rim of a cup at work, can transfer heat to the heat dissipation silk screen of 1 bottom of cup body
11, and then make heat dissipation silk screen 11 that the heat that device work generates to be shed by bottom of a cup 12,12 surface of bottom of a cup is in engraved structure, into
And the heat dissipation of the bracket is facilitated, when needing to splice, by the first conductive sheet 2 and another 1 surface of cup body on 1 surface of cup body
Second conductive sheet 5 is connected, and then makes the second protrusion 7 on the first card slot 3 and the second conductive sheet 5 inside the first conductive sheet 2
It fastens, first protrusion 4 on 2 surface of the first conductive sheet fastens with the second card slot 6 inside the second conductive sheet 5, and then conveniently
So that 2 cup bodies 1 is stitched together, and then facilitate the using effect of the SMD patch support, is not described in detail in this specification
Content belongs to the prior art well known to professional and technical personnel in the field.
Although the utility model is described in detail with reference to the foregoing embodiments, come for those skilled in the art
Say, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic into
Row equivalent replacement, within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on should all
It is included within the scope of protection of this utility model.
Claims (5)
1. a kind of SMD patch support for facilitating splicing, including cup body (1) and bottom of a cup (12), it is characterised in that: the cup body (1)
Right side be fixed with the first conductive sheet (2), and the first card slot (3) are offered on the inside of the first conductive sheet (2), and first is conductive
It is provided with first raised (4) above piece (2), is fixed with the second conductive sheet (5) on the left of the cup body (1), and second is conductive
The inside of piece (5) offers the second card slot (6), and second raised (7), the cup are provided with above the second conductive sheet (5)
Bottom (12) setting is provided in the bottom of cup body (1), and above bottom of a cup (12) radiates silk screen (11), in the cup body (1)
Portion is provided with rim of a cup (8), and connecting spring (9) are fixed on the inner wall of rim of a cup (8), and one end of connecting spring (9) is connected with
It connects copper sheet (10).
2. a kind of SMD patch support for facilitating splicing according to claim 1, it is characterised in that: first conductive sheet
(2) be made of the first card slot (3) and first raised (4), and the first conductive sheet (2) and cup body (1) are welded connecting, and first
There are two conductive sheet (2) settings.
3. a kind of SMD patch support for facilitating splicing according to claim 1, it is characterised in that: second conductive sheet
(5) it is made of the second card slot (6) and second raised (7), and the second conductive sheet (5) is to be connected together with the first conductive sheet (2).
4. a kind of SMD patch support for facilitating splicing according to claim 1, it is characterised in that: the connecting spring (9)
It is to be fixedly connected, and the outer surface for connecting copper sheet (10) is serrated structure, and connects copper sheet (10) with copper sheet (10) are connect
There are four settings.
5. a kind of SMD patch support for facilitating splicing according to claim 1, it is characterised in that: the heat dissipation silk screen
It (11) is to be fixedly connected, and radiating is not connect between silk screen (11) and bottom of a cup (12) with the inner wall of cup body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822187313.9U CN209016095U (en) | 2018-12-25 | 2018-12-25 | A kind of SMD patch support facilitating splicing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822187313.9U CN209016095U (en) | 2018-12-25 | 2018-12-25 | A kind of SMD patch support facilitating splicing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209016095U true CN209016095U (en) | 2019-06-21 |
Family
ID=66844172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822187313.9U Active CN209016095U (en) | 2018-12-25 | 2018-12-25 | A kind of SMD patch support facilitating splicing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209016095U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111619209A (en) * | 2020-05-12 | 2020-09-04 | 霍山县雁江印务有限公司 | Packaging carton watermark printing device |
-
2018
- 2018-12-25 CN CN201822187313.9U patent/CN209016095U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111619209A (en) * | 2020-05-12 | 2020-09-04 | 霍山县雁江印务有限公司 | Packaging carton watermark printing device |
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