CN208992005U - A kind of laser scribing means with cooling back installation - Google Patents
A kind of laser scribing means with cooling back installation Download PDFInfo
- Publication number
- CN208992005U CN208992005U CN201821768200.1U CN201821768200U CN208992005U CN 208992005 U CN208992005 U CN 208992005U CN 201821768200 U CN201821768200 U CN 201821768200U CN 208992005 U CN208992005 U CN 208992005U
- Authority
- CN
- China
- Prior art keywords
- axis
- mould group
- laser
- carriage
- cooling back
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a kind of laser scribing means with cooling back installation, including laser scriber and cooling back installation engaged therewith；Laser scriber includes rack, mobile microscope carrier, moving laser device and positioning component；Rack includes pedestal and the side wall on pedestal and positioned at pedestal two sides, and the top of pedestal is equipped with groove；Cooling back installation includes liquid reserve tank, the first water pump being connected with liquid reserve tank, the filter being connected with the first water pump, the second water pump being connected with filter, the deionization mechanism being connected with the second water pump and the water spout being connected with deionization mechanism below pedestal, water spout is set on cutting assembly, and the bottom of groove is equipped with the through-hole being connected with liquid reserve tank.Cooling back installation with laser scriber cooperation is set, the chip after cutting is rinsed using water spout and so that chip is cooled down simultaneously, reduces the cooling time of chip, improves production efficiency, and cleaned simultaneously to chip.
Description
Technical field
The utility model is specifically related to a kind of laser scribing means with cooling back installation.
Background technique
Currently, existing laser scribing means is processed using single cutting head, after carrying out product aligning using jig, pass through
The mode of axis movement cuts workpiece.This processing method positioning accuracy is poor, it is difficult to meet the high-precision cutting of high production capacity
Demand.For this purpose, the utility model patent of Patent No. CN201721698161.8, discloses a kind of laser scribing means, can be used for
Cut crystal etc. comprising: rack；Mobile microscope carrier, the mobile microscope carrier include being set to the Y-axis mould group of the rack and can sliding
It is set to the carrier assemblies of Y-axis mould group dynamicly, the carrier assemblies hold chip；Moving laser device, the moving laser device
It is set up in above the mobile microscope carrier, the moving laser device includes being set to the X-axis mould group of the rack and slideably setting
In the cutting assembly of X-axis mould group, the X-axis mould group drives the cutting assembly to cut the chip on the carrier assemblies
It cuts；Positioning component, the positioning component include being set to the first positioning device of the cutting assembly and being fixedly arranged on rack at least
One second positioning device, first positioning device and the second positioning device co-locate the chip on the carrier assemblies.It is logical
The workpiece in the first positioning device and the second positioning device co-location carrier assemblies is crossed, detection and localization is effectively scanned, leads to
Operation computer is crossed, starts X-axis mould group according to the data of scanning and Y-axis mould group carries out position adjustment, and calculates machining path progress
Cutting, effectively improves machining accuracy, meets high-precision cutting demand.However, it still remains following problem: laser cutting is brilliant
After piece, chip temperature is increased, can not fast cooling, enter back into subsequent handling after needing to wait chip cooling, reduce production effect
Rate, and chip can not be cleaned.
Utility model content
In order to solve the above problems existing in the present technology, the utility model aim is to provide a kind of band circulating cooling dress
The laser scribing means set.
The technology employed by the present utility model is a kind of laser scribing means with cooling back installation, including laser
Dicing device and cooling back installation engaged therewith；The laser scriber includes rack, mobile microscope carrier, mobile laser
Device and positioning component；The rack includes pedestal and the side wall on pedestal and positioned at pedestal two sides, is set at the top of pedestal
It is fluted；The mobile microscope carrier includes the Y-axis mould group being set in the groove and the microscope carrier being slidingly disposed in Y-axis mould group
Component, the carrier assemblies hold chip；The moving laser device includes the X-axis mould group on the side wall and can slide
The cutting assembly being set in X-axis mould group dynamicly, the X-axis mould group drive the cutting assembly to the chip on the carrier assemblies
It is cut；The positioning component includes the first positioning device on the cutting assembly and is fixedly arranged on rack at least
One second positioning device, first positioning device and the second positioning device co-locate the chip on the carrier assemblies；Institute
It states the first water pump that cooling back installation includes liquid reserve tank below the pedestal, is connected with liquid reserve tank, be connected with the first water pump
Filter, the second water pump being connected with filter, the deionization mechanism that is connected with the second water pump and with deionization mechanism phase
Water spout even, water spout are set on cutting assembly, and the bottom of the groove is equipped with the through-hole being connected with liquid reserve tank.
Optionally, the carrier assemblies include being slidingly disposed at the rotating device of Y-axis mould group and set on the rotating dress
The transparent microscope carrier set, the rotating device driving transparent microscope carrier rotation.
Optionally, the transparent microscope carrier includes the rotor plate for holding workpiece and the rotation on the rotor plate
Axis, the rotation axis and the rotating device are detachably connected, and the rotating device driving rotation axis drives the rotor plate
Rotation.
Optionally, the positioning component further includes the reflection unit connecting with the second positioning device, the second positioning dress
Setting includes at least two, and every one second positioning device is equipped with a reflection unit, and the Y-axis mould group drives the carrier assemblies to move
Dynamic, so that the rotation axis is between two second positioning devices, first positioning device is towards the top of the transparent microscope carrier
Face, every one second positioning device pass through a reflection unit towards the back side of the transparent microscope carrier.
Optionally, the Y-axis mould group includes the first carriage set on rack, the drive of the Y-axis set on the first carriage
Moving part and the first pan carriage for being slidingly disposed at the first carriage and being connect with the Y-axis actuator, the microscope carrier group
Part is set to first pan carriage, and the Y-axis actuator drives the first pan carriage to drive the carrier assemblies in first carriage
Upper movement.
Optionally, the moving laser device further includes the Z axis lifting device with the X-axis mould group in angle setting, institute
Cutting assembly is stated on the Z axis lifting device, the X-axis mould group drives the Z axis lifting device and the cutting assembly
Transverse shifting, the Z axis lifting device drive the cutting assembly vertically movable.
Optionally, the X-axis mould group include second carriage, set on the second carriage X-axis drive and can slide
The second pan carriage for being set to the second carriage dynamicly and connecting with the X-axis drive, the Z axis lifting device are set to institute
The second pan carriage is stated, the X-axis drive drives second pan carriage to drive the Z axis lifting device in second sliding
Transverse shifting on frame.
Optionally, the Z axis lifting device includes the third sliding rack connecting with the X-axis mould group, is set to the third
The Z axis actuator of sliding rack and the crane for being slidingly disposed at the third sliding rack and being connect with the Z axis actuator,
The cutting assembly is set to the crane, and the Z axis actuator drives the crane to drive the cutting assembly described
It is vertically movable on third sliding rack.
Optionally, the cutting assembly includes set on the fixed frame of the Z axis lifting device and set on the fixed frame
At least dual-laser head, first positioning device are set on a laser head, and the water spout is set on another laser head, and are sprayed water
Third water pump is equipped between mouth and the deionization mechanism.
The utility model has the following beneficial effects: the cooling back installation of setting and laser scriber cooperation, when X-axis mould group
After driving cutting assembly to cut the chip on carrier assemblies, two laser heads stop working, and X-axis mould group continues movement and drives
Water spout on cutting assembly moves back and forth, and water spout, which starts to spray water, to be rinsed the chip after cutting and drop chip simultaneously
Temperature reduces the cooling time of chip, improves production efficiency, and cleaned simultaneously to chip.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model.
Fig. 2 is the schematic perspective view of laser scriber.
Specific embodiment
With reference to the accompanying drawing and specific embodiment is further elaborated the utility model.
As depicted in figs. 1 and 2, a kind of laser scribing means with cooling back installation of the present embodiment, including laser scribing
Device and cooling back installation engaged therewith；The laser scriber includes rack, mobile microscope carrier 20, mobile laser dress
Set 30 and positioning component；The rack includes pedestal 41 and the side wall 42 on pedestal 41 and positioned at 41 two sides of pedestal, pedestal
41 top is equipped with groove；The mobile microscope carrier 20 includes the Y-axis mould group 21 in the groove and is slidingly disposed at Y
Carrier assemblies 22 in Axle mould group 21, the carrier assemblies 22 hold chip；The moving laser device 30 includes set on described
X-axis mould group 31 on side wall 42 and the cutting assembly 33 being slidingly disposed in X-axis mould group 31, the X-axis mould group 31 drive institute
Cutting assembly 33 is stated to cut the chip on the carrier assemblies 22；The positioning component includes being set to the cutting assembly
The first positioning device 11 on 33 and at least one second positioning device 12 for being fixedly arranged on rack, 11 He of the first positioning device
Second positioning device 12 co-locates on the carrier assemblies 22 chip；The cooling back installation includes being set under pedestal 41
The liquid reserve tank 51 of side, the first water pump 52 being connected with liquid reserve tank 51, the filter 53 being connected with the first water pump 52 and filter 53
Connected the second water pump 54, the deionization mechanism 55 being connected with the second water pump 54 and the water spout being connected with deionization mechanism 55
56, water spout 56 is set on cutting assembly 33, and the bottom of the groove is equipped with the through-hole 41a being connected with liquid reserve tank 51.
After X-axis mould group 31 drives cutting assembly 33 to cut the chip on carrier assemblies 22, two laser heads stop
Work, X-axis mould group 31 continue movement and the water spout 56 on cutting assembly 22 are driven to move back and forth, and water spout 56 starts water spray to cutting
Chip after cutting is rinsed and so that chip is cooled down simultaneously, reduces the cooling time of chip, improves production efficiency, and simultaneously
Chip is cleaned.Waste water after cleaning falls into the groove at 41 top of pedestal, enters liquid reserve tank 51 by through-hole 41a, then
It is pumped by the first water pump 52 to filter 53 and is filtered, deionization mechanism 55 is pumped by the second water pump 54 after filtering, through the past
The deionized water for the acquisition that ion mechanism 55 is gone after deionization is sent by third water pump 57 to water spout 56, and then is recycled,
Water resource is saved.
First positioning device 11 and the second positioning device 12 are CCD visual detection equipment, and in embodiment, workpiece setting has
Mark point, the first positioning device 11 and the second positioning device 12 are effectively positioned for the Mark point on workpiece, the present embodiment
Laser scriber further includes control device, and positioning component, mobile microscope carrier 20 and moving laser device 30 are electric with control device
Connection effectively carries out cutting operation to this laser scribing means by control device.Control device can be equipped with operating software and
The computer of system, in order to operate.
Specifically, mobile microscope carrier 20 includes the Y-axis mould group 21 in groove and is slidingly disposed at Y-axis mould group 21
Carrier assemblies 22, carrier assemblies 22 hold chip；Moving laser device 30 is set up in mobile 20 top of microscope carrier, moving laser device
30 include the X-axis mould group 31 for being set to rack and the cutting assembly 33 for being slidingly disposed at X-axis mould group 31, and the drive of X-axis mould group 31 is cut
Component 33 is cut to cut the chip on carrier assemblies 22；Positioning component includes the first positioning dress on cutting assembly 33
It sets 11 and is fixedly arranged at least one second positioning device 12 of rack, this laser scriber connects computer, and user passes through operation electricity
Brain carries out the first positioning device 11 of starting and the second positioning device 12 to knife, the first positioning device 11 and the second positioning device
12 co-locate the chip on carrier assemblies 22, are effectively scanned detection and localization, by operating computer, according to the data of scanning
Start X-axis mould group 31 and Y-axis mould group 21 carry out position adjustment, and calculate machining path and cut, effectively improves machining accuracy,
Meet high-precision cutting demand.
Specifically, the present embodiment moving laser device 30 further includes the Z axis lifting device with X-axis mould group 31 in angle setting
32, cutting assembly 33 is set on Z axis lifting device 32, and X-axis mould group 31 drives Z axis lifting device 32 and cutting assembly 33 laterally to move
Dynamic, Z axis lifting device 32 drives cutting assembly 33 vertically movable.
When being cut according to the data of scanning calculating machining path, passes through Z axis lifting device 32 and drive cutting assembly
33 liftings, adjust the cutting distance of cutting assembly 33 and workpiece, effectively improve cutting precision, guarantee cut quality, increase fortune
Flowing mode meets the needs of different situations.
The present embodiment X-axis mould group 31 includes second carriage, the X-axis drive and slideably set on second carriage
Set on second carriage and the second pan carriage for connecting with X-axis drive, Z axis lifting device 32 is set in the second pan carriage, X-axis
Actuator drives the second pan carriage to drive the transverse shifting in second carriage of Z axis lifting device 32.
X-axis drive can be motor, motor or other driving equipments；X-axis drive can be fixed by way of being spirally connected
It is connected to second carriage, concretely X-axis drive opens up through-hole to screw connection manner, and screw thread is arranged in one end of second carriage
Hole, bolt passes through through-hole and threaded hole is threadedly coupled, effective easy disassembly.
In embodiment, X-axis drive is equipped with shaft, and X-axis drive is threadedly coupled by shaft and the second pan carriage, X-axis
The rotation of actuator drive shaft is moved so that shaft drives the second pan carriage to be located in second carriage, and effectively accurate control is cut
33 moving distance of component is cut, realizes bilateral reciprocation.
The present embodiment Z axis lifting device 32 includes the third sliding rack 321 connecting with X-axis mould group 31, is set to third sliding
The Z axis actuator 322 of frame 321 and the crane for being slidingly disposed at third sliding rack 321 and being connect with Z axis actuator 322
323, cutting assembly 33 is set to crane 323, and Z axis actuator 322 drives crane 323 that cutting assembly 33 is driven to slide in third
It is vertically movable on frame 321.
Second pan carriage and third sliding rack 321 are arranged in angle, Z axis actuator 322 can for motor, motor or its
His driving equipment；Z axis actuator 322 can be fixedly connected on third sliding rack 321 by way of being spirally connected, and screw connection manner specifically may be used
Through-hole is opened up for Z axis actuator 322, threaded hole is arranged in one end of third sliding rack 321, and bolt passes through through-hole and threaded hole screw thread
Connection, effective easy disassembly.
Z axis actuator 322 is equipped with shaft, and Z axis actuator 322 is threadedly coupled by shaft and crane 323, Z axis driving
The rotation of 322 drive shaft of part is moved so that shaft drives crane 323 to be located on third sliding rack 321, and effectively accurate control is cut
33 moving distance of component is cut, realizes bilateral reciprocation.
Cutting assembly 33 includes at least dual-laser head set on the fixed frame of Z axis lifting device 32 and set on fixed frame
331, the first positioning device 11 is set on a laser head 331, and the water spout 56 is set on another laser head 331, and water spout
Third water pump 57 is equipped between 56 and the deionization mechanism 55.
Laser head 331 is two, and the opposite sides that two laser heads 331 are set to fixed frame is symmetrical set, when microscope carrier group
Part 22 holds two chips, designs cutting route by computer software, to control the movement of X-axis mould group 31 and drive two laser
First 331 is mobile, wherein control device control two laser heads 331 adjust laser output powers, repetition rate, pulse width, with
The distance of chip effectively improves cutting accuracy, realizes while cutting multiple workpiece, improves production efficiency.
The present embodiment carrier assemblies 22 include being slidingly disposed at the rotating device 221 of Y-axis mould group 21 and set on rotating dress
221 transparent microscope carrier 222 is set, rotating device 221 drives transparent microscope carrier 222 to rotate.
When computer design goes out cutting route, X-axis mould group 31 controls 33 transverse cuts of cutting assembly, then rotating device 221
Rotation drives workpiece rotation, so that chip more varied angle, controls 33 transverse cuts of cutting assembly followed by X-axis mould group 31, effectively
Complete the cutting route that computer design goes out.
Workpiece is placed on transparent microscope carrier 222 for convenience, the transparent microscope carrier 222 of the present embodiment includes for holding workpiece
Rotor plate 2221 and rotation axis 2222 set on rotor plate 2221, rotation axis 2222 and rotating device 221 removably connect
It connects, rotating device 221 drives rotation axis 2222 that rotor plate 2221 is driven to rotate.
One end of rotor plate 2221 can be fixedly connected on rotation axis 2222 by way of clamping, and snap fit is concretely
Buckle is arranged in one end of rotation axis 2222, and card slot is arranged in the center of rotor plate 2221, and rotor plate 2221 is sheathed on card by card slot
Button, is effectively formed fixation, easy to disassemble；Workpiece first can be placed in transparent microscope carrier 222 by user, then by transparent microscope carrier 222
It is installed on rotating device 221, effectively avoids for workpiece being placed in the position for being difficult to cut.
The present embodiment positioning component further includes the reflection unit 13 connecting with the second positioning device 12, the second positioning device 12
It include at least two, every one second positioning device 12 is equipped with a reflection unit 13, and Y-axis mould group 21 drives carrier assemblies 22 to move
Dynamic, so that rotation axis 2222 is between 2 second positioning devices 12, the first positioning device 11 is towards the top of transparent microscope carrier 222
Face, every one second positioning device 12 pass through a reflection unit 13 towards the back side of transparent microscope carrier 222.
Transparent microscope carrier 222 is made of transparent material, and reflecting mirror, 12 ocular surface of the second positioning device are equipped in reflection unit 13
It is reflected to reflecting mirror, effectively changes the view directions of the second positioning device 12, when the Mark point of workpiece is located at the back side, Y-axis
Mould group 21 drives carrier assemblies 22 to be moved between 2 second positioning devices 12, and each reflection unit 13 is adjacent to transparent microscope carrier
The back side of 222 rotor plate 2221, every one second positioning device 12 is reflected by corresponding reflection unit 13 turns sight directive
The back side of movable plate 2221, the front for being face-up placed in rotor plate 2221 of workpiece, the sight of every one second positioning device 12
Across the transparent microscope carrier 222 of transparent material, so that the Mark point for scanning back of work is positioned, effective scanning Mark point is being carried on the back
The chip in face.
The present embodiment Y-axis mould group 21 include set on rack first carriage, set on first carriage Y-axis actuator,
And the first pan carriage for being slidingly disposed at first carriage and connecting with Y-axis actuator, carrier assemblies 22 are set to the first translation
Frame, Y-axis actuator drive the first pan carriage that carrier assemblies 22 is driven to move in first carriage.
Y-axis actuator can be motor, motor or other driving equipments；Y-axis actuator can be fixed by way of being spirally connected
It is connected to first carriage, concretely Y-axis actuator opens up through-hole to screw connection manner, and screw thread is arranged in one end of first carriage
Hole, bolt passes through through-hole and threaded hole is threadedly coupled, effective easy disassembly.
First carriage and second carriage are orthogonal, for this purpose, Y-axis actuator drives the first pan carriage to drive microscope carrier group
Part 22 moves in first carriage, realizes front-rear reciprocation movement, laterally cuts so that cooperation X-axis mould group 31 controls cutting assembly 33
It cuts, efficiently accomplishes the cutting route that computer design goes out.
The utility model is not limited to above-mentioned optional embodiment, anyone can obtain under the enlightenment of the utility model
Other various forms of products, however, making any variation in its shape or structure, all the utility model rights that falls into are wanted
The technical solution in confining spectrum is sought, is all fallen within the protection scope of the utility model.
Claims (9)
1. a kind of laser scribing means with cooling back installation, it is characterised in that: cooperate including laser scriber and with it
Cooling back installation；The laser scriber includes rack, mobile microscope carrier, moving laser device and positioning component；It is described
Rack includes pedestal and the side wall on pedestal and positioned at pedestal two sides, and the top of pedestal is equipped with groove；The mobile microscope carrier
Including the Y-axis mould group being set in the groove and the carrier assemblies being slidingly disposed in Y-axis mould group, the carrier assemblies are contained
Put chip；The moving laser device includes the X-axis mould group on the side wall and is slidingly disposed in X-axis mould group
Cutting assembly, the X-axis mould group drive the cutting assembly to cut the chip on the carrier assemblies；The positioning group
Part includes the first positioning device on the cutting assembly and at least one second positioning device for being fixedly arranged on rack, described
First positioning device and the second positioning device co-locate the chip on the carrier assemblies；The cooling back installation includes setting
Liquid reserve tank below pedestal, the filter being connected with the first water pump, is connected with filter at the first water pump being connected with liquid reserve tank
The second water pump, the deionization mechanism being connected with the second water pump and the water spout being connected with deionization mechanism, water spout be set to
On cutting assembly, the bottom of the groove is equipped with the through-hole being connected with liquid reserve tank.
2. the laser scribing means according to claim 1 with cooling back installation, it is characterised in that: the carrier assemblies packet
Include the rotating device for being slidingly disposed at Y-axis mould group and the transparent microscope carrier set on the rotating device, the rotating device driving
The transparent microscope carrier rotation.
3. the laser scribing means according to claim 2 with cooling back installation, it is characterised in that: the transparent microscope carrier packet
The rotor plate for holding workpiece and the rotation axis on the rotor plate are included, the rotation axis and the rotating device can
It releasably connects, the rotating device driving rotation axis drives the rotor plate rotation.
4. the laser scribing means according to claim 3 with cooling back installation, it is characterised in that: the positioning component is also
Including the reflection unit connecting with the second positioning device, second positioning device includes at least two, every one second positioning
Device is equipped with a reflection unit, and the Y-axis mould group drives the carrier assemblies mobile, determines so that the rotation axis is located at two second
Between the device of position, first positioning device passes through a reflection towards the top surface of the transparent microscope carrier, every one second positioning device
Device is towards the back side of the transparent microscope carrier.
5. the laser scribing means according to claim 1 with cooling back installation, it is characterised in that: the Y-axis mould group packet
It includes the first carriage set on rack, the Y-axis actuator set on the first carriage and is slidingly disposed at described first and slide
Moving frame and the first pan carriage connecting with the Y-axis actuator, the carrier assemblies are set to first pan carriage, the Y-axis
Actuator drives the first pan carriage that the carrier assemblies is driven to move in first carriage.
6. -5 any laser scribing means with cooling back installation according to claim 1, it is characterised in that: the movement
Laser aid further includes the Z axis lifting device with the X-axis mould group in angle setting, and the cutting assembly is set to the Z axis liter
On falling unit, the X-axis mould group drives the Z axis lifting device and the cutting assembly transverse shifting, the Z axis lifting device
Drive the cutting assembly vertically movable.
7. the laser scribing means according to claim 6 with cooling back installation, it is characterised in that: the X-axis mould group packet
Include second carriage, set on the second carriage X-axis drive and be slidingly disposed at the second carriage and with institute
The second pan carriage of X-axis drive connection is stated, the Z axis lifting device is set to second pan carriage, and the X-axis drive drives
It moves second pan carriage and drives Z axis lifting device transverse shifting in the second carriage.
8. the laser scribing means according to claim 6 with cooling back installation, it is characterised in that: the Z axis lifting dress
Set including connect with the X-axis mould group third sliding rack, set on the Z axis actuator and slideably of the third sliding rack
Set on the third sliding rack and the crane that connect with the Z axis actuator, the cutting assembly is set to the crane, institute
Stating Z axis actuator drives the crane to drive the cutting assembly vertically movable on the third sliding rack.
9. the laser scribing means according to claim 6 with cooling back installation, it is characterised in that: the cutting assembly packet
Include at least dual-laser head set on the fixed frame of the Z axis lifting device and set on the fixed frame, first positioning device
On a laser head, the water spout is set on another laser head, and the is equipped between water spout and the deionization mechanism
Three water pumps.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821768200.1U CN208992005U (en) | 2018-10-29 | 2018-10-29 | A kind of laser scribing means with cooling back installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821768200.1U CN208992005U (en) | 2018-10-29 | 2018-10-29 | A kind of laser scribing means with cooling back installation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208992005U true CN208992005U (en) | 2019-06-18 |
Family
ID=66805937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821768200.1U Active CN208992005U (en) | 2018-10-29 | 2018-10-29 | A kind of laser scribing means with cooling back installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208992005U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113245698A (en) * | 2021-07-14 | 2021-08-13 | 深圳光远智能装备股份有限公司 | Automatic water supply system for nondestructive laser scribing of battery piece |
-
2018
- 2018-10-29 CN CN201821768200.1U patent/CN208992005U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113245698A (en) * | 2021-07-14 | 2021-08-13 | 深圳光远智能装备股份有限公司 | Automatic water supply system for nondestructive laser scribing of battery piece |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104889841A (en) | Stone surface machining tool | |
| CN210306060U (en) | Automatic seek mark cutting machine | |
| CN207547910U (en) | Laser scribing means | |
| CN208992005U (en) | A kind of laser scribing means with cooling back installation | |
| CN109046851A (en) | A kind of metal product processing unit (plant) with multi-angle spraying function | |
| CN209124974U (en) | A kind of cluster head polishing thimble print burr equipment | |
| CN110181183A (en) | A kind of optical-fiber laser cutting machine | |
| CN208358053U (en) | A kind of anti-slag sputtering laser cutting machine | |
| CN213917033U (en) | Cutting device is used in steel grating production | |
| CN205933613U (en) | Duplex position three sword glass -cutting machine | |
| CN208358057U (en) | A kind of laser cutting machine | |
| CN116214256A (en) | Numerical control machining equipment with multifunctional spraying device and machining method of numerical control machining equipment | |
| CN108972673A (en) | The grooving apparatus and grooving method of heavy caliber pitch polishing tol grid slot | |
| CN216329263U (en) | Annular diamond wire cutting machine | |
| CN104385394A (en) | Automatic tenoning machine | |
| CN212264712U (en) | Cutting device | |
| CN2661357Y (en) | Laser cutting machine tool with double laser head | |
| CN103350383A (en) | Polishing device of axicon and polishing method of axicon | |
| CN103586984A (en) | Ceramic tile edge sawing device and ceramic tile rim processing method | |
| CN201287403Y (en) | Novel automatic multi-cutter cutting machine | |
| CN209350629U (en) | Single-station trepan | |
| CN205765344U (en) | The building stones Plane surface grinding machine can tested for stone surface | |
| CN218799563U (en) | Sawing machine for cutter machining | |
| CN219190796U (en) | Novel saw blade cutting machine for cabinet table top | |
| CN110449603A (en) | A kind of numerical control lathe side's machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |