CN208985974U - A kind of diode matrix frame structure - Google Patents
A kind of diode matrix frame structure Download PDFInfo
- Publication number
- CN208985974U CN208985974U CN201821494750.9U CN201821494750U CN208985974U CN 208985974 U CN208985974 U CN 208985974U CN 201821494750 U CN201821494750 U CN 201821494750U CN 208985974 U CN208985974 U CN 208985974U
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- Prior art keywords
- chip
- plate
- fixedly installed
- copper material
- material frame
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Abstract
The utility model discloses a kind of diode matrix frame structures, including copper material frame, the upper center of the copper material frame is fixedly installed chip positioning plate, the chip positioning plate and fixed plate setting symmetrical above and below are in copper material frame upper end, chip slot is fixedly installed between the chip positioning plate and above copper material frame, the chip positioning plate is fixedly installed location hole close to one end of chip slot, one end of the close chip slot of the fixed plate is fixedly installed curved surface connecting plate, one end of the curved surface connecting plate and be located at chip slot above be fixedly installed chip backing plate, the upper end of the chip backing plate is provided with chip, four end turnings of the chip are respectively positioned on the corner upper end of location hole, the utility model relates to diodes to assemble field.A kind of diode matrix frame structure avoids the chip after assemble welding that skew may occur, is conducive to the reliability for enhancing diode by effectively being positioned to chip.
Description
Technical field
The utility model relates to diodes to assemble field, specifically a kind of diode matrix frame structure.
Background technique
Diode, in electronic component, there are two the devices of electrode for a kind of tool, only an electric current are allowed to be flowed through by single direction,
Many uses are the functions using its rectification.And varactor is then used to the adjustable condenser as electronic type.It is most of
The current direction that diode has we normally referred to as " rectify " function.The most common function of diode is exactly only to allow
Electric current, by (referred to as forward bias voltage drop), blocks (referred to as reverse bias) when reversed by single direction.Therefore, diode can be thought of as
The non-return valve of electronic edition.With the scale of diode industry, frame all matrixings used in diode assembly are in early days
With graphite plate come positioning chip, but because of the two-dimensional structure of matrix, the positioning of graphite plate be cannot achieve.This patent is using existing
The copper material of frame increases chip positioning structure, to realize in welding and assembling process, the problem of chip positioning, if do not had
Chip positioning considers that after assemble welding, skew may occur for chip, will appear the risk of reliability so as to cause product.
Utility model content
(1) the technical issues of solving
In view of the deficiencies of the prior art, the utility model provides a kind of diode matrix frame structure, solves existing
Chip does not account for chip positioning problem in welding and assembling process, and after assemble welding, skew may occur for chip, thus
The problem of causing product to will appear security risk.
(2) technical solution
In order to achieve the above object, the utility model is achieved by the following technical programs: a kind of diode matrix frame
Structure, including copper material frame, the upper center of the copper material frame are fixedly installed chip positioning plate, the copper material frame and position
It is fixedly installed fixed plate in the side of chip positioning plate, the chip positioning plate and fixed plate setting symmetrical above and below are in copper material
Frame upper end between the chip positioning plate and is located above copper material frame and is fixedly installed chip slot, the chip positioning plate
It is fixedly installed location hole close to one end of chip slot, one end of the close chip slot of the fixed plate is fixedly installed curved surface company
Fishplate bar, one end of the curved surface connecting plate and is located above chip slot and is fixedly installed chip backing plate, the chip backing plate it is upper
End is provided with chip, and four end turnings of the chip are respectively positioned on the corner upper end of location hole.
Preferably, the middle part surface fixation of the chip backing plate offers through-hole.
Preferably, the surface of the chip backing plate is uniformly provided with the first fixation hole.
Preferably, the surface of the chip and with the first fixation hole corresponding position fixation offer the second fixation hole.
(3) beneficial effect
The utility model provides a kind of diode matrix frame structure, have it is following the utility model has the advantages that
A kind of diode matrix frame structure, by being fixedly welded with chip positioning plate in the upper end of copper material frame,
Between chip positioning plate and it is located above copper material frame and is fixedly installed chip slot, by one end of curved surface connecting plate and is located at
It is provided with chip backing plate above chip slot, chip can be placed on above chip backing plate, is respectively positioned on four end turnings of chip fixed
Position hole corner upper end, by chip backing plate middle part surface regulation offer through-hole, can in the use process of chip into
Row heat dissipation, while by being fixedly installed location hole close to one end of chip slot in chip positioning plate, it can be worn by fastening oncomelania
It crosses location hole to compress chip, by being uniformly provided with the first fixation hole on the surface of chip backing plate, on the surface of chip
And the second fixation hole is offered with the fixation of the first fixation hole corresponding position, it can be solid across the second fixation hole and first by fastening nail
To determine hole and chip is accurately fixed, by effectively positioning, avoids after assemble welding, skew may occur for chip,
The problem of will appear security risk so as to cause product, increases the reliability of diode.
Detailed description of the invention
Fig. 1 is the utility model overall structure diagram；
Fig. 2 is the utility model chip base plate connection structure schematic diagram；
Fig. 3 is structural schematic diagram at the utility model A.
In figure: 1- copper material frame, 2- chip positioning plate, 3- chip slot, 4- location hole, 5- fixed plate, 6- curved surface connecting plate,
7- chip backing plate, 8- chip, 9- through-hole, the first fixation hole of 10-, the second fixation hole of 11-.
Specific embodiment
Below in conjunction with the attached drawing in the utility model example, the technical solution in the utility model example is carried out clear, complete
Site preparation description, it is clear that the described embodiments are only a part of the embodiments of the utility model, instead of all the embodiments.
Based on the embodiments of the present invention, obtained by those of ordinary skill in the art without making creative efforts
Every other embodiment, fall within the protection scope of the utility model.
Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of diode matrix frame structure, including
Copper material frame 1, the upper center of copper material frame 1 are fixedly installed chip positioning plate 2, copper material frame 1 and are located at chip positioning plate 2
Side be fixedly installed fixed plate 5, chip positioning plate 2 and fixed plate 5 is symmetrical above and below is arranged in 1 upper end of copper material frame, core
Between piece positioning plate 2 and be located above copper material frame 1 and be fixedly installed chip slot 3, chip positioning plate 2 close to chip slot 3 one
End is fixedly installed location hole 4, and one end of the close chip slot 3 of fixed plate 5 is fixedly installed curved surface connecting plate 6, curved surface connection
One end of plate 6 and be located above chip slot 3 and be fixedly installed chip backing plate 7, on chip backing plate 7 can chip placement, pass through positioning
Hole 4 is fixed, and the upper end of chip backing plate 7 is provided with chip 8, and four end turnings of chip 8 are respectively positioned on the corner of location hole 4
End.
The middle part surface fixation of chip backing plate 7 offers through-hole 9, can the chip 8 to upper end to carry out heat dissipation ventilative.
The surface of chip backing plate 7 is uniformly provided with the first fixation hole 10.
The surface of chip 8 and with 10 corresponding position of the first fixation hole fixation offer the second fixation hole 11.
In use, by being fixedly welded with chip positioning plate 2 in the upper end of copper material frame 1, between chip positioning plate 2 and
Chip slot 3 is fixedly installed above copper material frame 1, by setting in one end of curved surface connecting plate 6 and above chip slot 3
It is equipped with chip backing plate 7, chip 8 can be placed on to 7 top of chip backing plate, four end turnings of chip 8 is made to be respectively positioned on the side of location hole 4
Angle upper end offers through-hole 9 by the middle part surface regulation in chip backing plate 7, can carry out in the use process to chip 8 scattered
Heat, while by being fixedly installed location hole 4 close to one end of chip slot 3 in chip positioning plate 2, it can be passed through by fastening oncomelania
Location hole 4 compresses chip 8, by being uniformly provided with the first fixation hole 10 on the surface of chip backing plate 7, in chip 8
Surface and with 10 corresponding position of the first fixation hole fixation offer the second fixation hole 11, can by fastening nail across the second fixation hole
11 and first fixation hole 10 chip 8 is accurately fixed, by effectively positioning, avoid after assemble welding, chip 8 can
The problem of skew capable of occurring, will appear security risk so as to cause product, the reliability of diode is increased, using simple
It is convenient.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions.By sentence " element limited including one ..., it is not excluded that
There is also other identical elements in the process, method, article or apparatus that includes the element ".
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (4)
1. a kind of diode matrix frame structure, including copper material frame (1), it is characterised in that: the upper end of the copper material frame (1)
Middle part is fixedly installed chip positioning plate (2), the copper material frame (1) and the side fixed setting for being located at chip positioning plate (2)
Have fixed plate (5), the setting symmetrical above and below of the chip positioning plate (2) and fixed plate (5) is described in copper material frame (1) upper end
It is fixedly installed chip slot (3) between chip positioning plate (2) and above copper material frame (1), the chip positioning plate (2) is leaned on
One end of nearly chip slot (3) is fixedly installed location hole (4), and one end fixation of the close chip slot (3) of the fixed plate (5) is set
Be equipped with curved surface connecting plate (6), one end of the curved surface connecting plate (6) and be located at chip slot (3) above be fixedly installed chip mat
The upper end of plate (7), the chip backing plate (7) is provided with chip (8), and four end turnings of the chip (8) are respectively positioned on location hole (4)
Corner upper end.
2. a kind of diode matrix frame structure according to claim 1, it is characterised in that: the chip backing plate (7)
Middle part surface fixation offers through-hole (9).
3. a kind of diode matrix frame structure according to claim 1, it is characterised in that: the chip backing plate (7)
Surface is uniformly provided with the first fixation hole (10).
4. a kind of diode matrix frame structure according to claim 3, it is characterised in that: the surface of the chip (8)
And the second fixation hole (11) are offered with the fixation of the first fixation hole (10) corresponding position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821494750.9U CN208985974U (en) | 2018-09-13 | 2018-09-13 | A kind of diode matrix frame structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821494750.9U CN208985974U (en) | 2018-09-13 | 2018-09-13 | A kind of diode matrix frame structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208985974U true CN208985974U (en) | 2019-06-14 |
Family
ID=66783999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821494750.9U Expired - Fee Related CN208985974U (en) | 2018-09-13 | 2018-09-13 | A kind of diode matrix frame structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208985974U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111599745A (en) * | 2020-06-01 | 2020-08-28 | 中国电子科技集团公司第十三研究所 | Terahertz diode circuit assembling plate and preparation method thereof |
-
2018
- 2018-09-13 CN CN201821494750.9U patent/CN208985974U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111599745A (en) * | 2020-06-01 | 2020-08-28 | 中国电子科技集团公司第十三研究所 | Terahertz diode circuit assembling plate and preparation method thereof |
| CN111599745B (en) * | 2020-06-01 | 2022-12-06 | 中国电子科技集团公司第十三研究所 | Terahertz diode circuit assembling plate and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190614 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |