CN208969288U - A kind of optical module transmitting optical device and optical module - Google Patents
A kind of optical module transmitting optical device and optical module Download PDFInfo
- Publication number
- CN208969288U CN208969288U CN201822061677.2U CN201822061677U CN208969288U CN 208969288 U CN208969288 U CN 208969288U CN 201822061677 U CN201822061677 U CN 201822061677U CN 208969288 U CN208969288 U CN 208969288U
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- Prior art keywords
- laser
- chip
- optical
- lens
- optical module
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- Optical Couplings Of Light Guides (AREA)
Abstract
The utility model discloses a kind of optical module transmitting optical device and optical modules, optical module transmitting optical device includes pedestal, chip of laser, the PCB being connected with chip of laser, lens, the light part out for being coupled and being fixed on the base with chip of laser, it further include being fixed on the base and predetermined position is provided with the substrate of U-type groove, substrate has thermal conductivity, wherein: chip of laser is fixed on the surface of substrate, lens are fixed in the U-type groove of predeterminated position, and predeterminated position is the maximum position of light power of the chip of laser obtained by optical analog.Above-mentioned technical proposal disclosed in the present application, directly lens can be fixed in the U-type groove of substrate, without being coupled and being fixed to lens by automatic Lens Coupling machine and laser-beam welding machine, therefore, the coupling complexity of optical module transmitting optical device can be reduced, the preparation efficiency of optical module transmitting optical device is improved, and the preparation cost of optical module transmitting optical device can be reduced.
Description
Technical field
The utility model relates to technical field of photo communication, emit optical device and light more specifically to a kind of optical module
Module.
Background technique
With the fast development of optical communication technique, the data transmission bauds of optical module is promoted from 10G, 25G, 40G to existing
100G, 200G, 400G.It includes four channels, the knot in each channel that 100G (or 200G, 400G) optical module, which emits optical device,
Structure may refer to Fig. 1, and it mainly to include PCB that it illustrates the structural schematic diagrams in the channel of existing optical module transmitting optical device
(Printed Circuit Board, printed circuit board) 11, heat sink 13, metab 14, lens 15, is adjusted chip of laser 12
Section ring 16 and the metal with optical fiber 17 trap 18, and the corresponding course of work is that external circuit to the golden finger of PCB11 is powered on driving
Chip of laser 12 shines, and the light of sending passes through the coupling of lens 15, converges to the metal with optical fiber 17 and traps 18 the insides.It is making
When standby optical module transmitting optical device, in order to preferably transmit optical signal, then need to couple lens 15 and optical fiber 17.
For existing optical module emits optical device, firstly, it is necessary to couple to lens 15, process is substantially are as follows:
In the periphery package metal sleeve of lens 15, and the PCB11 for being fixed with chip of laser 12 is clamped in automatic Lens Coupling machine
On, i.e., lens 15 are adsorbed on one and be able to carry out in the mobile electronic axle in upper and lower, left and right, and on the light direction of optical path
A detector is placed, with the optical power that real-time detection is coupled to during electronic axle driving lens 15 are mobile；Work as detection
It is when the maximum optical power arrived, then in such a way that laser-beam welding machine is using laser welding that metal sleeve is fixed in the optical path.So
Afterwards, optical fiber 17 is coupled: the contact pin with optical fiber 17 is inserted into metal and is trapped in 18, metal is trapped 18 to be pressed from both sides by mechanical device
On automatic coupling laser welder；Using automatic coupling laser welder automatic coupling light, when coupling maximum, 18 are trapped to metal
Laser welding is carried out with 14 junction of metab.
By the above process it is found that the process of Lens Coupling and fiber coupling is comparatively laborious, complicated, therefore, then system will increase
The standby time, reduce preparation efficiency.In addition, in Lens Coupling, due to used automatic Lens Coupling machine and laser-beam welding machine
More expensive, therefore, then the preparation cost that will lead to product increases.
In conclusion how to reduce the coupling complexity of optical module transmitting optical device, preparation efficiency is improved, reduces optical mode
Block emits the preparation cost of optical device, is current those skilled in the art technical problem urgently to be resolved.
Utility model content
In view of this, the purpose of the utility model is to provide a kind of optical module transmitting optical device and optical modules, to reduce light
Module emits the coupling complexity of optical device, improves preparation efficiency, and reduces the preparation cost of optical module transmitting optical device.
To achieve the goals above, the utility model provides the following technical solutions:
A kind of optical module emits optical device, including pedestal, chip of laser, the PCB being connected with the chip of laser, saturating
Mirror, be coupled with the chip of laser and fix on the base go out light part, further include it is fixed on the base and
Predetermined position is provided with the substrate of U-type groove, and the substrate has thermal conductivity, in which:
The chip of laser is fixed on the surface of the substrate, and the lens are fixed on the U-type groove of the predeterminated position
Interior, the predeterminated position is the maximum position of light power of the chip of laser obtained by optical analog.
Preferably, further include be arranged in it is heat sink between the substrate and the chip of laser.
Preferably, the substrate is equidistantly fixed on the base.
Preferably, between the substrate and the pedestal and between the lens and the U-type groove by epoxy glue or
Ultraviolet glue is fixed.
Preferably, the lens are globe lens or non-globe lens.
Preferably, the light part out includes under the adjusting ring being connected with the pedestal, the metal being connected with the adjusting ring
Set and by fiber stub be inserted into the metal trap in optical fiber.
Preferably, isolator is provided in the optical path of the chip of laser and the fiber stub.
A kind of optical module, including optical module as described in any one of the above embodiments emit optical device.
The utility model provides a kind of optical module transmitting optical device and optical module, wherein the optical module emits optical device
It is coupled including pedestal, chip of laser, the PCB being connected with chip of laser, lens and chip of laser and is fixed on pedestal
On go out light part, further include being fixed on the base and predetermined position is provided with the substrate of U-type groove, substrate has thermal conductivity,
In: chip of laser is fixed on the surface of substrate, and lens are fixed in the U-type groove of predeterminated position, and predeterminated position is by optics
Simulate the maximum position of light power of obtained chip of laser.
Chip of laser is fixed on the substrate surface with thermal conductivity by above-mentioned technical proposal disclosed in the present application, will be saturating
Mirror is fixed in the U-type groove of substrate predetermined position, and substrate is fixed on the base, and will be coupled with chip of laser
Light part is fixed on the base out, to transmit the optical signal that chip of laser is emitted, wherein predeterminated position is by optical analog
The maximum position of the light power of obtained chip of laser, it can directly will be U-shaped set by lens fixation on substrate
In slot, without being coupled and being fixed to lens by automatic Lens Coupling machine and laser-beam welding machine, therefore, it can drop
The coupling complexity of low optical module transmitting optical device, improves the preparation efficiency of optical module transmitting optical device, and can reduce light
The preparation cost of module transmitting optical device.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is the embodiments of the present invention, for those of ordinary skill in the art, without creative efforts, also
Other attached drawings can be obtained according to the attached drawing of offer.
Fig. 1 is the structural schematic diagram in the channel that existing optical module emits optical device；
Fig. 2 is the structural schematic diagram that a kind of optical module provided by the embodiment of the utility model emits optical device.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 2 is referred to, it illustrates a kind of structures of optical module transmitting optical device provided by the embodiment of the utility model to show
It is intended to, may include pedestal 21, chip of laser 22, the PCB23 being connected with chip of laser 22, lens 24 and laser core
Piece 22 be coupled and be fixed on pedestal 21 go out light part 25, can also include be fixed on pedestal 21 and predetermined position be arranged
There is the substrate 26 of U-type groove, substrate 26 has thermal conductivity, in which:
Chip of laser 22 is fixed on the surface of substrate 26, and lens 24 are fixed in the U-type groove of predeterminated position, predeterminated position
For the maximum position of light power of chip of laser 22.
Optical module transmitting optical device may include pedestal 21, chip of laser 22, be connected with chip of laser 22
PCB23, lens 24, go out light part 25 and substrate 26.Wherein, light part 25 and chip of laser 22 are coupled and are fixed on pedestal out
On 21, the optical signal that the chip of laser 22 converged to for receiving lens 24 is launched, and for providing optical module hair
The optical interface for penetrating optical device, received optical signal transmission is gone out.It should be noted that the pedestal 21 mentioned by here
It can be metab etc..
Chip of laser 22 included by optical module transmitting optical device is fixed on the surface of substrate 26, substrate 26 and PCB23
It is each attached on pedestal 21, wherein chip of laser 22 can be realized with PCB23 by spun gold etc. and is electrically connected, by outer
Circuit is powered for PCB23, and provides driving by PCB23 for chip of laser 22 and chip of laser 22 is made to shine.
Substrate 26 for fixed laser chip 22 is specifically as follows silicon etc., thermal conductivity with higher.In laser
When device chip 22 works, the substrate 26 with thermal conductivity can distribute heat caused by chip of laser 22 in time.
In addition, (predeterminated position is to advance with optical simulation software etc. to be calculated by optical analog to the predeterminated position of the substrate 26
Chip of laser 22 the maximum position of light power) at be provided with U-type groove, which can hold the lens in optical path
24, so that lens 24 are not moved in vertical direction in the horizontal direction, consequently facilitating passing through High Precision Automatic chip mounter
Lens 24 are fixed in the U-type groove of substrate 26 by the way of directly mounting.Due to the predeterminated position of substrate 26 be provided with it is U-shaped
Therefore lens 24 can be then directly anchored in the U-type groove by slot, without first adjust lens 24 and chip of laser 22 it
Between relative position (relative position on tri- directions X, Y, Z), then, then lens 24 are fixed, therefore, be can simplify
The preparation process of optical module transmitting optical device.
Wherein it is possible to High Precision Automatic chip mounter using the U that lens 24 are attached to substrate 26 by way of directly mounting
Be in type groove because are as follows: first, no matter lens 24 are globe lens or non-globe lens, and diameter machining tolerance is very subtle (universal
Only 2-3 μm, maximum is no more than 5 μm)；Second, it is found by optical analog, vertical between chip of laser 22 and lens 24
Coupling efficiency can be made to reach optical module transmitting optical device when differing on direction and in horizontal direction in 30 μ ms to imitate coupling
The requirement of rate；Third, currently, the tolerance of vertical direction, which is 10 μm, to be guaranteed for the processing of substrate 26, the public affairs of horizontal direction
Difference is ± 1 μm；4th, used High Precision Automatic chip mounter can guarantee 5 μm of patch precision.Therefore, then it can use
The fixed lens 24 of the mode directly mounted, to dispense 24 coupling technique of lens and couple relevant equipment to lens 24.
That is, first passing through optical analog in advance obtains the maximum position of light power of chip of laser 22, and serving as a contrast
U-type groove is arranged in the corresponding position at bottom 26, then, lens 24 is directly fixed on substrate when preparing optical module transmitting optical device
In U-type groove on 26, so as to dispense the step for coupling to lens 24.Later, then to light part 25 out into
Row coupling, and the light part 25 that goes out after coupling is fixed on pedestal 21, i.e., so that the coupling of optical module transmitting optical device becomes only
Coupling to light part 25 out.Due to not needing the coupling of progress lens 24, in the process for preparing optical module transmitting optical device
In, then it no longer needs to use the metal sleeve of package lens 24, also no longer needs to use automatic Lens Coupling machine and for welding
The laser-beam welding machine of lens 24 simplifies optical module hair to can then reduce the coupling complexity of optical module transmitting optical device
The preparation process of optical device is penetrated, and the preparation time of optical module transmitting optical device can be shortened, optical module is improved and emits optical device
Preparation efficiency, and can reduce optical module transmitting optical device preparation cost.
Chip of laser is fixed on the substrate surface with thermal conductivity by above-mentioned technical proposal disclosed in the present application, will be saturating
Mirror is fixed in the U-type groove of substrate predetermined position, and substrate is fixed on the base, and will be coupled with chip of laser
Light part is fixed on the base out, to transmit the optical signal that chip of laser is emitted, wherein predeterminated position is by optical analog
The maximum position of the light power of obtained chip of laser, it can directly will be U-shaped set by lens fixation on substrate
In slot, without being coupled and being fixed to lens by automatic Lens Coupling machine and laser-beam welding machine, therefore, it can drop
The coupling complexity of low optical module transmitting optical device, improves the preparation efficiency of optical module transmitting optical device, and can reduce light
The preparation cost of module transmitting optical device.
A kind of optical module provided by the embodiment of the utility model emits optical device, can also include setting in substrate 26 and swash
Heat sink 27 between light device chip 22.
It, then can be in substrate 26 and laser core in order to preferably distribute heat caused by chip of laser 22
Heat sink 27 are arranged between piece 22, so that heat caused by chip of laser 22 can emit light by heat sink 27 guiding optical module
The outside of device, to reduce heat to influence brought by the normal work of optical module transmitting optical device.It wherein, heat sink 27 can
To be prepared using materials such as copper, oxygen-free copper, molybdenum copper, diamond, silicon, silicon carbide, the aluminium nitride with high-termal conductivity.
It should be noted that when that there are when heat sink 27, then can be pasted first with automatic eutectic in optical module transmitting optical device
Piece machine welds together chip of laser 22 with heat sink 27.Specifically, one layer of weldering can be deposited in advance on heat sink 27 surface
Material, and solder is heated, so that solder fusing, after encountering cold nitrogen, solder solidification, at this point, chip of laser
22 can weld together with heat sink 27.Then, then above-mentioned heat sink 27 with chip of laser 22 can be passed through automatic
Chip mounter is attached on substrate 26, and is fixed on it on substrate 26, later, then substrate 26 is fixed on pedestal 21.
A kind of optical module provided by the embodiment of the utility model emits optical device, and substrate 26 can equidistantly be fixed on pedestal
On 21.
It may include multiple substrates 26 in optical module transmitting optical device, and these substrates 26 can equidistantly be fixed on bottom
On seat 21, to constitute substrate array.It is of course also possible to be adjusted according to actual needs and to the position of substrate 26, so that light
Module, which emits optical device, has preferable performance.
A kind of optical module provided by the embodiment of the utility model emits optical device, between substrate 26 and pedestal 21 and lens
It can be fixed by epoxy glue or ultraviolet glue between 24 and U-type groove.
Between substrate 26 and pedestal 21 and between lens 24 and the U-type groove of substrate 26 can by epoxy glue or
The ultraviolet glue of person is fixed, to improve the adhesion strength between substrate 26 and pedestal 21 and between lens 24 and U-type groove, thus
Prevent substrate 26, lens 24 from impacting due to movement occurs to the performance of optical module transmitting optical device during the work time.
It wherein, specifically can be by High Precision Automatic when lens 24 are fixed in the U-type groove of substrate 26 using glue
Chip mounter puts upper glue in the U-type groove of substrate 26, and controls High Precision Automatic chip mounter and lens 24 are attached to the pre- of substrate 26
If on position, then, fixing glue, so that lens 24 are fixed on substrate 26.Lens 24 are being fixed on substrate 26 it
Afterwards, then it can use glue substrate 26 is bonded on pedestal 21, then, heated baking carried out to glue, keep substrate 26 fixed
On pedestal 21.
A kind of optical module provided by the embodiment of the utility model emits optical device, and lens 24 can be globe lens or aspheric
Lens.
It can be globe lens that optical module, which emits lens 24 included in optical device, or non-globe lens, it can
The optical signal that chip of laser 22 is emitted is converged to out in light part 25 using globe lens or non-globe lens.
A kind of optical module provided by the embodiment of the utility model emits optical device, and light part 25 may include and 21 phase of pedestal out
Adjustings ring 251 even traps with the metal that is connected of adjusting ring 251 and 252 and is trapped in 252 by fiber stub insertion metal
Optical fiber 253.
Light part 25 can specifically include to adjust ring 251, metal and trap and 252 and is inserted under metal by fiber stub out
Optical fiber 253 in set 252.
Lens 24 are being fixed in the U-type groove of substrate 26, and after substrate 26 is fixed on pedestal 21, then it can will
It adjusts ring 251 to be placed on pedestal 21, metal is trapped and 252 is inserted into and adjusts in ring 251, and fiber stub is inserted into metal
It traps in 252, and the other end of optical fiber 253 is connected with light power meter, monitor optical power using light power meter.Then, then
The automatic coupling function of opening automatic coupling bonding machine traps to adjusting ring 251, metal when monitoring maximum optical power
252 and pedestal 21 carry out laser welding, light part 25 will be gone out and be fixed on pedestal 21.
Wherein, two end faces of used fiber stub can be plane, can also be inclined-plane.
A kind of optical module provided by the embodiment of the utility model emits optical device, the light of chip of laser 22 and fiber stub
Isolator can be set in road.
Isolator can be set in the optical path of chip of laser 22 and fiber stub, to allow optical signal from chip of laser
22 pass through to optical fiber 253, and prevent optical signal carry out back through, i.e. isolator can limit the direction of optical signal,
So that optical signal can only one direction transmission, to improve the efficiency of transmission of optical signal.
The utility model embodiment additionally provides a kind of optical module, including any of the above-described kind of optical module emits optical device.
Since the coupling complexity of any of the above-described kind of optical module transmitting optical device is relatively low, preparation efficiency is relatively high, system
Standby cost is relatively low, therefore, for including the optical module of any of the above-described kind of optical module transmitting optical device, in the preparation may be used
Simplify preparation process to reduce, shorten preparation time, improve preparation efficiency, reduces preparation cost.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the element that the process, method, article or equipment including a series of elements is intrinsic.?
Do not have in the case where more limiting, the element limited by sentence "including a ...", it is not excluded that including the element
There is also other identical elements in process, method, article or equipment.In addition, provided by the embodiment of the utility model above-mentioned
In technical solution with correspond to the consistent part of technical solution realization principle and unspecified in the prior art, in order to avoid excessive superfluous
It states.
The foregoing description of the disclosed embodiments makes those skilled in the art can be realized or use the utility model.
Various modifications to these embodiments will be apparent for a person skilled in the art, general original as defined herein
Reason can be realized in other embodiments without departing from the spirit or scope of the present utility model.Therefore, this is practical new
Type is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase
Consistent widest scope.
Claims (8)
1. a kind of optical module emits optical device, including pedestal, chip of laser, the PCB being connected with the chip of laser, saturating
Mirror is coupled with the chip of laser and fixes light part out on the base, which is characterized in that further includes being fixed on institute
It states on pedestal and predetermined position is provided with the substrate of U-type groove, the substrate has thermal conductivity, in which:
The chip of laser is fixed on the surface of the substrate, and the lens are fixed in the U-type groove of the predeterminated position, institute
State the maximum position of light power that predeterminated position is the chip of laser obtained by optical analog.
2. optical module according to claim 1 emits optical device, which is characterized in that further include being arranged in the substrate and institute
It states heat sink between chip of laser.
3. optical module according to claim 2 emits optical device, which is characterized in that the substrate is equidistantly fixed on described
On pedestal.
4. optical module according to claim 1 emits optical device, which is characterized in that between the substrate and the pedestal,
And it is fixed between the lens and the U-type groove by epoxy glue or ultraviolet glue.
5. optical module according to claim 4 emits optical device, which is characterized in that the lens are globe lens or aspheric
Lens.
6. optical module according to any one of claims 1 to 5 emits optical device, which is characterized in that it is described go out light part include
The adjusting ring being connected with the pedestal, the metal being connected with the adjusting ring trap and are inserted into the metal by fiber stub
Optical fiber in trapping.
7. optical module according to claim 6 emits optical device, which is characterized in that the chip of laser and the optical fiber
Isolator is provided in the optical path of lock pin.
8. a kind of optical module, which is characterized in that emit optical device including optical module as described in any one of claim 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822061677.2U CN208969288U (en) | 2018-12-07 | 2018-12-07 | A kind of optical module transmitting optical device and optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822061677.2U CN208969288U (en) | 2018-12-07 | 2018-12-07 | A kind of optical module transmitting optical device and optical module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208969288U true CN208969288U (en) | 2019-06-11 |
Family
ID=66766328
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822061677.2U Expired - Fee Related CN208969288U (en) | 2018-12-07 | 2018-12-07 | A kind of optical module transmitting optical device and optical module |
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|---|---|
| CN (1) | CN208969288U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109358398A (en) * | 2018-12-07 | 2019-02-19 | 东莞铭普光磁股份有限公司 | A kind of optical module, optical module transmitting optical device and preparation method thereof |
| CN113985535A (en) * | 2021-10-28 | 2022-01-28 | 中国科学院半导体研究所 | Method for determining ultraviolet adhesive curing time for optical module packaging |
-
2018
- 2018-12-07 CN CN201822061677.2U patent/CN208969288U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109358398A (en) * | 2018-12-07 | 2019-02-19 | 东莞铭普光磁股份有限公司 | A kind of optical module, optical module transmitting optical device and preparation method thereof |
| CN109358398B (en) * | 2018-12-07 | 2024-05-14 | 东莞铭普光磁股份有限公司 | Optical module, optical module light emitting device and preparation method thereof |
| CN113985535A (en) * | 2021-10-28 | 2022-01-28 | 中国科学院半导体研究所 | Method for determining ultraviolet adhesive curing time for optical module packaging |
| CN113985535B (en) * | 2021-10-28 | 2023-06-27 | 中国科学院半导体研究所 | Method for determining ultraviolet glue curing time length for optical module encapsulation |
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