CN208967919U - A kind of dehumidification by condensation device based on semiconductor chilling plate - Google Patents
A kind of dehumidification by condensation device based on semiconductor chilling plate Download PDFInfo
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- CN208967919U CN208967919U CN201821412859.3U CN201821412859U CN208967919U CN 208967919 U CN208967919 U CN 208967919U CN 201821412859 U CN201821412859 U CN 201821412859U CN 208967919 U CN208967919 U CN 208967919U
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- cooling fin
- semiconductor chilling
- chilling plate
- fan
- dehumidification
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- Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
Abstract
The utility model relates to dehumidification equipment fields, specifically disclose a kind of dehumidification by condensation device based on semiconductor chilling plate, comprising: shell；Main board control circuit is set in the housing；Fan, cooling fin, semiconductor chilling plate and cooling fin, fan air inlet, cooling fin, semiconductor chilling plate and cooling fin are set in shell in a manner of being successively bonded, fan and semiconductor chilling plate are connect with main board control circuit respectively, the corresponding shell position in the air inlet of fan offers air inlet, and the corresponding shell position of the blowing direction of fan offers air outlet；Water receiving tank is set on the drop-off positions for the water droplet for being condensed in cooling fin, and the water outlet of water receiving tank extends to the outside of shell；Foam-rubber cushion is set between cooling fin and cooling fin；Hydrophilic material coating is set to the surface of cooling fin.The device is dehumidified using the temperature difference that semiconductor chilling plate generates with condensation, and quick condensate and draining setting are increased, so that dehumidifying speed is faster, dry environment keeps more lasting.
Description
Technical field
The utility model belongs to dehumidification equipment field, in particular to a kind of dehumidification by condensation dress based on semiconductor chilling plate
It sets.
Background technique
Electric Power Generating Equipment is the vitality of each enterprise, is the core of life.It is also the main work that enterprise creates profit
Tool, current industrial process stream, the degree of automation are higher and higher.Can ambient temperature and humidity be to influence electrical equipment work normally
A key factor.If ambient temperature and humidity is excessively high, electrical equipment temperature rise can also increase, and seal aging is caused to add
Fastly, it even will appear the case where burning seal when serious.Air humidity is excessive to will lead to equipment surface cohesion moisture, can draw
It plays mould and breeds and accelerate, and then electrical insulation strength is caused to reduce, cause metal erosion quickening that contact surface is caused to aoxidize, contact electricity
Resistance increases.As soon as glitch may cause the halt production of large area, the operating of production equipment efficiently, safe how just can guarantee
It is particularly important.
When the principle of traditional heating type dehumidifier is that temperature is higher, more moisture can be accommodated in air, heating air is just
The moisture that may congeal into dewdrop can be made to retain in air, without condensing in equipment surface.But moisture works as chance also in electric cabinet
When big to the temperature difference, the moisture in air will condense in equipment surface, still can operate normally and impact to equipment.And it produces
Self-heating when product work, can accelerate peripheral cable and ageing equipment, or even can destroy cable insulation, there are security risks.
Utility model content
The purpose of this utility model is to provide a kind of dehumidification by condensation device based on semiconductor chilling plate, can be rapid
Cabinet humidity is reduced, the moisture content in equipment is expelled directly out except equipment cabinet body, releases moisture puzzlement, it is ensured that electric equipment operation
Safety.
To achieve the above object, the utility model provides a kind of dehumidification by condensation device based on semiconductor chilling plate, packet
It includes: shell；Main board control circuit is disposed in the housing；Fan, cooling fin, semiconductor chilling plate and cooling fin, the wind
Fan air inlet, cooling fin, semiconductor chilling plate and cooling fin are set in the shell in a manner of being successively bonded, the cooling
Piece corresponds to the cold end of semiconductor chilling plate, and the cooling fin corresponds to the hot end of semiconductor chilling plate, the fan and semiconductor system
Cold connect with the main board control circuit respectively, and the corresponding shell position in the air inlet of the fan offers air inlet
Mouthful, the corresponding shell position of the air-out direction of the fan offers air outlet；Water receiving tank is set in the cooling fin
Water droplet fall position on, the water outlet of the water receiving tank extends to the outside of the shell；Foam-rubber cushion is set to the heat dissipation
Between piece and the cooling fin；Hydrophilic material coating is set to the surface of the cooling fin.
Preferably, in above-mentioned technical proposal, the shell includes bottom plate and top cover, and the bottom plate and top cover are by that can tear open
The mode unloaded connects.
It preferably, further include being disposed in the housing Temperature Humidity Sensor in above-mentioned technical proposal, the temperature and humidity sensing
Device is connect with the main board control circuit.
Preferably, in above-mentioned technical proposal, the main board control circuit includes: control chip, indicator light, display screen and outer
Connection interface, the control chip respectively with the semiconductor chilling plate, fan, Temperature Humidity Sensor, indicator light, display screen and outer
Connection interface connection.
Preferably, in above-mentioned technical proposal, the outer surface of the shell is equipped with control panel, and the control panel is equipped with
Operation button, equipment work light indicating area and display area, the operation button are connect with the main board control circuit.
Preferably, in above-mentioned technical proposal, the main board control circuit by power switch be disposed in the housing
Power supply connection.
Preferably, in above-mentioned technical proposal, the hydrophilic material coating is by XZ-GT01 nano-hydrophilic coating silicon materials system
At.
Preferably, in above-mentioned technical proposal, the cooling fin and cooling fin are radiating aluminium sheet.
Preferably, in above-mentioned technical proposal, the surface area of the cooling fin is greater than the air inlet of fan, the table of cooling fin
Face area is less than the cooling fin.
Preferably, in above-mentioned technical proposal, the fan, cooling fin, semiconductor chilling plate and the cooling fin that are successively bonded
It is arranged in a manner of vertical level.
Compared with prior art, the utility model has the following beneficial effects:
1. the dehumidification by condensation device based on semiconductor chilling plate in the utility model quotes the spy of temperature difference great Yi condensation
Point generates hot end and cold end simultaneously using semiconductor chilling plate, generates in the condensate face for the cooling fin connecting with cold end very low
Temperature, so that the moisture content in air is condensed in condensate face, and fall into water receiving tank to be discharged outside shell.Due in electric cabinet in air
Humidity is remarkably decreased, accordingly even when ambient temperature is greatly reduced, will not generate condensation again, it is normal fundamentally to solve electric cabinet
The humidity puzzlement seen.Meanwhile completely cutting off hot and cold alternation, more conducively condensate using foam-rubber cushion, after increasing condensate speed, and in cooling fin
If hydrophilic material coating, so that condensate is rapidly separated cooling fin and is discharged, therefore, while increasing quick condensate and draining is set
It sets, prevents condensate from resting on too long with secondary formation wet environment in shell, so that dehumidifying speed is faster, dry environment is kept more
Aid is long.
2. shell, fan, cooling fin, semiconductor chilling plate and cooling fin in the utility model can flattening setting,
65mm can be as thin as hereinafter, the fields such as high-voltage switching operation mechanism box of narrow space in power electronics industry can be easily mounted on
It closes, meanwhile, using high-performance Temperature Humidity Sensor, can be used for a long time under strong electrical field, magnetic field and severe natural environment.
Detailed description of the invention
Fig. 1 is the overall structure figure of the dehumidification by condensation device according to the present utility model based on semiconductor chilling plate.
Fig. 2 is that the dehumidification by condensation device according to the present utility model based on semiconductor chilling plate goes out the structure after decapsidate
Figure.
Fig. 3 is cooling fin, semiconductor chilling plate and condensate film structure chart according to the present utility model.
Fig. 4 is semiconductor chilling plate local structural graph according to the present utility model.
Main appended drawing reference explanation:
1- shell, 2- bottom plate, 3- air inlet, 4- mounting hole, 5- air outlet, 6- water pipe head, 7- indicator light, 8- are shown
Screen, 9- operation button, 10- external interface, 11- power switch, 12-USB interface, 13- top cover, 14- control panel, 15- mainboard
Control circuit, 16- fan, 17- cooling fin, 18- cooling fin, 19- water receiving tank, 20- semiconductor chilling plate, 21- power supply, the sea 22-
Silk floss pad.
Specific embodiment
With reference to the accompanying drawing, specific embodiment of the present utility model is described in detail, it is to be understood that this is practical
Novel protection scope is not limited by the specific implementation.
Fig. 1-Fig. 4 shows the dehumidification by condensation dress based on semiconductor chilling plate according to the preferred embodiments of the present invention
The structure chart set.
As Figure 1-Figure 4, the dehumidification by condensation device in the embodiment based on semiconductor chilling plate, comprising: shell 1, control
Panel 14 processed, mainboard 15, fan 16, cooling fin 17, semiconductor chilling plate 20, cooling fin 18, water receiving tank 19, foam-rubber cushion 22, parent
Water material coating and Temperature Humidity Sensor.Shell 1 is preferably designed using dismountable structure, such as includes bottom plate 2 and top cover 13, bottom
Plate 2 and top cover 13 are connected by screw to, and open up several mounting holes 4 in the peripheral part of bottom plate 2, to facilitate installation, disassembly.Wind
16 air inlets, cooling fin 17, semiconductor chilling plate 20 and cooling fin 18 is fanned to be set in a manner of being successively bonded on bottom plate 2, it is cold
But the cold end of the corresponding semiconductor chilling plate 20 of piece 18, the hot end of the corresponding semiconductor chilling plate 20 of cooling fin 17 and dissipates cooling fin 18
Backing 17 is preferably radiating aluminium sheet, wherein between cooling fin 17 and semiconductor chilling plate 20, semiconductor chilling plate 20 and cooling fin
It is bonded with heat-conducting cream between 18, to make the condensate for being condensed in cooling fin 18 more preferably drip, i.e., bottom plate 2 is during installation to hang down
The mode of straight horizontal plane is installed, and by 16 air inlet of fan being successively bonded, cooling fin 17, semiconductor chilling plate 20 and cold
But piece 18 is arranged in a manner of vertical level, and condensate is vertically fallen, prevent condensate stay in cooling fin 18 with
It causes to drain the problems such as slow, meanwhile, shell 1, fan 16, cooling fin 17, semiconductor chilling plate 20 and cooling fin 18 can be flat
Graduation setting can be as thin as 65mm hereinafter, the high-voltage switch gear operation machine of narrow space in power electronics industry can be easily mounted on
The occasions such as structure case.
As Figure 1-Figure 4, corresponding 1 position of shell of the blowing mouth of fan 16 offers air outlet 5, the air draught of fan 16
Corresponding 1 position of shell in direction offers air inlet 3 (shell two sides all have), and the top end face and backboard of shell 1 are additionally provided with several
Heat release hole, it is preferred in the embodiment so that air pressure balance in shell 1, show a kind of preferred radiator structure, cooling fin 17
Surface area be greater than the air inlet of fan, the surface area of cooling fin 18 is less than cooling fin 17, so that effluent stream is only
One will all act on cooling fin 17 by cooling fin 17, air-flow, and heat dissipation effect is more obvious；Water receiving tank 19 is cold set on being condensed in
But on the drop-off positions of the water droplet of piece 18, the water outlet of water receiving tank 19 extends to the outside of shell 1 by waterpipe jointing 6.
The embodiment also shows a kind of dehumidification structure of optimization, is set to cooling fin 17 and cooling fin 18 using a foam-rubber cushion
Between, completely cut off hot and cold alternation, more conducively condensate, after increasing condensate speed, sets hydrophilic material coating in the surface of cooling fin 18, i.e.,
Hydrophilic material coating preferably uses XZ-GT01 nano-hydrophilic coating silicon materials to be coated on 18 surface of cooling fin and is made, so that condensate
It is rapidly separated cooling fin 18 to be discharged, therefore, while increasing quick condensate and draining setting, prevent condensate from resting on shell 1
Inside too long with secondary formation wet environment, so that dehumidifying speed is faster, dry environment keeps more lasting.
With further reference to Fig. 1-Fig. 2, main board control circuit 15 is set in shell 1, and Temperature Humidity Sensor is controlled set on mainboard
On circuit 15, using high-performance Temperature Humidity Sensor, it can be used for a long time under strong electrical field, magnetic field and severe natural environment.
Main board control circuit 15 includes: control chip, indicator light 7, display screen 8 and external interface 10, and control chip is preferably AVR core
Piece, model ATMEGA16A, control chip respectively with semiconductor chilling plate 20, fan 16, Temperature Humidity Sensor, indicator light 7,
Display screen 8 and external interface 10 connect, and external interface 10 includes all kinds of communication interfaces, such as usb 12, and reservation 8 is external
Interface 10 connects preferred equipment, and usb 12 collects the temperature and humidity in electric cabinet for connecting temperature and humidity receiver, for except
The conversion of wet working state of device provides foundation.The outer surface of shell is equipped with control panel 14, and control panel 14 is equipped with operation
Key 9, equipment work light indicating area and display area, operation button 9 are connect with main board control circuit 15, mainboard control
Circuit 15 is connect by power switch 11 with the power supply 21 being set in the housing, to provide operating voltage for various elements.Display screen 8
Show real-time temperature and humidity value, indicator light 7 shows the state of work at present, and power switch 11 controls the energization of dehumidification device
State.
Semiconductor chilling plate dehumidification device at work, quote the temperature difference great Yi condensation the characteristics of, opened by power switch 11
After dynamic, air is sucked by air inlet 3, hot end and cold end are generated simultaneously using semiconductor chilling plate 20, what is connect with cold end
The condensate face of cooling fin 18 generates low-down temperature, after air and the contact of cooling fin 18, the hydrogenesis in air is made to exist
In cooling fin 18, then drained by drainage element, the air-flow after carrying out hydrofuge is finally discharged from air outlet 5, due to empty in electric cabinet
Humidity in gas is remarkably decreased, accordingly even when ambient temperature is greatly reduced, will not generate condensation again, fundamentally solve
The common humidity puzzlement of electric cabinet.Further, Temperature Humidity Sensor acquires the temperature and humidity in electric cabinet in real time, partly leads for control
The work of body cooling piece and fan provides foundation, meanwhile, fan 16 at work, can play cooling effect to cooling fin 17, make
Cooling fin 17 temperature reduce, simultaneously because the temperature difference of 20 hot and cold side of semiconductor chilling plate can achieve 40~65 degrees Celsius it
Between, therefore, fan also reduces the temperature of cooling fin, the temperature of cooling fin is further while reducing the temperature of cooling fin
It reduces, and improves the dehumidifying rate of dehumidification device.
The description of the aforementioned specific exemplary embodiment to the utility model is in order to illustrate and illustration purpose.These
Description is not wishing to for the utility model to be limited to disclosed precise forms, and it will be apparent that according to the above instruction, can carry out
It is many to change and change.The purpose of selecting and describing the exemplary embodiment is that explaining the specific principle of the utility model
And its practical application, so that those skilled in the art can be realized and utilize a variety of different examples of the utility model
Property embodiment and various chooses and changes.The scope of the utility model is intended to by claims and its waits similar shapes
Formula is limited.
Claims (10)
1. a kind of dehumidification by condensation device based on semiconductor chilling plate characterized by comprising
Shell；
Main board control circuit is disposed in the housing；
Fan, cooling fin, semiconductor chilling plate and cooling fin, the fan air inlet, cooling fin, semiconductor chilling plate and cooling
Piece is set in the shell in a manner of being successively bonded, and the cooling fin corresponds to the cold end of semiconductor chilling plate, the heat dissipation
Piece corresponds to the hot end of semiconductor chilling plate, and the fan and semiconductor chilling plate are connect with the main board control circuit respectively, institute
The corresponding shell position in air inlet for stating fan offers air inlet, the corresponding shell of the air-out direction of the fan
Position offers air outlet；
Water receiving tank is set on the position that the water droplet in the cooling fin falls, and the water outlet of the water receiving tank extends to the shell
The outside of body；
Foam-rubber cushion is set between the cooling fin and the cooling fin；And
Hydrophilic material coating is set to the surface of the cooling fin.
2. the dehumidification by condensation device according to claim 1 based on semiconductor chilling plate, which is characterized in that the shell packet
Bottom plate and top cover are included, the bottom plate connects by way of it can dismantle with top cover.
3. the dehumidification by condensation device according to claim 1 based on semiconductor chilling plate, which is characterized in that further include being set to
Temperature Humidity Sensor in the shell, the Temperature Humidity Sensor are connect with the main board control circuit.
4. the dehumidification by condensation device according to claim 3 based on semiconductor chilling plate, which is characterized in that the mainboard control
Circuit processed includes: control chip, indicator light, display screen and external interface, the control chip respectively with the semiconductor refrigerating
Piece, fan, Temperature Humidity Sensor, indicator light, display screen and external interface connection.
5. the dehumidification by condensation device according to claim 4 based on semiconductor chilling plate, which is characterized in that the shell
Outer surface is equipped with control panel, and the control panel is equipped with operation button, equipment work light indicating area and viewing area
Domain, the operation button are connect with the main board control circuit.
6. the dehumidification by condensation device according to claim 1 based on semiconductor chilling plate, which is characterized in that the mainboard control
Circuit processed is connect by power switch with the power supply being disposed in the housing.
7. the dehumidification by condensation device according to claim 1 based on semiconductor chilling plate, which is characterized in that the hydrophilic material
Matter coating is made of XZ-GT01 nano-hydrophilic coating silicon materials.
8. the dehumidification by condensation device according to claim 1 based on semiconductor chilling plate, which is characterized in that the cooling fin
It is radiating aluminium sheet with cooling fin.
9. the dehumidification by condensation device according to claim 1 based on semiconductor chilling plate, which is characterized in that the cooling fin
Surface area be greater than the air inlet of fan, the surface area of cooling fin is less than the cooling fin.
10. the dehumidification by condensation device according to claim 1 based on semiconductor chilling plate, which is characterized in that be successively bonded
The fan, cooling fin, semiconductor chilling plate and cooling fin be arranged in a manner of vertical level.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821412859.3U CN208967919U (en) | 2018-08-30 | 2018-08-30 | A kind of dehumidification by condensation device based on semiconductor chilling plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821412859.3U CN208967919U (en) | 2018-08-30 | 2018-08-30 | A kind of dehumidification by condensation device based on semiconductor chilling plate |
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| Publication Number | Publication Date |
|---|---|
| CN208967919U true CN208967919U (en) | 2019-06-11 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821412859.3U Active CN208967919U (en) | 2018-08-30 | 2018-08-30 | A kind of dehumidification by condensation device based on semiconductor chilling plate |
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| CN (1) | CN208967919U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109163381A (en) * | 2018-08-30 | 2019-01-08 | 广西鑫百纳电气有限公司 | A kind of dehumidification by condensation device based on semiconductor chilling plate |
| CN113243584A (en) * | 2020-02-12 | 2021-08-13 | 武汉益永康医疗科技有限公司 | Temperature and humidity control system in protective clothing |
-
2018
- 2018-08-30 CN CN201821412859.3U patent/CN208967919U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109163381A (en) * | 2018-08-30 | 2019-01-08 | 广西鑫百纳电气有限公司 | A kind of dehumidification by condensation device based on semiconductor chilling plate |
| CN113243584A (en) * | 2020-02-12 | 2021-08-13 | 武汉益永康医疗科技有限公司 | Temperature and humidity control system in protective clothing |
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