CN208961749U - A kind of the diamond lap disk and grinding device of semiconductor - Google Patents
A kind of the diamond lap disk and grinding device of semiconductor Download PDFInfo
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- CN208961749U CN208961749U CN201821736650.2U CN201821736650U CN208961749U CN 208961749 U CN208961749 U CN 208961749U CN 201821736650 U CN201821736650 U CN 201821736650U CN 208961749 U CN208961749 U CN 208961749U
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Abstract
The utility model relates to milling apparatus technical fields, disclose the diamond lap disk and grinding device of a kind of semiconductor, including top lap and lower abrasive disk, it is provided with first shaft hole and the second axis hole respectively at top lap and lower grinding disk center, second axis hole is provided with rotation gear, rotation gear side is provided with third groove, the other side is relatively set with axis, several the first grooves are offered on top lap and lower abrasive disk, abrasive sheet is provided in several first grooves, several apopores are evenly arranged on top lap, contact is provided with several rotating disks on lower abrasive disk, the periphery of rotating disk is equipped with teeth, the structure of teeth matches with rotation gear, several product through-holes are provided in rotating disk；The device is provided with top lap and lower abrasive disk, sufficiently can be clamped operation to abrasive product, and to grinding one-sidedness stress, more evenly, grinding effect is more preferable for grinding.
Description
Technical field
The utility model relates to milling apparatus technical fields, and in particular to a kind of diamond lap disk of semiconductor and grinding
Device.
Background technique
Semiconductor material needs to be ground its surface, at present to semiconductor material during the manufacturing
Milling apparatus, grinding efficiency is low, and in the prior art, grinding work has two: firstly, generally using mixing roll and
Semiconductor material linear contact grinding and polishing be easy to cause due to stress linear when semiconductor material is ground and generates uneven item
Line reduces the uniformity of semiconductor material grinding and polishing, reduces the total quality of semiconductor material grinding and polishing.Secondly,
Existing polisher lapper clamping effect is poor, when polisher lapper is to semiconductor material grinding and polishing, since grinding and polishing presss from both sides
Tight effect is poor, be easy to cause semiconductor material to be in the presence of sliding, grinds to affect polisher lapper to semiconductor material
Grinding and polishing light reduces the practicability of semiconductor material polisher lapper, therefore there is an urgent need to a kind of efficiently to semiconductor material
Milling apparatus.Due to diamond hardness with higher, thermal conductivity and refractive index, also there is preferable wearability and stabilization
Property, therefore it is widely used and makes the various aspects such as cutter for cutting, optical component, decoration.
Utility model content
In view of the deficienciess of the prior art, the utility model discloses a kind of diamond lap disk of semiconductor, the grinding
Abrasive sheet in disk on top lap and lower abrasive disk treats abrasive product upper and lower surface while carrying out grinding operation, product face
Property stress, grinding more evenly；The fixed product of rotating disk, top lap, lower abrasive disk step up it simultaneously, and product is difficult to slide,
Grinding effect is more preferable；And provide a kind of diamond lap device of semiconductor.
To achieve the goals above, the utility model provides the following technical solutions:
A kind of diamond lap disk of semiconductor, including top lap and lower abrasive disk, the top lap and lower grinding
Disk is cyclic structure, is provided with first shaft hole and the second axis hole respectively at the top lap and lower grinding disk center, runs through institute
It states the second axis hole and is provided with rotation gear, the rotation gear side is provided with third groove, the other side is relatively set with axis,
Several the first grooves are offered on the top lap and lower abrasive disk, are provided with grinding in several described first grooves
Piece；
Several apopores are evenly arranged on the top lap, contact is provided with several rotations on the lower abrasive disk
The periphery of disk, the rotating disk is equipped with teeth, and the structure of the teeth matches with the rotation gear, sets in the rotating disk
It is equipped with several product through-holes.
In the present invention, it is preferred that the abrasive sheet is diamond material.
In the present invention, it is preferred that the apopore is evenly distributed on the top lap.
In the present invention, it is preferred that the top lap is identical with lower abrasive disk size.
In the present invention, it is preferred that the abrasive sheet is interspersed in a ring, is distributed in outmost turns and innermost circle
The abrasive sheet diameter is less than the diameter for being distributed in the abrasive sheet at middle part.
In the present invention, it is preferred that the product through-hole is rectangular configuration, and the product through-hole circularizes distribution.
A kind of diamond lap device of semiconductor, the grinding device is interior to be equipped with the diamond lap disk, under described
Abrasive disk is movably arranged in grinding groove, and insertion is provided with gear ring, the gear between the grinding groove and the lower abrasive disk
Gear on circle is matched with the gear in the rotating disk, and the lower abrasive disk, which matches, is provided with rotation gear, the rotation
Motor is fixedly installed in rotating disk；
It is provided with several support frames above the top lap, is provided with support plate, the branch above support frame as described above
Fagging is fixedly connected with support rod.
Compared with prior art, the utility model has the beneficial effects that
1. the utility model is provided with the abrasive sheet of several diamond materials on abrasive disk, abrasive sheet is to production to be ground
Product upper and lower surface carries out grinding operation simultaneously, and product face property stress, grinding is more evenly；The fixed product of rotating disk simultaneously, upper grinding
Disk, lower abrasive disk step up it, and product is difficult to slide, and grinding effect is more preferable；It is provided with apopore on top lap, is convenient for
Abrasive product is washed away with water in process of lapping, effectivelying prevent product, temperature is excessively high during the grinding process, damages product, together
When wash away can effectively clear up the fine powder generated in process of lapping in time, to guarantee that the abrasive sheet moment is to product
It is ground, rather than the product powder to get off is just ground in grinding.
2. the utility model contact is provided with rotating disk, several product through-holes are provided in the rotating disk, product is put
In product through-hole, facilitate the pick-and-place of product, improves grinding working efficiency.
3. top lap, lower abrasive disk, rotating disk and rotation geared parts are provided with mutual cooperation in the utility model
Gear, motor need to only drive rotation gear, top lap and lower abrasive disk to be rotated, will be further driven in rotating disk
Product rotates between top lap and lower abrasive disk, and then is effectively ground under the action of abrasive sheet.
Detailed description of the invention
Fig. 1 is the fractionation structural representation of lower millstone and rotating disk in a kind of diamond lap disk of semiconductor of the utility model
Figure.
Fig. 2 is the top view of lower millstone in a kind of diamond lap disk of semiconductor of the utility model.
Fig. 3 is the top view of lower abrasive disk in a kind of diamond lap disk of semiconductor of the utility model.
Fig. 4 is the bottom view of top lap in a kind of diamond lap disk of semiconductor of the utility model.
Fig. 5 is the partial enlarged view of rotating disk in a kind of diamond lap disk of semiconductor of the utility model.
Fig. 6 is a kind of structural schematic diagram of the diamond lap device of semiconductor of the utility model.
Fig. 7 is the signal that rotating disk and gear ring match in a kind of diamond lap device of semiconductor of the utility model
Figure.
Main element symbol description: 1, top lap；2, lower abrasive disk；3, first shaft hole；4, the second axis hole；5, rotary teeth
Wheel；6, support plate；7, abrasive sheet；8, apopore；9, rotating disk；10, product through-hole；101, interior ring through hole；102, outer ring through hole；
11, motor；12, gear ring；13, grinding groove；14, support rod；15, crane；16, third groove.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
It should be noted that it can be directly on another component when component is referred to as " being fixed on " another component
Or there may also be components placed in the middle.When a component is considered as " connection " another component, it, which can be, is directly connected to
To another component or it may be simultaneously present component placed in the middle.When a component is considered as " being set to " another component, it
It can be and be set up directly on another component or may be simultaneously present component placed in the middle.Term as used herein is " vertical
", " horizontal ", "left", "right" and similar statement for illustrative purposes only.
Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model
The normally understood meaning of the technical staff in domain is identical.Terminology used in the description of the utility model herein only be
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term " and or " used herein includes
Any and all combinations of one or more related listed items.
Please referring also to Fig. 1 to Fig. 7, the in the present embodiment a kind of diamond lap disk of semiconductor, including top lap 1
It with lower abrasive disk 2, is ground for clamping the product in the rotating disk 9, the top lap 1 and lower abrasive disk 2 are ring
It is respectively arranged with first shaft hole 3 and the second axis hole 4 at shape structure, the top lap 1 and lower 2 center of abrasive disk, in order to pacify
Motor is set, second axis hole 4 is provided with rotation gear 5, motor drives rotation gear 5 to rotate, and rotation gear 5 is further
Rotating disk 9 is driven to rotate, 5 side of rotation gear is provided with third groove 16, the other side is relatively set with axis, and described the
Three grooves 16 are used to the rotation gear 5 being rotatably connected on the grinding groove 13 for fixing the motor 11, the axis
It is interior, several the first grooves are offered on the top lap 1 and lower abrasive disk 2, for placing abrasive sheet 7, several institutes
It states and is provided with abrasive sheet 7 in groove, abrasive sheet 7 carries out grinding operation to product；And the top lap 1 is equipped with abrasive sheet 7
With lower abrasive disk 2 be equipped with abrasive sheet 7 while be oppositely arranged；Treat the table of abrasive product top lap 1 and lower abrasive disk 2
Face carries out grinding operation to it simultaneously, and product face property stress, grinding is more evenly.
Several apopores 8 are evenly arranged on the top lap 1, water enters abrasive disk by apopore 8, produces to grinding
Product are washed away, and contact is provided with several rotating disks 9 on the lower abrasive disk 2, and the rotating disk 9 is carried out for placing product
The periphery of grinding operation, the rotating disk 9 is equipped with teeth, and the structure of the teeth matches with the rotation gear 5, with tooth
Interaction between wheel rotates the rotation gear 5, drive several rotating disks 9 to be rotated, in the rotating disk 9
Several product through-holes 10 are provided with, for product through-hole 10 for placing product, top lap 1, lower abrasive disk 2 step up it, produce
Product are difficult to slide, and grinding effect is more preferable.
In the present embodiment, the abrasive sheet 7 be diamond material, diamond hardness with higher, thermal conductivity and
Refractive index, also has preferable wearability and stability, thus its be widely used make cutter for cutting, optical component,
The various aspects such as decoration.
In the present embodiment, the quantity of the apopore 8 is greater than 20, and is evenly distributed on the top lap 1.
In the present embodiment, the top lap 1 is identical with lower 2 size of abrasive disk.
In the present embodiment, the quantity of the abrasive sheet 7 is 400, and 400 abrasive sheets 7 staggeredly divide in a ring
Cloth, 7 diameter of the abrasive sheet for being distributed in outmost turns and innermost circle is the half for being distributed in 7 diameter of the abrasive sheet at middle part,
As long as the working region of grinding operation is the intermediate region of the top lap 1 and lower abrasive disk 2, it is therefore desirable to place more
Outmost turns and innermost circle is arranged however, the fringe region of top lap 1 and lower abrasive disk 2 is underwork region in abrasive sheet 7
7 diameter of abrasive sheet is the half for being distributed in 7 diameter of the abrasive sheet at middle part, can effectively save material, reduce cost.
In the present embodiment, the product through-hole 10 is rectangular configuration, and quantity is 11；11 product through-holes 10
Distribution is circularized, 11 product through-holes 10 include 3 interior ring through hole and 8 outer ring through hole, can effectively ensure that grinding for product
Grind quality and grinding efficiency.
A kind of diamond lap device of semiconductor, the grinding device is interior to be equipped with the diamond lap disk, under described
Abrasive disk 2 is movably arranged in grinding groove 13, and the second groove is arranged at 13 center of grinding groove, and the rotation gear 5 is close
Axis is set at the center of 13 side of grinding groove, and the axis matches with second groove, and the rotation gear 5 is logical
It crosses central axis to be connected in the grinding groove 13, insertion is provided with gear ring between the grinding groove 13 and the lower abrasive disk 2
12, the gear on the gear ring 12 is matched with the gear in the rotating disk 9, using on the gear ring 12 gear with
It cooperates between survey gear within the rotating disk 9 weeks, drives the rotating disk 9 that product is driven to carry out spin finishing movement, it is described
Lower abrasive disk 2, which matches, is provided with rotation gear 5, is fixedly installed motor 11, the rotation gear 5 on the rotation gear 5
Third groove, the output shaft of the motor 11 and the third groove phase are set at the center of 11 side of motor
Match, the motor 11 is fixedly connected with the rotation gear 5, drives entire abrasive disk to start grinding behaviour using the motor 11
Make；
It is provided with several support frames 15 above the top lap 1, is provided with support plate 6 above support frame as described above 15,
The support plate 6 is fixedly connected with connecting rod 14, and the bracket above the connecting rod 14 through the device is connect with cylinder, cylinder
It is moved up and down for controlling the top lap 1, while the lower abrasive disk 2 cooperates and clamps product to be ground and carry out
Grinding operation.
In the present embodiment, product to be ground is placed between the top lap 1 and the lower abrasive disk 2 and is ground
Mill processing is, it can be achieved that the entire surface of abrasive sheet and product to be ground carries out contact grinding, raising grinding quality and grinding efficiency.
Working principle when work, opens inlet pipeline, and water enters top lap 1 via apopore 8, at this point, arranging operation
Rotating disk 9 is placed sequentially on lower abrasive disk 2 by personnel, then the product ground will be needed to be placed sequentially in the product through-hole 10
In, after the completion of the placement of all products, starting cylinder, cylinder drives 1 descending motion of top lap, grinds top lap 1 under
Mill 2 is clamped operation to rotating disk 9；Restart motor 11, at this point, the motor 11 will drive the rotation gear 5 to open
Beginning makes rotating motion, and drives the rotating disk 9 and product around rotating between the rotation gear 5 and grinding groove 13, realizes grinding
Piece 7 carries out grinding operation to product surface.
Above description is the detailed description for the preferable possible embodiments of the utility model, but embodiment is not limited to
The patent claim of the utility model, the same changes or modifications completed under technical spirit suggested by all the utility model
Change, should belong to the covered the scope of the patents of the utility model.
Claims (7)
1. a kind of diamond lap disk of semiconductor, including top lap (1) and lower abrasive disk (2), it is characterised in that: on described
Abrasive disk (1) and lower abrasive disk (2) are cyclic structure, are respectively arranged at the top lap (1) and lower abrasive disk (2) center
First shaft hole (3) and the second axis hole (4) are provided with rotation gear (5), the top lap (1) through second axis hole (4)
Several the first grooves are offered on lower abrasive disk (2), are provided with abrasive sheet (7) in several described first grooves；
Several apopores (8) are evenly arranged on the top lap (1), the lower abrasive disk (2) if on contact and be provided with
The periphery of dry rotating disk (9), the rotating disk (9) is equipped with teeth, the structure of the teeth and rotation gear (5) phase
Match, several product through-holes (10) are provided on the rotating disk (9).
2. a kind of diamond lap disk of semiconductor according to claim 1, it is characterised in that: the abrasive sheet (7) is
Diamond material.
3. a kind of diamond lap disk of semiconductor according to claim 1, it is characterised in that: the apopore (8) is equal
It is even to be distributed on the top lap (1).
4. a kind of diamond lap disk of semiconductor according to claim 1, it is characterised in that: the top lap (1)
It is identical with lower abrasive disk (2) size.
5. a kind of diamond lap disk of semiconductor according to claim 1, it is characterised in that: the abrasive sheet (7) is in
Annular is interspersed, and the abrasive sheet (7) diameter for being distributed in outmost turns and innermost circle is less than the grinding for being distributed in middle part
The diameter of piece (7).
6. a kind of diamond lap disk of semiconductor according to claim 1, it is characterised in that: the product through-hole (10)
For rectangular configuration, the product through-hole (10) is distributed in a ring.
7. a kind of a kind of grinding device of the diamond lap disk of semiconductor described in any one of -6 according to claim 1,
It is characterized by: the lower abrasive disk (2) is movably arranged in grinding groove (13), the grinding groove (13) and the lower abrasive disk
(2) insertion is provided with gear ring (12) between, and the gear on the gear ring (12) and the gear on the rotating disk (9) match
It closes, the lower abrasive disk (2), which matches, is provided with rotation gear (5), is fixedly installed motor on the rotation gear (5)
(11)；
It is provided with several support frames (15) above the top lap (1), is provided with support plate above support frame as described above (15)
(6), the support plate (6) is fixedly connected with connecting rod (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821736650.2U CN208961749U (en) | 2018-10-25 | 2018-10-25 | A kind of the diamond lap disk and grinding device of semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821736650.2U CN208961749U (en) | 2018-10-25 | 2018-10-25 | A kind of the diamond lap disk and grinding device of semiconductor |
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| Publication Number | Publication Date |
|---|---|
| CN208961749U true CN208961749U (en) | 2019-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821736650.2U Active CN208961749U (en) | 2018-10-25 | 2018-10-25 | A kind of the diamond lap disk and grinding device of semiconductor |
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| CN (1) | CN208961749U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113231919A (en) * | 2021-05-10 | 2021-08-10 | 南通瑞景光电科技有限公司 | Environment-friendly grinding process for optical element |
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2018
- 2018-10-25 CN CN201821736650.2U patent/CN208961749U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113231919A (en) * | 2021-05-10 | 2021-08-10 | 南通瑞景光电科技有限公司 | Environment-friendly grinding process for optical element |
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