CN208950159U - A kind of wall heatiing panel - Google Patents

A kind of wall heatiing panel Download PDF

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Publication number
CN208950159U
CN208950159U CN201821371387.1U CN201821371387U CN208950159U CN 208950159 U CN208950159 U CN 208950159U CN 201821371387 U CN201821371387 U CN 201821371387U CN 208950159 U CN208950159 U CN 208950159U
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CN
China
Prior art keywords
wallboard
heat
heat dissipating
dissipating layer
radiating fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201821371387.1U
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Chinese (zh)
Inventor
林海明
铁恒
李彦宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHEJIANG HONGBO NEW BUILDING MATERIALS CO Ltd
Original Assignee
ZHEJIANG HONGBO NEW BUILDING MATERIALS CO Ltd
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Filing date
Publication date
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Priority to CN201821371387.1U priority Critical patent/CN208950159U/en
Application granted granted Critical
Publication of CN208950159U publication Critical patent/CN208950159U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

This is practical in order to solve room different height uneven heating, the technical problems such as wallboard service life and heat energy loss devise a kind of wall heatiing panel, including wallboard base and the heating equipment of wallboard base side is set, it further include wallboard surface layer and heat dissipating layer, wallboard surface layer and wallboard base surround to form wallboard chamber, heating equipment and heat dissipating layer are located in wallboard chamber, heat dissipating layer is arranged in heating equipment close to metope side, heat dissipating layer includes the heat absorption area for covering heating equipment and the heat release zone for surrounding heat absorption area, radiating fin group is provided on heat release zone, the heating of originally centrally located heating equipment is subjected to each position that is balanced to the greatest extent and dividing to room by heat dissipating layer, by the distribution of the different length radiating fin on heat dissipating layer by certain heat transfer to different positions, to realize evenly distributing for room temperature, more It has mended warm gas and has risen the relatively low defect of brought room low altitude area temperature, solved the problems, such as the waste of energy.

Description

A kind of wall heatiing panel
Technical field
The utility model relates to wallboard design field more particularly to a kind of wall heatiing panels.
Background technique
With the development of modern Intelligent furniture and comfortableization furniture, people start to pursue the raising of quality of life, in the winter It, especially southern area is not carried out heating, in order to enable oneself possessing a comfortable living environment, people are often in A series of household heating measures such as middle installation floor heating, also have wall a corresponding heating, but hot-water heating used by heating or Person's electric heating can not fill up entire wall, if fill up wall not only results in a large amount of consumption in this way, but also can cause a system The security risk of column, so the prior art usually uses mosquito-repellent incense type or S type carries out laying heat source, such benefit is to maximize Use heat source, guarantee that the heat of Central District is sufficient, certainty also brings surrounding area heat source insufficiency in this way, and heat is not The problems such as foot, so as to cause the uneven in temperature of wallboard, and then brings the rupture of wallboard, and the service life is short.
Utility model content
The utility model devises a kind of wall heatiing panel, including wallboard base and setting to solve the above technical problem Heating equipment in wallboard base side, further includes wallboard surface layer and heat dissipating layer, the wallboard surface layer and the wallboard base Layer, which surrounds, forms wallboard chamber, and the heating equipment and the heat dissipating layer are located in the wallboard chamber, and the heat dissipating layer setting exists For the heating equipment close to metope side, the heat dissipating layer includes heat absorption area and the encirclement heat absorption for covering the heating equipment The heat release zone in area is provided with radiating fin group on the heat release zone.
As the preferred of the utility model, the radiating fin group includes multiple radiating fins, and the radiating fin is under And its upper height is gradually reduced, the altitude range of the radiating fin is 10mm ~ 60mm.
The heating equipment supplies heat on vertical metope as a result, by being arranged at it close to the wallboard surface layer One layer of the heat dissipating layer carries out heat dissipation and the reallocation of a part of heat, since thermal current has obviously in vertical direction Rise phenomenon, so warm gas can preferentially assemble upwards when room is heated, so the radiating fin is under And its upper height is gradually reduced so that the heat dissipation effect for the heat dissipating layer being located in wallboard bottom is as the increase of height gradually weakens, I.e. in the distribution of equal heat quantity, the heat distributed positioned at metope bottom is more, and the heat distributed at the top of metope is few, So as to realize more heating at room low altitude area, to make up the rising of warm gas so that at low altitude area temperature reduce lack It falls into, the heat-sinking capability of the radiating fin increases with the increase of the height of the radiating fin and ratio is higher, Zhi Daosuo After the height arrival 60mm for stating radiating fin, the direct ratio ratio of height and heat-sinking capability starts to reduce, so the heat dissipation Heat dissipation conversion ratio of the height of fin in 60mm is best.
As the preferred of the utility model, the wallboard surface layer is provided with heat dissipation blind hole close to the side of the heat dissipating layer, Thermofin is provided in the heat dissipation blind hole.
As the preferred of the utility model, the heat dissipating layer is made of graphene or metal material, the radiating fin It is affixed with the heat dissipating layer, multiple thermally conductive through-holes are offered on the heat dissipating layer.
It as the preferred of the utility model, is interconnected between the heat dissipation blind hole, the thermofin is from centre to two Side height is successively reduced in arithmetic progression.
As the preferred of the utility model, the heating equipment includes hot-water heating or heating wire heating.
As the preferred of the utility model, be provided with protrusion and pit below the heat absorption area, the heat absorption area with it is described One layer of cement is equipped between heating equipment.
The protrusion in the heat absorption area and pit, that is, heat absorption area increase with area on the heating equipment opposite face as a result, Greatly, so that endotherm area increases, to improve heat absorption efficiency, heat can be absorbed from the heating equipment faster and is used for Heating, one layer of thin cement is for protecting the heating equipment.
As the preferred of the utility model, the radiating fin is backwards to the wallboard surface layer and linear setting.
As the preferred of the utility model, a kind of wall heatiing panel, including wallboard base, heating equipment, wallboard surface layer and dissipate Thermosphere, the wallboard surface layer and the wallboard base surround to form wallboard chamber, and the heat dissipating layer is located at the institute in the wallboard chamber Heat dissipating layer is stated to be connected with the heating plant on floor or cooling fin.
As a result, using floor as the heating equipment of wallboard, by heat dissipating layer by a part of heat transfer in floor Into the room of different height corresponding to metope and metope.
As the preferred of the utility model, the heat dissipating layer principle metope side is provided with radiating fin group, the heat dissipation Fins set includes multiple radiating fins, its height is gradually reduced the radiating fin from bottom to top, the height of the radiating fin Range is 10mm ~ 60mm, and the radiating fin is arranged towards the wallboard surface layer.
The utility model has the following beneficial effects:
The utility model applicability is very strong, there is very big development prospect, and compared with prior art, the utility model is by dissipating Originally the heating of centrally located heating equipment is carried out each position that is balanced to the greatest extent and dividing to room by thermosphere, is led to The distribution of the different length radiating fin on heat dissipating layer is crossed by certain heat transfer to different positions, to realize room temperature Degree evenly distributes, and compensates for warm gas and rises the relatively low defect of brought room low altitude area temperature, solves energy Waste problem, while can be to provide heating demands in main life height living, additionally it is possible to prevent wallboard uneven heating and draw The loss of the life consumption and resource that rise.
Below by drawings and examples, the technical solution of the utility model is described in further detail.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model;
Fig. 2 is the schematic top plan view of the utility model;
Fig. 3 is the partial enlarged view of the utility model heat dissipation blind hole;
Fig. 4 is the structural schematic diagram of the utility model embodiment two;
In figure, 1- wallboard base, 2- heating equipment, 3- wallboard surface layer, 4- heat dissipating layer, 41- heat absorption area, the heat release zone 42-, 5- Wallboard chamber, 6- radiating fin group, 7- heat dissipation blind hole.
Specific embodiment
The utility model is described in further detail below in conjunction with attached drawing.
As shown in Figure 1,2 and 3, embodiment one, a kind of wall heatiing panel, including wallboard base 1 and setting are in the wall The heating equipment 2 of 1 side of plate base, it is characterised in that: it further include wallboard surface layer 3 and heat dissipating layer 4, the wallboard surface layer 3 and institute It states the encirclement of wallboard base 1 and forms wallboard chamber 5, the heating equipment 2 and the heat dissipating layer 4 are located in the wallboard chamber 5, described For the setting of heat dissipating layer 4 in the heating equipment 2 close to metope side, the heat dissipating layer 4 includes the heat absorption for covering the heating equipment 2 Area 41 and the heat release zone 42 for surrounding the heat absorption area 41, are provided with radiating fin group 6, the radiating fin on the heat release zone 42 Group 6 includes multiple radiating fins, its height is gradually reduced the radiating fin from bottom to top, the altitude range of the radiating fin For 10mm ~ 60mm, the heating equipment 2 supplies heat on vertical metope, by being arranged at it close to the wallboard surface layer 3 One layer of the heat dissipating layer 4 carries out heat dissipation and the reallocation of a part of heat, due to thermal current in vertical direction have it is bright Aobvious rise phenomenon, so warm gas can preferentially assemble upwards when room is heated, so the radiating fin is certainly Its lower and upper height is gradually reduced so that the heat dissipation effect for the heat dissipating layer being located in wallboard bottom is as the increase of height gradually subtracts Weak, i.e., in the distribution of equal heat quantity, the heat distributed positioned at metope bottom is more, and is located at the heat distributed at the top of metope It is few, so as to realize more heating at room low altitude area, to make up the rising of warm gas so that temperature reduces at low altitude area Defect, the heat-sinking capability of the radiating fin increases with the increase of the height of the radiating fin and ratio is higher, directly To after the height arrival 60mm of the radiating fin, the direct ratio ratio of height and heat-sinking capability starts to reduce, so it is described Heat dissipation conversion ratio of the height of radiating fin in 60mm is best, and the wallboard surface layer 3 is provided with close to the side of the heat dissipating layer 4 Radiate blind hole 7, is provided with thermofin in the heat dissipation blind hole 7.
In the present embodiment, the heat dissipating layer 4 is made of graphene or metal material, the radiating fin group 6 with it is described Heat dissipating layer 4 is affixed, and multiple thermally conductive through-holes are offered on the heat dissipating layer 4, are interconnected between the heat dissipation blind hole 7, the biography Hot fin is successively reduced from centre to both sides height in arithmetic progression, and the heating equipment 2 includes that hot-water heating or heating wire heat, It is provided with protrusion and pit below the heat absorption area 41, is equipped with a floor water between the heat absorption area 41 and the heating equipment 2 Mud, the protrusion in the heat absorption area 41 and pit, that is, heat absorption area 41 increase with area on 2 opposite face of heating equipment, so that Endotherm area increases, to improve heat absorption efficiency, can absorb heat from the heating equipment 2 faster and be used to heat, One layer of thin cement is for protecting the heating equipment 2, and the radiating fin is backwards to the wallboard surface layer 3 and linear setting.
Such as Fig. 4, embodiment two, a kind of wall heatiing panel, including wallboard base 1, heating equipment 2, wallboard surface layer 3 and heat dissipation Layer 4, the wallboard surface layer 3 and the wallboard base 1, which surround, forms wallboard chamber 5, and the heat dissipating layer 4 is located in the wallboard chamber 5 In, the heat dissipating layer 4 is connected with the heating plant on floor or cooling fin, using floor as the heating equipment 2 of wallboard, By heat dissipating layer 4 by the room of different height corresponding to a part of heat transfer to metope and metope in floor, institute It states 4 principle metope side of heat dissipating layer and is provided with radiating fin group 6, the radiating fin group 6 includes multiple radiating fins, described to dissipate Its height is gradually reduced hot fin from bottom to top, and the altitude range of the radiating fin is 10mm ~ 60mm, the radiating fin court It is arranged to the wallboard surface layer 3.
Embodiment described above is only that preferred embodiments of the present invention are described, not practical new to this The conception and scope of type is defined.Without departing from the design concept of the present utility model, ordinary people in the field is to this The all variations and modifications that the technical solution of utility model is made, should fall within the protection scope of the present utility model, this is practical Novel claimed technology contents, are all described in the claims.

Claims (10)

1. a kind of wall heatiing panel, heating equipment (2) including wallboard base (1) and setting in wallboard base (1) side, It is characterized by also including wallboard surface layer (3) and heat dissipating layer (4), the wallboard surface layer (3) and the wallboard base (1) are surrounded It is formed wallboard chamber (5), the heating equipment (2) and the heat dissipating layer (4) are located at the heat dissipating layer in the wallboard chamber (5) (4) in the heating equipment (2) close to metope side, the heat dissipating layer (4) includes the suction for covering the heating equipment (2) for setting Hot-zone (41) and the heat release zone (42) for surrounding heat absorption area (41), are provided with radiating fin group (6) on the heat release zone (42).
2. a kind of wall heatiing panel according to claim 1, it is characterised in that: the radiating fin group (6) includes multiple dissipates Hot fin, its height is gradually reduced the radiating fin from bottom to top, and the altitude range of the radiating fin is 10mm ~ 60mm.
3. a kind of wall heatiing panel according to claim 1, it is characterised in that: the wallboard surface layer (3) is close to the heat dissipation The side of layer (4) is provided with heat dissipation blind hole (7), is provided with thermofin in the heat dissipation blind hole (7).
4. a kind of wall heatiing panel according to claim 1, it is characterised in that: the heat dissipating layer (4) is by graphene or gold Belong to material to be made, the radiating fin group (6) and the heat dissipating layer (4) are affixed, offer on the heat dissipating layer (4) multiple thermally conductive Through-hole.
5. a kind of wall heatiing panel according to claim 3, it is characterised in that: it is interconnected between the heat dissipation blind hole (7), The thermofin is successively reduced from centre to both sides height in arithmetic progression.
6. a kind of wall heatiing panel according to claim 1, it is characterised in that: the heating equipment (2) include hot-water heating or Heating wire heating.
7. a kind of wall heatiing panel according to claim 1, it is characterised in that: be provided with protrusion below the heat absorption area (41) And pit, a floor cement is equipped between the heat absorption area (41) and the heating equipment (2).
8. a kind of wall heatiing panel according to claim 2, it is characterised in that: the radiating fin is backwards to the wallboard surface layer (3) and linearly it is arranged.
9. a kind of wall heatiing panel, it is characterised in that: including wallboard base (1), heating equipment (2), wallboard surface layer (3) and heat dissipating layer (4), the wallboard surface layer (3) and the wallboard base (1), which surround, forms wallboard chamber (5), and the heat dissipating layer (4) is located at described In wallboard chamber (5), the heat dissipating layer (4) is connected with the heating plant on floor or cooling fin.
10. a kind of wall heatiing panel according to claim 9, it is characterised in that: heat dissipating layer (4) the principle metope side is set It is equipped with radiating fin group (6), the radiating fin group (6) includes multiple radiating fins, it is high from bottom to top for the radiating fin Degree is gradually reduced, and the altitude range of the radiating fin is 10mm ~ 60mm, and the radiating fin is towards the wallboard surface layer (3) Setting.
CN201821371387.1U 2018-08-24 2018-08-24 A kind of wall heatiing panel Expired - Fee Related CN208950159U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821371387.1U CN208950159U (en) 2018-08-24 2018-08-24 A kind of wall heatiing panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821371387.1U CN208950159U (en) 2018-08-24 2018-08-24 A kind of wall heatiing panel

Publications (1)

Publication Number Publication Date
CN208950159U true CN208950159U (en) 2019-06-07

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821371387.1U Expired - Fee Related CN208950159U (en) 2018-08-24 2018-08-24 A kind of wall heatiing panel

Country Status (1)

Country Link
CN (1) CN208950159U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109162405A (en) * 2018-08-24 2019-01-08 浙江宏博新型建材有限公司 A kind of wall heatiing panel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109162405A (en) * 2018-08-24 2019-01-08 浙江宏博新型建材有限公司 A kind of wall heatiing panel

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CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20190607

Termination date: 20200824