CN208922057U - Curved substrate with surface groove structure - Google Patents
Curved substrate with surface groove structure Download PDFInfo
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- CN208922057U CN208922057U CN201821280323.0U CN201821280323U CN208922057U CN 208922057 U CN208922057 U CN 208922057U CN 201821280323 U CN201821280323 U CN 201821280323U CN 208922057 U CN208922057 U CN 208922057U
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- curved substrate
- groove structure
- substrate
- pattern
- curved
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Abstract
The utility model discloses a kind of curved substrates with surface groove structure, it include: a curved substrate, the surface of the curved substrate has the pattern of at least one groove structure, and the resolution ratio of the pattern, between 0.1-100 microns, the curved substrate with surface groove structure of the utility model, which has, can be achieved patterning, low cost, pattern high-resolution.
Description
Technical field
The utility model is about a kind of curved substrate, especially with regard to a kind of curved surface base with surface groove structure
Plate.
Background technique
Currently, intelligent device such as smartphone, smart watch, intelligent medical equipment etc., is all collocated with large-size screen monitors
Curtain allows user to watch the information on screen.These devices with large screen gradually all move towards individual character other than powerful
Change, beautiful shape-designing, including appearance, shape, color etc..These must all pass through the shelling machine for making us appreciating and manufacture
To realize.And currently, curving shell moulding, especially attractive, it is increasingly becoming the following trend of intelligent device.
Currently, making for the pattern of the curving shell of intelligent device, there are following several engineering methods: the first public law:
Transfer technique by the plane pattern of pre-production, then is transferred to the curved surface of target, and the processing cost of such engineering method is low, but adds
Work speed is slow, material cost is high, and the lines resolution ratio of pattern is poor.Second of engineering method: ink-jet+laser engraving, by ink-jet side
Pigment is sprayed onto the curved surface of target by method, then is carved pattern by way of laser engraving, and such engineering method processing cost is high and adds
Work speed is slow, and equipment cost is also very high, and material cost is also high, and advantage is the lines high resolution of pattern, (micro- up to 20um
Rice).The third engineering method: if Chinese patent CN205318085U is exposed with curved surface light shield, developing manufacture process, to realize
The pattern of curving shell makes, and has the advantages that the cost of material is low, the lines high resolution of pattern, processing procedure are simple；It is lacked
Point is that must still use curved surface light shield.
Therefore, how to develop and be provided simultaneously with that processing cost is low, process velocity is fast, the cost of material is low, the lines of pattern
The multiple advantage of high resolution, and the technology of multicolour pattern can be produced on curved surface shell, become intelligent device manufacturer
The developing direction hoped for.
Utility model content
To reach above-mentioned purpose, the utility model provides a kind of curved substrate with surface groove structure, with sharp
Light direct write image technology (Laser Direct Imaging, LDI) and photoresist processing procedure use photoresist processing procedure to need to solve over
The problem of light shield, is realized without light shield, processing procedure is simple, high resolution, low cost special technique effect.
The utility model provides a kind of curved substrate with surface groove structure, comprising: a curved substrate, the curved surface
The surface of substrate has the pattern of at least one groove structure, and the resolution ratio of the pattern is between 0.1-100 microns (um).
For the above and other objects, features and advantages of the utility model can be clearer and more comprehensible, be cited below particularly it is several compared with
Good embodiment, and cooperate institute's accompanying drawings, it is described in detail below (embodiment).
Detailed description of the invention
Fig. 1 is an implementation of the production method flow chart of the curved substrate with surface groove structure of the utility model
Example.
Fig. 2A -2L is the method stream for the curved substrate (internal layer surface) that production has surface groove structure in the utility model
The section (along A-A hatching) and top view of curved substrate in journey figure and each process.
Fig. 3 A-3L is the method stream for the curved substrate (superficies) that production has surface groove structure in the utility model
The section (along A-A hatching) and top view of curved substrate in journey figure and each process.
Symbol description in attached drawing:
10: curved substrate；11: groove；2: part；20: photoresist layer；201: unexposed portion；202: exposed portion；21:
Groove；30: laser direct-writing camera；31: laser；40: spray head；41: Protective coatings；50: protective film.
Specific embodiment
Embodiment according to the present utility model, the utility model provide a kind of curved substrate with surface groove structure
And preparation method thereof, it is to come with laser direct-writing image technology (Laser Direct Imaging, LDI) and photoresist processing procedure
It solves the problems, such as over and needs light shield with photoresist processing procedure, realize without light shield, processing procedure is simple, high resolution, low cost spy
Different technical effect.
It please refers to shown in Fig. 1 and Fig. 2A -2H, is the production of the curved substrate with surface groove structure of the utility model
In method, the section of the method flow diagram and the curved substrate in each process with the curved substrate of surface groove structure is made
(along A-A hatching) and top view.Fig. 1 and Fig. 2A -2L that will arrange in pairs or groups simultaneously below is illustrated.This is with surface groove structure
The production method of curved substrate includes:
Step 101: forming a photoresist layer on the surface of a curved substrate.This step is shown in Fig. 2A -2C, in curved surface
In the internal layer surface of substrate 10, photoresist layer 20 is formd.
Step 102: being exposed with laser direct-writing imaging modality on the photoresist layer, to form an at least pattern.This reality
With in a novel preferred embodiment, use laser luminescence diode (Laser Diode), the wavelength of laser source is between 250-
450 nanometers (nm), preferably between 300-450 nanometers.Therefore, this laser source can be directly to light used by the utility model
The material (minus photoresist) of resistance layer 20 is exposed.This step is to be sent out shown in Fig. 2 D-2F with laser direct-writing camera 30
The laser 31 penetrated, directly in the movement being exposed on photoresist layer 20, to constitute the exposed portion 202 and unexposed portion of pattern
201, as shown in the part of 2 amplification of part of Fig. 2 E, 2F.Come directly by laser direct-writing image technology (LDI) to photoresist layer 20
The exposure for carrying out part can reach the special technique effect saved fabrication procedures with reach high-resolution pattern.
After the laser beam that laser direct-writing camera 30 issues passes through collimator and extender device, then via horizontal and weight d-axis scanning vibration
Mirror focuses to 20 surface of photoresist layer, the platform of high speed feed of arranging in pairs or groups, it can be achieved that large-area scanning 20 material surface of photoresist layer
Pattern forming processing procedure.Laser facula Duplication will affect its 20 surface topography of photoresist layer.Influence laser beam overlap ratio factor include
Laser scan rate, laser pulse repetition frequency, laser spot diameter and hot spot occlusion distance (Bs).When laser pulse repeats frequency
When rate is higher, laser beam overlap ratio is higher, and can reduce as feed speed increases its laser beam overlap ratio.
The utility model be used to be supplied to the laser direct-writing camera 30 laser source include traditional solid-state laser (such as
Nd-YAG or Fiber Laser), gas laser, excimer laser, femtosecond laser, picosecond laser, laser luminescence diode
(Laser Diode) etc..Wherein, the wavelength of laser source is between 250-450 nanometers (nm), preferably between 300-450 nanometers.
It, can be with using the femtosecond laser (Femtosecond laser) of near infrared light in one embodiment of the utility model
The resolution of laser pattern technology is improved, and is quickly molded directly within pattern on substrate using laser writing technology.
Wherein, the resolution ratio of laser direct-writing camera 30 can be between 0.1-100 microns (um).In other words, exposure portion
Points 202 width is between 0.1-100 microns (um)；21 depth of groove of pattern is between 0.1-100 microns (um)
(that is, thickness of pattern).Exposed portion 202 specifically, in the embodiment of Fig. 2A -2L, the surface location of curved substrate 10
Positioned at two sides, therefore, visually wide exposed portion 202 is formed, must just control the exposed portion 202 in different location
Between spacing and exposed portion 202 itself width (resolution ratio).This point, can be by the scalability of laser direct-writing camera 30
To reach.Pattern after having made is as shown in Fig. 2 E, 2F.
Step 103: developing to the photoresist layer, make the curved substrate to remove the part that the photoresist layer is not exposed
Surface on formed have an at least pattern the photoresist layer.As shown in Figure 2 G, with minus photoresist developer solution to photoresist layer 20
After being developed, the unexposed portion 201 not being exposed will be removed, and leave exposed portion 202.And there is an at least figure
In the photoresist layer 20 of case, pattern therein is made of exposed portion 202.
Step 104: the curved substrate being etched, in forming an at least pattern on the surface of the curved substrate.
As illustrated in figure 2h, under the groove 21 of photoresist layer 20, since it is not covered by photoresist layer 20, liquid can be etched and etched.
Etching solution is etching solution needed for selecting to correspond to the material of curved substrate 10.As glass curve substrate, sapphire curved substrate,
Ceramic curved substrate, plastic curved surface substrate or the corresponding etching solution of polymer composite curved substrate are different from.It has etched
Afterwards, i.e., as illustrated in figure 2h, it will will form on curved substrate 10 groove 11 (as shown in figure 2i), and curved surface base is formed in by groove 11
Surface groove structure on plate 10.
Step 105: removing the photoresist layer.After removing photoresist layer 20, i.e. state shown in composition Fig. 2 I.Entire curved substrate
On 10, the surface groove structure constituted by the formation of groove 11 is further comprised.The surface groove structure that groove 11 is constituted
Pattern thickness can be between 0.1-100 microns (um) and the pattern resolution between groove 11 can be between 0.1-100 microns
(um) between, preferably between 0.5-100 microns, better between 1-100 microns.
Step 106: forming a protective film on this at least surface of the curved substrate of a pattern.Such as Fig. 2 J-2K
Shown, finally in forming protective film 50 on the surface of the curved substrate 10 with an at least pattern, the mode of formation can be used
Spray head 40 shown in Fig. 2 J carries out the coating of Protective coatings 41, is perhaps coated or is used using method of spin coating
Other methods carry out the coating of Protective coatings 41.Wherein, it is thin to can be a carborundum films layer, borazon for protective film 50
Film layer, oxide film layer, an aluminum oxide film layer, a zirconia film layer or other protective layers with high rigidity
All may be used.After coating, then the solidification (UV photocuring, heat cure ...) of Protective coatings 41 is carried out, the system of protective film 50 can be completed
Make, as shown in figure 2k.Finally, the curved substrate 10 for the patterning that can be completed as shown in figure 2l.
Embodiment shown in Fig. 2A -2L is can to realize surface groove structure fabrication in the inner surface of curved substrate 10
It patterns, without special techniques effects such as light shield, low cost, pattern high-resolution.
Hereinafter, will illustrate the utility model by surface groove structure fabrication in the specific implementation of the outer surface of curved substrate 10
Example, please refers to shown in Fig. 3 A-3L.Fig. 3 A-3F can correspond respectively to embodiment shown in Fig. 2A -2L, and the difference of the two is only that
Embodiment shown in Fig. 3 A-3L is that photoresist layer 20 is formed in the outer surface of curved substrate 10, and embodiment shown in Fig. 2A -2F
For the inner surface that photoresist layer 20 is formed in curved substrate 10, remaining technical characteristic is identical.Therefore, no longer superfluous below
It states.
The embodiment as shown in Fig. 2A -2L and Fig. 3 A-3L is it is found that the surface groove structure of the utility model can be made in song
Inner surface, outer surface or the inner surface of face substrate 10 and outer surface all make.
In addition, curved substrate is also selected from one of following substrate: a transparent glass curved substrate, a transparent sapphire curved surface
Substrate, a crystalline ceramics curved substrate, a transparent plastic curved substrate and a transparent polymer composite material curved substrate.
As seen from the above embodiment, the production method of the curved substrate with surface groove structure of the utility model is made
The curved substrate with surface groove structure made, comprising: the surface of a curved substrate, the curved substrate has at least one recessed
The pattern of slot structure, and the resolution ratio of the pattern is between 0.1-100 microns (um), preferably between 0.5-100 micron
Between, better between 1-100 microns.The thickness of pattern is between 0.1-100 microns (um).
Although the technology contents of the utility model have been disclosed above in the preferred embodiment, it is not limited to this
Utility model, it is any to be familiar with this those skilled in the art, do not depart from the utility model spirit make it is a little change and retouch, should all contain
It is placed in the scope of the utility model, therefore the protection scope of the utility model works as what the claim depending on appended by was defined
Subject to.
Claims (8)
1. a kind of curved substrate with surface groove structure characterized by comprising a curved substrate, the curved substrate
Surface has the pattern of at least one groove structure, and the resolution ratio of the pattern is between 0.1-100 microns.
2. as described in claim 1 with the curved substrate of surface groove structure, which is characterized in that the wherein resolution of the pattern
Rate is between 0.5-100 microns.
3. as described in claim 1 with the curved substrate of surface groove structure, which is characterized in that the wherein resolution of the pattern
Rate is between 1-100 microns.
4. as described in claim 1 with the curved substrate of surface groove structure, which is characterized in that wherein the curved substrate selects
From one of following substrate: a glass curve substrate, a sapphire curved substrate, ceramic a curved substrate, a plastic curved surface substrate
An or polymer composite curved substrate.
5. as described in claim 1 with the curved substrate of surface groove structure, which is characterized in that wherein the curved substrate selects
From one of following substrate: a transparent glass curved substrate, a transparent sapphire curved substrate, a crystalline ceramics curved substrate, one
Transparent plastic curved substrate or a transparent polymer composite material curved substrate.
6. as described in claim 1 with the curved substrate of surface groove structure, which is characterized in that the wherein depth of the pattern
Between 0.1-100 microns.
7. as described in claim 1 with the curved substrate of surface groove structure, which is characterized in that further include: a protective film,
The protective film is formed on the surface of the curved substrate of the pattern at least one groove structure.
8. as claimed in claim 7 with the curved substrate of surface groove structure, which is characterized in that the wherein protective film are as follows:
In one carborundum films layer, borazon film layer, oxide film layer, an aluminum oxide film layer or a zirconia film layer
One of which.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821280323.0U CN208922057U (en) | 2018-08-09 | 2018-08-09 | Curved substrate with surface groove structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821280323.0U CN208922057U (en) | 2018-08-09 | 2018-08-09 | Curved substrate with surface groove structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208922057U true CN208922057U (en) | 2019-05-31 |
Family
ID=66702594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821280323.0U Active CN208922057U (en) | 2018-08-09 | 2018-08-09 | Curved substrate with surface groove structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208922057U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112346297A (en) * | 2019-08-06 | 2021-02-09 | Oppo广东移动通信有限公司 | Electronic equipment 3D rear cover, manufacturing method of electronic equipment 3D rear cover and electronic equipment |
-
2018
- 2018-08-09 CN CN201821280323.0U patent/CN208922057U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112346297A (en) * | 2019-08-06 | 2021-02-09 | Oppo广东移动通信有限公司 | Electronic equipment 3D rear cover, manufacturing method of electronic equipment 3D rear cover and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211109 Address after: 402760 No. 8, Shuangxing Avenue, Biquan street, Bishan District, Chongqing (independent commitment) Patentee after: Chongqing Hengyu Electronic Material Co.,Ltd. Address before: No. 5, Lane 68, Aikou Fifth Street, Zhubei City, Hsinchu County, Taiwan, China Patentee before: Xu Mingan Patentee before: Weng Peixi |
|
| TR01 | Transfer of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Curved substrate with surface groove structure Effective date of registration: 20220801 Granted publication date: 20190531 Pledgee: Chongqing Liangshan Industrial Investment Co.,Ltd. Pledgor: Chongqing Hengyu Electronic Material Co.,Ltd. Registration number: Y2022990000496 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |