CN208908176U - Drum chip inductor and electronic equipment - Google Patents

Drum chip inductor and electronic equipment Download PDF

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Publication number
CN208908176U
CN208908176U CN201821484160.8U CN201821484160U CN208908176U CN 208908176 U CN208908176 U CN 208908176U CN 201821484160 U CN201821484160 U CN 201821484160U CN 208908176 U CN208908176 U CN 208908176U
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Prior art keywords
fixed
chip inductor
solder joint
metal pins
blade
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CN201821484160.8U
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Chinese (zh)
Inventor
陈楚彬
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Shenzhen Union Magnetic Technology Co Ltd
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Individual
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Abstract

The utility model discloses a kind of drum chip inductor and electronic equipments, wherein the drum chip inductor includes magnetic core, the enameled wire for being around in the magnetic core side and two metal pins being fixed on a blade of the magnetic core, and each metal pins include the fixed part fixed with the blade and contact the haptic element portion be connected with external circuit cooperation;Wherein, it sets to seal there are two solder joint on the blade of the fixed fixed part and hides structure, each solder joint envelope hiding structure corresponds to the solder joint on the Feng Zangyi fixed parts, two fixed parts are distinguished corresponding solder joint envelope hiding structure cooperation and are fixed, and the one side backwards to the blade in two haptic element portions is in same plane.The problem of the utility model solves in the prior art, and plug-in unit pin and the circuit board contacts difficulty of drum inductance and the pad of chip inductor float height and be easy to fall off.

Description

Drum chip inductor and electronic equipment
Technical field
The utility model relates to inductance applied technical fields, more particularly to a kind of drum chip inductor and electronic equipment.
Background technique
Drum inductance or chip inductor, be with insulated conductor (such as enameled wire, cotton-covered wire, modeling rubber-insulated wire) in insulation framework or Electromagnetic induction element made of coiling on magnetic core, belongs to common inductance element.Drum inductance or chip inductor can lead to direct current Resistance exchange, to AC signal carry out Isolation or with the composition resonance circuit such as capacitor, resistor.Drum inductance or patch Any electric current of inductance in circuit, can all generate magnetic field, and the magnetic flux in magnetic field acts on circuit again.
Drum inductance in the prior art is to be cooperated using plug-in unit pin and circuit board guide pinhole inductance is connected, plugged The pin of formula needs to align when injecting the guide pinhole of circuit board, error is easy in process, and the solder joint of pin protrudes The upper surface of magnetic core blade (floating height), it is easy to fall off.Chip inductor in the prior art needs electrosilvering or other metal materials Material is as patch, and process is more many and diverse, and cost is relatively high.Problem above has seriously affected the development of inductance industry, this Kind situation needs to change.
Utility model content
The utility model embodiment provides a kind of drum chip inductor and electronic equipment, to solve in the prior art, drum The leg of plug-in unit inductance is easy to fall off and chip inductor needs that patch is electroplated, so that the problem of process many and diverse high expensive.
In order to solve the above technical problems, the first technical solution that the utility model embodiment uses is as follows:
A kind of drum chip inductor comprising magnetic core is around in the enameled wire of the magnetic core side and is fixed on the magnetic core A blade on two metal pins, each metal pins include the fixed part fixed with the blade and with outside The haptic element portion of circuit cooperation contact conducting;Wherein, the fixed part of each metal pins and haptic element portion are in bending, Gu It is set on the blade of the fixed fixed part there are two solder joint envelope hiding structure, each solder joint envelope hiding structure corresponds to Feng Zangyi Solder joint on the fixed part, two fixed parts are distinguished corresponding solder joint envelope hiding structure cooperation and are fixed, and two The one side backwards to the blade in the haptic element portion is in same plane.
In order to solve the above technical problems, the second technical solution that the utility model embodiment uses is as follows:
A kind of electronic equipment comprising circuit board, the circuit board include above-mentioned drum chip inductor.
The beneficial effect of the utility model embodiment is: being in contrast to the prior art, the utility model embodiment is logical It crosses and two solder joints envelope hiding structures is set on the blade of the fixation fixed part, each solder joint envelope hiding structure corresponds to Feng Zangyi admittedly Determine the solder joint in portion, two fixed parts are distinguished corresponding solder joint envelope hiding structure cooperation and fixed, the back in two haptic element portions Be in same plane to the one side of the blade, solve in the prior art, the leg of drum plug-in unit inductance be easy to fall off and Chip inductor needs that patch is electroplated, so that the problem of process many and diverse high expensive.
Detailed description of the invention
Fig. 1 is a kind of overall structure section signal of one embodiment of drum chip inductor of the utility model embodiment Figure;
Fig. 2 is a kind of overall structure section of the magnetic core of one embodiment of drum chip inductor of the utility model embodiment Schematic diagram;
Fig. 3 is a kind of overall structure top view of one embodiment of drum chip inductor of the utility model embodiment;
Fig. 4 is the overall structure frame diagram of one embodiment of a kind of electronic equipment of the utility model embodiment.
Specific embodiment
Embodiment one
Fig. 1, Fig. 2 and Fig. 3 are please referred to, Fig. 1 is that the overall structure of the drum chip inductor 100 of the utility model embodiment is cutd open Face schematic diagram, Fig. 2 are the overall structure diagrammatic cross-sections of the magnetic core 10 of the drum chip inductor 100 of the utility model embodiment, Fig. 3 is the overall structure top view of the drum chip inductor 100 of the utility model embodiment, can be obtained in conjunction with Fig. 1, Fig. 2 and Fig. 3 It arrives, a kind of drum chip inductor 100 of the utility model embodiment comprising magnetic core 10, the paint for being around in 10 side of magnetic core Two metal pins 30 envelope curve 20 (can also be other insulated conductors) and be fixed on a blade 11 of the magnetic core 10, often A metal pins 30 include the fixed part 32 fixed with the blade 11 and contact the haptic element be connected with external circuit cooperation Portion 31.Wherein, the fixed part 32 and the haptic element portion 31 are integrally formed, and are mutually conducted.
Wherein, the fixed part 32 of each metal pins 30 and haptic element portion 31 are in bending, the fixed fixation It is set on the blade 11 in portion 32 there are two 321 envelope of solder joint hiding structure, each 321 envelope of solder joint hiding structure corresponds to Feng Zangyi Solder joint 321 on the fixed part 32, two fixed parts 32 distinguish corresponding 321 envelope of solder joint hiding structure cooperation Fixed, the one side backwards to the blade 11 in two haptic element portions 31 is in same plane.
In the present embodiment, optionally, the magnetic core 10 backwards in the haptic element portion 31 of two metal pins 30 One side be plane, and the haptic element portion 31 of two metal pins 30 is symmetrical about the center line of the magnetic core 10.
In the present embodiment, optionally, center of two 321 envelope of solder joint hiding structures about the corresponding blade 11 Symmetrical, 321 envelope of solder joint hiding structure is stepped groove 12, and the stepped groove 12 includes inside groove 122 and outer groove 121, described Inside groove 122 and the fixed part 32 cooperation are fixed, wherein the positive terminal of the enameled wire 20 winds the metal pins 30 Fixed part 32, the negative pole end of the enameled wire 20 winds the fixed part 32 of another metal pins 30.The fixation The position of the winding enameled wire 20 in portion 32 is fixed and is connected by scolding tin, and the position of the scolding tin is just solder joint 321.
Wherein, insulating bodies 40 is intensively filled between the metal pins 30 and the inner wall of the outer groove 121, it is described exhausted Edge object 40 hides the inside groove 122 for sealing.
In the present embodiment, optionally, the insulating bodies 40 is UV glue, that is to say quick-drying gelatin, this glue adherence force Strong solidification is fast, and the fixed part of the metal pins 30 32 rapidly can be all fixed on to 121 the inside of outer groove.In this way, described The solder joint 321 of metal pins 30 just ensconces 122 the inside of inside groove by UV glue envelope, not will receive the interference of external force and falls off.
In the present embodiment, optionally, the shape of the inside groove 122 and the outer groove 121 is cylindrical, the inside groove The center line of 122 center line and the outer groove 121 is same center line, namely the preferably described inside groove 122 and the outer groove 121 Opening be circle, and two circles be concentric circles.This structure is easily worked, and can save processing technology cost, And the appearance of this structure is very beautiful.
In the present embodiment, optionally, corresponding described in the haptic element portion 31 of two metal pins 30 Blade 11 (for plane) is parallel, is conducive to the haptic element portion 31 in this way with the external circuit board contact equilibrium.Each metal The rectangular shape of the fixed part 32 of pin 30 and the haptic element portion 31.Preferably, the shape of the metal pins 30 is L shape Shape, and haptic element portion 31 be it is flat, at least contact surface of haptic element portion 31 and the external circuit board is plane, such haptic element portion 31 with The area of the external circuit board contact just will increase, and contact the external circuit board will be very stable, and turn-on effect will be more preferable.
In the present embodiment, optionally, be wrapped in the fixed part 32 the enameled wire 20 be located at the inside groove 122 it Interior, a part of the fixed part 32 forms the solder joint 321 by melting the positive/negative extreme fixation of tin and the enameled wire 20.
In the present embodiment, optionally, the haptic element portion 31 of two metal pins 30 is spaced each other insulation, avoids Two contacts of haptic element portion 31 lead to short circuit problem.
In the present embodiment, optionally, the inner wall of the inside groove 122 and the outer groove 121 is equipped with anti-skid chequer (in figure not Mark), this anti-skid chequer facilitates the fixation of UV glue and the outer groove 121.
The utility model embodiment on the blade 11 of the fixation fixed part 32 by being arranged two 321 Feng Zangjie of solder joint Structure, each 321 envelope of solder joint hiding structure correspond to the solder joint 321 on Feng Zangyi fixed part 32, and two fixed parts 32 are right with it respectively 321 envelope of the solder joint hiding structure cooperation answered is fixed, and the one side backwards to the blade 11 in two haptic element portions 31 is in same flat Face solves in the prior art, and the leg of drum plug-in unit inductance is easy to fall off and chip inductor needs that patch is electroplated, so that work The problem of sequence many and diverse high expensive.
Embodiment two
Referring to Fig. 4, Fig. 4 is the overall structure frame diagram of a kind of electronic equipment of the utility model embodiment, with reference to Fig. 4 It can be seen that a kind of electronic equipment 300 of the utility model comprising circuit board 200, the circuit board 200 include embodiment Drum chip inductor 100 described in one.Wherein, the electronic equipment 300 includes at least one circuit board 200, the circuit board 200 Including at least a drum chip inductor 100.Since the drum chip inductor 100 has carried out in detail in example 1 Thin explanation, this will not be repeated here.
The electronic equipment 300 of the utility model embodiment comprising circuit board 200, the drum patch which includes Piece inductance 100, the drum chip inductor 100 seal hiding structure by the way that two solder joints are arranged on the blade of the fixation fixed part, Each solder joint envelope hiding structure corresponds to the solder joint on Feng Zangyi fixed part, and two fixed parts distinguish corresponding solder joint Feng Zangjie Structure cooperation is fixed, and the one side backwards to the blade in two haptic element portions is in same plane, is solved in the prior art, work The leg of type plug-in unit inductance is easy to fall off and chip inductor needs that patch is electroplated, so that the problem of process many and diverse high expensive.
The foregoing is merely the embodiments of the present invention, and therefore it does not limit the scope of the patent of the utility model, all It is equivalent structure or equivalent flow shift made based on the specification and figures of the utility model, directly or indirectly uses In other related technical areas, it is also included in the patent protection scope of the utility model.

Claims (10)

1. a kind of drum chip inductor, which is characterized in that including magnetic core, be around in the enameled wire of the magnetic core side and be fixed on institute State two metal pins on a blade of magnetic core, each metal pins include the fixed part fixed with the blade and The haptic element portion of conducting is contacted with external circuit cooperation;
Wherein, the fixed part of each metal pins and haptic element portion are in bending, the leaf of the fixed fixed part On piece is set there are two solder joint envelope hiding structure, and each solder joint envelope hiding structure corresponds to the solder joint on the Feng Zangyi fixed parts, Two fixed parts are distinguished the structure cooperation of corresponding solder joint envelope hiding and are fixed, two haptic element portions backwards to described The one side of blade is in same plane.
2. drum chip inductor according to claim 1, which is characterized in that two solder joint envelope hiding structures are about corresponding The blade central symmetry distribution, solder joint envelope hiding structure is stepped groove, and the stepped groove includes inside groove and outer groove, institute It states inside groove and fixed part cooperation is fixed, wherein the positive terminal of the enameled wire winds the fixation of the metal pins Portion, the negative pole end of the enameled wire wind the fixed part of another metal pins;
Wherein, insulating bodies is intensively filled between the metal pins and the inner wall of the outer groove, the insulating bodies is used for Envelope hides the inside groove.
3. drum chip inductor according to claim 2, which is characterized in that the insulating bodies is UV glue.
4. drum chip inductor according to claim 2, which is characterized in that the shape of the inside groove and the outer groove is in It is cylindric.
5. drum chip inductor according to claim 2, which is characterized in that the center line of the inside groove and the outer groove Center line is same center line.
6. drum chip inductor according to claim 1, which is characterized in that the haptic element portion of two metal pins The corresponding blade is parallel, the fixed part of each metal pins and the rectangular shape in haptic element portion.
7. drum chip inductor according to claim 1, which is characterized in that the haptic element portion of two metal pins The one side backwards to the magnetic core be plane, and center line of the haptic element portion of two metal pins about the magnetic core Symmetrically.
8. drum chip inductor according to claim 2, which is characterized in that be wrapped in the enameled wire of the fixed part Within the inside groove, the fixed part forms the solder joint by melting the positive/negative extreme fixation of tin and the enameled wire.
9. drum chip inductor according to claim 1, which is characterized in that the haptic element portion of two metal pins It is spaced each other insulation.
10. a kind of electronic equipment, which is characterized in that it includes circuit board, and the circuit board includes any one of claim 1~9 The drum chip inductor.
CN201821484160.8U 2018-09-10 2018-09-10 Drum chip inductor and electronic equipment Active CN208908176U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821484160.8U CN208908176U (en) 2018-09-10 2018-09-10 Drum chip inductor and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821484160.8U CN208908176U (en) 2018-09-10 2018-09-10 Drum chip inductor and electronic equipment

Publications (1)

Publication Number Publication Date
CN208908176U true CN208908176U (en) 2019-05-28

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CN201821484160.8U Active CN208908176U (en) 2018-09-10 2018-09-10 Drum chip inductor and electronic equipment

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112097379A (en) * 2020-09-19 2020-12-18 深圳市吉天成科技有限公司 Water supplement instrument circuit control panel, control method and water supplement instrument

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112097379A (en) * 2020-09-19 2020-12-18 深圳市吉天成科技有限公司 Water supplement instrument circuit control panel, control method and water supplement instrument

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Effective date of registration: 20190704

Address after: 518000 Building A and B, No. 18 Chaoyang Road, Yanchuan, Songgang Street, Baoan District, Shenzhen City, Guangdong Province

Patentee after: Shenzhen union Magnetic Technology Co., Ltd.

Address before: 518000 Bao'an District, Shenzhen City, Guangdong Province, 2705, Zhongzhou Huafu Building

Patentee before: Chen Chubin