CN208895077U - A kind of inverter power semiconductor devices pin apparatus for bending - Google Patents
A kind of inverter power semiconductor devices pin apparatus for bending Download PDFInfo
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- CN208895077U CN208895077U CN201821715669.9U CN201821715669U CN208895077U CN 208895077 U CN208895077 U CN 208895077U CN 201821715669 U CN201821715669 U CN 201821715669U CN 208895077 U CN208895077 U CN 208895077U
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- bending
- pedestal
- pin
- inverter power
- power semiconductor
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Abstract
The utility model discloses a kind of inverter power semiconductor devices pin apparatus for bending, it is connect including pedestal and with pedestal and can be overturn around pedestal and be covered on the bending pressing plate on pedestal, the inverter power semiconductor devices includes device body and the pin that connect with device body, positioning groove is offered on the pedestal, the device body is matched with positioning groove, the pin extends to outside pedestal, the bending boss for bending pin is provided on the bending pressing plate, it further include being connect with pedestal and being overturn around pedestal and be covered on positioning pressuring plate on pedestal, the positioning pressuring plate includes the compression lug boss that can cooperate with inverter power contact of semiconductor device.The utility model structure is simple, easy to operate, when can make bending; device position is fixed, and guarantees bending precision and installation requirement, and the utility model can once-through operation complete the pin bendings of multiple devices; operating efficiency is improved, and uses antistatic material effective protection device.
Description
Technical field
The utility model belongs to electronic device processing technique field, and in particular to a kind of inverter power semiconductor devices
Pin apparatus for bending.
Background technique
In the prior art, it for the pin bending of inverter power semiconductor devices, is produced in trial production and small lot
When generally use manual clubfoot, batch production when using simple tool fixture complete clubfoot.Manual clubfoot wants operator
Ask higher, and efficiency is lower, though and existing tool fixture can be rapidly completed the clubfoot of power semiconductor, guarantee that installation is wanted
It asks, but production efficiency is not high, also has an impact to reliability.
Such as the patent document that notification number is CN202219306U discloses a kind of bending jig for pin of electronic device, the electricity
Sub- device pin bending jig includes pedestal and pressing plate, the one side articulated connection of the one side and pressing plate of the pedestal, pedestal
Upper surface is equipped with the first pit, and it is recessed that second to match is equipped at the corresponding position of the first pit of pedestal on pressing plate lower surface
Hole, the another side of pressing plate extend downwardly out bending part, and bending part is in the outside of pedestal another side.Institute in the patent document
The bending jig for pin of electronic device stated, operating efficiency is low, and without positioning when electronic device clubfoot, when bending operation encapsulates device
There are also the risks of damage.
Utility model content
To solve the above-mentioned problems, the utility model provides a kind of inverter power semiconductor devices pin bending dress
It sets, electronic device can be positioned well, in order to the bending operation to pin.
The technical solution of the utility model are as follows: a kind of inverter power semiconductor devices pin apparatus for bending, including pedestal
And it is connect with pedestal and the bending pressing plate on pedestal, the inverter power semiconductor devices can be overturn and be covered on around pedestal
Including device body and the pin connecting with device body, offer positioning groove on the pedestal, the device body with
Positioning groove matches, and the pin extends to outside pedestal, and the bending for bending pin is provided on the bending pressing plate
Boss further includes connecting and can overturning and be covered on around pedestal positioning pressuring plate on pedestal with pedestal, and the positioning pressuring plate includes can
With the compression lug boss of inverter power contact of semiconductor device cooperation.
When needing to carry out bending to pin, the device body of inverter power semiconductor devices is placed in positioning groove
Interior, pin position may extend to outside pedestal, fixed then by positioning pressuring plate around pedestal overturning and towards one side to overturn of base top surface
Compression lug boss on the pressing plate of position cooperates inverter power contact of semiconductor device, finally overturns bending pressing plate, bending pressure again
Plate will be covered on positioning pressuring plate, and bending boss is engaged with pin, continue to press, and bending pressing plate can press positioning
Plate applies pressure, so that inverter power semiconductor devices is fixed, while bending boss presses to pin position, so that lead portion
Position bending.
There are many connection types in the utility model between bending pressing plate and positioning pressuring plate and pedestal, such as can adopt
With articulated manner, and bending pressing plate and positioning pressuring plate can connect in same place, and positioning pressuring plate is located on the inside of bending pressing plate,
Therefore when overturning pushes bending pressing plate, positioning pressuring plate can be overturn simultaneously, so that positioning pressuring plate is turned on one's side towards base-plates surface one
Turn.
Preferably, the positioning groove is open at one end, the pedestal is corresponding with the opening end position of positioning groove
Edge is provided with the limit blend stop for preventing device body from deviating from out of positioning groove, and the pin is overlapped on limit blend stop simultaneously
It extends to outside pedestal.
In the utility model there are many structure types of positioning pressuring plate, preferably, the positioning pressuring plate is covered on pedestal
When upper, the compression lug boss is corresponding with limit blend stop position, and pin position corresponding with limit blend stop position is compressed admittedly
On fixing limit blend stop.The side wall that the side wall of compression lug boss can also be connected with pin with device body in the utility model contacts
Cooperation, and then by device body clamping and positioning groove, when preventing to pin bending, device body is shaken.
For the ease of overturning bending pressing plate, preferably, being provided with handle on the bending pressing plate.
Positioning pressuring plate for ease of operation, preferably, offering action pane on the bending pressing plate.Operator can
To apply pressure to positioning pressuring plate by action pane.
Preferably, the limit blend stop and base-plates surface position corresponding position are round-corner transition structure.
Preferably, the sidewall surfaces of the pedestal and limit blend stop position corresponding position tilt.Round-corner transition and base side
The inclination of wall low-angle is sprung back after can preventing pin bending so that there are certain gaps between side wall after pin bending,
Guarantee the verticality of pin bending.
Preferably, being provided with the positioning pin matched with device body in the positioning groove.
Preferably, the bending boss and bending clamp surface position corresponding position are round-corner transition structure.Round-corner transition
Structure is located at the inside of bending boss, and after bending boss is by pin bending, round-corner transition structure can play the role of evacuation,
Avoid abrasion pin.
Preferably, the positioning groove be it is multiple, multiple positioning grooves are arranged parallel.The utility model can be right simultaneously
Multiple devices carry out bending, greatly improve working efficiency.
The pedestal, bending pressing plate and positioning pressuring plate are made of antistatic material.
Compared with prior art, the beneficial effects of the utility model are embodied in:
The utility model structure is simple, easy to operate, and when can make bending, device position is fixed, and guarantees bending precision
And installation requirement, and the utility model can once-through operation complete the pin bendings of multiple devices, improve operating efficiency, and use
Antistatic material effective protection device.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model.
Fig. 2 bows for the utility model to structural schematic diagram.
Fig. 3 is the lateral structure schematic diagram of the utility model.
Fig. 4 is the utility model backsight direction structure schematic diagram.
Fig. 5 is the cross-sectional side structural schematic diagram of the utility model.
Specific embodiment
As shown in Figure 1 to 4, the utility model includes pedestal 2 and connect with pedestal 2 and can overturn and cover around pedestal 2
Bending pressing plate 3 on pedestal 2, inverter power semiconductor devices 1 include device body 11 and connect with device body 11
The pin 12 connect offers positioning groove on pedestal 2, and device body 11 is matched with positioning groove, and pin 12 extends to pedestal 2
Outside is provided with the bending boss 32 for bending pin 12 on bending pressing plate 3, further includes connecting with pedestal 2 and can be around pedestal 2
Positioning pressuring plate 4 on pedestal 2 is overturn and is covered on, positioning pressuring plate 4 includes that can be engaged with inverter power semiconductor devices 1
Compress lug boss 41.
It may be provided with the positioning pin 22 matched with device body 11, pedestal 2, bending in the utility model in positioning groove
Pressing plate 3 and positioning pressuring plate 4 can be made of antistatic material.When needing to carry out bending to pin 12, by inverter power
The device body 11 of semiconductor devices 1 is placed in positioning groove, and 12 position of pin may extend to outside pedestal 2, then will be determined
Position pressing plate 4 overturns around pedestal 2 and towards 2 top surface of pedestal, one side to overturn, and the compression lug boss 41 on positioning pressuring plate 4 is by inverter function
Rate semiconductor devices 1 is engaged, and finally overturns bending pressing plate 3 again, bending pressing plate 3 will be covered on positioning pressuring plate 4, and be rolled over
Curved boss 32 is engaged with pin 12, continues to press, and bending pressing plate 3 can apply pressure to positioning pressuring plate 4, so that inverter
Power semiconductor 1 is fixed, while bending boss 32 presses to 12 position of pin, so that 12 position of pin is bent.
Wherein positioning groove is open at one end, and the edge corresponding with the opening end position of positioning groove of pedestal 2 is provided with
The limit blend stop 21 for preventing device body 11 from deviating from out of positioning groove, pin 12 are overlapped on limit blend stop 21 and extend to base
Outside seat 2.Positioning groove is multiple in the utility model, and multiple positioning grooves are arranged parallel.The utility model can be right simultaneously
Multiple devices carry out bending, greatly improve working efficiency.
In the utility model there are many structure types of positioning pressuring plate 4, as shown in figure 5, positioning pressuring plate 4 in the utility model
When being covered on pedestal 2, it is corresponding with limit 21 position of blend stop to compress lug boss 41, and by pin 12 and limit 21 position pair of blend stop
The position answered is fixed on limit blend stop 21.The side wall that lug boss 41 is compressed in the utility model can also be with device body 11
The side wall for being connected with pin 12 is engaged, and then by 11 clamping of device body and positioning groove, prevents to 12 bending of pin
When, device body 11 is shaken.
As shown in Figure 1, being provided with handle 31 on bending pressing plate 3 for the ease of overturning bending pressing plate 3.For ease of operation
Positioning pressuring plate 4 offers action pane 33 on bending pressing plate 3.Operator can apply positioning pressuring plate 4 by action pane 33
Plus-pressure.
As shown in figure 5, limiting blend stop 21 and 2 surface location corresponding position of pedestal in the utility model as round-corner transition structure.
The sidewall surfaces of pedestal 2 and limit 21 position corresponding position of blend stop tilt.The inclination of 2 side wall low-angle of round-corner transition and pedestal, makes
There are certain gaps between side wall after 12 bending of pin, sprung back after 12 bending of pin can be prevented, guarantee 12 folding of pin
Curved verticality.Bending boss 32 and 3 surface location corresponding position of bending pressing plate are round-corner transition structure.Round-corner transition structure is located at
The inside of bending boss 32, after bending boss 32 is by 12 bending of pin, round-corner transition structure can play the role of evacuation, keep away
Exempt to wear pin 12.
Claims (10)
1. a kind of inverter power semiconductor devices pin apparatus for bending, including pedestal and it connect and can be turned over around pedestal with pedestal
Turn and be covered on the bending pressing plate on pedestal, the inverter power semiconductor devices includes device body and and device body
The pin of connection offers positioning groove on the pedestal, and the device body is matched with positioning groove, and the pin extends
To pedestal, the bending boss for bending pin is provided on the bending pressing plate, which is characterized in that further include and pedestal
Positioning pressuring plate on pedestal is connected and can overturn and be covered on around pedestal, the positioning pressuring plate includes can be with inverter power semiconductor
The compression lug boss of device contacts cooperation.
2. inverter power semiconductor devices pin apparatus for bending as described in claim 1, which is characterized in that the positioning is recessed
Slot it is open at one end, pedestal edge corresponding with the opening end position of positioning groove, which is provided with, prevents device body from fixed
The limit blend stop deviate from the groove of position, the pin are overlapped on limit blend stop and extend to outside pedestal.
3. inverter power semiconductor devices pin apparatus for bending as claimed in claim 2, which is characterized in that the positioning pressure
When plate is covered on pedestal, the compression lug boss is corresponding with limit blend stop position, and pin is corresponding with limit blend stop position
Position be fixed limit blend stop on.
4. inverter power semiconductor devices pin apparatus for bending as described in claim 1, which is characterized in that the bending pressure
Handle is provided on plate.
5. the inverter power semiconductor devices pin apparatus for bending as described in Claims 1 to 4 is any, which is characterized in that institute
It states and offers action pane on bending pressing plate.
6. inverter power semiconductor devices pin apparatus for bending as claimed in claim 3, which is characterized in that the limiting block
Item and base-plates surface position corresponding position are round-corner transition structure.
7. inverter power semiconductor devices pin apparatus for bending as claimed in claim 6, which is characterized in that the pedestal with
Limit the sidewall surfaces inclination of blend stop position corresponding position.
8. inverter power semiconductor devices pin apparatus for bending as described in claim 1, which is characterized in that the positioning is recessed
The positioning pin matched with device body is provided in slot.
9. inverter power semiconductor devices pin apparatus for bending as described in claim 1, which is characterized in that the bending is convex
Platform and bending clamp surface position corresponding position are round-corner transition structure.
10. inverter power semiconductor devices pin apparatus for bending as described in claim 1, which is characterized in that the positioning
Groove be it is multiple, multiple positioning grooves are arranged parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821715669.9U CN208895077U (en) | 2018-10-22 | 2018-10-22 | A kind of inverter power semiconductor devices pin apparatus for bending |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821715669.9U CN208895077U (en) | 2018-10-22 | 2018-10-22 | A kind of inverter power semiconductor devices pin apparatus for bending |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208895077U true CN208895077U (en) | 2019-05-24 |
Family
ID=66576594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821715669.9U Active CN208895077U (en) | 2018-10-22 | 2018-10-22 | A kind of inverter power semiconductor devices pin apparatus for bending |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208895077U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110238317A (en) * | 2019-07-22 | 2019-09-17 | 镇江市康特电子有限责任公司 | A kind of tool for infrared receiving terminal pin forming |
| CN111014504A (en) * | 2019-12-09 | 2020-04-17 | 河北汉光重工有限责任公司 | Many pins device forming device |
| CN112355173A (en) * | 2020-10-21 | 2021-02-12 | 江西世星科技有限公司 | Chip bending die with angle compensation |
| CN113477836A (en) * | 2021-09-08 | 2021-10-08 | 山东元捷电子科技有限公司 | Post-processing equipment for semiconductor electronic device production |
-
2018
- 2018-10-22 CN CN201821715669.9U patent/CN208895077U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110238317A (en) * | 2019-07-22 | 2019-09-17 | 镇江市康特电子有限责任公司 | A kind of tool for infrared receiving terminal pin forming |
| CN111014504A (en) * | 2019-12-09 | 2020-04-17 | 河北汉光重工有限责任公司 | Many pins device forming device |
| CN111014504B (en) * | 2019-12-09 | 2021-05-14 | 河北汉光重工有限责任公司 | Many pins device forming device |
| CN112355173A (en) * | 2020-10-21 | 2021-02-12 | 江西世星科技有限公司 | Chip bending die with angle compensation |
| CN113477836A (en) * | 2021-09-08 | 2021-10-08 | 山东元捷电子科技有限公司 | Post-processing equipment for semiconductor electronic device production |
| CN113477836B (en) * | 2021-09-08 | 2021-11-26 | 山东元捷电子科技有限公司 | Post-processing equipment for semiconductor electronic device production |
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