CN208866963U - A kind of polishing jig for large-size sapphire diaphragm - Google Patents
A kind of polishing jig for large-size sapphire diaphragm Download PDFInfo
- Publication number
- CN208866963U CN208866963U CN201821220684.6U CN201821220684U CN208866963U CN 208866963 U CN208866963 U CN 208866963U CN 201821220684 U CN201821220684 U CN 201821220684U CN 208866963 U CN208866963 U CN 208866963U
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- China
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- wax
- absorption layer
- size sapphire
- polishing
- sapphire diaphragm
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model relates to sapphire window piece polishing field, in particular to it is a kind of for large-size sapphire diaphragm without wax polishing jig.To solve polishing disk because of internal and external line speed difference, caused by large-size sapphire diaphragm each point removal rate it is unbalanced, " turned-down edge " problem for being easy to appear when preventing large-size sapphire diaphragm from polishing, the utility model provide a kind of large-size sapphire diaphragm without wax polishing jig, including ceramic disk, without wax absorption layer, round epoxy resin board, large-size sapphire diaphragm, copper dish, through-hole, shaft；The utility model, which can be such that large-size sapphire diaphragm rotates under motor force, is influenced the rotation together with round epoxy resin board by lower wall linear differential simultaneously, avoiding sapphire window piece, concentrated wear is too fast during the polishing process, turned-down edge phenomenon is reduced, so that the removal rate relative equilibrium of large-size sapphire diaphragm each point.
Description
Technical field
The utility model relates to sapphire window piece polishing technology fields, in particular to a kind of to be used for large-size sapphire window
The polishing jig of mouth piece.
Background technique
Sapphire Substrate is presently the most a kind of universal substrate material, is growth GaN, the most common substrate of ZnO material,
Sapphire substrate surface performance can be influenced by mechanical polishing surface treatment, tradition is to large-size sapphire diaphragm polishing jig
Using liquid wax or solid wax by product attachment film on ceramic disk, ceramic disc spins are driven under pressure head motor force,
Because of polishing disk internal and external line speed difference, easily cause the removal rate of product each point unbalanced.
Summary of the invention
Large-size sapphire diaphragm each point is caused because of internal and external line speed difference to solve polishing disk in above-mentioned technical proposal
Removal rate it is unbalanced, " turned-down edge " problem for being easy to appear when preventing large-size sapphire diaphragm from polishing, the utility model mentions
For a kind of polishing jig for large-size sapphire diaphragm.
The technical solution of the utility model is: a kind of polishing jig of large-size sapphire substrate wafer, including ceramic disk,
Without wax absorption layer, round epoxy resin board, large-size sapphire diaphragm, copper dish, shaft.
To be puted up without wax absorption layer on ceramic disk, the composite construction that no wax absorption layer is made of multi-layer resinous material, most
The above is glass layer, and centre is the soft adsorption layer of black, and here is gum layer, no wax absorption layer hole depth rate large-size sapphire
Diaphragm finished product thickness is 0.14 millimeter small；Round epoxy resin board is placed in no wax absorption layer circular hole again, the circular rings
Oxygen resin plate thickness is equal to no wax absorption layer hole depth, and round epoxy resin board outer diameter ratio is without the small 0.2-0.3 in wax absorption layer aperture
Millimeter, large-size sapphire diaphragm to be processed is placed in round epoxy resin board square hole；Large scale is blue precious when work
Copper dish push above stone window mouth piece, and copper dish inner hollow can inject polishing fluid；No wax absorption layer and ceramic disk open hole, lead to
Hole is provided with no wax absorption layer circular hole avris.
The utility model advantage is: upper lower burrs while rotating backward, large-size sapphire diaphragm is by inside and outside polishing disk
Linear velocity difference drives epoxy resin board rotation, the removal rate relative equilibrium of such large-size sapphire diaphragm each point.
Detailed description of the invention
Fig. 1 is conventional polishing jig lower wall schematic diagram；
Fig. 2 is the utility model lower wall schematic diagram；
Fig. 3 is that the utility model uses placement schematic diagram；
Wherein: ceramic disk 1, no wax absorption layer 2, round epoxy resin board 3, large-size sapphire diaphragm 4, copper dish 5 are led to
Hole 6, shaft 7.
Specific embodiment
Illustrate the utility model with reference to the accompanying drawing:
Referring to Fig. 2, Fig. 3, the utility model includes ceramic disk 1, no wax absorption layer 2, round epoxy resin board 3, large scale
Sapphire window piece 4 will be puted up without wax absorption layer 2 on ceramic disk 1, and no wax absorption layer 2 is answered by what multi-layer resinous material formed
Structure is closed, is topmost glass layer, centre is the soft adsorption layer of black, and here is gum layer, and no wax absorption layer hole depth rate is big
Size sapphire window piece finished product thickness is 0.14 millimeter small；Round epoxy resin board 3 is placed on no 2 circular hole of wax absorption layer again
Interior, round 4 thickness of epoxy resin board is equal to no 2 hole depth of wax absorption layer, and round 3 outer diameter ratio of epoxy resin board is without wax absorption layer 2
Aperture is 0.2-0.3 millimeters small, and large-size sapphire diaphragm 4 is placed in round 4 square hole of epoxy resin board, polished to face
On；Copper dish push above large-size sapphire diaphragm when work, and copper dish hollow portion injects polishing fluid.
7 rotation around the shaft of ceramic disk 1, what is attached thereon rotates together without wax absorption layer 2, at the same time, the copper dish 5 of top
Add polishing fluid, decline presses to large-size sapphire diaphragm, be subject to suitable pressure, immediately around the shaft 7 with 1 opposite direction of ceramic disk
Rotation, internal and external line speed difference when large-size sapphire diaphragm 4 is rotated by copper dish 5 at this time, and drive round asphalt mixtures modified by epoxy resin
The rotation in no 2 circular hole of wax absorption layer of rouge plate 3, while rotation also is influenced by 1 linear differential of lower section ceramic disk, such large scale is blue
The removal rate relative equilibrium of jewel diaphragm each point.
In work, since copper dish contact large-size sapphire diaphragm surface polishing generates abrasive dust, polishing effect, copper are influenced
The polishing fluid release of 5 hollow space of disk injection, reduces by 5 temperature of copper dish；Simultaneously as round 3 outer diameter ratio of epoxy resin board is without wax
2 aperture of absorption layer is small, and abrasive dust is generated when work and is deposited in crack the rotation for influencing round epoxy resin board 3, is inhaled by no wax
The through-hole 6 of attached pad 2 and ceramic disk 1, can throw away the abrasive dust for falling and accumulating in no 2 hole of wax absorption layer in work in time.
Claims (5)
1. it is a kind of for large-size sapphire diaphragm without wax polishing jig, comprising: ceramic disk, it is characterised in that: ceramic disk
For upper surface patch without wax absorption layer, no wax absorption layer upper layer has multiple circular holes, places the circular rings that can be move freely in circular hole
Oxygen resin plate, ceramic disk top are the copper dish for the polishing of large-size sapphire diaphragm.
2. no wax polishing jig according to claim 1, it is characterised in that: it is made of most without wax absorption layer multilayered structure
The above is glass layer, and centre is the soft adsorption layer of black, and here is gum layer.
3. no wax polishing jig according to claim 1, it is characterised in that: round epoxy resin board thickness is equal to no wax
Absorption layer hole depth, outer diameter ratio are small without wax absorption layer aperture.
4. no wax polishing jig according to claim 1, it is characterised in that: copper dish inner hollow, inside are equipped with coolant liquid.
5. no wax polishing jig according to claim 1, it is characterised in that: no wax absorption layer is opened with ceramic disk to be connected each other
Logical through-hole, the through-hole on no wax absorption layer are opened in no wax absorption layer circular hole bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821220684.6U CN208866963U (en) | 2018-07-31 | 2018-07-31 | A kind of polishing jig for large-size sapphire diaphragm |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821220684.6U CN208866963U (en) | 2018-07-31 | 2018-07-31 | A kind of polishing jig for large-size sapphire diaphragm |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208866963U true CN208866963U (en) | 2019-05-17 |
Family
ID=66463870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821220684.6U Active CN208866963U (en) | 2018-07-31 | 2018-07-31 | A kind of polishing jig for large-size sapphire diaphragm |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208866963U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115008341A (en) * | 2022-06-28 | 2022-09-06 | 东莞市盈鑫半导体材料有限公司 | Wax-free polishing adsorption pad positive pressure heat lamination process |
| CN115284151A (en) * | 2022-08-18 | 2022-11-04 | 广东先导微电子科技有限公司 | Wax-free polishing process method |
-
2018
- 2018-07-31 CN CN201821220684.6U patent/CN208866963U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115008341A (en) * | 2022-06-28 | 2022-09-06 | 东莞市盈鑫半导体材料有限公司 | Wax-free polishing adsorption pad positive pressure heat lamination process |
| CN115284151A (en) * | 2022-08-18 | 2022-11-04 | 广东先导微电子科技有限公司 | Wax-free polishing process method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190522 Address after: 330000 Room 908, Building A, Madison Square Commercial Office Building, 228 Jinggangshan Avenue, Qingyunpu District, Nanchang City, Jiangxi Province (9th floor) Patentee after: Jiangxi Weijia Creative Development Enterprise Management Co., Ltd. Address before: 330000 698 Tianxiang North Road, hi tech Industrial Development Zone, Nanchang, Jiangxi Patentee before: Zeng Xiqiang |
|
| TR01 | Transfer of patent right |