CN208848860U - A kind of conducting resinl shaping equipment of chip package process section - Google Patents
A kind of conducting resinl shaping equipment of chip package process section Download PDFInfo
- Publication number
- CN208848860U CN208848860U CN201821535781.4U CN201821535781U CN208848860U CN 208848860 U CN208848860 U CN 208848860U CN 201821535781 U CN201821535781 U CN 201821535781U CN 208848860 U CN208848860 U CN 208848860U
- Authority
- CN
- China
- Prior art keywords
- conveyer belt
- stock guide
- cabinet
- bottom end
- conducting resinl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007493 shaping process Methods 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000001914 filtration Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000009423 ventilation Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000004513 sizing Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
Landscapes
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
The utility model discloses a kind of conducting resinl shaping equipments of chip package process section in chip encapsulation technology field, including cabinet, the cabinet includes left plate and right side plate, the cabinet top is provided with feed inlet, stock guide A is provided on the cabinet wall of the feed inlet bottom side, the bottom end the stock guide A is provided with conveyer belt A, stock guide B is provided on the cabinet wall of the conveyer belt A right end bottom side, the bottom end the stock guide B is provided with conveyer belt B, stock guide C is provided on the cabinet wall of the left end conveyer belt B bottom side, the bottom end the stock guide C is provided with conveyer belt C, stock guide D is provided on the cabinet wall of the conveyer belt C right end bottom side.The utility model is designed reasonably, structure is simple, by the way that the conveyer belt accepted mutually is arranged in cabinet, so that conducting resinl can either heat-shaping in cabinet, additionally it is possible to which self-emptying simplifies workflow, improves work efficiency.
Description
Technical field
The utility model discloses a kind of conducting resinl shaping equipments of chip package process section, specially chip encapsulation technology
Field.
Background technique
For the conducting resinl of chip package, application requirement only can be only achieved after solidifying and setting, the prior art is carrying out
When conducting resinl is formed, need worker that unshaped conducting resinl is placed into shaping equipment, after undetermined type, it is also necessary to worker
Conducting resinl is taken out, cumbersome, time-consuming and laborious, cost of labor is higher.For this purpose, we have proposed a kind of chip package process sections
Conducting resinl shaping equipment come into operation, to solve the above problems.
Utility model content
It is above-mentioned to solve the purpose of this utility model is to provide a kind of conducting resinl shaping equipment of chip package process section
The problem of being proposed in background technique.
To achieve the above object, the utility model provides the following technical solutions: a kind of conducting resinl of chip package process section
Shaping equipment, including cabinet, the cabinet include left plate and right side plate, and the cabinet top is provided with feed inlet, it is described into
Stock guide A is provided on the cabinet wall of material mouth bottom side, the bottom end the stock guide A is provided with conveyer belt A, and the conveyer belt A is right
It holds and is provided with stock guide B on the cabinet wall of bottom side, the bottom end the stock guide B is provided with conveyer belt B, the left end the conveyer belt B
Stock guide C is provided on the cabinet wall of bottom side, the bottom end the stock guide C is provided with conveyer belt C, the conveyer belt C right end bottom
Stock guide D is provided on the cabinet wall of side, the bottom end the stock guide D is provided with conveyer belt D, cabinet bottom end leftward position
It is provided with discharge port.
Preferably, the outer end of the left plate and right side plate is respectively connected with heating chamber, is provided with hot wind in the heating chamber
The air inlet of the outer end machine A, the air-heater A is provided with air filtration column A, is provided on the left plate and right side plate logical
Air holes.
Preferably, between the bottom end the stock guide A and conveyer belt A, between the bottom end stock guide B and conveyer belt B, stock guide C
Gap is provided between the bottom end stock guide D and conveyer belt D between bottom end and conveyer belt C.
Preferably, the cabinet bottom end is provided with air-heater B, and the bottom end the air-heater B is connected with air filtration column B.
Preferably, heat release hole is provided on the conveyer belt A, conveyer belt B, conveyer belt C and conveyer belt D.
Compared with prior art, the utility model has the beneficial effects that by the way that the conveying accepted mutually is arranged in cabinet
Band, so that conducting resinl can either heat-shaping in cabinet, additionally it is possible to which self-emptying simplifies workflow, improves work
Efficiency.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model.
In figure: 1- cabinet；2- left plate；3- right side plate；4- feed inlet；5- stock guide A；6- conveyer belt A；7- stock guide B；
8- conveyer belt B；9- stock guide C；10- conveyer belt C；11- stock guide D；12- conveyer belt D；13- discharge port；14- heating chamber；15-
Air-heater A；16- air filtration column A；17- air-heater B；18- air filtration column B.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Referring to Fig. 1, the utility model provides a kind of technical solution: a kind of conducting resinl sizing dress of chip package process section
Set, including cabinet 1, the cabinet 1 includes left plate 2 and right side plate 3, and 1 top of cabinet is provided with feed inlet 4, it is described into
Stock guide A5 is provided on 1 inner wall of cabinet of 4 bottom side of material mouth, the bottom end the stock guide A5 is provided with conveyer belt A6, the conveying
Stock guide B7 is provided on 1 inner wall of cabinet with A6 right end bottom side, the bottom end the stock guide B7 is provided with conveyer belt B8, described defeated
It send and is provided with stock guide C9 on 1 inner wall of cabinet with the left end B8 bottom side, the bottom end the stock guide C9 is provided with conveyer belt C10, institute
It states and is provided with stock guide D11 on 1 inner wall of cabinet of conveyer belt C10 right end bottom side, the bottom end the stock guide D11 is provided with conveyer belt
D12, the 1 bottom end leftward position of cabinet are provided with discharge port 13, the outer end of the left plate 2 and right side plate 3 be respectively connected with plus
Hot chamber 14 is provided with air-heater A15 in the heating chamber 14, and the air inlet of the outer end the air-heater A15 is provided with air mistake
Filter column A16, is provided with ventilation hole on the left plate 2 and right side plate 3, air-heater A15 blowing hot-air inwardly, by ventilation
Hole, so that conducting resinl in cabinet 1 is by sizing heat, between the bottom end the stock guide A5 and conveyer belt A6, the bottom stock guide B7
Between end and conveyer belt B8, between the bottom end stock guide C9 and conveyer belt C10 between the bottom end stock guide D11 and conveyer belt D12
It is provided with gap, 1 bottom end of cabinet is provided with air-heater B17, and the bottom end the air-heater B17 is connected with air filtration column B18,
Accelerate the sizing of conducting resinl, be provided with heat release hole on the conveyer belt A6, conveyer belt B8, conveyer belt C10 and conveyer belt D12,
Allow the conducting resinl on conveyer belt A6, conveyer belt B8, conveyer belt C10 and conveyer belt D12 by sufficient heat, accelerates to lead
The sizing of electric glue.
Working principle: when work, conducting resinl being fallen into cabinet 1 from feed inlet 4, conducting resinl pass sequentially through conveyer belt A6,
Conveyer belt B8, conveyer belt C10 and conveyer belt D12's is continuously conveyed, constantly by the air-heater A15 of two sides and bottom in cabinet 1
The drying of the air-heater B17 of side, finally, the conducting resinl being formed falls into discharge port 13 from the left end of conveyer belt D12, and from out
Material mouth 13 be discharged cabinet 1, the present apparatus by the way that the conveyer belt accepted mutually is arranged in cabinet 1 so that conducting resinl in cabinet 1 both
It being capable of heat-shaping, additionally it is possible to which self-emptying simplifies workflow, improves work efficiency.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of conducting resinl shaping equipment of chip package process section, including cabinet (1), it is characterised in that: cabinet (1) packet
Left plate (2) and right side plate (3) are included, cabinet (1) top is provided with feed inlet (4), the cabinet of feed inlet (4) bottom side
(1) it is provided on inner wall stock guide A (5), stock guide A (5) bottom end is provided with conveyer belt A (6), and the conveyer belt A (6) is right
It holds and is provided with stock guide B (7) on cabinet (1) inner wall of bottom side, stock guide B (7) bottom end is provided with conveyer belt B (8), described
It is provided with stock guide C (9) on cabinet (1) inner wall of conveyer belt B (8) left end bottom side, stock guide C (9) bottom end is provided with defeated
Band C (10) is sent, is provided with stock guide D (11) on cabinet (1) inner wall of conveyer belt C (10) the right end bottom side, the stock guide D
(11) bottom end is provided with conveyer belt D (12), and cabinet (1) bottom end leftward position is provided with discharge port (13).
2. a kind of conducting resinl shaping equipment of chip package process section according to claim 1, it is characterised in that: the left plate
(2) it is respectively connected with heating chamber (14) with the outer end of right side plate (3), is provided with air-heater A (15) in the heating chamber (14), it is described
The air inlet of air-heater A (15) outer end is provided with air filtration column A (16), is all provided on the left plate (2) and right side plate (3)
It is equipped with ventilation hole.
3. a kind of conducting resinl shaping equipment of chip package process section according to claim 1, it is characterised in that: the stock guide
Between (5) bottom end A and conveyer belt A (6), between (7) bottom end stock guide B and conveyer belt B (8), (9) bottom end stock guide C and conveying
Gap is provided between (11) bottom end stock guide D and conveyer belt D (12) between band C (10).
4. a kind of conducting resinl shaping equipment of chip package process section according to claim 1, it is characterised in that: the cabinet
(1) bottom end is provided with air-heater B (17), and air-heater B (17) bottom end is connected with air filtration column B (18).
5. a kind of conducting resinl shaping equipment of chip package process section according to claim 1, it is characterised in that: the conveyer belt
Heat release hole is provided on A (6), conveyer belt B (8), conveyer belt C (10) and conveyer belt D (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821535781.4U CN208848860U (en) | 2018-09-19 | 2018-09-19 | A kind of conducting resinl shaping equipment of chip package process section |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821535781.4U CN208848860U (en) | 2018-09-19 | 2018-09-19 | A kind of conducting resinl shaping equipment of chip package process section |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208848860U true CN208848860U (en) | 2019-05-10 |
Family
ID=66373429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821535781.4U Expired - Fee Related CN208848860U (en) | 2018-09-19 | 2018-09-19 | A kind of conducting resinl shaping equipment of chip package process section |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208848860U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115815083A (en) * | 2022-11-10 | 2023-03-21 | 电子科技大学长三角研究院(湖州) | Conductive adhesive shaping device for chip packaging process section |
-
2018
- 2018-09-19 CN CN201821535781.4U patent/CN208848860U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115815083A (en) * | 2022-11-10 | 2023-03-21 | 电子科技大学长三角研究院(湖州) | Conductive adhesive shaping device for chip packaging process section |
| CN115815083B (en) * | 2022-11-10 | 2023-08-15 | 电子科技大学长三角研究院(湖州) | Conductive adhesive shaping device for chip packaging process section |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190510 |