CN208835022U - A kind of clamping device for sensor chip die bond - Google Patents
A kind of clamping device for sensor chip die bond Download PDFInfo
- Publication number
- CN208835022U CN208835022U CN201821451535.0U CN201821451535U CN208835022U CN 208835022 U CN208835022 U CN 208835022U CN 201821451535 U CN201821451535 U CN 201821451535U CN 208835022 U CN208835022 U CN 208835022U
- Authority
- CN
- China
- Prior art keywords
- tube body
- outside
- die bond
- sensor chip
- battery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000428 dust Substances 0.000 claims description 21
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 235000005121 Sorbus torminalis Nutrition 0.000 claims description 2
- 244000152100 Sorbus torminalis Species 0.000 claims description 2
- 238000003860 storage Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 210000003813 thumb Anatomy 0.000 description 1
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- Sampling And Sample Adjustment (AREA)
Abstract
The utility model discloses a kind of clamping devices for sensor chip die bond, including tube body, the top of the tubular body is provided with micro-suction pump, and the top on the outside of tube body is provided with control switch, the control switch is electrically connected by conducting wire and micro-suction pump, battery compartment is evenly arranged on tube body below the control switch, and the inside of battery compartment is all provided with battery, the outside of the battery compartment is all provided with battery cover board, and the middle position of the tubular body is provided with fixed plate.The utility model is equipped with the Manual clamping mechanism of fixed plate, reset spring, mounting rod, supporting rod, connecting rod and dragging block composition, the chip of large volume can be clamped by manual gripping body, and the automatic clamping mechanism formed with micro-suction pump, air-suction cover is used cooperatively, it enables a device to be clamped chip according to the difference of chip size, improves the practicability of device.
Description
Technical field
The utility model relates to sensor production equipment technical field, specially a kind of folder for sensor chip die bond
Tight device.
Background technique
Sensor (English name: transducer/sensor) is a kind of detection device, can experience measured letter
Breath, and the information that can will be experienced are for conversion into electric signal or the information output of other required forms, according to certain rules to meet
Transmission, processing, storage, display, record and control of information etc. requirement, and needed in the production process of sensor to chip into
Row is fixed, it is therefore desirable to be clamped using clamping device to chip, but traditional clamping device is only capable of through supporting rod to core
Piece is clamped, of different sizes due to chip, causes lesser chip to clamp more inconvenient, and practicability is lower, and clamp
The dust of chip surface can not be cleared up simultaneously, cause the die bond of chip unstable, reduce the quality of production of product.
Utility model content
The purpose of this utility model is to provide a kind of clamping devices for sensor chip die bond, to solve above-mentioned back
The problem of being proposed in scape technology.
To achieve the above object, the utility model provides the following technical solutions: a kind of folder for sensor chip die bond
Tight device, including tube body, the top of the tubular body are provided with micro-suction pump, and the top on the outside of tube body is provided with control
Switch, the control switch are electrically connected by conducting wire and micro-suction pump, on the tube body below the control switch uniformly
It is provided with battery compartment, and the inside of battery compartment is all provided with battery, the outside of the battery compartment is all provided with battery cover board, described
The middle position of tubular body is provided with fixed plate, and the bottom of fixed plate is provided with reset spring, the reset spring
Bottom is provided with mounting rod, and limit casing is evenly arranged on the outside of mounting rod, and the outside of the limit casing is all provided with
Strut, and the one end of strut far from limit casing is all connect with tube body, is provided with flat recess on the tube body of the fixed plate bottom,
And flat recess is internally provided with connecting rod, one end of the connecting rod is connect with mounting rod, and connecting rod is far from mounting rod
One end is provided with dragging block, the bottom on the inside of the tube body is provided with dust storehouse, and dust storehouse is internally provided with dust bag, institute
The output end for stating micro-suction pump is connected to by conduit with the top of dust storehouse, and the middle position of the bottom is provided with
Air-suction cover, and the top of air-suction cover is connected to by conduit with the bottom of dust storehouse, the bottom symmetrical on the outside of the tube body is provided with
Through-hole, and the inside of through-hole is all provided with supporting rod, the top of the supporting rod is all hinged with mounting rod.
Preferably, the outside at the top of the tube body is evenly arranged with heat dissipation port, and handle is arranged in the outside of bottom.
Preferably, the limit casing is provided with three groups, and the distance between adjacent limit casing is identical.
Preferably, the battery is provided with four groups, and the angle between adjacent cell is 90 °.
Preferably, the inside of the supporting rod bottom is all provided with rubber block, and the inside of rubber block be all provided with it is anti-skidding
Line.
Preferably, the bottom of the air-suction cover is provided with circular slab, and the bottom of circular slab is evenly arranged with suction hole.
Compared with prior art, the utility model has the beneficial effects that this is used for the clamping device of sensor chip die bond
The Manual clamping mechanism of fixed plate, reset spring, mounting rod, supporting rod, connecting rod and dragging block composition is installed, by manual
Gripping body can be clamped the chip of large volume, and the automatic clamping mechanism formed with micro-suction pump, air-suction cover
It is used cooperatively, enables a device to be clamped chip according to the difference of chip size, improve the practicability of device, tube body
The setting of the dust collection mechanism of inside micro air pump, disposal box and air-suction cover composition, can be in the clamping process of chip, to chip
Carry out automatic dust removing, it is ensured that the cleaning of chip improves fixed effect, improves the quality of product.
Detailed description of the invention
Fig. 1 is the main view schematic cross-sectional view of the utility model；
Fig. 2 is the schematic front view of the utility model；
Fig. 3 is the air-suction cover schematic diagram of the utility model.
In figure: 1, supporting rod；2, air-suction cover；3, through-hole；4, dust storehouse；5, tube body；6, dust bag；7, strut；8, it limits
Casing；9, reset spring；10, battery compartment；11, micro-suction pump；12, battery；13, fixed plate；14, connecting rod；15, it drags
Block；16, flat recess；17, mounting rod；18, battery cover board；19, control switch；20, radiate port.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-3 is please referred to, a kind of embodiment provided by the utility model: a kind of clamping dress for sensor chip die bond
It sets, including tube body 5, the top inside tube body 5 is provided with micro-suction pump 11, herein the model KVP04 of micro-suction pump 11,
And the top in 5 outside of tube body is provided with control switch 19, control switch 19 is electrically connected by conducting wire and micro-suction pump 11,
It is evenly arranged with battery compartment 10 on the tube body 5 of 19 lower section of control switch, and the inside of battery compartment 10 is all provided with battery 12, battery
The outside in storehouse 10 is all provided with battery cover board 18, and the middle position inside tube body 5 is provided with fixed plate 13, and fixed plate 13
Bottom is provided with reset spring 9, and the bottom of reset spring 9 is provided with mounting rod 17, and the outside of mounting rod 17 is evenly arranged with
Limit casing 8, the outside of limit casing 8 is all provided with strut 7, and the one end of strut 7 far from limit casing 8 all connects with tube body 5
It connects, is provided with flat recess 16 on the tube body 5 of 13 bottom of fixed plate, and flat recess 16 is internally provided with connecting rod 14, connecting rod
14 one end is connect with mounting rod 17, and connecting rod 14 is provided with dragging block 15 far from one end of mounting rod 17,5 inside of tube body
Bottom is provided with dust storehouse 4, and dust storehouse 4 is internally provided with dust bag 6, the output end of micro-suction pump 11 by conduit with
The top of dust storehouse 4 is connected to, and the middle position of 5 bottom of tube body is provided with air-suction cover 2, and the top of air-suction cover 2 passes through conduit
It is connected to the bottom of dust storehouse 4, the bottom symmetrical in 5 outside of tube body is provided with through-hole 3, and the inside of through-hole 3 is all provided with clamping
Bar 1, the top of supporting rod 1 are all hinged with mounting rod 17.
In this embodiment: the outside at 5 top of tube body is evenly arranged with heat dissipation port 20, and the outside setting of 5 bottom of tube body
Handle improves the heat dissipation effect of micro-suction pump 11, and the taking convenient for device using handle, and limit casing 8 is provided with three
Group, and the distance between adjacent limit casing 8 is identical, improves the limit effect of mounting rod 17, and battery 12 is provided with four groups, and
Angle between adjacent cell 12 is 90 °, improves the cruising ability of device, and the inside of 1 bottom of supporting rod is all provided with rubber
Block, and the inside of rubber block is all provided with anti-skid chequer, prevents from damaging chip, improves the safety of chip, air-suction cover 2
Bottom be provided with circular slab, and the bottom of circular slab is evenly arranged with suction hole, reduces the extraction face of 2 bottom of air-suction cover
Product, improves the absorption effect of device.
Working principle: it before use, charging to battery 12, then, installs to the inside of battery compartment 10, to miniature pumping
Pump 11 is powered, in use, by control switch 19, opens the switch of micro-suction pump 11, micro-suction pump 11 by pipeline with
Dust storehouse 4 is connected to air-suction cover 2, and by extracting air inside air-suction cover 2, keeps the environment of 2 internal negative pressure of air-suction cover, then
One hand holds tube body 5, and thumb is placed on dragging block 15, and when clamping biggish chip, drop-down dragging block 15 passes through company
Extension bar 14 drives mounting rod 17 to be declined, and when mounting rod 17 declines, reset spring 9 generates deformation, and draws mounting rod
It pulls, and when the decline of mounting rod 17, supporting rod 1 is pushed, and is matched with through-hole 3, the bottom of supporting rod 1 is opened, so
Afterwards, the top of chip is placed the device in, slow release drags block 15, and reset spring 9 is slowly pullled mounting rod 17 and moved up, and clamps
The bottom crimp of bar 1, is clamped chip, and while clamping, air-suction cover 2 is from extraneous draw air, to the ash of chip surface
Dirt is drawn, and is stored in the inside of dust storehouse 4, and when clamping lesser chip, pressing dragging block 15, keeps supporting rod with strength
1 keeps open configuration, device is moved to the top of chip, the suction generated by micro-suction pump 11 inhales chip
It takes, and is fitted in the top of air-suction cover 2, the position of chip is fixed, after being installed, by control switch 19, close
Close micro-suction pump 11.
Although the utility model is described in detail with reference to the foregoing embodiments, come for those skilled in the art
Say, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic into
Row equivalent replacement, within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on should all
It is included within the scope of protection of this utility model.
Claims (6)
1. a kind of clamping device for sensor chip die bond, including tube body (5), it is characterised in that: the tube body (5) is internal
Top be provided with micro-suction pump (11), and the top on the outside of tube body (5) is provided with control switch (19), the control switch
(19) be electrically connected by conducting wire and micro-suction pump (11), uniformly sets on the tube body (5) below the control switch (19)
It is equipped with battery compartment (10), and the inside of battery compartment (10) is all provided with battery (12), the outside of the battery compartment (10) is all arranged
Have battery cover board (18), the internal middle position of the tube body (5) is provided with fixed plate (13), and the bottom of fixed plate (13)
It is provided with reset spring (9), the bottom of the reset spring (9) is provided with mounting rod (17), and the outside of mounting rod (17) is equal
Even to be provided with limit casing (8), the outside of the limit casing (8) is all provided with strut (7), and strut (7) is far from limit sleeve
One end of pipe (8) is all connect with tube body (5), is provided with flat recess (16) on the tube body (5) of fixed plate (13) bottom, and one
Word slot (16) is internally provided with connecting rod (14), and one end of the connecting rod (14) is connect with mounting rod (17), and connecting rod
(14) one end far from mounting rod (17) is provided with dragging block (15), and the bottom on the inside of the tube body (5) is provided with dust storehouse
(4), and dust storehouse (4) is internally provided with dust bag (6), and the output end of the micro-suction pump (11) passes through conduit and storage dirt
The top in storehouse (4) is connected to, and the middle position of tube body (5) bottom is provided with air-suction cover (2), and the top of air-suction cover (2)
It is connected to by conduit with the bottom of dust storehouse (4), the bottom symmetrical on the outside of the tube body (5) is provided with through-hole (3), and through-hole
(3) inside is all provided with supporting rod (1), and the top of the supporting rod (1) is all hinged with mounting rod (17).
2. a kind of clamping device for sensor chip die bond according to claim 1, it is characterised in that: the tube body
(5) outside at the top of is evenly arranged with heat dissipation port (20), and handle is arranged in the outside of tube body (5) bottom.
3. a kind of clamping device for sensor chip die bond according to claim 1, it is characterised in that: the limit
Casing (8) is provided with three groups, and the distance between adjacent limit casing (8) is identical.
4. a kind of clamping device for sensor chip die bond according to claim 1, it is characterised in that: the battery
(12) four groups are provided with, and the angle between adjacent cell (12) is 90 °.
5. a kind of clamping device for sensor chip die bond according to claim 1, it is characterised in that: the clamping
The inside of bar (1) bottom is all provided with rubber block, and the inside of rubber block is all provided with anti-skid chequer.
6. a kind of clamping device for sensor chip die bond according to claim 1, it is characterised in that: the air-breathing
The bottom of cover (2) is provided with circular slab, and the bottom of circular slab is evenly arranged with suction hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821451535.0U CN208835022U (en) | 2018-09-06 | 2018-09-06 | A kind of clamping device for sensor chip die bond |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821451535.0U CN208835022U (en) | 2018-09-06 | 2018-09-06 | A kind of clamping device for sensor chip die bond |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208835022U true CN208835022U (en) | 2019-05-07 |
Family
ID=66312201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821451535.0U Expired - Fee Related CN208835022U (en) | 2018-09-06 | 2018-09-06 | A kind of clamping device for sensor chip die bond |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208835022U (en) |
-
2018
- 2018-09-06 CN CN201821451535.0U patent/CN208835022U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190507 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |