CN208834083U - Light supply apparatus, projector - Google Patents

Light supply apparatus, projector Download PDF

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Publication number
CN208834083U
CN208834083U CN201821585998.6U CN201821585998U CN208834083U CN 208834083 U CN208834083 U CN 208834083U CN 201821585998 U CN201821585998 U CN 201821585998U CN 208834083 U CN208834083 U CN 208834083U
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China
Prior art keywords
light
mentioned
supply apparatus
optical system
shafts
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CN201821585998.6U
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Chinese (zh)
Inventor
山田裕贵
三浦雄一
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Ushio Denki KK
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Ushio Denki KK
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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/0239Combinations of electrical or optical elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00Optical objectives specially designed for the purposes specified below
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00Condensers, e.g. light collectors or similar non-imaging optics
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00Projectors or projection-type viewers; Accessories therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00Projectors or projection-type viewers; Accessories therefor
    • G03B21/14Details
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00Projectors or projection-type viewers; Accessories therefor
    • G03B21/14Details
    • G03B21/20Lamp housings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Projection Apparatus (AREA)
  • Semiconductor Lasers (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Microscoopes, Condenser (AREA)
  • Lenses (AREA)

Abstract

Light supply apparatus and projector inhibit the expansion of unit scale using multiple semiconductor laser chips and improve light output.Light supply apparatus has: multiple light emissions go out region, are arranged on identical or different semiconductor laser chip;First refractive optical system, include multiple flat surfaces with different inclinations angle, go out that multiple respective at least part of first light shafts that region is projected are incident to different above-mentioned flat surface from adjacent multiple above-mentioned light emissions, multiple above-mentioned respective chief rays of first light shafts are transformed to be separated from each other and multiple second light shafts for advancing and project;And second dioptric system, for the multiple above-mentioned second light shafts incidences projected from above-mentioned first refractive optical system, the direction of travel of multiple above-mentioned respective chief rays of second light shafts is transformed to substantially parallel relative to optical axis, and multiple above-mentioned second light shafts is transformed to substantially parallel light shafts respectively and are projected.

Description

Light supply apparatus, projector
Technical field
The utility model relates to light supply apparatus, in particular to utilize the light source dress of the light projected from semiconductor laser chip It sets.In addition, the utility model relates to have the projector of such light supply apparatus.
Background technique
It is being promoted as the light source for projector using the technology of semiconductor laser chip.In recent years, from city Semiconductor laser chip is used as light source like this and further improves the light supply apparatus of light output by field.
In order to improve the light output of light source side, it may be considered that light will be projected from multiple semiconductor laser chips and carry out optically focused Method.But there are certain width for semiconductor laser chip, they are configured with touching and is limited.That is, Multiple semiconductor laser chips are only configured, will lead to light supply apparatus enlargement.
From this viewpoint, there are following technologies: for example following patent documents 1 like that, configure semiconductor in first area Chip of laser group configures other semiconductor laser chip groups in the second area different from first area, using by gap The combination mechanism that mirror is constituted synthesizes the light projected from two semiconductor laser chipsets.In this way, with only existing The case where same position arrangement multiple semiconductor laser chips, is compared, and can reduce configuration area and improve luminous intensity.
Existing technical literature
Patent document
1 Japanese Unexamined Patent Publication 2017-215570 bulletin of patent document
In addition, the method as the luminous intensity for improving light source side, it may be considered that use the areas for being provided with multiple injection laser The method of the semiconductor laser chip in domain (light emission goes out region: hereinafter sometimes referred to " emitter ").Such semiconductor laser Device chip is sometimes referred to as " multi-emitting figure ".The present application people have studied by by the semiconductor laser of multi-emitting figure Device chip is used in light source come the case where improving luminous intensity, there are projects as follows for discovery.
Figure 1A is the perspective view for showing schematically the construction for the semiconductor laser chip for having an emitter.It is such Semiconductor laser chip is sometimes referred to as " single-shot beam type ".It is projected in addition, also being schematically shown in Figure 1A from emitter Light (laser) light shafts.In addition, in the present specification, the light group for being formed as pencil that will be projected from single emitter The light projected in parallel from the center of emitter and optical axis is known as " chief ray " by referred to as " light shafts ".
It is known in the case where so-called " end face light emitting-type " semiconductor laser chip 100 as shown in Figure 1A, from hair The light shafts 101L that beam 101 projects presents oval tapered.It in the present specification, will be with optical axis (Z-direction shown in figure 1A) just The big direction (Y-direction shown in figure 1A) of among 2 directions (X-direction and Y-direction) handed over, light shafts 101L angle of divergence claims For " fast axis direction ", the small direction of the angle of divergence of light shafts 101L (X-direction shown in Figure 1A ') is known as " slow-axis direction ".This In, the angle of divergence refers to the 1/e of the maximum chief ray of luminous intensity2Luminous intensity advance light and chief ray formed by angle 2 Angle again.
Figure 1B be divided into light shafts 101L the case where from X-direction and the case where from Y-direction and schematic map The figure shown.As shown in Figure 1B, for fast axis direction, the angle of divergence θ of light shafts 101LyGreatly, for slow-axis direction, light shafts 101L Angle of divergence θxIt is small.
In addition, in each figure below, for convenience of description, sometimes by the angle of divergence of light shafts than practical exaggeration map Show.
In the light (light that configures multiple semiconductor laser chips 100 and will be projected from each semiconductor laser chip 100 Beam 101L) carry out optically focused and in the case where utilizing, from the viewpoint of the size for inhibiting optical component, usually by each light shafts 101L is photochemical in parallel to carry out optically focused by lens later.Specifically, the rear class in semiconductor laser chip 100 configures collimation Lens (also referred to " collimation lens "), to reduce the angle of divergence of each light shafts 101L.
Fig. 2A be schematically illustrated at semiconductor laser chip 100 rear class be configured with collimation lens 102 in the case where The figure for the light shafts advanced on YZ in-plane.In addition, being depicted only in Fig. 2A from the upper end of emitter and lower end injection Light.
A according to fig. 2, light shafts 101L become essence after passing through collimation lens 102, about fast axis direction (Y-direction) On directional light harness (hereinafter referred to as " substantially parallel light shafts ".).In addition, in the present specification, " substantial directional light Harness " or " substantially parallel light shafts " refer to light shafts of the angle of divergence less than 4 °.In addition, in Fig. 2A into each figure below, greatly Directional light harness is caused to be illustrated as complete directional light harness sometimes.
Fig. 2 B is to be schematically illustrated at the rear class of semiconductor laser chip 100 to be configured in the case of collimation lens 102 The figure for the light shafts advanced on XZ in-plane.B according to fig. 2, light shafts 101L are after passing through collimation lens 102 about slow axis Direction (X-direction) also becomes substantially parallel light shafts.
Fig. 3 A be show schematically the semiconductor laser chip for having multiple emitters with Figure 1A difference construction it is vertical Body figure.In Fig. 3 A, shows semiconductor laser chip 110 and have the case where two emitters (111,112).
Fig. 3 B is to copy Figure 1B, and being divided into will be from the light shafts (111L, 112L) that each emitter (111,112) projects from the side X To the case where observation and the figure that schematically illustrates the case where from Y-direction.Each emitter (111,112) is about Y-direction shape At in same coordinate position, therefore when from X-direction, light shafts (111L, 112L) are completely overlapped.On the other hand, each transmitting Body (111,112) is formed in different coordinate positions, therefore light shafts (111L, 112L) when from Y-direction about X-direction It is shown in such a way that respective positions deviate.
It studies the rear class of the semiconductor laser chip 110 illustrated in figure 3 a, configure standard in the same manner as Fig. 2A and Fig. 2 B The form of light shafts in the case where straight lens 102.As described referring to Fig. 3 B, light shafts when from X-direction (111L, 112L) is completely overlapped.Accordingly, with respect to fast axis direction (Y-direction), each light shafts (111L, 112L) are passing through collimation thoroughly It is same as Fig. 2A to become substantially parallel light shafts after mirror 102.
Fig. 4 be schematically illustrated at semiconductor laser chip 110 rear class be configured in the case where collimation lens 102 The figure for the light shafts advanced on XZ in-plane.Semiconductor laser chip 110 has the multiple emitters separated in the X direction (111,112), therefore the X of the center of the X-coordinate of the center of collimation lens 102 and each emitter (111,112) is sat Mark is inevitably generated deviation.
As a result, the light shafts 111L projected from emitter 111 and the light shafts 112L projected from emitter 112 are dividing Substantially parallel light shafts, but the chief ray 111Lm and light shafts 112L of light shafts 111L Chuan Guo not be become after collimation lens 102 Chief ray 112Lm it is not parallel.That is, light shafts 111L and light shafts 112L make the respective row in relation to X-direction respectively Into direction difference.
In the case of such a construction, even if later being gathered each light shafts (111L, 112L) optically focused using condensing optical system Light beam bundle after light can also be spread, and generation is not able to guide to the light in direction as a purpose.As a result, the utilization of light Efficiency reduces.Especially utilize in the semiconductor laser chip 110 of the multiple multi-emitting figures of configuration from each semiconductor laser In the case where the light that device chip 110 projects, unavailable light reaches the amount that cannot ignore.
After passing through collimation lens 102, the angle of the direction of travel of the related X-direction of light shafts 111L and light shafts 112L Degree, is determined by the distance between emitter (111,112) relative to the relative value of the focal length of collimation lens 102.In more detail It says, in the position for setting each emitter (111,112) from the optical axis of collimation lens 102 to the optical axis farthest away from collimation lens 102 Distance be d, when the focal length of collimation lens 102 is f, light shafts (111L, 112L) respective chief ray (111Lm, Angle θ formed by the optical axis of direction of travel and collimation lens 112Lm) is by θ=tan-1(d/f) it provides.
In particular, the case where semiconductor laser chip 110, the angle θ for being configured to configure multiple multi-emitting figures become smaller Under, the collimation lens 102 long using multiple focal lengths is needed, therefore unit scale becomes very big.
The above subject in the semiconductor laser chip 100 of single-shot beam type it can also happen that.That is, the above subject is such as Generation is equally possible in lower situation: in order to make the output of semiconductor laser chip 100 rise and make the width of emitter 101 The case where broadening, the semiconductor laser chip 100 for configuring multiple single-shot beam types simultaneously make from multiple semiconductor laser chips 100 light shafts projected the situation incident to a collimation lens 102.
Utility model content
The utility model is in view of the above subject, and it is an object of the present invention to provide inhibiting device using multiple semiconductor laser chips The expansion of scale and the light supply apparatus for improving light output.In addition, the purpose of this utility model is to provide have light source dress The projector set.
The light supply apparatus of the utility model is characterized in that having: multiple light emissions go out region, are arranged in identical or different On semiconductor laser chip;
First refractive optical system, comprising multiple flat surfaces with different inclinations angle, from adjacent multiple above-mentioned light It is incident to different above-mentioned flat surfaces to project multiple respective at least part of first light shafts that region is projected, it will be multiple above-mentioned The respective chief ray of first light shafts is transformed to be separated from each other and multiple second light shafts for advancing and project;And second refraction Optical system, for the multiple above-mentioned second light shafts incidences projected from above-mentioned first refractive optical system, by multiple above-mentioned second The direction of travel of the respective chief ray of light shafts be transformed to it is substantially parallel relative to optical axis, and by multiple above-mentioned second light shafts It is transformed to substantially parallel light shafts respectively and projects.
Above-mentioned light supply apparatus has first refractive optical system in the rear class of laser source, which includes Multiple flat surfaces with different inclinations angle.From laser source project multiple first light shafts respective at least part to The different flat surfaces of first refractive optical system are incident.Corresponding to the inclination angle for being formed in flat surface, multiple first light shafts Refraction, change in travel direction.Here, the inclination angle of each flat surface is set to, and makes multiple respective key lights of first light shafts Line is separated from each other and advances.As a result, each second light shafts after passing through first refractive optical system are separated from each other and advance.
Thus, the chief ray of the second light shafts after first refractive optical system is each other in the traveling of direction and light On the extended line in contrary direction (laser source), converge in certain range.Have passed through first refractive optical system The second light shafts chief ray be each substantially from a light emission go out region project light.
Above-mentioned light supply apparatus has the second dioptric system in the rear class of first refractive optical system, the second refraction light System the direction of travel of multiple respective chief rays of second light shafts is transformed to it is substantially parallel relative to optical axis, and will be more A second light shafts are transformed to substantially parallel light shafts respectively and project.Have passed through each second light of the second dioptric system The mutual direction of travel of beam becomes substantially same direction.
Thus, above-mentioned light supply apparatus will go out the first light shafts that region is projected from multiple light emissions and pass through first refractive optical system System is transformed to substantially pass through the second refractive optics for these the second light shafts from the second light shafts that a region is projected System projects each light shafts with each light with each other as substantial parallel light (roughly parallel light) each other.
For the roughly parallel light, each light shafts do not intersect each other, or are only that extremely fine light is handed over each other Fork.As a result, these light shafts are carried out optically focused in rear class, to obtain the light with high radiation illumination.
Also, according to above-mentioned light supply apparatus, the second refractive optics system is configured by the rear class in first refractive optical system System, inhibits the diffusion of light, therefore does not need the long large-scale collimation lens of configuration focal length, can inhibit the expansion of unit scale Greatly.
Above-mentioned light supply apparatus can also have it is multiple on same semiconductor laser chip have multiple light emissions go out region The semiconductor laser chip of multi-emitting figure made of (so-called " emitter "), and can also have multiple in same half Go out the semiconductor laser core of single-shot beam type made of region (emitter) on conductor laser chip with single light emission Piece.
In above-mentioned light supply apparatus, it is also possible to have packaging part, which accommodates above-mentioned semiconductor laser chip, And has in a part and radioparent window portion is presented to light;Above-mentioned window portion is made of above-mentioned first refractive optical system.
According to above structure, laser source and first refractive optical system can be packaged and be configured to a light source dress It sets.By configuring the second dioptric system of the light supply apparatus and the focal length corresponding to purposes in outside, obtain big Cause directional light.
In above-mentioned light supply apparatus, be also possible to have packaging part, the packaging part accommodate above-mentioned semiconductor laser chip with And above-mentioned first refractive optical system, and have in a part and radioparent window portion is presented to light;Above-mentioned window portion is by above-mentioned Two dioptric systems are constituted.
According to above structure, laser source and first refractive optical system and the second dioptric system can be sealed It fills and is configured to a light supply apparatus.Roughly parallel light just only can be obtained by the light supply apparatus.
In above-mentioned light supply apparatus, above-mentioned packaging part can also accommodate multiple above-mentioned semiconductor laser chips.
In above-mentioned light supply apparatus, above-mentioned first refractive optical system can also have multiple above-mentioned flat in light incident surface side Face.
Multiple first light shafts for going out region injection from light emission are spread centered on its chief ray and are advanced.Respective key light Line keeping parallelism and advance, but light shafts diffusion and carries out, as a result light shafts a part arrival optical axis.If each light shafts A part reaches optical axis, then light shafts also spread behind and advance, and a part of light shafts is more than optical axis, mutual light shafts A part be piled up traveling.Also, the overlapping of light shafts becomes larger with traveling.
Therefore, first refractive optical system is preferably the position for comparing a part arrival optical axis of the first light shafts by prime Configuration.It configures in this way, each first light shafts projected from each emitter can be more than each first light shafts of optical axis Before a part overlapping, each flat surface to first refractive optical system is incident.
That is, configuring first refractive optics by leading portion by the position that a part than the first light shafts reaches optical axis System, multiple first light shafts for going out region injection from light emission are incident on the different of first refractive optical system completely respectively puts down On smooth face.As a result, it is possible to the whole light for making to include in each first light shafts by above-mentioned second dioptric system at For roughly parallel light, and guided to rear class.
On the contrary, first refractive optical system can also reach the position gradation rearward of optical axis than a part of the first light shafts It sets.In this case, the first adjacent light shafts each other have a part overlapping in the state of, to the second dioptric system Flat surface it is incident.
In addition, going out the first light shafts that region is projected from light emission shows position intensity of light highest, remoter in chief ray From chief ray then being distributed with light distribution, such as Gaussian Profile of more sharply declining of luminous intensity.
In the case of such a construction, it is incident on the first light shafts of the flat surface of first refractive optical system are included one It advances in the different direction of the chief ray of some light Xiang Yutong light shafts.The light will not pass through the second refractive optics system of rear class System and it is substantially parallel with chief ray, and be likely to become stray light.But as described above, such as Gauss is presented in each first light shafts The such distribution of distribution, and each first light shafts included chief ray near light by the second dioptric system to It advances with the chief ray same direction, therefore these light are converged to destination locations by the condensing optical system of rear class.That is, In this approach, the intensity of unavailable light is also extremely low, in the case where integrally considering as device, not to the benefit of light Big influence is caused with efficiency.
In above-mentioned light supply apparatus, the light emergence face of above-mentioned first refractive optical system and above-mentioned second dioptric system Light incident surface can also be common.
By using above structure, can will be projected from the laser source for having multiple light emissions and going out region by an optical system Light shafts be transformed to roughly parallel light, and then each light shafts are also transformed to roughly parallel light each other.By can be by a light System is transformed to roughly parallel light, and the expansion of unit scale is inhibited.In addition, for configure first refractive optical system and The respective component of second dioptric system becomes one, thus further suppresses the expansion of unit scale.
The projector of the utility model is characterized in that, is thrown image using the light projected from above-mentioned light supply apparatus Shadow.
Utility model effect
According to the utility model, realizes the expansion for inhibiting unit scale using multiple semiconductor laser chips and mention The light supply apparatus of High Light Output.
Detailed description of the invention
Figure 1A is the perspective view for showing schematically the construction of semiconductor laser chip of single-shot beam type.
Figure 1B be divided into the case where light shafts that will be projected from the semiconductor laser chip of Figure 1A are from X-direction and from Y-direction observation situation and the figure that schematically illustrates.
Fig. 2A be schematically illustrated at semiconductor laser chip rear class be configured with it is flat in YZ in the case where collimation lens The figure for the light shafts that face side travels upwardly.
Fig. 2 B be schematically illustrated at semiconductor laser chip rear class be configured with it is flat in XZ in the case where collimation lens The figure for the light shafts that face side travels upwardly.
Fig. 3 A is the perspective view for showing schematically the construction of semiconductor laser chip of multi-emitting figure.
Fig. 3 B be divided into the case where light shafts that will be projected from the semiconductor laser chip of Fig. 3 A are from X-direction and from The case where Y-direction is observed and the figure that schematically illustrates.
Fig. 4 be schematically illustrated at the semiconductor laser chip of Fig. 3 A rear class be configured in the case where collimation lens The figure for the light shafts advanced on XZ in-plane.
Fig. 5 is the figure for showing schematically the structure of an embodiment of light supply apparatus.
Fig. 6 A is to be schematically illustrated at the rear class of the semiconductor laser chip of Fig. 3 A to be configured with first refractive optical system In the case where the figure of light shafts advanced on XZ in-plane.
Fig. 6 B is a part of enlarged drawing of Fig. 6 A.
Fig. 7 is to show schematically to keep first refractive optical system integrated with the second dioptric system and become coupling folding Penetrate the figure of the structural example of optical system.
Fig. 8 is the figure for showing schematically the structure of an embodiment of packed light supply apparatus.
Fig. 9 is the figure for showing schematically the other structures example of packed light supply apparatus.
Figure 10 is the figure for showing schematically the other structures example of packed light supply apparatus.
Figure 11 is the figure for showing schematically the other structures example of packed light supply apparatus.
Figure 12 A is the figure for showing schematically the other structures example of packed light supply apparatus.
Figure 12 B is the figure of the X/Y plane view of Figure 12 A.
Figure 12 C is the figure for showing schematically the other structures example of packed light supply apparatus.
Figure 12 D is the figure of the X/Y plane view of Figure 12 C.
Figure 13 A is the perspective view for the light supply apparatus that multiple semiconductor laser chips are encapsulated by same packaging part.
Figure 13 B shows schematically that multiple semiconductor laser chips are individually marked off by a packaging part and are packaged The figure of the structure of one embodiment of light supply apparatus.
Figure 14 A is the perspective view for the light supply apparatus that multiple semiconductor laser chips are encapsulated by same packaging part.
Figure 14 B is to show schematically that multiple semiconductor laser chips are packaged in the same space of a packaging part The figure of the structure of one embodiment of light supply apparatus.
Figure 14 C is to show schematically that multiple semiconductor laser chips are packaged in the same space of a packaging part The figure of the other structures example of light supply apparatus.
Figure 14 D is to show schematically that multiple semiconductor laser chips are packaged in the same space of a packaging part The figure of the other structures example of light supply apparatus.
Figure 15 is the figure for showing schematically the structural example of the projector including light supply apparatus.
Description of symbols
1: light supply apparatus;
2: first refractive optical system;
2a, 2b: the flat surface that first refractive optical system has;
3: the second dioptric systems;
4: coupling dioptric system;
5: semiconductor laser chip;
6: convergence region;
7: boundary face;
9: projector;
10,20: light emission goes out region;
11,21: the first light shafts;
12,22: the second light shafts;
30: packaging part;
30a, 30b, 30c, 30d, 30e: the window portion of packaging part;
31,32: multiple package;
31a, 32a, 32b: the window portion of multiple package;
33: optical component;
40: rear class optical system;
50: integral optical system;
60: optical axis;
70: lamp optical system;
71: blue-light source;
72: fluorescent light source;
73: scattered reflection optical system;
74,75: dichroscope;
76: combining optical;
77: wavelength plate;
80: light splitting projection optical system;
81a, 81,81c: dichroscope;
81d, 81e: mirror;
82B, 82G, 82R: modulating device;
84: projection optics system;
85: color combining optical;
90: screen;
100,110: semiconductor laser chip;
101,111,112: emitter;
101L, 111L, 112L: the light shafts projected from emitter;
102: collimation lens.
Specific embodiment
The light supply apparatus of the utility model and each embodiment of projector are said hereinafter, suitably referring to attached drawing It is bright.In addition, each attached drawing below all schematically illustrates, actual size might not be consistent with the size on attached drawing.
Fig. 5 is the structure chart for showing schematically an embodiment of light supply apparatus.Light supply apparatus 1 has semiconductor laser Device chip 5, first refractive optical system 2 and the second dioptric system 3.
In Fig. 5, illustrating semiconductor laser chip 5 as an example is to have to go out region (10,20) there are two light emission The case where laser source of multi-emitting figure.In addition, in each figure below, it is also same as Figure 1A~Fig. 4, it is specified that this 3 axis of XYZ. That is, optical axis is set as Z-direction, by light emission go out region (10,20) mutually from direction be set as X-direction, will be with X-direction and Z-direction Orthogonal direction is set as Y-direction.
First refractive optical system 2 is will to go out the first of region (10,20) injection from the light emission of semiconductor laser chip 5 Light shafts (11,21) are with the optical system of defined angle refraction.In present embodiment, first refractive optical system 2 is The incident surface side of one light shafts (11,21) has the prism of the flat surface (2a, 2b) with different inclinations angle.About inclination angle Explanation, be described below referring to Fig. 6 B.
Second dioptric system 3 be the second light shafts (12,22) projected by incidence from first refractive optical system 2, The direction of travel of the respective chief ray of second light shafts (12Lm, 22Lm) is transformed to substantially parallel relative to optical axis and is incited somebody to action Multiple above-mentioned second light shafts (12,22) are transformed to the optical system of substantially parallel light shafts respectively.Second in present embodiment Dioptric system 3 is collimation lens.
Fig. 6 A is to be schematically illustrated at the rear class of semiconductor laser chip 5 to be configured with the feelings of first refractive optical system 2 The figure for the light shafts advanced on XZ in-plane under condition.Go out region (10,20) from the light emission of semiconductor laser chip 5 to project The first light shafts (11,21) reflected by first refractive optical system 2, each chief ray (12Lm, 22Lm) is to be separated from each other place Formula is advanced.Then, from first refractive optical system 2 project the second light shafts (12,22) on one side with each chief ray (12Lm, It dissipates on the basis of 22Lm) and advances on one side.
Fig. 6 B is a part of enlarged drawing of Fig. 6 A.The flat surface (2a, 2b) of first refractive optical system 2 is set with inclination angle (θa,θb).More particularly, the inclination angle (θ a, θ b) of each flat surface (2a, 2b) is set to, so that having following function: to the greatest extent The first light shafts of pipe (11,21) from phase from light emission go out region (10,20) and project, but optically carry out simulation as from same One convergence region 6 projects like that.
Here, the inclination angle (θ a, θ b) of flat surface (2a, 2b) refers to the optical axis 60 of the first light shafts (11,21) for base Punctual angle adds positive and negative value according to direction of rotation to distinguish about the angle.It here, is counterclockwise by direction of rotation The case where direction, is set as just, and the case where clockwise direction is set as negative.That is, according to the example of Fig. 6 B, first refractive optical system 2 Flat surface 2a tilted counterclockwise relative to optical axis 60, the value that tiltangleθ a is positive.On the other hand, first refractive optics The flat surface 2b of system 2 is tilted clockwise relative to optical axis 60, the value that tiltangleθ b is negative.That is, flat surface The tiltangleθ b of the tiltangleθ a and flat surface 2b of 2a are mutually different value.
In addition, in the present embodiment, the inclination angle (θ a, θ b) of flat surface (2a, 2b) is set to make convergence region 6 Go out the centre of region (10,20) in the light emission of semiconductor laser chip 5, however, you can also not be located at semiconductor laser chip 5 Light emission go out the centres of region (10,20).In turn, it may not be on optical axis 60.
As shown in Fig. 6 B, in the case where drawing following imaginary line (11a, 21a), each imaginary line converges on convergence region 6, Above-mentioned imaginary line is will be by the light of the flat surface of first refractive optical system 2 (plane of incidence) (2a, 2b) and outgoing plane 2c refraction Each chief ray (12Lm, 22Lm) of beam to the extended line of direction of travel opposite direction.That is, having passed through first refractive optical system 2 each light shafts (11,21) become the light shafts from imaginary convergence region 6, i.e. substantially projected from single-shot beam.
As referring to as Fig. 2 B narration, from the emitter of the semiconductor laser chip 100 of single-shot beam type, (light emission goes out Region) 101 project light shafts 101L roughly parallel light is transformed to by collimation lens 102.It is same as its, from shown in fig. 5 half The light shafts (11,21) that conductor laser chip 5 projects are transformed to substantially by first refractive optical system 2 from single-shot beam It is incident to the second dioptric system 3 after the light shafts of injection, it is transformed to so that each light shafts (12,22) become substantially Directional light harness.
Fig. 7 is the figure for showing schematically the other structures example of light supply apparatus 1.As shown in fig. 7, light supply apparatus 1 can also have It is standby to make to couple dioptric system 4 made of 3 integration of first refractive optical system 2 and the second dioptric system.Shown in Fig. 7 Label 7 refer to first refractive optical system 2 and the second dioptric system 3 boundary face.Based on the reason same as Fig. 6 A, Configure coupling dioptric system 4 prime first refractive optical system 2 the plane of incidence (in Fig. 6 B flat surface (2a, 2b)) the first light shafts (11,21) reflected are on the basis of chief ray (11m, 21m) divergently in first refractive optical system 2 It advances.The light shafts (11,21) for reaching boundary face 7 are incident to the second dioptric system 3 as former state, in the second dioptric system It advances in 3.Also, in the outgoing plane refraction of the second dioptric system 3 (coupling dioptric system 4), as substantially parallel Light emission goes out.
Coupling dioptric system 4 can also be by by the first refractive optical system 2 of refractive index having the same and the Two dioptric systems 3 are coupled and are constituted, or can also be by the first refractive optical system 2 and the with different refractive index Two dioptric systems 3 are coupled and are constituted.
In addition, coupling dioptric system 4 can not also make two component couplings, but it is configured to a component.For example, It can also be constituted with convex surface, in incident surface side with the optical component of the different flat surface in inclination angle by projecting surface side.
Light supply apparatus 1 can also be realized and by semiconductor laser chip 5 with defined material package.Fig. 8 is to show Meaning ground indicates the figure of the structure of an embodiment of packed light supply apparatus 1.In example shown in Fig. 8,1 institute of light supply apparatus The packaging part 30 having encapsulates semiconductor laser chip 5, and first refractive optical system 2 and the second dioptric system 3 are matched It sets in the outside of packaging part 30.In a part of packaging part 30, it is equipped with and radioparent window portion 30a is presented to light.
The part such as coefficient of thermal expansion as kovar teleoseal other than the window portion 30a of packaging part 30 is close to glass Metal constitute, window portion 30a optical glass as such as BK-7 constitutes.In light supply apparatus 1 shown in Fig. 8, window portion 30a Configure with the light emission of semiconductor laser chip 5 position that go out region (10a, 20a) opposed, from each light emission go out region (10a, 20a) the first light shafts (11,21) projected pass through first refractive optical system of the window portion 30a to configuration in the outside of packaging part 30 System 2 is incident.
That is, light supply apparatus 1 shown in Fig. 8 with the light supply apparatus 1 illustrated referring to Fig. 5 in the case where being compared, it is different Be only semiconductor laser chip 5 light emission go out between region (10a, 20a) and first refractive optical system 2 configured with pair The traveling of first light shafts (11,21) does not cause the window portion 30a of the packaging part 30 of influence optically, therefore duplicate from avoiding Viewpoint is set out, and the traveling of each light shafts later about window portion 30a omits the description.
Fig. 9 is the figure for showing schematically the other structures example of packed light supply apparatus 1.In example shown in Fig. 9, light source The packaging part 30 that device 1 has encapsulates semiconductor laser chip 5 and first refractive optical system 2, the second refractive optics system 3 configuration of system is in the outside of packaging part 30.In a part of packaging part 30, it is equipped with and radioparent window portion 30a is presented to light.
Also have semiconductor laser chip 5, configuration in light supply apparatus 1 shown in Fig. 9 in semiconductor laser chip 5 Second dioptric system 3 of the first refractive optical system 2 of rear class and the rear class configured in first refractive optical system 2, It is identical as the light supply apparatus 1 illustrated referring to Fig. 5 in this regard, the row from the viewpoint of avoiding repetition, about each light shafts Into omitting the description.
Light supply apparatus 1 shown in Fig. 9 is needed in the structure of the inside of packaging part 30 configuration first refractive optical system 2 Setting can configure the space of first refractive optical system 2 in packaging part 30.But influence small, it is no longer necessary to by first The configuration of dioptric system 2 is in the outside of packaging part 30, and due to this point, the unit scale whole as light supply apparatus 1 can Downsizing.
In turn, light supply apparatus 1 according to Fig. 9 can be by first refractive light compared with light supply apparatus 1 shown in Fig. 8 System 2 configures near semiconductor laser chip 5.Therefore, in the feelings that semiconductor laser chip 5 is multi-emitting figure It, can be before the first light shafts (11,21) for going out region (10,20) injection from each light emission be significantly spread, to first under condition The defined plane of incidence (flat surface 2a, 2b) of dioptric system 2 is incident.As a result, it is possible to make first refractive optical system 2 The size reduction of the plane of incidence (flat surface 2a, 2b), therefore be conducive to the whole miniaturization of light supply apparatus 1.
Figure 10 is the figure for showing schematically the other structures example of packed light supply apparatus 1.It more particularly, is the first folding Penetrate optical system 2 have both packaging part 30 in standby Fig. 8 window portion 30a function structure.
Also have semiconductor laser chip 5, configuration in light supply apparatus 1 shown in Fig. 10 in semiconductor laser chip 5 Rear class first refractive optical system 2 and configuration first refractive optical system 2 rear class the second dioptric system 3, it is identical as the light supply apparatus 1 illustrated referring to Fig. 5 in this regard, therefore from the viewpoint of avoiding repetition, about each light The traveling of beam omits the description.
Figure 11 is the figure for showing schematically the other structures example of packed light supply apparatus 1.It more particularly, is the second folding Penetrate optical system 3 have both packaging part 30 in standby Fig. 8 window portion 30a function structure, and by first refractive optical system 2 Configuration is in the inside of packaging part.
Also have semiconductor laser chip 5, configuration in light supply apparatus 1 shown in Figure 11 in semiconductor laser chip 5 Rear class first refractive optical system 2 and configuration first refractive optical system 2 rear class the second dioptric system 3, it is identical as the light supply apparatus 1 illustrated referring to Fig. 5 in this regard, from avoiding duplicate viewpoint from triggering, about each light shafts Traveling omits the description.
It is also that the inside in packaging part 30 same as the structure of Fig. 9 configures first refractive in light supply apparatus 1 shown in Figure 11 The structure of optical system 2, it is therefore desirable to which setting can configure the space of first refractive optical system 2 in packaging part 30.But Its influence is small, can by first refractive optical system 2 configure near semiconductor laser chip 5, and no longer need by First refractive optical system 2 and the configuration of the second dioptric system 3, due to these points, fill outside packaging part 30 as light source 1 whole unit scale is set, it being capable of downsizing.
Figure 12 A is the figure for showing schematically the other structures example of packed light supply apparatus 1.It more particularly, is by Coupling dioptric system 4 made of 3 integration of one dioptric system 2 and the second dioptric system has both in standby Fig. 8 The structure of the function of the window portion 30a of packaging part 30.Do not need first refractive optical system 2 and the second dioptric system 3 it Between installation space, compared with the light supply apparatus 1 shown in Figure 11, the downsizing of unit scale can be further realized.
In Figure 12 A, the window portion of packaging part 30 is constituted with the second dioptric system 3, by first refractive optical system 2 and the Two dioptric systems 3 engage and constitute coupling dioptric system 4.It is shown in Figure 12 B under the X/Y plane view in Figure 12 A First refractive optical system 2 and the second dioptric system 3 shape.Wherein, in X/Y plane view, first refractive optical system System 2 is in shape identical with the second dioptric system 3, therefore in Figure 12 B, first refractive optical system 2 is hidden in the Behind two dioptric systems 3.
It is also the window portion that packaging part 30 is constituted with the second dioptric system 3 in Figure 12 C, by first refractive optical system 2 It is engaged with the second dioptric system 3 and constitutes and couple dioptric system 4.The X/Y plane view in Figure 12 C is shown in Figure 12 D Under first refractive optical system 2 and the second dioptric system 3 shape.
As the embodiment of Figure 12 C and Figure 12 D, the part of second dioptric system 3 can also be equivalent to A part is configured in a manner of the outer wall face contact with packaging part 30.In addition, first refractive optical system 2 and the second refractive optics System 3 may not be round or quadrangle in X/Y plane depending in.
Also have semiconductor laser chip 5 in light supply apparatus 1 shown in Figure 12 A and 12B, make configuration in semiconductor laser Refractive optics is coupled made of 3 integration of first refractive optical system 2 and the second dioptric system of the rear class of device chip 5 System 4, it is identical as the light supply apparatus 1 illustrated referring to Fig. 7 in this regard, therefore from the viewpoint of avoiding repetition, about each The traveling of light shafts, omits the description.
Light supply apparatus 1 can also have multiple semiconductor laser chips 5.It in this case, can also be by each semiconductor Chip of laser 5 is encapsulated with the same packaging part.Figure 13 A is by the same packaging part 31 of multiple semiconductor laser chips 5 (hereinafter, sometimes referred to as " multiple package 31 ".) encapsulation light supply apparatus 1 schematical perspective view.The light source of the utility model Device can also be made of multiple package 31, the light source as projector etc. come using.Figure 13 A is to schematically illustrate its an example Figure.In light supply apparatus 1 shown in Figure 13 A, semiconductor laser chip 5 is configured in multiple package 31 and is individually divided Configuring area out.In addition, for convenience of description, the diagram of dioptric system (2,3) is omitted in Figure 13 A.
It is same as Figure 10~Figure 11, it can also be by the window portion of multiple package 31 first refractive optical system 2 or the second folding Penetrate the composition of optical system 3.In addition it is also possible to it is same as Figure 12 A~Figure 12 D, by first refractive optical system 2 and second are reflected The common coupling dioptric system 4 of optical system 3 is constituted.
If constituting multiple semiconductor laser chips 5 and dioptric system (2,3) with a packaging part, can cut Subtract the number of packages for being configured at external optical system, in turn, additionally it is possible to will be used to apply each semiconductor laser chip 5 alive Electrode also communization, therefore be conducive to the downsizing of unit scale.For the semiconductor being accommodated in the same multiple package 31 The aligning method of the quantity of chip of laser 5 and each semiconductor laser chip 5, is not particularly limited.
Figure 13 B is the multiple package 31 that will be illustrated in Figure 13 A and configures the dioptric system (2,3) of grade behind together The figure of expression.Multiple semiconductor laser chips are individually marked off to encapsulate by a packaging part.The dress of light source shown in Figure 13 B It sets 1 and configures multiple semiconductor laser chips 5, the exterior arrangement first refractive optics in multiple package 31 in multiple package 31 System 2 and the second dioptric system 3 and constitute.
Figure 14 A is other perspective views for the light supply apparatus that multiple semiconductor laser chips 5 are encapsulated by the same packaging part. Different from light supply apparatus 1 shown in Figure 13 A in light supply apparatus 1 shown in figure 14 A, semiconductor laser chip 5 is in multiple package It does not mark off individually and configures in 32.In addition, Figure 14 A is same as Figure 13 A, for convenience of description, refraction light is omitted The diagram of system (2,3).
Figure 14 B is the multiple package 32 that will be illustrated in Figure 14 A and configures the dioptric system (2,3) of grade behind together The figure of expression.Light supply apparatus 1 shown in Figure 14 B configures multiple semiconductor laser chips 5, by sealing more in multiple package 32 Exterior arrangement first refractive optical system 2 and the second dioptric system 3 that the window portion 32a of piece installing 32 separates and constitute.
Figure 14 C is to show schematically that multiple semiconductor laser chips are packaged in the same space of a packaging part The figure of the other structures example of light supply apparatus.As shown in Figure 14 C, it is also possible to multiple couplings of first refractive optical system 2 and constitutes Optical component 33.
Figure 14 D is to show schematically that multiple semiconductor laser chips are packaged in the same space of a packaging part The figure of the other structures example of light supply apparatus.As shown in fig. 14d, it is also possible to multiple couplings of first refractive optical system 2 and constitutes One optical component 33, and then optical component 33 constitutes the window portion 32b of multiple package 32.
As another other embodiments, it is also possible to injection surface side and the second refraction light of the optical component 33 of Figure 14 D The plane of incidence side contacts of system or it is common and constitute an optical component.
Figure 15 is the figure for showing schematically the structural example of the projector including above-mentioned light supply apparatus 1.Projector 9 has packet It includes the lamp optical system 70 of light supply apparatus 1, throw the backward screen 90 that the light guided by lamp optical system 70 be divided The light splitting projection optical system 80 of shadow.
In example shown in figure 15, it is contemplated to make the red the case where using light source of light supply apparatus 1.That is, lamp optical system 70 have the light supply apparatus 1 as red light source, blue-light source 71, receive the blue light projected from blue-light source 71 and generation Fluorescent light source 72, scattered reflection optical system 73, the dichroscope (74,75), integral optical system 50, synthesizing optical system of fluorescence 76 and 1/4 wavelength plate 77 of system.
The high red light R of the optical density projected from light supply apparatus 1 by dichroscope 74 after being reflected, guidance to integral light System 50.In addition, the blue light B projected from blue-light source 71 according to polarization be separated into the light reflected by dichroscope 75 and Transmit the light of dichroscope 75.For example, dichroscope 75 also may include can according to polarization direction to the direction of travel of light into The polarization separation element of row control.
The blue light for certain polarization direction reflected by dichroscope 75 is directed to fluorescent light source 72, is used as fluorescent light source The excitation light of 72 fluorophor for being included, obtained Fluoroscopic dichroscope (75,74) are directed to integral optical system 50. The blue light of other polarization directions of dichroscope 75 is transmitted after passing through 1/4 wavelength plate 77, to scattered reflection optical system System 73 is incident, diffusion light reflected from scattered reflection optical system 73 and again pass through 1/4 wavelength plate 77 and be directed to two to Look mirror 75.For the light after being reflected by dichroscope 75, transmission dichroscope 74 is directed to integral optical system 50.
In integral optical system 50, after homogenizing the Illumination Distribution of white light, synthesized by combining optical 76 For white light.The structure of combining optical 76 or the polarization conversion device including homogenizing polarization direction.
The white light for having passed through combining optical 76 is directed to light splitting projection optical system 80.It is projected by light splitting Each dichroscope (81a, 81b, 81c) that optical system 80 is included carry out white light obtained from color separated suitably via It is incident to assorted modulating device (82R, 82G, 82B) after mirror (81d, 81e) adjusts direction of travel.Modulating device (82R, 82G, 82B) white light is modulated according to image information, it is exported to color combining optical 83.Color synthesis optical system System 83 synthesizes the light for corresponding to above-mentioned image information, incident to projection optics system 84.Projection optics system 84 will be right Should in above-mentioned image information light projection to screen 90.
In addition, in projector 9 shown in figure 15, it is contemplated to it is red that the light supply apparatus 1 of present embodiment are used in generation The case where light source of coloured light, but may be the light source for generating blue light.In this case, can also have and generate blue light Light supply apparatus 1 and the incident blue light projected from the light supply apparatus 1 and the fluorescent light source for generating fluorescence as excited light, Blue light and fluorescence are synthesized via combining optical 76 and generate white light.
In turn, projector 9 is also possible to the light of generation R, G, B colors of light supply apparatus 1 by present embodiment, by synthesizing The form that optical system 76 synthesizes these light.That is, light supply apparatus 1 can also have the semiconductor for generating blue light respectively Chip of laser 5, the semiconductor laser chip 5 for generating red light, the semiconductor laser chip 5 for generating green light.At this In the case of, the white light projected from each light supply apparatus 1 can also be transmitted by light guide members such as optical fiber, and the modulation to colors Device (82R, 82G, 82B) is incident.
In addition, about projector 9 shown in figure 15, it is contemplated that modulating device (82R, 82G, 82B) is by transmission-type liquid crystal element The case where composition and be shown, but reflective modulation device (DMD: digital micromirror device, registered trademark) also can be used. Light splitting projection optical system 80 is set properly according to the structure of modulating device.
[other embodiments]
Hereinafter, being illustrated to other embodiments.
It<1>is to have to go out the more of region (10,20) there are two light emission referring to the semiconductor laser chip 5 that Fig. 5 is equal and describes Emit three-dimensional-structure.The quantity that the light emission that the semiconductor laser chip 5 has goes out region is not limited to 2, is also possible to 3 More than a.The quantity of the different flat surface in the inclination angle that first refractive optical system 2 has (2a, 2b ...) is according to light emission Out the quantity in region and set.
On the contrary, being also possible to each semiconductor laser chip 5 is to have individual light emission referring for example to Figure 1A come what is described The single-shot in region penetrates three-dimensional-structure out, is the injection light from multiple semiconductor laser chips 5 to first refractive optical system 2 Incident structure.In turn, light is being projected to 2 incidence of first refractive optical system from multiple semiconductor laser chips 5 In mode, each semiconductor laser chip 5 is also possible to multi-emitting figure construction.As long as in addition, first refractive optical system 2 with Each semiconductor laser chip 5 is arranged in correspondence with, can also even if the first refractive optical system 2 is located separately itself To be integrally formed as array-like.
<2>in the above-described embodiment, it is contemplated that the light emission of each semiconductor laser chip 5 goes out region (10,20) and is formed in On the end face of semiconductor laser chip 5 so-called " end face light emitting-type " construction the case where and be illustrated.But even if Each semiconductor laser chip 5 is so-called " surface-emitting type " construction that light is taken out along the stacking direction of semiconductor layer, similarly The utility model can be applied.
<3>as long as multiple light shafts are carried out optically focused and to the application of defined irradiation object object irradiation, in addition to projection Also the light supply apparatus 1 of the utility model can be applied other than instrument.As an example, light supply apparatus 1 can be used as exposure device Light source utilize.
<4>only an example, the utility model do not limit the optical arrangement mode that above-mentioned light supply apparatus 1 has In each structure of diagram.For example, the row for making light can also be there may suitably be between certain optical system and other optical systems Into the reflective optics of direction change.

Claims (7)

1. a kind of light supply apparatus, which is characterized in that have:
Multiple light emissions go out region, are arranged on identical or different semiconductor laser chip;
First refractive optical system goes out comprising multiple flat surfaces with different inclinations angle from adjacent multiple above-mentioned light emissions Multiple respective at least part of first light shafts that region is projected are incident to different above-mentioned flat surfaces, by multiple above-mentioned first The respective chief ray of light shafts is transformed to multiple second light shafts that while mutually separate on one side advances and projects;And
Second dioptric system, multiple above-mentioned second light shafts projected by incidence from above-mentioned first refractive optical system will The direction of travel of multiple above-mentioned respective chief rays of second light shafts be transformed to it is substantially parallel relative to optical axis, and will be multiple on The second light shafts are stated to be transformed to substantially parallel light shafts respectively and project.
2. light supply apparatus as described in claim 1, which is characterized in that
Has packaging part, which accommodates above-mentioned semiconductor laser chip, and has in a part and present thoroughly to light The window portion of penetrating property;
Above-mentioned window portion is made of above-mentioned first refractive optical system.
3. light supply apparatus as described in claim 1, which is characterized in that
Have packaging part, which accommodates above-mentioned semiconductor laser chip and above-mentioned first refractive optical system, and Have in a part and radioparent window portion is presented to light;
Above-mentioned window portion is made of above-mentioned second dioptric system.
4. light supply apparatus as claimed in claim 2 or claim 3, which is characterized in that
Above-mentioned packaging part accommodates multiple above-mentioned semiconductor laser chips.
5. light supply apparatus according to any one of claims 1 to 3, which is characterized in that
Above-mentioned first refractive optical system has multiple above-mentioned flat surfaces in light incident surface side.
6. light supply apparatus as claimed in claim 5, which is characterized in that
The light incident surface of the light emergence face of above-mentioned first refractive optical system and above-mentioned second dioptric system is common.
7. a kind of projector, which is characterized in that
Using the light projected from light supply apparatus according to any one of claims 1 to 3, image is projected.
CN201821585998.6U 2018-07-04 2018-09-28 Light supply apparatus, projector Active CN208834083U (en)

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