CN208833810U - A kind of semiconductor devices thermal resistance measurement equipment - Google Patents
A kind of semiconductor devices thermal resistance measurement equipment Download PDFInfo
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- CN208833810U CN208833810U CN201821498404.8U CN201821498404U CN208833810U CN 208833810 U CN208833810 U CN 208833810U CN 201821498404 U CN201821498404 U CN 201821498404U CN 208833810 U CN208833810 U CN 208833810U
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- semiconductor devices
- mandril
- push rod
- resistance measurement
- turntable
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 53
- 238000005259 measurement Methods 0.000 title claims abstract description 24
- 238000012360 testing method Methods 0.000 claims abstract description 13
- 238000005096 rolling process Methods 0.000 claims abstract description 3
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000013461 design Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000005457 optimization Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
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Abstract
The utility model discloses a kind of semiconductor devices thermal resistance measurement equipment, including bottom plate and the rack and apparatus of heat resistance test that are fixedly mounted on bottom plate upper end, Electrohydraulic push rod is fixedly installed in the rack, the Electrohydraulic push rod lower end is fixedly installed with turntable, the disk lower surface rolling is equipped with driven gear, the driven gear lower surface offers multiple mounting holes, a mandril is plugged in each mounting hole, every mandril lower end is detachably equipped with a pressure sensor, the pressure sensor outer cover is equipped with pressure head, the size of the pressure head of every mandril lower end is different.Beneficial effect is: a kind of semiconductor devices thermal resistance measurement equipment described in the utility model can be realized automatic adjustment pressure head to the pressure of semiconductor devices, and the semiconductor devices of various volume sizes can be fixed, semiconductor devices is facilitated to carry out thermo-resistance measurement, feature-rich, practicability is good.
Description
Technical field
The utility model relates to semiconductor fields, and in particular to a kind of semiconductor devices thermal resistance measurement equipment.
Background technique
As the direction that semiconductor devices is small to size, integrated level is high is developed, the power of semiconductor devices is higher and higher,
The heat generated in the unit time when work is also more and more, therefore is easy to increase junction temperature, then leads to device reliability
Decline, the lost of life.Therefore for its reliability of accurate evaluation, being tested the thermal resistance of semiconductor devices just seems especially heavy
It wants.
Thermal resistance tester is the thermal resistance of currently used electric method measurement semiconductor devices, and operating method is that first will partly lead
Body device is fixed on temperature platform with fixed device, and thermo-resistance measurement, fixed device are then carried out to it by thermal resistance tester
It is generally matched with thermal resistance tester, generally passes through pressure head and compress semiconductor devices on temperature platform, due to pressure head
The pressure size of semiconductor devices is easy to influence test result, and needs ceaselessly to adjust pressure value in test process,
Therefore fixed device allow for conveniently, the reliable and accurate pressure head that adjusts to the pressure of semiconductor devices, however existing fixation
Device is all to rely on to manually adjust pressure size in use, and operation is more troublesome, time-consuming and laborious, not very practical.
Utility model content
The purpose of this utility model is that providing a kind of semiconductor devices thermal resistance measurement to solve the above-mentioned problems sets
It is standby, it is simple with the fixture structure for solving semiconductor devices thermal resistance measurement equipment traditional in the prior art, it can not adjust automatically
The pressure to semiconductor devices is saved, can only rely on and manually adjust, it is troublesome in poeration, it is time-consuming and laborious, and a certain type can only be measured
Semiconductor devices, application range is small, it is not very practical the problems such as.It is preferred in many technical solutions provided by the utility model
Technical solution can be realized automatic adjustment pressure head to the pressure of semiconductor devices, and can be to the semiconductor of various volume sizes
The technical effects such as device is fixed, and semiconductor devices is facilitated to carry out thermo-resistance measurement, feature-rich, and practicability is good, it is as detailed below
It illustrates.
To achieve the above object, the utility model provides following technical scheme:
A kind of semiconductor devices thermal resistance measurement equipment provided by the utility model, including bottom plate and be fixedly mounted on bottom plate
The rack and apparatus of heat resistance test at end, Electrohydraulic push rod is fixedly installed in the rack, and the Electrohydraulic push rod lower end is fixedly mounted
There is turntable, the disk lower surface rolling is equipped with driven gear, and the driven gear lower surface offers multiple mounting holes, often
A mandril is plugged in a mounting hole, every mandril lower end is detachably equipped with a pressure sensor, the pressure sensing
Device outer cover is equipped with pressure head, and the size of the pressure head of every mandril lower end is different；
It is also fixedly installed with driving motor on the turntable, driving gear is installed on the output shaft of the driving motor,
The driving gear engages connection with driven gear, and when driving motor rotation, driving gear band moves driven gear rotation, driven
Gear rotation drives more mandril rotations；
Temperature platform is also fixedly installed on the bottom plate, the pressure head is located at the surface of the temperature platform, the electricity
General who has surrendered is placed on the compression of the semiconductor devices on temperature platform under liquid push rod rotation promotion turntable, mandril and pressure head；
The display for being also equipped with the processor being electrically connected with pressure sensor in the rack and being electrically connected with processor,
Pressure sensor will test data and pass to processor, show over the display after processor is handled.
As the significant design of this case, the Electrohydraulic push rod is fixedly mounted on the rack vertically, and turntable is fixedly mounted
On the push rod cup of Electrohydraulic push rod lower end.
As the optimization design of this case, the turntable inclination is fixedly mounted on the push rod cup of Electrohydraulic push rod lower end.
As the optimization design of this case, the mounting hole is inclined hole, and the central axis of multiple mounting holes is in turntable
Be centrosymmetric distribution centered on mandrel line.
As the optimization design of this case, positioned at turntable the lowermost mandril central axis straight down.
As the optimization design of this case, the driving motor quantity has multiple, and is mounted on one on each driving motor
A driving gear engaged with driven gear.
Above technical scheme is used, in use, first semiconductor devices is placed on temperature platform, then control driving is electric
Machine rotation drive sliding tooth wheel rotation, sliding tooth wheel rotation drive driven gear rotation, driven gear rotation drive mandril along
The central axis of driven gear rotates, until a certain mandril is rotated to vertical position (i.e. turntable bottom), and under the mandril
The volume size for the semiconductor devices placed on the pressure head at end and temperature platform, which matches, (when semiconductor devices volume is larger, answers
The biggish pressure head of volume is selected, at this point, pressure head is easy to damage semiconductor devices by pressure if still using the pressure head of small volume), it
Afterwards, the rotation of control Electrohydraulic push rod drives mandril decline, while adjusting the position of semiconductor devices, and pressure head is made to be pressed on semiconductor device
Part upper surface, later, electro-hydraulic push away can be controlled when pressure value reaches predetermined value by observing the pressure value shown on display
Bar stops operating, in test process, when needing to adjust pressure value, it is only necessary to control Electrohydraulic push rod positive and negative rotation and drive on mandril
Lower pico- mobile, easy to operate without being adjusted with hand, time saving and energy saving, practicability is good.
Beneficial effect is: a kind of semiconductor devices thermal resistance measurement equipment described in the utility model can be realized automatic tune
Pressure head is saved to the pressure of semiconductor devices, and the semiconductor devices of various volume sizes can be fixed, it is convenient partly to lead
Body device carries out thermo-resistance measurement, and feature-rich, practicability is good.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the main view of the utility model；
Fig. 2 is the left view of the utility model；
Fig. 3 is the internal structure chart of Fig. 1 of the utility model；
Fig. 4 is the cross-sectional view of the turntable of the utility model；
Fig. 5 is the internal structure chart of the mandril of the utility model；
Fig. 6 is the partial enlarged view of Fig. 5 of the utility model.
The reference numerals are as follows:
1, bottom plate；2, rack；3, apparatus of heat resistance test；4, display；5, processor；6, Electrohydraulic push rod；7, turntable；8, it drives
Dynamic motor；9, gear is driven；10, driven gear；11, mounting hole；12, mandril；13, pressure head；14, temperature platform；15, pressure passes
Sensor.
Specific embodiment
To keep the purpose of this utility model, technical solution and advantage clearer, below by the technology to the utility model
Scheme is described in detail.Obviously, the described embodiments are only a part of the embodiments of the utility model, rather than all
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not before making creative work
Obtained all other embodiment is put, the range that the utility model is protected is belonged to.
Referring to shown in Fig. 1-Fig. 6, a kind of semiconductor devices thermal resistance measurement equipment provided by the utility model, including bottom plate 1
With the rack 2 and apparatus of heat resistance test 3 for being fixedly mounted on 1 upper end of bottom plate, apparatus of heat resistance test 3 is used to carry out semiconductor devices
Thermo-resistance measurement belongs to the prior art since the test method and its working principle of apparatus of heat resistance test 3 disclose, therefore
Herein without repeating, Electrohydraulic push rod 6 is fixedly installed in rack 2, Electrohydraulic push rod 6 moves down on mandril 12 and pressure head 13 for pushing
It is dynamic, semiconductor devices is compressed, 6 lower end of Electrohydraulic push rod is fixedly installed with turntable 7, and turntable 7 is for installing driven gear 10 and driving
Motor 8,7 lower surface of turntable roll and are equipped with driven gear 10, and 10 lower surface of driven gear offers multiple mounting holes 11, installation
Hole 11 is plugged with a mandril 12, every 12 lower end of mandril is detachably pacified for installing fixed mandril 12 in each mounting hole 11
Equipped with a pressure sensor 15, pressure sensor 15 is for measuring pressure head 13 to the pressure of semiconductor devices, pressure sensor
15 outer covers are equipped with pressure head 13, and the size of the pressure head 13 of every 12 lower end of mandril is different, design in this way, convenient to different big
Small semiconductor devices is fixed；
Referring to driving motor 8 shown in Fig. 1-Fig. 5, is also fixedly installed on turntable 7, installed on the output shaft of driving motor 8
There is driving gear 9, gear 9 is driven to engage connection with driven gear 10, when driving motor 8 rotates, driving gear 9 drives driven
Gear 10 rotates, and the rotation of driven gear 10 drives more mandrils 12 to rotate；
Referring to temperature platform 14 shown in Fig. 1-Fig. 5, is also fixedly installed on bottom plate 1, pressure head 13 is located at the temperature platform 14
Surface, the rotation of Electrohydraulic push rod 6 pushes the lower general who has surrendered of turntable 7, mandril 12 and pressure head 13 to be placed on partly leading on temperature platform 14
Body device compresses；
Referring to shown in Fig. 1-Fig. 6, be also equipped in rack 2 processor 5 being electrically connected with pressure sensor 15 and with processing
The display 4 that device 5 is electrically connected, pressure sensor 15 will test data and pass to processor 5, be shown in after the processing of processor 5
On display 4.
As optional embodiment, Electrohydraulic push rod 6 is fixedly mounted on vertically in rack 2, and turntable 7 is fixedly mounted on
On the push rod cup of 6 lower end of Electrohydraulic push rod.
The inclination of turntable 7 is fixedly mounted on the push rod cup of 6 lower end of Electrohydraulic push rod, is designed in this way, and adjustment mandril 12 is facilitated
Height and position is fixed the semiconductor devices of various height to meet.
Mounting hole 11 is inclined hole, and the central axis of multiple mounting holes 11 is in center centered on the central axis of turntable 7
It is symmetrical.
Positioned at 7 the lowermost mandril 12 of turntable central axis straight down, design in this way, mandril 12 can just be vertically lowered
Semiconductor devices is compressed, the measurement numerical value of pressure sensor 15 could be accurate.
8 quantity of driving motor has multiple, and the drive engaged with driven gear 10 is mounted on each driving motor 8
Moving gear 9, multiple driving motors 8 guarantee that there is enough power driven gear 10 to be driven to rotate.
Above technical scheme is used, in use, first semiconductor devices is placed on temperature platform 14, then control driving
The rotation of motor 8 drives driving gear 9 to rotate, and the driving rotation of gear 9 drives driven gear 10 to rotate, and the rotation of driven gear 10 drives
Mandril 12 is rotated along the central axis of driven gear 10, until to vertical position, (i.e. turntable 7 is most lower for a certain rotation of mandril 12
End), and the volume size for the semiconductor devices placed on the pressure head 13 of 12 lower end of mandril and temperature platform 14 matches (when partly leading
When body device volume is larger, the biggish pressure head 13 of Ying Xuanyong volume, at this point, if still using the pressure head 13 of small volume, pressure head
13 are easy to damage semiconductor devices by pressure), later, the control rotation of Electrohydraulic push rod 6 drives mandril 12 to decline, while adjusting semiconductor devices
Position, so that pressure head 13 is pressed on semiconductor devices upper surface, later, the pressure value that shows on display 4 observed, to pressure
When value reaches predetermined value, Electrohydraulic push rod 6 can be controlled and stopped operating, in test process, when needing to adjust pressure value, it is only necessary to
Controlling 6 positive and negative rotation of Electrohydraulic push rod drives about 12 mandril slightly mobile, easy to operate without being adjusted with hand, saves
Shi Shengli, practicability are good.
Above description is only a specific implementation of the present invention, but the protection scope of the utility model is not limited to
In this, anyone skilled in the art within the technical scope disclosed by the utility model, can readily occur in variation
Or replacement, it should be covered within the scope of the utility model.Therefore, the protection scope of the utility model should be with the power
Subject to the protection scope that benefit requires.
Claims (6)
1. a kind of semiconductor devices thermal resistance measurement equipment, including bottom plate and the rack and thermo-resistance measurement that are fixedly mounted on bottom plate upper end
Equipment, it is characterised in that: Electrohydraulic push rod is fixedly installed in the rack, the Electrohydraulic push rod lower end is fixedly installed with turntable,
The disk lower surface rolling is equipped with driven gear, and the driven gear lower surface offers multiple mounting holes, each installation
It is plugged with a mandril in hole, every mandril lower end is detachably equipped with a pressure sensor, outside the pressure sensor
It is arranged with pressure head, the size of the pressure head of every mandril lower end is different；
It is also fixedly installed with driving motor on the turntable, driving gear is installed on the output shaft of the driving motor, it is described
Driving gear engages connection with driven gear, and when driving motor rotation, driving gear band moves driven gear rotation, driven gear
Rotation drives more mandril rotations；
Also it is fixedly installed with temperature platform on the bottom plate, the pressure head is located at the surface of the temperature platform, described electro-hydraulic to push away
General who has surrendered is placed on the compression of the semiconductor devices on temperature platform under bar rotation promotion turntable, mandril and pressure head；
The display for being also equipped with the processor being electrically connected with pressure sensor in the rack and being electrically connected with processor, pressure
Sensor will test data and pass to processor, show over the display after processor is handled.
2. a kind of semiconductor devices thermal resistance measurement equipment according to claim 1, it is characterised in that: the Electrohydraulic push rod is perpendicular
Straight to be fixedly mounted on the rack, turntable is fixedly mounted on the push rod cup of Electrohydraulic push rod lower end.
3. a kind of semiconductor devices thermal resistance measurement equipment according to claim 2, it is characterised in that: the turntable inclination is solid
Dingan County is on the push rod cup of Electrohydraulic push rod lower end.
4. a kind of semiconductor devices thermal resistance measurement equipment according to claim 3, it is characterised in that: the mounting hole is oblique
Hole, and the central axis of multiple mounting holes is centrosymmetric distribution centered on the central axis of turntable.
5. a kind of semiconductor devices thermal resistance measurement equipment according to claim 4, it is characterised in that: be located at turntable bottom
Mandril central axis straight down.
6. a kind of semiconductor devices thermal resistance measurement equipment according to claim 1, it is characterised in that: the driving motor number
Amount has multiple, and the driving gear engaged with driven gear is mounted on each driving motor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821498404.8U CN208833810U (en) | 2018-09-13 | 2018-09-13 | A kind of semiconductor devices thermal resistance measurement equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821498404.8U CN208833810U (en) | 2018-09-13 | 2018-09-13 | A kind of semiconductor devices thermal resistance measurement equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208833810U true CN208833810U (en) | 2019-05-07 |
Family
ID=66313247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821498404.8U Expired - Fee Related CN208833810U (en) | 2018-09-13 | 2018-09-13 | A kind of semiconductor devices thermal resistance measurement equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208833810U (en) |
-
2018
- 2018-09-13 CN CN201821498404.8U patent/CN208833810U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190507 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |