CN208819838U - Transistor process equipment - Google Patents
Transistor process equipment Download PDFInfo
- Publication number
- CN208819838U CN208819838U CN201821221447.1U CN201821221447U CN208819838U CN 208819838 U CN208819838 U CN 208819838U CN 201821221447 U CN201821221447 U CN 201821221447U CN 208819838 U CN208819838 U CN 208819838U
- Authority
- CN
- China
- Prior art keywords
- magazine
- discharge port
- pusher
- bonding
- feed inlet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of transistor process equipments.The transistor process equipment includes die Bonder, bonding equipment, Transfer pipe, pressure sensor and pusher.Die Bonder includes bonding die body and the discharge port that is set on bonding die body.Bonding equipment includes bonding wire body and the feed inlet that is set on bonding wire body.Transfer pipe is the tubular structure of both ends open.The Single port of Transfer pipe is connected to discharge port, and another port is connected to feed inlet.Pressure sensor is set to the bottom of discharge port.Pusher is set to the side of discharge port, for pushing the magazine of bonding die body output to feed inlet along discharging direction.Pusher is connect with pressure sensor signal.Wherein, driving signal is exported after pressure sensor sensing magazine push magazine to trigger pusher.The transistor process equipment disclosed by the utility model solves not can be carried out the technical issues of automatically delivering of magazine in the prior art between die Bonder and bonding equipment.
Description
Technical field
The utility model relates to field of semiconductor processing, and in particular to a kind of transistor process equipment.
Background technique
Transistor die Bonder and copper wire bonding equipment are the first two procedures equipment of semiconductor manufacturing process, are ray machines
Electrical integrated secret instrument all has the work characteristics of accurate, high speed, uninterrupted, localized hyperthermia and interval movement.Transistor
Die Bonder successively takes chip away from wafer, pastes lead frame and obtains bonding die, copper wire bonding equipment connects the pad on chip
The pin being connected in lead frame makes internal/external signal connection.
Currently, traditional mode, which is that die bonder is unified, places a region, bonding equipment is unified to place another area again
Domain.Die bonder send the product processed loading magazine to discharge port, in case feed inlet of the manual handling to bonding equipment.
Summary of the invention
Although existing artificial flowing mode is also able to achieve the purpose of magazine transmission, this mode efficiency is lower, people
Power higher cost, and it is easy to appear operation error.
Therefore, existing equipment set-up mode can not achieve the automatic biography that magazine is carried out between die Bonder and bonding equipment
It send.
The purpose of this utility model is to provide a kind of transistor process equipments, to solve existing die Bonder and bonding equipment
Between not can be carried out the technical issues of automatically delivering of magazine.
The transistor process equipment, comprising: die Bonder, bonding equipment, Transfer pipe, pressure sensor and pusher；It is viscous
Piece machine comprising bonding die body and the discharge port being set on bonding die body；Bonding equipment comprising bonding wire body and be set to weldering
Feed inlet on line body；Transfer pipe is the tubular structure of both ends open；The Single port and discharge port of Transfer pipe connect
Logical, another port is connected to feed inlet；Pressure sensor is set to the bottom of discharge port；Pusher is set to discharging
The side of mouth, for pushing the magazine of bonding die body output to feed inlet along discharging direction；Pusher and pressure sensor are believed
Number connection；Wherein, driving signal is exported after pressure sensor sensing magazine push magazine to trigger pusher.
Optionally, pusher includes pushing motor, and pushing motor is connect with pressure sensor signal；Pushing motor receives
Start to act after to driving signal, to push magazine to feed inlet.
Optionally, pusher includes electric power spring, and electric power spring is connect with pressure sensor signal；Electric power spring-reception
Generation thrust is moved along discharging direction after to driving signal, to push magazine to feed inlet.
Optionally, Transfer pipe is made of transparent material.
Optionally, Transfer pipe is detachably connected to inlet port and outlet port respectively.
Technical solutions of the utility model have the advantages that transistor process equipment disclosed in the utility model embodiment,
Due to being provided with Transfer pipe the connection discharge port of die Bonder and the feed inlet of bonding equipment, and it is provided through in discharge port
The pressure sensor and pusher of signal connection, when the magazine of die Bonder output is sent to feed inlet, pressure sensor is pressurized
Output driving signal pushes magazine to trigger pusher afterwards, and the magazine of die Bonder output is automatically pushed to weldering
In line machine, to improve production efficiency and reduce production cost.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of one of the utility model embodiment transistor process equipment；Fig. 2 is that this is practical new
The partial structure diagram of one of type embodiment transistor process equipment.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
Personnel's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation,
It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " first ", " second ",
" third " is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also indirectly connected through an intermediary, it can be with
It is the connection inside two elements, can be wireless connection, be also possible to wired connection.For those of ordinary skill in the art
For, the concrete meaning of above-mentioned term in the present invention can be understood with concrete condition.
As long as in addition, the non-structure each other of technical characteristic involved in invention described below different embodiments
It can be combined with each other at conflict.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes still within the protection scope of the invention.
Fig. 1 and Fig. 2 are please referred to, is the structural schematic diagram of one of the utility model embodiment transistor process equipment.
Transistor process equipment includes: die Bonder 1, bonding equipment 2, Transfer pipe 3, pressure sensor 4 and pusher 5.
Die Bonder 1 includes bonding die body 11 and the discharge port 12 being set on bonding die body 11.
It should be noted that die Bonder 1 pastes lead frame and obtains bonding die, make for successively taking chip away from wafer
The bonding die made, which is reloaded into magazine, to be sent to discharge port 12.12 1 side opening of discharge port, for that will be in communication with the outside, transmission material
Box.
Bonding equipment 2 includes bonding wire body 21 and the feed inlet 22 being set on bonding wire body 21.
It should be noted that bonding equipment 2 is used to the pad on chip being connected to the pin in lead frame, make inside and outside
Signal communication.Feed inlet 22 is set in bonding wire body 21, a side opening, for being put into the magazine of the output from die Bonder 1.
Transfer pipe 3 is the tubular structure of both ends open, and the Single port of Transfer pipe 3 is connected to discharge port 12, the other end
Mouth is connected to feed inlet 22.
It should be noted that in a particular embodiment, Transfer pipe 3 can be opened for the round tube shape structure of both ends open or both ends
The square tube type structure of mouth.
Pressure sensor 4 is set to the bottom of discharge port 12.
It should be noted that in a particular embodiment, pressure sensor 4 may be disposed at the body of the bottom of discharge port 12
Interior, when bonding die body 11 has magazine output and send to discharge port 12, pressure sensor 4 is pressurized, to generate setting signal simultaneously
It is sent to pusher.
Pusher is set to the side of discharge port 12, for pushing the magazine of 11 output of bonding die body along discharging direction extremely
Feed inlet 22.Pusher 5 is connect with 4 signal of pressure sensor.
It should be noted that in a particular embodiment, pusher 5 may be disposed on the body of the side of discharge port 12.
It should also be noted that, the motive force size of pusher 5, can be configured and adjust according to the case where actual production equipment,
For example, biggish motive force can be set when cartridge volume is larger or 3 length of Transfer pipe is longer；When cartridge volume is smaller
Or 3 length of Transfer pipe it is shorter when, lesser motive force can be set.It, can be more by the way that reasonable motive force size is arranged
Accurately magazine is sent to feed inlet 22, and will not be collided with bonding wire body 21, guarantees that the quality of product will not be because touching
It hits and is damaged.
Wherein, output driving signal is after pressure sensor 4 senses magazine to trigger the promotion magazine of pusher 5.
It should be noted that can then sense when pressure sensor 4 is under pressure and be fed into magazine in discharge port 12, at this time
Pressure sensor 4 issues driving signal to pusher 5, and pusher 5 pushes magazine to discharge in the triggering lower edge of driving signal
Direction pushes magazine movement, enters in feed inlet 22 by Transfer pipe 3, to complete to automatically deliver the process of magazine.
In a particular embodiment, pusher 5 includes pushing motor, and pushing motor is connect with 4 signal of pressure sensor.It pushes away
Dynamic motor starts to act after receiving driving signal, to push magazine to feed inlet 22.
In a particular embodiment, pusher 5 includes electric power spring, and electric power spring is connect with 4 signal of pressure sensor.Electricity
Generation thrust is moved along discharging direction after power spring-reception to driving signal, to push magazine to feed inlet 22.
In a particular embodiment, Transfer pipe 3 is made of transparent material.Need to illustrate when, by using transparent material
Transfer pipe 3 made of expecting more intuitive can see the case where magazine transmits, can when magazine is transmitted and broken down
Failure cause is quickly found out by intuitively observing.
In a particular embodiment, Transfer pipe 3 is detachably connected to feed inlet 22 and discharge port 12 respectively.It needs to illustrate
It is that Transfer pipe 3 is connected to feed inlet 22 and discharge port 12 respectively by dismountable mode, allows to more easily pass
It send channel 3 to take out from integral device, is conducive to the carrying, maintenance and the replacement of Transfer pipe 3 that carry out equipment.
Technical solutions of the utility model have the advantages that transistor process equipment disclosed in the utility model embodiment,
Due to being provided with Transfer pipe the connection discharge port of die Bonder and the feed inlet of bonding equipment, and it is provided through in discharge port
The pressure sensor and pusher of signal connection, when the magazine of die Bonder output is sent to feed inlet, pressure sensor is pressurized
Output driving signal pushes magazine to trigger pusher afterwards, and the magazine of die Bonder output is automatically pushed to weldering
In line machine, to improve production efficiency and reduce production cost.
The above is only the embodiments of the present invention, and therefore it does not limit the scope of the patent of the utility model, all utilizations
Equivalent structure or equivalent flow shift made by the utility model description is applied directly or indirectly in other relevant
Technical field similarly includes within the scope of patent protection of the utility model.
Claims (5)
1. a kind of transistor process equipment characterized by comprising die Bonder comprising bonding die body and be set to described viscous
Discharge port on piece body；Bonding equipment comprising bonding wire body and the feed inlet being set on the bonding wire body；Transmission is logical
Road is the tubular structure of both ends open；The Single port of the Transfer pipe is connected to the discharge port, another port with it is described
Feed inlet connection；Pressure sensor is set to the bottom of the discharge port；Pusher is set to the discharge port
Side, for pushing the magazine of the die Bonder output to the feed inlet along discharging direction；The pusher and the pressure
Force sensor signals connection；Wherein, the pressure sensor exports driving signal after sensing the magazine to trigger the pusher
Magazine described in mechanism urges.
2. transistor process equipment according to claim 1, which is characterized in that the pusher includes pushing motor,
The pushing motor is connect with the pressure sensor signal；The pushing motor starts to move after receiving the driving signal
Make, to push the magazine to the feed inlet.
3. transistor process equipment according to claim 1, which is characterized in that the pusher includes electric power spring,
The electric power spring is connect with the pressure sensor signal；Along discharging side after the electric power spring-reception to the driving signal
Thrust is generated to movement, to push the magazine to the feed inlet.
4. transistor process equipment according to claim 1, which is characterized in that the Transfer pipe uses transparent material system
At.
5. transistor process equipment according to claim 1, which is characterized in that the Transfer pipe respectively with the charging
Mouth is detachably connected to the discharge port.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821221447.1U CN208819838U (en) | 2018-07-31 | 2018-07-31 | Transistor process equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821221447.1U CN208819838U (en) | 2018-07-31 | 2018-07-31 | Transistor process equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208819838U true CN208819838U (en) | 2019-05-03 |
Family
ID=66272096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821221447.1U Expired - Fee Related CN208819838U (en) | 2018-07-31 | 2018-07-31 | Transistor process equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208819838U (en) |
-
2018
- 2018-07-31 CN CN201821221447.1U patent/CN208819838U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190503 Termination date: 20200731 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |