CN208798264U - Flexible printed circuit board and electronic device - Google Patents
Flexible printed circuit board and electronic device Download PDFInfo
- Publication number
- CN208798264U CN208798264U CN201821236419.7U CN201821236419U CN208798264U CN 208798264 U CN208798264 U CN 208798264U CN 201821236419 U CN201821236419 U CN 201821236419U CN 208798264 U CN208798264 U CN 208798264U
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- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- flexible printed
- thickness
- glue
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 47
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 35
- 229910052709 silver Inorganic materials 0.000 claims abstract description 35
- 239000004332 silver Substances 0.000 claims abstract description 35
- 229910052802 copper Inorganic materials 0.000 claims abstract description 28
- 239000010949 copper Substances 0.000 claims abstract description 28
- 239000010410 layer Substances 0.000 claims description 91
- 239000010408 film Substances 0.000 claims description 32
- 239000011889 copper foil Substances 0.000 claims description 19
- 239000013039 cover film Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 11
- 238000005452 bending Methods 0.000 claims description 5
- 239000011241 protective layer Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 230000003064 anti-oxidating effect Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 15
- 230000006870 function Effects 0.000 description 8
- 239000002356 single layer Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 239000003292 glue Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000035807 sensation Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Include the first silver film, the first routing layer, the first glue-line, the second routing layer and the second silver film being cascading on thickness direction this application discloses a kind of flexible printed circuit board, includes copper plate in the first routing layer and the second routing layer；It include bent area and the bonding pad positioned at bent area end in its transverse direction, the thickness that first glue-line is located at bent area is less than the thickness that glue-line area is located in bonding pad, alternatively, the first routing layer and the second routing layer thickness that copper plate is located at bent area at least one are less than the thickness being located in bonding pad.The above structure makes the reference planes of the first silver film and the second silver film as two layers of cabling, to achieve the effect that two-layer wiring.Meanwhile first glue-line or copper plate be located at the thickness in bent area less than its thickness in bonding pad so that flexible printed circuit board be made while realizing more more preferable performances compare it is relatively thin.The application also provides a kind of electronic device including the above flexible printed circuit board.
Description
Technical field
This application involves fields of communication technology, more particularly to a kind of flexible printed circuit board and electronic device.
Background technique
The function of the electronic devices such as mobile phone, tablet computer is stronger and stronger, such as dual camera, fingerprint recognition and face
Identification etc..In order to make the with better function of electronic device, needs to be arranged multiple module, usually use single layer FPC between disparate modules
(flexible printed circuit board) carries out the electrical connection of two disparate modules.With the development of smart phone its working frequency, transmission
Rate is higher and higher, and when using interface protocols such as MIPI or MDDI, the resistance requirements of differential pair cabling are controlled to a certain range
Interior, this requires differential pair signals to be corresponding with one layer of reference planes.It, would generally be using again when FPC is designed in existing technology
As a reference plane as route, such cost can be multiplied the copper foil of one layer or two layers of increase, while increase the copper foil number of plies
The thickness of FPC can be made to increase, flexible printed circuit board is caused to become thick.
Utility model content
For the increasingly thicker technical problem of the thickness of flexible printed circuit board in the electronic devices such as mobile phone, the application is provided
A kind of flexible printed circuit board and electronic device.
The technical solution that the application uses is: a kind of flexible printed circuit board is provided,
On the flexible printed circuit board thickness direction include be cascading the first silver film, the first routing layer,
It include copper facing in first glue-line, the second routing layer and the second silver film, first silver film and second silver film
Layer；It include bent area and positioned at the bonding pad of the bent area end in the flexible printed circuit board transverse direction, described first
The thickness that glue-line is located at the bent area is less than the thickness that the glue-line area is located in the bonding pad, alternatively, described first walks
Line layer and second routing layer thickness that copper plate is located at the bent area at least one, which are less than, to be located in the bonding pad
Thickness.
The application also provides a kind of electronic device, including flexible printed circuit board described above.
In flexible printed circuit board and electronic device in the application, by by the first glue-line in bent area, or
The thickness of coated copper layer in copper plate or the second routing layer in first routing layer subtracts with respect to its thickness for being each located on bonding pad
It is small, or be zero.So that the thickness of flexible printed circuit board bending is smaller than bonding pad, there is performance of preferably destroying or force to yield.
Detailed description of the invention
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, the drawings in the following description are only some examples of the present application, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is the structural schematic diagram in one embodiment of the application electronic device；
Fig. 2 is the structural schematic diagram in one embodiment of the application flexible printed circuit board；
Fig. 3 is the structural schematic diagram before the application improves in one embodiment of single layer cabling flexible printed circuit board；
Fig. 4 is the structural schematic diagram before the application improves in one embodiment of two-layer wiring flexible printed circuit board；
Fig. 5 is the structural schematic diagram of flexible printed circuit board decomposed shown in Fig. 2；
Fig. 6 is the separated structure schematic diagram of the application flexible printed circuit board application scenarios；
Fig. 7 is the structural schematic diagram in another embodiment of the application flexible printed circuit board；
Fig. 8 is the structural schematic diagram in the application flexible printed circuit board another embodiment；
Fig. 9 is the structural schematic diagram in the another embodiment of the application flexible printed circuit board；
Figure 10 is the structural schematic diagram in the application flexible printed circuit board another embodiment；
Figure 11 is the structural schematic diagram in the another embodiment of the application flexible printed circuit board.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation description.It is understood that specific embodiment described herein is only used for explaining the application, rather than to the limit of the application
It is fixed.It also should be noted that illustrating only part relevant to the application for ease of description, in attached drawing and not all knot
Structure.Based on the embodiment in the application, obtained by those of ordinary skill in the art without making creative efforts
Every other embodiment, shall fall in the protection scope of this application.
Term " first ", " second ", " third " in the application are used for description purposes only, and should not be understood as instruction or dark
Show relative importance or implicitly indicates the quantity of indicated technical characteristic." first ", " second ", " are defined as a result,
Three " feature can explicitly or implicitly include at least one of the features.In the description of the present application, the meaning of " plurality " is extremely
It is two few, such as two, three etc., unless otherwise specifically defined.The directional instruction of institute is (all in the embodiment of the present application
Such as up, down, left, right, before and after ...) it is only used for explaining in the phase under a certain particular pose (as shown in the picture) between each component
To positional relationship, motion conditions etc., if the particular pose changes, directionality instruction also correspondingly changes therewith
Become.In addition, term " includes " and " having " and their any deformations, it is intended that cover and non-exclusive include.Such as comprising
The process, method, system, product or equipment of a series of steps or units are not limited to listed step or unit, and
It is optionally further comprising the step of not listing or unit, or optionally further comprising for these process, methods, product or equipment
Intrinsic other step or units.
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments
It is contained at least one embodiment of the application.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
Referring to Fig. 1 and Fig. 2, Fig. 1 is the structural schematic diagram in one embodiment of the application electronic device, and Fig. 2 is this flexibility print
Structural schematic diagram in one embodiment of printed circuit board.This application provides a kind of antenna module 100 and including the electricity of the antenna
Sub-device 200.Specific electronic device 200 can be any one of multiple electronic equipments, multiple electronic equipments include but
It is not limited to cellular phone, smart phone, other wireless telecom equipments, personal digital assistant, audio player, other media plays
Device, music recorder, video recorder, camera, other medium recorders, radio, Medical Devices, calculator, programmable telemetry
Device, pager, netbook computer, personal digital assistant (PDA), portable media player (PMP), Motion Picture Experts Group
(MPEG-1 or MPEG-2) audio layer 3 (MP3) player, the equipment such as portable medical device and digital camera and combinations thereof.
Electronic device 200 includes the flexible printed circuit board 100 that following any embodiment is introduced.
Flexible printed circuit board 100 provided by the present application is two-layer wiring structure, in order to preferably embody changing for the application
Into point, the structure of single layer cabling flexible printed circuit board before lower improve is introduced first, and in order to realize better performance, is improved
The flexible printed circuit structure of the two-layer wiring of preceding formation.
Since product is with the raising of performance, working frequency, transmission rate are higher and higher, such as camera, display screen etc.
Component is controlled using the interface protocols such as MIPI or MDDI, the resistance requirements of differential pair cabling into a certain range, this will
Differential pair signal is asked to be corresponding with one layer of reference planes；Need one layer of routing layer and one layer of reference layer.If Fig. 3 is structure improvement
The structural schematic diagram of the preceding flexible printed circuit board 300 with single layer cabling.The flexible printed circuit board 300 includes stacking gradually
The first cover film 10a, the first glue-line 20a, the first copper plate 30a, the first copper foil layer 40a, first base material 50a, second being arranged
Glue-line 60a, the second substrate 70a, the second copper foil layer 80a, the second copper plate 90a, third glue-line 110a, the second cover film 120a.
Wherein the first copper foil layer 30a is routing layer, and the second copper foil layer 80a is the reference layer of the first copper foil layer 40a.
As its function is stronger and stronger to the development of intelligence for smart phone, circuit also becomes increasingly complex, dual camera, and three
Camera is even more, fingerprint recognition, and recognition of face etc. has only had the connection of single layer cabling layer signal in the lesser space of product
It is unable to satisfy demand, needs two layers or more routing layers could meet demand.If Fig. 4 is more next in order to cope with electronic apparatus functions
It is more powerful, the flexible printed circuit board 400 with two-layer wiring formed before being improved in the case that various modules are more and more
Structural schematic diagram.The flexible printed circuit board 400 includes the first cover film 10b being cascading, the first glue-line 20b, the
One copper plate 30b, the first copper foil layer 40b, first base material 50b, the second glue-line 60b, the second cover film 70b, third glue-line 80b,
Second copper plate 90b, the second copper foil layer 110b, the second substrate 120b, the 4th glue-line 130b, third substrate 140b, third copper foil
150b, third copper plate 160b, the 5th glue-line 170b, third cover film 180b, the 6th glue-line 190b, the 4th substrate 210b,
Four copper foil layer 220b, the 4th copper plate 230b, layer 7 glue 240b and the 4th cover film 250b.
From above structure can be seen that improve before with two layers of Wiring structure flexible printed circuit board 400 be only
On basis with single layer Wiring structure, it is accumulated another layer routing layer and one layer of reference layer.Will two single layers walk knot
The circuit board of structure is superimposed together, and then realizes the structure of two-layer wiring, but thickness is then single layer cabling flexible print circuit
Twice of plate 300.Such structure greatly improves the cost of preparation, simultaneously because it is too thick, therefore the flexibility prints
The performance of destroying or force to yield of brush circuit 400 substantially reduces, and is unfavorable for assembling.And for needing to connect by flexible printed circuit board 400, and
Need the change for being bent retracted positions such as stretching using flexible printed circuit board 400 come the feelings of the device slided in use
Under condition, which is even more that can not apply, even if also will be greatly reduced the service life reluctantly using upper.
Referring also to Fig. 2 and Fig. 5, specifically, the flexible printed circuit board 100 includes being cascading in the application
The first silver film 10, the first routing layer 20, the first glue-line 30, the second routing layer 40 and the second silver film 50.One embodiment
In, the first routing layer 20 and the second routing layer 40 include cover film 22, the second glue-line 24, copper plate being cascading
26, copper foil layer 28 and substrate 21.As shown in Fig. 2, the first routing layer 20 and cover film 22, the second glue in the second routing layer 40
Layer 24, copper plate 26, copper foil layer 28 and each layer of substrate 21 are symmetrical arranged with respect to the first glue-line 30.First routing layer 20 and second
The cover film 22 of routing layer 30 and the second glue-line 24 open up window 222 respectively, divide on the first silver film 10 and the second silver film 50
Not Xing Cheng protrusion 12, the first silver film 10 and the second silver film 50 are filled in window 222 and copper by protrusion 12 respectively
Layers of foil 28 connects.Further, in the embodiment, the area of window 222 is greater than 0.8mm2, to guarantee the first silver film 10 and second
Silver film 50 can contact sufficiently with copper plate 26.Specifically, window 222 can be one or more.
Using the above structure, so that reference layer of first silver film 10 as the first routing layer 20, the second silver film 50 are made
For the reference layer of the second routing layer.Specifically, the first silver film 10 and the second silver film pass through respectively protrusion 12 with by the
Copper foil layer 28 in one routing layer 20 and the second routing layer 40 connects, so that the first film layer 10 and the second silver film 50 difference
Reflux plane as 40 high-speed line of the first routing layer 20 and the second routing layer.And then keep the flexible printed circuit board 100 real
The structure of two-layer wiring is showed, while compared to the flexible printed circuit board 400 with two-layer wiring before improving, flexible printing electricity
Road plate 100 greatly reduces thickness, so that the flexible printed circuit board 100 has better bending performance, is easily installed, simultaneously
Also more meet the more frivolous feature of electronic device 200.
Referring to Fig. 6, it is possible to understand that, in an embodiment, the application electronic device 200 includes circuit main board 150 and function
Energy component 160, functional unit 160 are connected to circuit main board 150 by flexible printed circuit board 100.Specifically, different embodiments
In, functional unit 160 includes camera or light sensation.The electronic devices 200 such as many mobile phones are made more at present in order to make to shield accounting
Greatly, the functional units such as camera or light sensation component 200 are made into concealed.
Specifically, flexible printed circuit board 100 includes bonding pad 170 and bent area 180 in an embodiment.Further, even
The end that area 170 is located at bent area 180 is connect, bonding pad 170 is used for linkage function component 160, such as camera.Bent area 180
Another end far from bonding pad 170 is connect with circuit main board 150, and then functional unit 160 is connected to circuit main board 150
On.In the embodiment that functional unit 160 is concealed structure, i.e., functional unit 160 needs to stretch out electronics when in use
Outside device 200, the bending of bent area 180 is between functional unit 160 and circuit main board 150 in the embodiment.
By taking functional unit 160 includes camera as an example, it is hidden in when camera is otiose in electronic device 200,
When electronic device 200 is needed using camera function, camera is released, at this time the bent area of flexible printed circuit board 100
180 stretching, extensions, when camera retracts 200 inside of electronic device when not in use, the bent area of flexible printed circuit board 100
It is bent between functional unit 160 and circuit main board 150, bent area 180 is in bending state.
Referring to Fig. 7, optionally, in an embodiment, the first glue-line 30 is located at the thickness of bent area 180 less than the first glue-line 30
Thickness positioned at bonding pad 170.Referring to Fig. 8, further, in another embodiment, the first glue-line 30 is located at the thickness of bent area 180
It is zero, that is to say, that be only coated with the first glue-line 30 in bonding pad 170, be not provided with the first glue-line 30 in bent area 180.It is understood that
, the first glue-line 30 is provided in bonding pad 170 to combine the substrate 21 of the first cabling 10 and the second cabling 40,
Therefore the thickness of first glue-line 30 is smaller in bent area 180 or is zero function of not influencing flexible printed circuit board 100.
Specifically, 60 shape of the first gap is arranged between the first cabling 10 and the substrate 21 of the second cabling 40 in an embodiment
At cushion space.First gap 60 is then the space that the first glue-line 30 is arranged originally, and first gap 60 is by bent area 180
It removes the first glue-line 30 or the first glue-line 30 is thinned and be formed by space.The setting in first gap 60 enables to flexible print
Each layer of printed circuit board 100 is located at the position of bent area 180 when flexible printed circuit board 100 bends or stretches
Deformation can be generated using the gap, so that the flexible printed circuit board 100 has performance of preferably destroying or force to yield.So that
Flexible printed circuit board 100 either during the installation process or is applied in electronic device 200 for connecting need in use
In the case where sliding using flexible printed circuit board 100, performance of destroying or force to yield well is all had, while more frivolous.
Further, in another embodiment, at least one of copper plate 26 in the first cabling 20 and the second cabling 40 position
Thickness in bent area 180 is less than the thickness being each located in bonding pad 170, as shown in Figure 9 and Figure 10.So that first walks
There are the second gaps 70 between line 20 and/or the second glue-line and copper plate in the second cabling 40, are flexible printed circuit board 100
Deformation provide cushion space.Or first glue-line 30 with the first copper plate 40 be bonded setting so that flexible circuit board 100 is curved
Folding area 180 is made thinner.It should be understood that bent area 180 is thinner, the performance of destroying or force to yield of flexible printed circuit board 100 is also more preferable.
Optionally, in another embodiment, at least one of the copper plate 26 in the first cabling 20 and the second cabling 40 is located at
Bent area 180 with a thickness of zero.So that being deposited between the first cabling 20 or the second glue-line and copper foil layer in the second cabling 40
In gap, increase a cushion space；Or second glue-line setting, and then entire flexible printed circuit board are bonded with copper foil layer
Bent area 180 is thinner in 100.Both the above structure enables to the bent area 180 of flexible printed circuit board 100 to have
There is performance of preferably destroying or force to yield.
Specifically, the first glue-line 30, copper plate 26 are located at the thickness of 180 position of bent area, flexible printing can prepared
During circuit board 100, be coated with thinner thickness in bent area 180, can also be thinned after the same thickness of coating or
Person hollows out, this is not specifically limited.
Design is so that the thickness of flexible printed circuit board 100 is less than or equal to 275 μm through the above structure.Optionally, flexible
The thickness of bent area 180 can be made smaller than the thickness of bonding pad 170 in printed circuit board 100, and the two can also be with one certainly
Sample is thick.
Referring to Figure 11, in an embodiment, at least one of the first silver film 10 and the second silver film 50 deviate from the first glue
30 side of layer are equipped with protective layer 80.Further, in an embodiment, protective layer 80 is antioxidation coating.The setting of protective layer 80 can
The first silver film 10 and the second silver film 50 are protected, the first silver film 10 and the second silver film 50 is prevented to be oxidized, and then is guaranteed
The service life of flexible printed circuit board 100.
In the application, structure makes the reference planes of the first silver film 10 and the second silver film 50 as cabling, to reach
Two-layer wiring, the effect of the double-deck reference layer flexible printed circuit board, so that flexible printed circuit board 100 is realizing more more preferable property
Can while be made compare it is relatively thin, while can by the impedance control to certain range of the differential pair cabling of each module,
Guarantee the performance of electronic device 200.
The foregoing is merely presently filed embodiments, are not intended to limit the scope of the patents of the application, all to utilize this
Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field similarly includes in the scope of patent protection of the application.
Claims (15)
1. a kind of flexible printed circuit board, which is characterized in that include stacking gradually on the flexible printed circuit board thickness direction
The first silver film, the first routing layer, the first glue-line, the second routing layer and the second silver film being arranged, first routing layer
With in second routing layer include copper plate；Including bent area and positioned at described in the flexible printed circuit board transverse direction
The bonding pad of bent area end, the thickness that first glue-line is located at the bent area are less than the glue-line area and are located at the connection
Thickness in area, alternatively, first routing layer and second routing layer at least one copper plate be located at the bent area
Thickness be less than be located at the bonding pad in thickness.
2. flexible printed circuit board according to claim 1, which is characterized in that first silverskin and second silverskin
At least one of away from first glue-line side be equipped with protective layer.
3. flexible printed circuit board according to claim 2, which is characterized in that the protective layer is antioxidation coating.
4. flexible printed circuit board according to claim 1, which is characterized in that first routing layer and described second is walked
Line layer respectively includes the cover film being cascading, the second glue-line, the copper plate, copper foil layer and substrate, and described first
The cover film of routing layer and second routing layer and second glue-line open up window respectively, first silver film and
Protrusion is respectively formed on second silver film, first silver film and second silver film pass through the protrusion respectively
Portion is filled in the window and connect with copper foil layer, and the area of the window is greater than 0.8mm2。
5. flexible printed circuit board according to claim 4, which is characterized in that first glue-line is located at the bent area
Thickness be less than first glue-line and be located at the thickness of the bonding pad.
6. flexible printed circuit board according to claim 4, which is characterized in that first glue-line is located at the bent area
With a thickness of zero.
7. flexible printed circuit board according to claim 5 or 6, which is characterized in that first routing layer and described
Gap is set between two layers of substrate in two routing layers and forms cushion space.
8. flexible printed circuit board according to claim 5 or 6, which is characterized in that first routing layer and described
Two layers of substrate in two routing layers is bonded setting.
9. flexible printed circuit board according to claim 4, which is characterized in that the copper plate is located at the bent area
Thickness is less than the copper plate and is located at the thickness in the bonding pad.
10. flexible printed circuit board according to claim 9, which is characterized in that the copper plate is located at the bent area
With a thickness of zero, second glue-line is bonded setting with the copper foil layer.
11. flexible printed circuit board according to claim 1-6, which is characterized in that the flexible print circuit
The thickness of plate is less than or equal to 275 μm.
12. a kind of electronic device, which is characterized in that including flexible printed circuit board as claimed in any one of claims 1 to 6.
13. electronic device according to claim 12, which is characterized in that described including circuit main board and functional unit
Functional unit is connected to the circuit main board by the flexible printed circuit board.
14. electronic device according to claim 13, the functional unit includes camera.
15. electronic device according to claim 13, the flexible printed circuit board includes bent area and is located at described
The bonding pad of bent area end, the functional unit are connect with the bonding pad, and the flexible printed circuit board is far from the company
Area one end is connect to connect with the circuit main board, at the same bent area bending in the functional unit and the circuit main board it
Between.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821236419.7U CN208798264U (en) | 2018-08-01 | 2018-08-01 | Flexible printed circuit board and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821236419.7U CN208798264U (en) | 2018-08-01 | 2018-08-01 | Flexible printed circuit board and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208798264U true CN208798264U (en) | 2019-04-26 |
Family
ID=66204227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821236419.7U Expired - Fee Related CN208798264U (en) | 2018-08-01 | 2018-08-01 | Flexible printed circuit board and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208798264U (en) |
-
2018
- 2018-08-01 CN CN201821236419.7U patent/CN208798264U/en not_active Expired - Fee Related
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190426 |
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| CF01 | Termination of patent right due to non-payment of annual fee |