CN208796979U - A kind of three-dimensional Fe Getter Films Prepared structure - Google Patents
A kind of three-dimensional Fe Getter Films Prepared structure Download PDFInfo
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Abstract
The utility model belongs to high-vacuum electronic devices field, discloses a kind of three-dimensional Fe Getter Films Prepared structure, including substrate, protrusion, surface of the protrusion to be distributed in the substrate in a manner of array arrangement；And Fe Getter Films Prepared, the substrate surface that the Fe Getter Films Prepared uniform deposition is not covered in the protrusion and by the protrusion.Using the utility model, have the advantages that improve Fe Getter Films Prepared unit area occupied pumping property.
Description
Technical field
The utility model relates to high-vacuum electronic devices field more particularly to a kind of three-dimensional Fe Getter Films Prepared structures.
Background technique
In vacuum electron device field, in order to maintain the high vacuum environment of device, generally in the package cavity of electronic device
One layer of body sidewall vapor deposition, sputtering or deposition Fe Getter Films Prepared, Fe Getter Films Prepared can absorb residual in the use process of electronic device
The gas that remaining and device releases again plays stable vacuum device vacuum degree, stabilizing device characteristic parameters, improves device
It can and extend the effect of device service life.
The development trend of vacuum electron device be volume-diminished, performance improve and price reduction it is similar " mole fixed
Rule ", during the diminution of volume, it may appear that squeeze Fe Getter Films Prepared area occupied problem, but reduce the face of Fe Getter Films Prepared
Product will necessarily reduce the pumping property of Fe Getter Films Prepared, and common solution is to promote the absorbability of gettering material, but inhale
The pumping property of gas agent material substantially determines that room for promotion is limited by material nature and component, also has and is inhaled by increasing
Gas agent film surface area increases the trial of pumping property, but is all confined in two-dimensional surface processing, such as increase film surface
Roughness, similar salient point, pit etc., the pumping property of film cannot be all greatly improved in these methods.
Utility model content
Technical problem to be solved by the utility model is to provide a kind of three-dimensional Fe Getter Films Prepared structures, can substantially increase
The surface area for adding Fe Getter Films Prepared improves the pumping property of Fe Getter Films Prepared.
In order to solve the above-mentioned technical problem, the utility model provides a kind of three-dimensional Fe Getter Films Prepared structure, including substrate,
Protrusion, the protrusion are distributed in the surface of the substrate in a manner of array arrangement；And Fe Getter Films Prepared, the getter
The substrate surface that film uniform deposition is not covered in the protrusion and by the protrusion.
Optionally, the relatively described protrusion in the region between the substrate surface protrusion forms groove, the groove
Cross-sectional shape is one or more of mixing of circle, polygon, honeycomb or multilayer nest array pattern.
Optionally, the protrusion has side wall and bottom surface, and the bottom surface of the protrusion is located at the substrate surface, described
For the side wall of protrusion perpendicular to the bottom surface of the protrusion, the section of the protrusion is U-shaped.
Further, the cross-sectional shape of the protrusion be round, polygon or other irregular figures one kind or
Several mixing.
It further, further include adhesion layer, the adhesion layer is deposited on the substrate surface, with array between the protrusion
Arrangement mode is distributed in the adherency layer surface, and the Fe Getter Films Prepared uniform deposition is not in the protrusion and by the protrusion
The adherency layer surface of portion's covering.
Further, the protrusion has multilayer, and the multilayer protrusion is longitudinally superimposed.
Further, the protrusion is made of silicon nitride, titanium, titanium cobalt, titanium vanadium or silica membrane.
Implement the utility model embodiment, has the following beneficial effects: and multiple arranged by being formed in substrate surface with array
The protrusion of mode for cloth distribution, increases the depositional area of Fe Getter Films Prepared, improves Fe Getter Films Prepared unit area occupied
Gettering ability, while improving the performance and service life of original vacuum electron device；
On the vacuum electron devices such as non-refrigerated infrared detector or Terahertz, gyro, if keeping identical suction
Gas ability, the area occupied of Fe Getter Films Prepared can compression at double, solve vacuum electron device volume-diminished bring technology
Problem.
Detailed description of the invention
It in order to more clearly describe the embodiments of the utility model or the technical solutions in the prior art and advantage, below will be right
Drawings that need to be used in the embodiment or the prior art description is briefly described, it should be apparent that, be described below in it is attached
Figure is only that some embodiments of the utility model is not making the creative labor for those of ordinary skill in the art
Under the premise of, it can also be obtained according to these attached drawings other attached drawings.
Fig. 1-Figure 10 is the specific process step cross-sectional view of the utility model embodiment one, in which:
Fig. 1 is that the utility model embodiment one makes the cross-sectional view after litho pattern on substrate；
Fig. 2-Fig. 3 is the cross-sectional view of optional litho pattern on one substrate of the utility model embodiment；
Fig. 4 is that one substrate etch of the utility model embodiment faces the cross-sectional view after groove directly；
Fig. 5 is the cross-sectional view after one substrate etch curved indentations of the utility model embodiment；
Fig. 6 is that one substrate etch of the utility model embodiment faces groove and the cross-sectional view after surface is removed photoresist directly；
Fig. 7 is one substrate etch curved indentations of the utility model embodiment and the cross-sectional view after surface is removed photoresist；
Fig. 8 is that one substrate surface of the utility model embodiment makes the cross-sectional view after litho pattern again；
Fig. 9 is the cross-sectional view after one substrate surface of the utility model embodiment deposition Fe Getter Films Prepared；
Figure 10 is section view of the utility model embodiment one after the substrate surface removal photoresist of deposition Fe Getter Films Prepared
Figure.
Figure 11-Figure 18 is the specific process step cross-sectional view of the utility model embodiment two, in which:
Figure 11 is the cross-sectional view of two substrate of the utility model embodiment；
Figure 12 is the cross-sectional view on two substrate of the utility model embodiment after deposition of adhesion；
Figure 13 is the cross-sectional view on two adhesion layer of the utility model embodiment after deposited sacrificial layer；
Figure 14 is the cross-sectional view after two sacrificial layer of the utility model embodiment is graphical；
Figure 15 is cross-sectional view of the utility model embodiment two after sacrificial layer surface depositing support layer；
Figure 16 is that two sacrificial layer surface supporting layer of the utility model embodiment forms the cross-sectional view after opening；
Figure 17, which is the utility model embodiment two, releases the cross-sectional view after sacrificial layer by opening；
Figure 18 is the adherency layer surface deposition air-breathing that the utility model embodiment two is not sacrificed layer covering in sacrificial layer and
Cross-sectional view after agent film.
Wherein, attached drawing correspondence markings in figure are as follows:
1- substrate 2- Fe Getter Films Prepared 3- protrusion
4- adhesion layer 5- sacrificial layer 6- supporting layer
Specific embodiment
It is practical new to this below in conjunction with attached drawing to keep the purpose of this utility model, technical solution and advantage clearer
Type is described in further detail.Obviously, described embodiment is only the utility model one embodiment, rather than all
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not before making creative work
Every other embodiment obtained is put, is fallen within the protection scope of the utility model.
" one embodiment " or " embodiment " referred to herein, which refers to, may be included at least one realization side of the utility model
A particular feature, structure, or characteristic in formula.In the description of the present invention, it should be understood that term " on ", "lower",
The orientation or positional relationship of the instructions such as "left", "right", "top", "bottom" is to be based on the orientation or positional relationship shown in the drawings, and is only
For ease of description the utility model and simplify description, rather than the device or element of indication or suggestion meaning must have it is specific
Orientation, be constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.In addition, term " the
One ", " second " is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance or implicitly indicates and is indicated
The quantity of technical characteristic." first " is defined as a result, the feature of " second " can be expressed or what is implied includes one or more
Multiple this feature.Moreover, term " first ", " second " etc. are to be used to distinguish similar objects, without specific for describing
Sequence or precedence.It should be understood that the data used in this way are interchangeable under appropriate circumstances, so as to described herein reality
It can be performed in other sequences than those illustrated or described herein with novel embodiment.
Embodiment one
As shown in Fig. 10, be a kind of three-dimensional Fe Getter Films Prepared structure of the utility model, including substrate 1 and getter it is thin
Film 2, the Fe Getter Films Prepared 2 are located at 1 surface of substrate；
Wherein, 1 surface of substrate forms multiple grooves being distributed in a manner of array arrangement by etching, each described recessed
The cross-sectional shape of slot can be polygon as shown in Fig. 2, such as regular quadrangle, regular hexagon or star, be also possible to
Circle as shown in Fig. 2, the surface area due to etching increased groove are the bottom surface perimeter of etched recesses multiplied by the erosion of groove
Depth is carved, and increases the surface area for the Fe Getter Films Prepared that groove surfaces product can increase positioned at groove surfaces, the table of Fe Getter Films Prepared
Area can correspondingly increase the pumping property of Fe Getter Films Prepared, therefore, in order to further increase the Fe Getter Films Prepared structure
Pumping property, groove can be honeycomb, i.e., can also be with by regular hexagon permutation and combination one by one at a kind of structure of array
It is the array pattern of multilayer nest as shown in Fig. 3, i.e., by a centrally located polygonal grooves and one or more positions
A kind of structure made of the nested graphic element of the polygonal ring shape groove composition of the respective shapes of outer ring is arranged in array；
Correspondingly, it is not etched the relatively described groove in 1 surface of substrate and forms multiple protrusions 3, the Fe Getter Films Prepared 2
1 surface of substrate that uniform deposition is not covered in the protrusion 3 and by the protrusion 3, the sidewall area of the protrusion 3 are
For the increased surface area of Fe Getter Films Prepared structure, when concrete application, can be suitable by changing groove etching depth or selection
Etched figure obtains the pumping properties of needs.
As shown in attached drawing 1 to attached drawing 10, above-mentioned three-dimensional Fe Getter Films Prepared 2 can be realized by following processing steps, specifically
Ground:
(a) substrate 1 is provided, makes litho pattern on substrate 1；
In the specific implementation, the substrate 1 is silicon chip substrate, and photoresist is coated in silicon chip substrate, is exposed development
Etc. processes, make litho pattern as shown in Fig. 1, the cross-sectional shape of litho pattern can be as shown in Fig. 2 positive four
Side shape, regular hexagon and the polygonal shapes such as star-like, are also possible to circle as shown in Fig. 2, inhale in order to further increase
The surface area of gas agent film 2, litho pattern are also possible to the array of honeycomb or multilayer nest as shown in Fig. 3
Figure；
(b) the deep silicon etch groove on substrate 1 is not etched the relatively described groove in 1 surface of substrate and forms protrusion 3；
In the specific implementation, the equidistant etched recesses on substrate 1, gas used are C4F8、SF6And O2, power control
In 1000-3000W, etch depth control controls between 1:1-10:1 in 2-50um, depth-to-width ratio；Use the C of different proportion4F8
And SF6, it is the groove faced directly that the pattern of deep silicon etch figure, which can be the side wall as described in attached drawing 4, is also possible to such as 5 institute of attached drawing
The side wall shown is the groove of curved surface, wherein side wall is that the increased surface area of groove faced directly is the bottom surface perimeter of groove multiplied by recessed
The etch depth of slot, side wall are that be greater than side wall be the groove faced directly to the increased surface area of groove of curved surface, and groove is more intensive,
Groove is deeper, and increased surface area is more, i.e. the increased surface area of Fe Getter Films Prepared 2 can be more；
(c) 1 surface of substrate is removed photoresist and is cleaned；
In the specific implementation, using the litho pattern in the general plasma oxidation method removal first step, then pass through
The mixed solution or EKC solution of organic solution such as ethylene glycol and BOE clean silicon wafer, residual to remove the photoresist after oxidation
Silicon slag in 1 groove of slag and substrate, after attached etching shown in Fig. 4 face directly groove remove photoresist cleaning after obtain it is as shown in Fig. 6
Structure, the curved indentations after attached etching shown in fig. 5 remove photoresist cleaning after obtain structure as shown in Fig. 7；
(d) it makes litho pattern again on substrate 1 and substrate 1 is carried out to sweep glue processing；
In the specific implementation, LOR glue and photoresist are successively coated in silicon chip substrate 1, it is preferable that the photoresist is negative
Glue after litho pattern, can have more glue residua in 1 groove of substrate the reason is that substrate 1 there are groove, such as uses positive photoresist, from
And subsequent technique is influenced, the processes such as exposure development are carried out after coating photoresist, make litho pattern as shown in Fig. 8, in order to
The residual glue film or glue point in 1 groove of substrate are removed, substrate 1 is carried out to sweep adhesive process processing after having made litho pattern；
(e) Fe Getter Films Prepared 2 is deposited on the substrate 1 with fluted and protrusion 3；
In the specific implementation, Fe Getter Films Prepared 2 is deposited on the attached substrate 1 shown in Fig. 8 with litho pattern, getter is thin
Film 2 can be evaporable film, be also possible to non-evaporable film such as zirconium aluminium, zircon ink, zirconium zirconium nickel etc. or composite aspirator
Agent film such as barium aluminium alloy and the combination of zirconium aluminium etc., Fe Getter Films Prepared deposition thickness are controlled in 0.5-2.5um, post-depositional film
As shown in Fig. 9；
(f) LOR glue and photoresist are removed, and cleans, dry.
In the specific implementation, using general Lift-off technique (stripping technology) removal LOR glue and photoresist, obtain as
Attached 2 structure of Fe Getter Films Prepared shown in Fig. 10, then 2 structure of Fe Getter Films Prepared described in cleaning, drying.
Embodiment two
It as shown in Fig. 18, is second of three-dimensional Fe Getter Films Prepared structure of the utility model, including substrate 1, adhesion layer
4, protrusion 3 and Fe Getter Films Prepared 2, the adhesion layer 4 are deposited on 1 surface of substrate, and the protrusion 3 is with array arrangement side
Formula is distributed in 4 surface of adhesion layer, and 2 uniform deposition of Fe Getter Films Prepared is not in the protrusion 3 and by the protrusion 3
4 surface of adhesion layer of covering；
Wherein, the substrate 1 is planar structure, and 4 uniform deposition of adhesion layer is in the surface of the planar substrate 1, institute
Stating adhesion layer 4 is a kind of excellent adhesiving metal film, such as metallic titanium membrane, the Fe Getter Films Prepared 2 can be firmly attached
In 4 film surface of adhesion layer；
Sacrificial layer 5, sacrificial layer 5 be graphical, 5 surface of sacrificial layer by sequentially forming on 4 surface of adhesion layer for the protrusion 3
It is formed after depositing support layer 6, etching supporting layer 6 and releasing sacrificial layer 5, the protrusion 3 has side wall and bottom surface, the protrusion
The bottom surface in portion 3 is set to 4 surface of adhesion layer, the side wall of the protrusion 3 perpendicular to the protrusion 3 bottom surface, it is described convex
The U-shaped setting of the section in portion 3 out, the cross-sectional shape of the protrusion 3 can be polygon, such as regular quadrangle, positive six side
Shape or star are also possible to circle, in order to further increase the surface area of protrusion 3, and the adherency layer surface can be equipped with two layers
Or more layer protrusion 3, the longitudinal superposition of the two or more layers protrusion 3；
The Fe Getter Films Prepared uniform deposition protrusion 3 and be not raised portion 3 covering adherency layer surface, according to convex
The difference of the cross-sectional shape in portion 3 out, the Fe Getter Films Prepared structure correspondingly have a different structures, such as protrusion 3
When cross section is regular hexagon, the Fe Getter Films Prepared structure is honeycomb, described when the cross section of protrusion 3 is round
Fe Getter Films Prepared structure is mushroom configuration, and since protrusion 3 has side wall vertically upward, the Fe Getter Films Prepared can sink simultaneously
The long-pending surfaces externally and internally in the side wall, so that the surface area of the Fe Getter Films Prepared structure is added significantly to, when the adhesion layer 4
When the protrusion 3 that there are two or more layers to be longitudinally superimposed on surface, correspondingly, the surface area of the Fe Getter Films Prepared structure can be into
One step increases.
As shown in attached drawing 11 to attached drawing 18, above-mentioned three-dimensional Fe Getter Films Prepared 2 can be realized by following processing steps, specifically
Ground:
(a) substrate 1, the deposition of adhesion 4 on substrate 1 are provided；
In the specific implementation, substrate 1 as shown in Fig. 11 is silicon chip substrate, and cleaning treatment is carried out to it and is dried, and
The deposition of adhesion 4 on substrate 1 afterwards, adhesion layer 4 select excellent adhesiving metal film such as metallic titanium membrane, and metallic titanium membrane is same
When be also a kind of Fe Getter Films Prepared, can absorb hydrogen in activated at, nitrogen and oxygen, the deposition thickness of adhesion layer arePost-depositional adhesion layer 4 is as shown in Fig. 12；
(b) the deposited sacrificial layer 5 on adhesion layer 4；
In the specific implementation, as shown in Fig. 13, sacrificial layer 5 is formed for nonphotosensitive polyimides through imidization thin
Film, for thickness control in 1-5um, sacrificial layer 5 is thicker, and the increased surface area of Fe Getter Films Prepared 2 can be more；
(c) sacrificial layer 5 is graphical；
In the specific implementation, sacrificial layer 5 is etched by the method for Lithography Etching and as shown in Fig. 14 is arranged with array
The litho pattern of mode for cloth distribution, litho pattern can be regular quadrangle, regular hexagon and the polygonal shapes such as star-like, can also
To be round or other irregular figures, correspondingly, the Fe Getter Films Prepared structure can be formed honeycomb, mushroom configuration or
Other structures；
(d) patterned 5 surface of sacrificial layer and be not sacrificed layer 5 covering film surface depositing support layer 6；
In the specific implementation, as shown in Fig. 15, by PECVD (plasma enhanced chemical vapor sedimentation) patterned
5 surface of sacrificial layer and the 4 surface depositing support layer 6 of adhesion layer for not being sacrificed the covering of layer 5, supporting layer 6 are silicon nitride film, support
Layer 6 also could alternatively be films, the plastics thickness controls such as titanium, titanium cobalt, titanium vanadium, silica and exist
(e) supporting layer 6 on 5 surface of etching portions of patterned sacrificial layer can be with the opening of releasing sacrificial layer 5 to be formed；
In the specific implementation, the supporting layer 6 on 5 surface of sacrificial layer is etched by the method for Lithography Etching to form such as attached drawing 16
Shown in be open；
(f) step (b) is repeated to step (e), prepares the supporting layer structure of bilayer or more above-mentioned steps (e) formation；
In the specific implementation, one layer of second sacrificial layer is deposited again in the supporting layer body structure surface that step (e) obtains, this
The thickness of two sacrificial layers is enough to cover all supporting layers 6, then repeatedly step (c), will be located at the of 6 overthe openings of supporting layer
Two sacrificial layers are graphical, patterned second sacrificial layer with patterned sacrificial layer shape is consistent for the first time in above-mentioned steps (3), then
It repeats step (d), is deposited on 6 surface of supporting layer that patterned second sacrificial layer and the second sacrificial layer not being patterned cover
Second supporting layer, repeats step (e), and the second support layer surface above patterned second sacrificial layer is etched open again
Mouthful, prepare the supporting layer structure of bilayer or more above-mentioned steps (e) formation；
(g) sacrificial layer is discharged by the opening that step (e) or step (f) etch, is formed multiple with array arrangement side
The protrusion 3 of formula distribution；
In the specific implementation, sacrificial layer is discharged using oxygen plasma by the opening, is obtained as shown in Fig. 17
Protrusion 3, the protrusion 3 have bottom surface and side wall, the bottom surface deposition on the adhesion layer, the side wall with it is described
Plane perpendicular.
(h) Fe Getter Films Prepared 2 is deposited in the resulting membrane structure surface of step (g).
In the specific implementation, the membrane structure shown in attached drawing 17 or the membrane structure surface with longitudinal superposition protrusion
Fe Getter Films Prepared 2 is deposited, Fe Getter Films Prepared 2 can be evaporable film, be also possible to non-evaporable film such as zirconium aluminium, zircon
Ink, zirconium nickel etc. or composite aspirator agent film such as barium aluminium alloy and the combination of zirconium aluminium etc., deposition thickness 1-5um, wherein
After the deposition Fe Getter Films Prepared of the membrane structure surface shown in attached drawing 17 as shown in Fig. 18, there is longitudinal superposition protrusion
Structure after the deposition Fe Getter Films Prepared of membrane structure surface is not shown.
Fe Getter Films Prepared structure prepared by method by embodiment one or two, if the height of lug boss is greater than width
The area of degree, increased Fe Getter Films Prepared 2 can be greater than 200%, if it is double-deck convex structure, can increase by 400% or more
2 area of Fe Getter Films Prepared, be equivalent to pumping property and increase nearly four times, if keeping original pumping property, getter is thin
The area occupied of film 2 is compressible to original 1/2 or even 1/4, can reduce the area of device, at the same for the miniaturization of device, just
The development for the applications such as taking provides strong technical support.
Embodiment three
The three-dimensional Fe Getter Films Prepared structure of the another kind of the utility model, including substrate, adhesion layer, protrusion and getter are thin
Film, the adhesion layer are deposited on the substrate surface, and the protrusion is distributed in the adherency layer surface in a manner of array arrangement,
The adherency layer surface that the Fe Getter Films Prepared uniform deposition is not covered in the protrusion and by the protrusion；
Wherein, the substrate surface forms multiple grooves being distributed in a manner of array arrangement by etching, the groove
Cross-sectional shape is as in the first embodiment, can be polygon, such as regular quadrangle, regular hexagon or star, is also possible to circle；
For the adhesion layer uniform deposition on the surface of the substrate, the adhesion layer is that a kind of excellent adhesiving metal is thin
Film, such as metallic titanium membrane, since the substrate has the groove being distributed in a manner of array arrangement, the adherency layer surface is corresponding
Form groove and protrusion；
Sacrificial layer, sacrificial layer be graphical, sacrificial layer surface by sequentially forming in adhesion layer convex surfaces for the protrusion
It is formed after depositing support layer, etching supporting layer and releasing sacrificial layer, the shape of the protrusion is identical as embodiment two, same to have
There are side wall and bottom surface, and side wall is perpendicular to bottom surface, the U-shaped setting of the section of the protrusion, the cross section of the protrusion
Shape equally can be polygon, such as regular quadrangle, regular hexagon or star, be also possible to circle, unlike, it is described convex
The bottom surface in portion is set to the boss surface of the adhesion layer out；
With embodiment two, the surface area of protrusion, the convex surfaces of the adhesion layer can be equipped with two in order to further increase
Layer or more protrusion, the two or more layers protrusion are longitudinally superimposed；
The Fe Getter Films Prepared uniform deposition protrusion and the portion of not being raised covering adherency layer surface, relative to reality
Example two is applied, since adherency layer surface has groove, to further increase the surface area of the Fe Getter Films Prepared structure；
With embodiment two, when the protrusion that there are the adhesion layer convex surfaces two or more layers to be longitudinally superimposed, institute
The surface area for stating Fe Getter Films Prepared structure can further increase.
It is above-mentioned three-dimensional Fe Getter Films Prepared can be realized by following processing steps, specifically:
(a) substrate is provided, makes litho pattern on substrate；
Specific implementation process is the same as (a) the step of embodiment one；
(b) etched recesses on substrate；
Specific implementation process is the same as (b) the step of embodiment one；
(c) substrate surface removes photoresist and cleans；
Specific implementation process is the same as (c) the step of embodiment one；
(d) deposition of adhesion on substrate；
Specific implementation process is the same as (a) the step of embodiment two；
(e) the deposited sacrificial layer on adhesion layer；
In the specific implementation, sacrificial layer is the film that nonphotosensitive polyimides is formed through imidization, the thickness of sacrificial layer
It is greater than the depth of adhesion layer surface groove；
(f) sacrificial layer is graphical；
In the specific implementation, by the method for Lithography Etching by sacrificial layer etching at the photoetching being distributed in a manner of array arrangement
Figure, litho pattern are located at the top of the adhesion layer surface groove, litho pattern can be regular quadrangle, regular hexagon and
Star-like equal polygonal shapes, are also possible to round or other irregular figures；
(g) patterned sacrificial layer surface and be not sacrificed layer covering film surface depositing support layer；
Specific implementation process is the same as (d) the step of embodiment two；
(h) supporting layer of etching portions of patterned sacrificial layer surface can be with the opening of releasing sacrificial layer to be formed；
Specific implementation process is the same as (e) the step of embodiment two；
(i) step (b) is repeated to step (h), prepares the supporting layer structure of bilayer or more above-mentioned steps (h) formation；
(j) sacrificial layer is discharged by the opening that step (h) or step (i) etch, is formed multiple with array arrangement side
The protrusion of formula distribution；
Specific implementation process with (e) the step of embodiment two or (f), unlike, the bottom surface deposition of the protrusion exists
In the convex surfaces of the adhesion layer；
(k) Fe Getter Films Prepared is deposited in the resulting membrane structure surface of step (j).
Specific implementation process is the same as (h) the step of embodiment two.
The above is preferred embodiments of the present invention, it is noted that for the ordinary skill of the art
For personnel, without departing from the principle of this utility model, several improvements and modifications can also be made, these are improved and profit
Decorations are also considered as the protection scope of the utility model.
Claims (7)
1. a kind of three-dimensional Fe Getter Films Prepared structure, which is characterized in that including substrate (1), protrusion (3), the protrusion (3) with
Array arrangement mode is distributed in the surface of the substrate (1)；And
Fe Getter Films Prepared (2), Fe Getter Films Prepared (2) uniform deposition is not in the protrusion (3) and by the protrusion (3)
Substrate (1) surface of covering.
2. a kind of three-dimensional Fe Getter Films Prepared structure according to claim 1, which is characterized in that substrate (1) surface is convex
The protrusion (3) relatively of the region between portion (3) forms groove out, the cross-sectional shape of the groove be circle, polygon,
One or more of mixing of honeycomb or multilayer nest array pattern.
3. a kind of three-dimensional Fe Getter Films Prepared structure according to claim 1, which is characterized in that the protrusion (3) has
Side wall and bottom surface, the bottom surface of the protrusion (3) are located at the substrate surface, and the side wall of the protrusion (3) is perpendicular to described
The section of the bottom surface of protrusion (3), the protrusion (3) is U-shaped.
4. a kind of three-dimensional Fe Getter Films Prepared structure according to claim 3, which is characterized in that the cross of the protrusion (3)
Cross sectional shape is one or more of mixing of round, polygon or other irregular figures.
5. a kind of three-dimensional Fe Getter Films Prepared structure according to claim 3, which is characterized in that further include adhesion layer (4), institute
It states adhesion layer (4) and is deposited on the substrate (1) surface, the protrusion (3) is distributed in the adhesion layer in a manner of array arrangement
(4) surface, the adherency that Fe Getter Films Prepared (2) uniform deposition is not covered in the protrusion (3) and by the protrusion (3)
Layer (4) surface.
6. a kind of three-dimensional Fe Getter Films Prepared structure according to claim 3, which is characterized in that the protrusion (3) has more
Layer, the multilayer protrusion (3) are longitudinally superimposed.
7. a kind of three-dimensional Fe Getter Films Prepared structure according to claim 3, which is characterized in that the protrusion is by nitrogenizing
Silicon, titanium, titanium cobalt, titanium vanadium or silica membrane composition.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111001545A (en) * | 2019-11-25 | 2020-04-14 | 烟台艾睿光电科技有限公司 | Method for preventing getter from falling particles and getter and reinforced coating assembly |
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2018
- 2018-07-27 CN CN201821203812.6U patent/CN208796979U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111001545A (en) * | 2019-11-25 | 2020-04-14 | 烟台艾睿光电科技有限公司 | Method for preventing getter from falling particles and getter and reinforced coating assembly |
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