CN208796140U - The super fusion all-in-one machine of one kind - Google Patents

Abstract

The utility model relates to the super fusion all-in-one machines of one kind, it is characterized in that, the super fusion all-in-one machine is at least provided with mainboard, the first central processing unit (1), the first Memory Controller Hub (2), driver interface module (5), network module (3), encrypting module (4), cooling system (6) and power-supply system (7).The super fusion all-in-one machine is additionally provided with the second central processing unit (8), the second Memory Controller Hub (9) and dual port memories module (10).The setting of up to 2 central processing units and corresponding hardware module of the utility model provides leading reliability, manageability and safety, improves carry out expanding required performance and flexibility in the future to the maximum extent.

Description

Super integration all-in-one

Technical Field

The invention relates to the technical field of all-in-one machines, in particular to a super-integration all-in-one machine.

Background

The super-fusion storage system is an object-oriented distributed storage system. The super-fusion means that resources and technologies such as computing, network, storage and server virtualization and the like are provided in the same set of unit equipment, and the super-fusion also comprises elements such as cloud management software, data reconstruction, multiple copies, snapshot technology and the like, and multiple nodes can be aggregated through the network, so that modular seamless transverse expansion is realized, and a uniform resource pool is formed.

In the super-fusion device, the most core hardware resources include server resources and disk resources. Due to the distributed and highly-extended characteristics of the super-fusion system, the operations for identifying the extended hardware resources and adding the hardware resources to the system in the system consume system resources, especially heterogeneous hardware resources. Meanwhile, the most important resource of the super-fusion system is data information stored on a disk, and for expanded disk resources, the system needs to effectively identify and protect the data information in the disk resources, which also consumes a large amount of system processing resources, devices and terminals.

The chinese patent application with publication number CN107844274A discloses a hardware resource management method, device and terminal based on a super-fusion storage system. The main technical scheme is as follows: periodically scanning whether new hardware resources exist in a local server by using a hardware resource management service; if yes, loading the new hardware resource into a management virtual machine in a local server; judging whether the new hardware resources have identification information, wherein the representation information is identification information of hardware resource labels in a management system used by the super-fusion storage system; if the new hardware resource exists, the new hardware resource is added to a hardware resource pool of the super-fusion storage system through the management virtual machine according to the identification information; and if the new hardware resource does not exist, marking identification information for the new hardware resource, and adding the new hardware resource into a hardware resource pool of the super-fusion storage system through the management virtual machine.

In order to realize the functions, a corresponding super-fusion all-in-one machine device capable of realizing the hardware resource management method of the super-fusion storage system is urgently needed, and a super-fusion all-in-one machine which has reliability, manageability and safety and can improve performance and flexibility required by future expansion to the maximum extent is urgently needed.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model provides a super integration all-in-one.

The utility model discloses a super integration all-in-one is provided with mainboard, first central processing unit, first memory controller, driver interface module, network module, cryptographic module, cooling system and electrical power generating system at least. The first central processing unit is fixed on the mainboard through a first central processing unit slot arranged on the mainboard, and is respectively connected with the first memory controller, the encryption module, the driver interface module, the network module, the heat dissipation system and the power supply system through the mainboard. The first memory controller is fixed on the mainboard through a first memory controller slot arranged on the mainboard and is connected with the first central processing unit through the mainboard. The network module is fixed on the mainboard through a network module slot arranged on the mainboard and is connected with the first central processing unit through the mainboard. The encryption module is fixed on the mainboard through an encryption module slot arranged on the mainboard and is connected with the first central processing unit through the mainboard. The driver interface module is connected with the first central processing unit through the mainboard. The heat dissipation system is connected with the first central processing unit through the mainboard. The power supply system is connected with the mainboard.

According to a preferred embodiment, the super-fusion all-in-one machine is further provided with a second central processing unit, a second memory controller and a dual-port memory module. The second central processing unit is fixed on the mainboard through a second central processing unit slot arranged on the mainboard and is respectively connected with the second memory controller, the dual-port memory module, the encryption module, the driver interface module, the network module, the heat dissipation system and the power supply system through the mainboard. The second memory controller is fixed on the mainboard through a second memory controller slot arranged on the mainboard and is connected with the second central processing unit through the mainboard. The dual-port memory module is connected with the first central processing unit.

According to a preferred embodiment, the first central processing unit is provided with at least one first memory port, and the first memory port is provided with at least one memory module. The second central processing unit is provided with at least one second memory port, and the second memory port is provided with at least one memory module.

According to a preferred embodiment, the driver interface module includes a plurality of driver interfaces and/or a plurality of driver adapter cards, and the driver adapter cards are respectively provided with a plurality of driver interfaces.

According to a preferred embodiment, the main board is further provided with at least one on-board port capable of being connected to a solid state disk. The at least one onboard port is connected with the first central processing unit, the second central processing unit, the first memory controller and the second memory controller through the mainboard respectively.

According to a preferred embodiment, the network module is one or more of an application specific integrated chip, a microprocessor and a single chip microcomputer. The network module comprises one or more of a network component mainboard local area network card, a high-speed network card and a universal network adapter.

According to a preferred embodiment, the cryptographic module is a trusted platform module or a trusted cryptographic module. The trusted platform module comprises one or more of a security chip for encryption, an encryption hard disk and an encryption memory. The trusted encryption module comprises one or more of a security chip for encryption, an encryption hard disk and an encryption memory.

According to a preferred embodiment, the heat dissipation system comprises several fans. The fans are respectively connected with the main board circuit in a parallel connection manner

According to a preferred embodiment, the power supply system comprises several redundant power supplies. The plurality of redundant power supplies are respectively connected with the mainboard circuit in a parallel mode.

According to a preferred embodiment, a driver backplane is further disposed on the motherboard of the super-fusion all-in-one machine. The driver backboard is connected with the first central processing unit, the second central processing unit, the driver interface module, the heat dissipation system and the power supply system through the mainboard respectively.

The utility model has the advantages of:

the utility model discloses a super integration all-in-one can provide reliability, manageability and the security that the trade is leading, furthest improves and expands required performance and flexibility in the future.

The dual-core system realizes data communication between the first central processing unit and the second central processing unit by adopting a high-performance dual-port memory module. Two ends of the dual-port memory module are provided with a set of same address lines, data lines and control lines, and the communication between the dual-port memory module and the first central processing unit and the communication between the dual-port memory module and the second central processing unit can be realized without complex logic control circuits. The application of the dual-port memory module simplifies the circuit structure. And the double-port memory module has large data transmission quantity and high speed, meets the requirements of high data transmission capacity and real-time performance of the ultra-fusion all-in-one machine, reduces peripheral logic circuits, enhances the system reliability, simplifies the hardware design and greatly improves the processing speed. The ultra-integration all-in-one machine also has the characteristics of strong operation processing capability, abundant interface resources, convenient software and hardware upgrading and the like

The utility model discloses a super fuse all-in-one carries on intel to strong extensible family treater, provides extensible performance and storage capacity to can improve the IO bandwidth, two treater of most supporting, the capacity of the highest 3 TB. The utility model discloses a super integration all-in-one provides basic or advanced hardware RAID protection and a series of network options, including customized LOM, ML2 and general PCIe network adapter. The utility model discloses a super integration all-in-one adopts unique AnyBay design, can select in same driver bracket and use various driver interfaces: SAS drives, SATA drives, or u.2nvme PCIe drives. The utility model discloses a super integration all-in-one provides board year NVMe PCIe port, but lug connection to U.2NVMe PCIe SSD, this can not occupy the IO slot, helps reducing NVMe solution acquisition cost. The utility model discloses a super integration all-in-one adopts 80+ titanium gold and platinum authentication redundant power, when being connected to 200 and supplanting with power 240V alternating current power supply, can provide 96% (titanium) or 94% (platinum) efficiency under 50% load, has extremely powerful every watt computing power. The utility model discloses a super integration all-in-one can accord with ASHRAE A4 standard (highest 45 ℃ [ 113F ]), and this helps reducing energy cost, still keeps world-level reliability simultaneously, and the highest height above sea level 3,050 meters that satisfies. The utility model discloses a super fuse all-in-one utilizes Integrated form I/O technique (Integrated I/O Technology) to embed PCI Express 3.0 controller in the treater, can help reducing the I/O delay and improve overall system performance. The utility model discloses a super integration trusted platform module (TCM) or trusted encryption module (TPM) of all-in-one provides senior encryption function (such as digital signature and remote authentication). The utility model discloses a super built-in XClarity Controller (XCC) of integration all-in-one can last monitored control system parameter, triggers the early warning to carry out the recovery operation when breaking down, with furthest shorten down time. The utility model discloses a super integration all-in-one can provide virtual operating panel in XClarity Mobile application of operation on Android or iOS Mobile device (being connected to the leading USB port that can visit XClarity Controller), can be used to quick display system state, firmware, network, operation conditions and early warning information. The utility model discloses a super high RAID of integration machine and from encrypting the driver can provide enterprise level data protection. The utility model discloses a super integration all-in-one supports industry standard AES NI, can provide more quick, more powerful encryption. The utility model discloses an it has at least one memory port, two storage module of every memory port to surpass every treater of fusion all-in-one. DDR4 memory uses the highest quality components offered by the first-class DRAM vendor, and the memory programmatically embeds a unique signature in the DIMM so that the customization server verifies that the installed memory is eligible and supported. Support, ECC, SDDC (for x4 based memory DIMMs), memory mirroring, rank sparing, memory polling, on-demand erase memory protection techniques.

Drawings

FIG. 1 is a schematic structural diagram of a super-fusion all-in-one machine carrying a single central processing unit;

FIG. 2 is a schematic structural diagram of a super-fusion all-in-one machine carrying a dual-CPU; and

FIG. 3 is a schematic structural diagram of a preferred embodiment of the hyper-fusion kiosk.

List of reference numerals

1: the first cpu 2: first memory controller

3: the network module 4: encryption module

5: the driver interface module 6: heat dissipation system

7: the power supply system 8: second central processing unit

9: the second memory controller 10: dual-port memory module

11: onboard port 12 driver backplane

31: first network component 32: second network component

51: first drive riser card 52: second driver adapter card

53: driver interface

61: first fan 62: second fan

63: third fan 64: fourth fan

65: fifth fan 66: sixth fan

71: first redundant power supply 72: second redundant power supply

Detailed Description

The following detailed description is made with reference to the accompanying drawings.

As shown in fig. 1, the utility model discloses a super integration all-in-one is provided with mainboard, first central processing unit 1, first memory controller 2, driver interface module 5, network module 3, encryption module 4, cooling system 6 and electrical power generating system 7 at least. The first central processing unit 1 is fixed on the mainboard through a first central processing unit slot arranged on the mainboard and is respectively connected with the first memory controller 2, the encryption module 4, the driver interface module 5, the network module 3, the heat dissipation system 6 and the power supply system 7 through the mainboard. The first memory controller 2 is fixed on the mainboard through a first memory controller slot arranged on the mainboard and is connected with the first central processing unit 1 through the mainboard. The network module 3 is fixed on the mainboard through a network module slot arranged on the mainboard and is connected with the first central processing unit 1 through the mainboard. The encryption module 4 is fixed on the mainboard through an encryption module slot arranged on the mainboard and is connected with the first central processing unit 1 through the mainboard. The driver interface module 5 is connected with the first central processing unit 1 through a mainboard. The heat dissipation system 6 is connected to the first cpu 1 through a motherboard. The power supply system 7 is connected to the main board. Wherein, the network module 3 is one or more of a special integrated chip, a microprocessor and a singlechip. The encryption module 4 is one or more of a special integrated chip, a microprocessor and a singlechip. The driver interface module is an interface or adapter card capable of connecting a driver and a motherboard. The heat dissipation system 6 is a fan or other cooling device.

Preferably, as shown in fig. 2, the super-fusion all-in-one machine is further provided with a second central processing unit 8, a second memory controller 9 and a dual-port memory module 10. The second central processing unit 8 is fixed on the motherboard through a second central processing unit 8 slot arranged on the motherboard and is respectively connected with the second memory controller 9, the dual-port memory module 10, the encryption module 4, the driver interface module 5, the network module 3, the heat dissipation system 6 and the power supply system 7 through the motherboard. The second memory controller 9 is fixed on the motherboard through a second memory controller slot arranged on the motherboard and is connected with the second central processing unit 8 through the motherboard. The dual-port memory module 10 is connected to the first cpu 1. Preferably, the hyper-convergence fabric carries an Intel to strongly scalable family processor, provides scalable performance and storage capacity, and can improve I/O bandwidth. The super-fusion all-in-one machine is at most provided with two processors, and each processor has 2666MHz TruDDR4 memory with the maximum of 1.5 TB. Preferably, the dual-core system uses the high-performance dual-port memory module 10 to implement data communication between the first central processing unit and the second central processing unit. The two ends of the dual-port memory module 10 are provided with a set of same address lines, data lines and control lines, and the communication between the dual-port memory module 10 and the first central processing unit 1 and the second central processing unit 8 can be realized without complex logic control circuits. The use of the dual port memory module 10 simplifies the circuit structure. And the data transmission quantity of the dual-port memory module 10 is large, the speed is high, the requirements of high data transmission capacity and real-time performance of the ultra-fusion all-in-one machine are met, peripheral logic circuits are reduced, the system reliability is enhanced, the hardware design is simpler, and the processing speed is greatly improved. Preferably, the first central processing unit 1 and the second central processing unit 8 of the super-fusion all-in-one machine are not limited to single-core or multi-core central processing units. The first central processing unit 1 and the second central processing unit 8 are relatively independent hardware modules of the central processing unit, and are different from a conventional dual-core central processing unit. The first central processing unit 1 and the dual-port memory module 10 are connected through PCIe. The second cpu 8 and the dual-port memory module 10 are connected via PCIe. The dual port memory module 10 is clearly distinguished from a cache integrated in a central processing unit. The cache integrated in the cpu is a static memory, which has a small capacity and is difficult to meet the high-speed computation and transmission requirements of a large capacity. The dual-port memory module 10 is a dynamic memory hardware module and has the characteristics of large capacity and high speed. The data transmission and interaction of the first central processing unit 1 and the second central processing unit 8 which are relatively independent are realized through the dual-port memory module 10, and the high-speed transmission and calculation of large capacity and large amount of data are realized, so that the high-speed data transmission requirement of the ultra-fusion all-in-one machine is met. The ultra-fusion all-in-one machine also has the characteristics of strong operation processing capability, abundant interface resources, convenient software and hardware upgrading and the like. The dual-port memory module 10 has two completely independent sets of data lines, address lines, and read/write control lines on one SRAM memory, and allows two independent systems to randomly access the memory at the same time, i.e., a shared multi-port memory. The dual-port memory module 10 is characterized in that the storage data is shared. A memory is provided with two independent sets of address, data and control lines, allowing two independent CPUs or controllers to simultaneously and asynchronously access memory cells. The dual-port memory module 10 may be used to increase the throughput of the memory and is suitable for real-time data caching.

Preferably, the first central processing unit 1 is provided with at least one first memory port, and the first memory port is provided with at least one storage module. The second central processing unit 8 is provided with at least one second memory port, which is provided with at least one memory module. This provides flexible and extensible internal storage for the hyper-converged kiosk. In a specific embodiment, the first central processing unit 1 is provided with 6 first memory ports, and each first memory port is provided with 2 memory modules. The first memory module may be a dual in-line memory module. The second central processing unit 8 is provided with 6 second memory ports, and each second memory port is provided with 2 memory modules. The memory module may be a dual in-line memory module, i.e., a DIMM. The dual in-line memory module is a novel memory bank appearing after the Pentium central processing unit is pushed out. It provides a 64-bit data channel. The dual inline memory module has similar performance to a single-side contact memory module (SIMM), except that two ends of a golden finger of the DIMM are not communicated with each other like the SIMM, and the two ends of the golden finger of the DIMM are respectively and independently used for transmitting signals, so that the dual inline memory module can meet the transmission requirement of more data signals. The optimized configuration or capacity optimized configuration of the super-fusion all-in-one machine supports 24 drives with 2.5 inches or 14 drives with 3.5 inches at most, and can be widely selected from various SAS/SATAHDD/SSD and NVMe PCIe SSD and different capacities. Preferably, DDR4 memory uses the highest quality components offered by the first-class DRAM vendor, and the memory programmatically embeds a unique signature in the DIMM so that the customization server verifies that the installed memory is eligible and supported. Support, ECC, SDDC (for x4 based memory DIMMs), memory mirroring, rank sparing, memory polling, on-demand erase memory protection techniques.

Preferably, the driver interface module 5 includes a plurality of driver interfaces and/or a plurality of driver adapter cards, and the plurality of driver adapter cards are respectively provided with a plurality of driver interfaces. Preferably, the driver interface is a high-speed serial computer expansion bus interface, namely a PCIe interface; the driver adapter card is a high-speed serial computer expansion bus adapter card, namely a PCIe adapter card. PCIe is a high-speed serial computer expansion bus standard, belongs to high-speed serial point-to-point double-channel high-bandwidth transmission, and connected devices distribute independent channel bandwidth and do not share bus bandwidth, and mainly support functions of active power management, error reporting, end-to-end reliable transmission, hot plug, service quality and the like. In one specific embodiment, as shown in fig. 3, the hyper-convergence fabric is provided with up to 6 PCIe interfaces. PCIe interface sets up at the casing rear panel of super integration all-in-one and is connected with the mainboard. In another specific embodiment, the super-convergence all-in-one machine is provided with two PCIe riser cards, namely a first PCIe riser card 51 and a second PCIe riser card 52, and a PCIe interface 53. The first PCIe adapter card 51 and the second PCIe adapter card 52 may be fixed on the motherboard through PCIe adapter card slots disposed on the motherboard. The first PCIe riser card provides 3 PCIe interfaces and the second PCIe riser card provides 2 PCIe interfaces. The PCIe interface 53 is provided on the chassis rear panel that is super-fused to be collective. Preferably, the drive bay is of a unique AnyBay design, thereby allowing for flexibility in using SAS, SATA or nvmecle drives in the same drive bay.

Preferably, the motherboard is also provided with at least one on-board port 11 capable of connecting to a solid state disk. At least one board-mounted port 11 is connected to the first central processor 1, the second central processor 8, the first memory controller 2 and the second memory controller 9 through the motherboard, respectively. Preferably, the onboard port is an nvmelle port. The ultra-convergence all-in-one machine can be directly connected to the U.2NVMe PCIe SSD through the onboard NVMePCIe port, so that an I/O slot is not occupied, and the acquisition cost of the NVMe solution is reduced. One or more than one on-board port 11 may be provided.

Preferably, the network module 3 is one or more of an application-specific integrated chip, a microprocessor and a single chip microcomputer. The network module 3 comprises one or more of a network component mainboard local area network card, a high-speed network card and a universal network adapter. In a specific embodiment, as shown in fig. 3, the network module 3 includes two network components, a first network component 31 and a second network component 32. Wherein, the first network component 31 adopts a customized motherboard lan card, i.e. LOM; the second network component adopts a high-speed network card, and preferably adopts an M.2 module or an NGFF module. In this specific embodiment, the first network component 31, i.e. the customized LOM, is fixed on the motherboard through the LOM slot disposed on the motherboard and is connected to the first central processor 1 and the second central processor 8 through the motherboard respectively. The second network component, i.e. the m.2 module, is fixed on the motherboard through the m.2 module slot arranged on the motherboard and is respectively connected with the first central processing unit 1 and the second central processing unit 8 through the motherboard.

Preferably, the encryption module is a trusted encryption module or a trusted platform module. The trusted platform module comprises one or more of a security chip for encryption, an encrypted hard disk and an encrypted memory. The trusted encryption module comprises one or more of a security chip for encryption, an encryption hard disk and an encryption memory. Preferably, the trusted platform module is a chip which is planted inside the computer and provides a trusted root for the computer, and refers to a security chip which conforms to the standards of the trusted platform module, and can effectively protect the computer and prevent an illegal user from accessing the computer. The chip is specified by a trusted computing group. The credible encryption module researched in China corresponds to the credible encryption module. A trusted encryption module, i.e. TCM, and/or a trusted platform module, i.e. TPM, provides advanced encryption functions such as digital signature and remote authentication. In one specific embodiment, the super-converged all-in-one machine is further configured with a high-level RAID and an optional self-encrypting drive which can provide enterprise-level data protection.

Preferably, the heat dissipation system 6 comprises several fans. The fans are connected with the main board circuit in a parallel mode respectively. In a specific embodiment, as shown in fig. 3, the heat dissipation system 6 includes 6 hot swap fans, including a first fan 61, a second fan 62, a third fan 63, a fourth fan 64, a fifth fan 65, and a sixth fan 66. The fan is fixed on the mainboard through the fan slot that sets up on the mainboard and is connected with first central processing unit 1 and second central processing unit 8 respectively through the mainboard. Electronic components needing heat dissipation in the super-fusion all-in-one machine are arranged in the direction of an air outlet of the fan. Preferably, the first central processing unit 1, the second central processing unit 8, the first memory controller 2, the second memory controller 9, the network module 3, the encryption module 4 and the driver interface module 5 are sequentially arranged from near to far in the direction of the air outlet of the fan. In other embodiments, the heat dissipation system may be other refrigeration systems such as an air conditioner.

Preferably, the power supply system comprises a number of redundant power supplies. The plurality of redundant power supplies are respectively connected with the main board circuit in a parallel connection mode. In one particular embodiment, as shown in FIG. 3, the super-fusion all-in-one machine includes a first redundant power supply and a second redundant power supply. Preferably, the first redundant power supply adopts 80+ titanium certification redundant power supply, and the second redundant power supply adopts 80+ platinum certification redundant power supply. When connected to 200-240V AC power supply, can provide 96% (titanium gold) or 94% (platinum gold) energy efficiency under 50% load, and has extremely strong calculation capacity per watt.

Preferably, as shown in fig. 3, a driver backplane 12 is further disposed on the motherboard of the super-fusion all-in-one machine. The driver back plate 12 is connected to the first central processing unit 1, the second central processing unit 8, the driver interface module 5, the heat dissipation system 6 and the power supply system 7 through the motherboard. In a specific embodiment, the driver backplane 12 is provided with a chip supporting hot plug, and is driven by a backplane driver. The driver back plate 12 provides hot plug function for the power supply system 7, the heat dissipation system 6 and the driver interface module 5 of the super-fusion all-in-one machine.

Preferably, the super-converged all-in-one machine provides basic or advanced hardware RAID protection.

Preferably, the ultra-fusion all-in-one machine conforms to ASHRAE A4 standard (maximum 45 ℃ [113 ° ])

F)), which helps to reduce energy costs while still maintaining world-level reliability. The maximum height of the device meets the height of 3,050 m.

Preferably, the hyper-fusion all-in-one machine utilizes Integrated I/O Technology (Integrated I/O Technology) to embed a PCI Express 3.0 controller in the processor, which can help reduce I/O latency and improve overall system performance.

Preferably, an XClarity Mobile application, which is executable on an Android or iOS Mobile device (connected to a front USB port accessible to an XClarity controller), provides a virtual operation panel, which can be used to quickly display system status, firmware, network, operating conditions, and early warning information.

Preferably, the ultra-fusion all-in-one machine supports the industry standard AES NI and can provide faster and stronger encryption.

The system specification of the preferred embodiment of the super-fusion all-in-one machine of the utility model is shown in table 1.

TABLE 1

The utility model discloses a super each component part that fuses all-in-one is the hardware, through the combination and the connection of each hardware, solves the problem that prior art exists. Specifically, the first central processing unit 1, the second central processing unit 8, the first memory controller 2, and the second memory controller 9 are all hardware. The network module 3 is one or more of a special integrated chip, a microprocessor and a singlechip. The encryption module 4 is one or more of a special integrated chip, a microprocessor and a singlechip. The driver interface module 5, the heat dissipation system 6 and the power supply system 7 are hardware devices known to those skilled in the art.

It should be noted that the above-mentioned embodiments are exemplary, and that those skilled in the art, having benefit of the present disclosure, may devise various arrangements that are within the scope of the present disclosure and that fall within the scope of the invention. It should be understood by those skilled in the art that the present specification and figures are illustrative only and are not limiting upon the claims. The scope of the invention is defined by the claims and their equivalents.

Claims (10)

1. A super-integration all-in-one machine is characterized by at least being provided with a mainboard, a first central processing unit (1), a first memory controller (2), a driver interface module (5), a network module (3), an encryption module (4), a heat dissipation system (6) and a power supply system (7); wherein,

the first central processor (1) is fixed on the mainboard through a first central processor slot arranged on the mainboard and is respectively connected with the first memory controller (2), the network module (3), the driver interface module (5), the encryption module (4), the heat dissipation system (6) and the power supply system (7) through the mainboard,

the first memory controller (2) is fixed on the mainboard through a first memory controller slot arranged on the mainboard and is connected with the first central processing unit (1) through the mainboard,

the network module (3) is fixed on the mainboard through a network module slot arranged on the mainboard and is connected with the first central processing unit (1) through the mainboard,

the encryption module (4) is fixed on the mainboard through an encryption module slot arranged on the mainboard and is connected with the first central processing unit (1) through the mainboard,

the driver interface module (5) is connected with the first central processing unit (1) through the mainboard,

the heat dissipation system (6) is connected with the first central processing unit (1) through the mainboard,

the power supply system (7) is connected with the mainboard.

2. The superfusion all-in-one machine according to claim 1, wherein the superfusion all-in-one machine is further provided with a second central processing unit (8), a second memory controller (9) and a dual-port memory module (10);

the second central processing unit (8) is fixed on the mainboard through a second central processing unit slot arranged on the mainboard and is respectively connected with the second memory controller (9), the dual-port memory module (10), the encryption module (4), the driver interface module (5), the network module (3), the heat dissipation system (6) and the power supply system (7) through the mainboard,

the second memory controller (9) is fixed on the mainboard through a second memory controller slot arranged on the mainboard and is connected with the second central processing unit (8) through the mainboard,

the dual-port memory module (10) is connected with the first central processing unit (1).

3. The hyper-fusion all-in-one machine according to claim 2, wherein the first central processing unit (1) is provided with at least one first memory port provided with at least one memory module, and the second central processing unit (8) is provided with at least one second memory port provided with at least one memory module.

4. The hyper-fusion all-in-one machine as claimed in claim 3, wherein the driver interface module (5) comprises a plurality of driver interfaces and/or a plurality of driver adapter cards, and a plurality of driver interfaces are respectively arranged on the plurality of driver adapter cards.

5. The hyper-fusion all-in-one machine according to claim 4, wherein at least one onboard port (11) capable of being connected to a solid state disk is further arranged on the mainboard, the at least one onboard port (11) is connected with the first central processing unit (1), the second central processing unit (8), and the first memory controller (2) and the second memory controller (9) through the mainboard.

6. The hyper-convergence all-in-one machine as claimed in claim 5, wherein the network module (3) is one or more of an application specific integrated chip, a microprocessor and a single chip microcomputer, and the network module (3) comprises one or more of a network component mainboard LAN card, a high-speed network card and a universal network adapter.

7. The hyper-fusion all-in-one machine of claim 6, wherein the encryption module is a trusted platform module or a trusted encryption module,

the trusted platform module comprises one or more of a security chip for encryption, an encryption hard disk and an encryption memory,

the trusted encryption module comprises one or more of a security chip for encryption, an encryption hard disk and an encryption memory.

8. The superfusion all-in-one machine as claimed in claim 7, wherein the heat dissipation system (6) comprises a plurality of fans which are connected with the motherboard circuit in parallel respectively.

9. The superfusion all-in-one machine according to claim 8, wherein the power supply system (7) comprises a plurality of redundant power supplies which are connected in parallel with the main board circuit respectively.

10. The superfusion all-in-one machine according to claim 8, wherein a driver backplane (12) is further provided on the motherboard of the superfusion all-in-one machine;

the driver back plate (12) is respectively connected with the first central processing unit (1), the second central processing unit (8), the driver interface module (5), the heat dissipation system (6) and the power supply system (7) through the mainboard.