CN208760136U - Conducting connecting part - Google Patents
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- CN208760136U CN208760136U CN201820254761.3U CN201820254761U CN208760136U CN 208760136 U CN208760136 U CN 208760136U CN 201820254761 U CN201820254761 U CN 201820254761U CN 208760136 U CN208760136 U CN 208760136U
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Abstract
The utility model discloses a kind of compliant conductive connector, the compliant conductive connector successively includes: basal layer；The adhesive force being set on the basal layer improves layer；The conductive layer being set on the adhesive force improvement layer；And it is set to the encapsulated layer on the conductive layer.In the compliant conductive connector of embodiment according to the present utility model, by setting conductive material and the four-layer structure that collectively constitutes of non-conducting material, under the premise of guaranteeing high conductivity and reliability, improve conducting connecting part can deformation behavior, it is comfortable and easy to wear.
Description
Technical field
The embodiments of the present invention are related to intelligence and dress technical field, in particular to a kind of compliant conductive connector.
Background technique
Intelligent clothing and intelligent wearable device are one of the industries that electronics industry field is quickly grown in recent years, except having
Outside the multiple functions such as heating, communication, sensing, shielding, wearable property is also an important performance factors in intelligent clothing, including
The stretchable of appropriateness, bending, twisting property are also wanted to work normally under deformation to keep coordinating with the movement of human body.
Intelligent clothing includes the electronic equipments such as power supply, functional circuit, component, conducting connecting part.Conducting connecting part is as electronic equipment
The middle critical component for connecting power supply, functional circuit, component etc., reliability and stability are particularly important.
The conducting connecting part of the prior art is mainly that the non-conducting material of conductive material and such as elastomeric material forms
Composite construction, tensility tends not to meet the requirement that intelligent wearable device is stretched repeatedly, is bent, folding, or leads
Electrical property cannot satisfy the use demand.
Utility model content
The embodiments of the present invention propose a kind of compliant conductive connector, at least can be by the way that conductive material is arranged
The four-layer structure collectively constituted with non-conducting material with provide it is good can deformation behavior, promote user and dress experience.
One aspect according to the present utility model, provides a kind of compliant conductive connector, the compliant conductive connector according to
Secondary includes: basal layer；The adhesive force being set on the basal layer improves layer；The conduction being set on the adhesive force improvement layer
Layer；And it is set to the encapsulated layer on the conductive layer.
According to some embodiments, base layer thickness 0.02-1mm, adhesive force improves layer with a thickness of 0.01-0.2mm,
Conductive layer thickness is 0.05-0.3mm, and encapsulated layer is with a thickness of 0.1-0.5mm.
According to some embodiments, base layer thickness 0.1-0.15mm, adhesive force improves layer with a thickness of 0.04-
0.05mm, conductive layer thickness 0.1-0.2mm, encapsulated layer is with a thickness of 0.2-0.3mm.
According to some embodiments, the basal layer includes high polymer elastic body thin film or the weaving by elastomer preparation
Object；It includes one of polyacrylic acid, polyurethane, polysiloxanes, polysulfide rubber or a variety of that the adhesive force, which improves layer,；It is described to lead
Electric layer includes low-melting-point metal or alloy, and conductive enhancing particle；And the encapsulated layer includes curable liquid-packing
Material.
According to some embodiments, the conductive enhancing uniform particle is distributed in the low-melting-point metal or alloy.
According to some embodiments, the low-melting-point metal or alloy include gallium, indium, tin, zinc, bismuth, lead, cadmium, mercury, sodium,
Potassium, magnesium, aluminium, iron, cobalt, manganese, titanium, vanadium, boron, carbon, silver, copper, iron, nickel, gallium-indium alloy, gallium-indium-tin alloy, gallium indium silver, gallium indium nickel,
One of gallium indium zinc, gallium indium copper, gallium indium silver-bearing copper, bismuth indium stannum alloy are a variety of；And the conductive enhancing particle include gold,
One of silver, copper, iron, titanium, zinc, wicker copper, silver-colored packet carbon, silver-colored packet glass, carbon nanotube, graphene, graphite, carbon black are more
Kind.
According to some embodiments, the high polymer elastic body thin film include polyurethane, polypropylene terephthalate,
One of polybutylene terephthalate (PBT), polysiloxanes, acetic acid and vinyl acetate copolymer, nitrile rubber, butadiene-styrene rubber
Or it is a variety of.
According to some embodiments, the elastomer includes spandex fibre, polypropylene terephthalate's fiber, gathers
One of olefin(e) fibre, nylon are a variety of.
According to some embodiments, the curable liquid encapsulating material includes that elastomeric polypropylenes yogurt liquid, elasticity are poly-
One of urethane lotion, acetic acid and vinyl acetate copolymer lotion, two-component polysiloxanes are a variety of.
According to some embodiments, the basal layer includes polysiloxane film；It includes poly- third that the adhesive force, which improves layer,
Olefin(e) acid；The conductive layer includes that gallium-indium alloy and silver powder are compound；And the encapsulated layer includes polysiloxanes
According to some embodiments, the basal layer includes butadiene-styrene rubber；It includes polysiloxanes that the adhesive force, which improves layer,；
The conductive layer includes that gallium indium yellow gold 90% (mass percent) and silver powder (mass percent) 10% are compound；And it is described
Encapsulated layer includes polysiloxanes.
According to some embodiments, the basal layer includes polysiloxane film；It includes poly- ammonia that the adhesive force, which improves layer,
Ester；The conductive layer includes that gallium-indium alloy 80% (mass percent) and copper powder 20% (mass percent) are compound；And it is described
Encapsulated layer includes polysiloxanes.
According to some embodiments, the basal layer includes spandex fibre；It includes polyurethane that the adhesive force, which improves layer,；Institute
Stating conductive layer includes that gallium-indium alloy 85% (mass percent) and silver-coated copper powder 15% (mass percent) are compound；And it is described
Encapsulated layer includes polyacrylic acid.
According to some embodiments, the basal layer, the adhesive force, which improve layer and the encapsulated layer, has approximate bullet
Property modulus.
According to some embodiments, the elongation at break of the compliant conductive connector is 30%-500%, elasticity modulus
For 10KPa-1000MPa.
According to some embodiments, the elongation at break of the compliant conductive connector is 100%-300%, elasticity modulus
For 1MPa-100MPa.
According to some embodiments, the conductivity of the conductive layer is 5*105-8*106S/m。
According to some embodiments, the sheet resistance of the compliant conductive connector is 0.01m Ω/sq-100 Ω/sq.
In the compliant conductive connector of embodiment according to the present utility model, pass through setting conductive material and non-conductive material
Expect the four-layer structure that collectively constitutes, under the premise of guaranteeing high conductivity and reliability, improve conducting connecting part can deformation behavior,
It is comfortable and easy to wear.
Detailed description of the invention
It is described by below with reference to attached drawing to made by the utility model, the other objects and advantages of the utility model will
It is clear that can simultaneously help to be fully understood by the utility model.
Fig. 1 shows the structural representation of the compliant conductive connector of an exemplary embodiment according to the present utility model
Figure.
Specific embodiment
Below with reference to the embodiments and with reference to the accompanying drawing the technical solutions of the present invention will be further described.?
In specification, the same or similar drawing reference numeral indicates the same or similar component.
In the following detailed description, for convenient for explain, elaborate many concrete details with provide to present disclosure implement
The comprehensive understanding of example.It should be apparent, however, that one or more embodiments without these specific details can also be by reality
It applies.In other cases, well known construction and device is diagrammatically embodied to simplify attached drawing.
The structure that Fig. 1 shows the compliant conductive connector 100 of an exemplary embodiment according to the present utility model is shown
It is intended to, as shown in Figure 1, compliant conductive connector 100 successively includes basal layer 1；The adhesive force being set on basal layer 1 improves layer
2；The conductive layer 3 being set on adhesive force improvement layer 2；And it is set to the encapsulated layer 4 on conductive layer 3.Conductive layer 3 is for mentioning
For the high conductivity of compliant conductive connector 100, basal layer 1 and encapsulated layer 4 play a protective role as perisphere, adhesive force
Improve the binding force that layer 2 is used to improve basal layer 1 Yu conductive layer 3 as intermediate layer.Basal layer 1, adhesive force improve layer 2
There is approximate elasticity modulus with encapsulated layer 4, each layer can be stretched under external force, distorts, fold, after the reset electrical property
It remains unchanged.
0.1mm-5m can be selected in the length of compliant conductive connector 100, is in some embodiments preferably 1cm-1m；It is whole
Body thickness can be 1-2mm.In some embodiments, the thickness of basal layer 1 can be 0.02-1mm, and adhesive force improves layer 2
Thickness can be 0.01-0.2mm, and the thickness of conductive layer 3 can be 0.05-0.3mm, and the thickness of encapsulated layer 4 can be 0.1-
0.5mm。
Further, in further embodiments, the thickness of basal layer 1 can be 0.1-0.15mm, and adhesive force improves layer 2
Thickness can be 0.04-0.05mm, the thickness of conductive layer 3 can be 0.1-0.2mm, and the thickness of encapsulated layer 4 can be 0.2-
0.3mm。
In the exemplary embodiment of the utility model, basal layer 1 is including high polymer elastic body thin film or by elastomer
The textile fabric of preparation；It includes one of polyacrylic acid, polyurethane, polysiloxanes, polysulfide rubber or more that adhesive force, which improves layer 2,
Kind；Conductive layer 3 includes low-melting-point metal or alloy substrate, wherein being dispersed with conductive enhancing particle.Encapsulated layer 4 includes curable
Liquid encapsulating material.
The elasticity modulus of the high polymer elastic body thin film of basal layer 1 is no more than 30mpa, and elongation at break is no less than 200%,
Textile fabric elasticity modulus is no more than 15mpa, and elongation at break is no less than 400%.Adhesive force improves layer viscosity in 4000-
20000cp, solid content is between 30%-50%.
According to one embodiment, in conductive layer 3, conduction enhancing particle is total with physics alternately through the effect of coupling agent
Mixed form is evenly distributed in low-melting-point metal or alloy substrate, and discrete particles size is, for example, 100nm-20 μm.Described
Coupling agent can be one of silane coupling agent, titanate coupling agent, aluminate coupling agent or a variety of.
Traditional conductive is generally made of conductive filler, high polymer binder, solvent and other auxiliary agents.Wherein lead
Electric filler is the main component for realizing slurry function.High polymer binder is simultaneously non-conductive, only as the carrier of conductive filler, rises
To the effect for helping conductive filler connection and fixing.Solvent is also non-conductive, is and to provide enough flowings for dissolving binder
Property guarantee that conductive filler is evenly dispersed, while adjusting viscosity, and guarantee electrocondution slurry flowing film forming.The embodiments of the present invention
Satisfactory electrical conductivity, mobility and the ability being bonded to metallic are had both using low-melting-point metal or alloy, has been altogether dispensed with molten
The use of the non-conductive component such as agent, defoaming agent, thickener, effectively conduction component are 100%.Effect of the conducting particles in coupling agent
Under, it is uniformly dispersed in low-melting-point metal or alloy component.In the case where stretching outer power drive, conducting particles can in conductive
Displacement, arrangement form conductive path, and low-melting alloy fills the gap formed by conducting particles.
Conductive layer 3 has in Life cycle with external force the ability of random variation, viscosity 10000cP-
100000cP, conductivity is in 5*105To 8*106S/m, and there is good humidity resistance, thermal shock resistance.Low melting point gold
Belong to or alloy refers to fusing point in 300 DEG C of metals and its alloy below.In one example, may include gallium, indium, tin, zinc,
One of bismuth, lead, cadmium, mercury, sodium, potassium, magnesium, aluminium, iron, cobalt, manganese, titanium, vanadium, boron, carbon, silver, copper, iron, nickel are a variety of.Conduction increases
Strong particle for enhancing monolithic conductive performance after mix with low-melting-point metal or alloy, may include gold, silver, copper, iron, titanium, zinc,
One of wicker copper, silver-colored packet carbon, silver-colored packet glass, carbon nanotube, graphene, graphite, carbon black are a variety of.
In some embodiments, low-melting-point metal or alloy include mercury, gallium, indium, gallium-indium alloy, gallium-indium-tin alloy, gallium copper
One of silver, gallium cupro-nickel, gallium indium zinc, gallium copper copper, gallium indium silver-bearing copper, bismuth indium stannum alloy are a variety of；And conduction enhancing particle packet
Include one of gold, silver, copper, iron, titanium, zinc, wicker copper, silver-colored packet carbon, silver-colored packet glass, carbon nanotube, graphene, graphite, carbon black
Or it is a variety of.
In the embodiments of the present invention, the high polymer elastic body thin film that basal layer 1 uses may include polyurethane, poly- pair
Phthalic acid propylene glycol rouge, polybutylene terephthalate (PBT), polysiloxanes, acetic acid and vinyl acetate copolymer, nitrile rubber,
One of butadiene-styrene rubber is a variety of.In some embodiments, the elastomer that basal layer 1 uses may include spandex fibre, gather
One of trimethylene's rouge fiber, polyolefine fiber, nylon are a variety of.
In the embodiments of the present invention, the curable liquid encapsulating material that encapsulated layer 4 uses may include that elasticity is poly-
One of acrylic emulsion, elastic polyurethane emulsion, acetic acid and vinyl acetate copolymer lotion, two-component polysiloxanes are more
Kind.
In one example, basal layer 1 may include polysiloxane film, and it may include polyacrylic acid that adhesive force, which improves layer 2, lead
It is compound and encapsulated layer 4 may include polysiloxanes with silver powder that electric layer 3 may include gallium-indium alloy.
In one example, basal layer 1 may include butadiene-styrene rubber, and it may include polysiloxanes, conductive layer that adhesive force, which improves layer 2,
3 to may include gallium indium yellow gold 90% (mass percent) compound and encapsulated layer 4 can wrap with silver powder 10% (mass percent)
Include polysiloxanes.
In one example, basal layer 1 may include polysiloxane film, and it may include polyurethane that adhesive force, which improves layer 2, conductive
It is compound and encapsulated layer 4 may include with copper powder 20% (mass percent) that layer 3 may include gallium-indium alloy 80% (mass percent)
Polysiloxanes.
In one example, basal layer 1 may include spandex fibre, and it may include polyurethane, conductive layer 3 that adhesive force, which improves layer 2,
It may include gallium-indium alloy 85% (mass percent) compound and encapsulated layer 4 can wrap with silver-coated copper powder 15% (mass percent)
Include polyacrylic acid.
The compliant conductive connector 100 of the exemplary embodiment of the utility model by using have can deformation behavior conduction
Layer improves layer 2 and encapsulated layer 4 with the same basal layer 1 with excellent tension property, adhesive force and cooperates jointly, realizes that flexibility is led
The overall flexibility of electrical connector 100 has good wearable property.In addition, four-layer structure is tightly engaged into, traditional elastic is improved
The single disadvantage of body material structure improves the binding force between layer and layer, is conducive to improve the reliable of compliant conductive connector 100
Property.
The compliant conductive connector 100 of the utility model can be used for power supply unit, control unit, communication unit and other function
The interconnection of energy unit, elongation at break is up to 30%-500%, elasticity modulus 10KPa-1000MPa.Further,
In some embodiments, the elongation at break of compliant conductive connector 100 is up to 100%-300%, elasticity modulus 1MPa-
100MPa, tensile elasticity are excellent.
In some embodiments, the sheet resistance of compliant conductive connector 100 is 0.01m Ω/sq-100 Ω/sq, and flexible
The resistance variations that conducting connecting part 100 is stretched 10,000 times repeatedly are no more than 5%, wash 100 resistance variations repeatedly and are no more than
10%, 100,000 resistance variations are bent repeatedly and are no more than 5%, are distorted 100,000 resistance variations repeatedly and are no more than 5%, therefore, tool
There are good wash resistant, fold resistant ability, and is still able to maintain excellent functional characteristic under deformation effect.
To sum up, the conducting connecting part of the utility model embodiment has the advantages that providing one kind has both excellent conduction
Property and deformability conductive layer, the conductive layer have high conductivity, and have good wet-heat resisting, heat shock resistance, length
Time stability in use；A kind of compliant conductive connector is provided, conventional conductive connector is solved and does not have wash resistant, folding
It folds, the disadvantage that stretch resistance energy or wash resistant, fold resistant, stretch resistance can be undesirable；One kind is provided can wash, fold repeatedly,
The conducting connecting part stretched without influencing its performance；The square resistance of the conducting connecting part is minimum to can reach 0.01m Ω, greatly
Reduce decaying of the conducting wire to battery power consumption.The conducting connecting part can be widely applied to electric heating clothes, flexible electric heating man
With textile, electromagnetic shielding clothing, electromagnetic shielding curtain, monitoring temperature intelligent clothing, intelligent infant temperature control woollen blanket, intelligent paper
The application fields such as urine pants, intelligent tent, intelligent umbrella.
It is illustrated below by specific embodiment.
Embodiment 1-5
Basal layer, adhesive force are improved layer, conductive layer and encapsulated layer successively to combine by forming shown in table 1, formed flexible
Conducting connecting part.The length of compliant conductive connector in embodiment 1-5 is 1m, and width is 0.5cm.Resistance value is using straight
It flows wheatstone bridge or is measured using four probe resistance instrument.Conductivity is that square resistance and conductive layer thickness are utilized under the conditions of 25 DEG C
It calculates.Elongation at break and elasticity modulus are obtained using universal tensile testing machine measurement under the conditions of 25 DEG C.
The concrete composition of compliant conductive connector in 1. embodiment 1-5 of table
Performance characterization is carried out to compliant conductive connector made from embodiment 1-5, the results are shown in Table 2.
Wherein, length refers to compliant conductive connector drawn 10000 times length after stretching；Stretching resistance, washing resistance,
Bending resistance and fold resistance respectively refer to compliant conductive connector drawn 10000 times, washing 100 times, bending 100000 times and
Fold 1000000 resistance values.
The performance of compliant conductive connector in 2. embodiment 1-5 of table
Comparative example 1-3
The compliant conductive connector of comparative example 1-3 is prepared using composition similar to Example 1, difference is,
Comparative example 1 is not added with adhesive force compared with Example 1 and improves layer；
Encapsulated layer is changed to elastic polyurethane solid gum to comparative example 2 compared with Example 1；
Encapsulated layer is changed to elastic polyurethane solid gum to comparative example 3 compared with Example 1.
The length of compliant conductive connector in comparative example 1-3 is 1m, and width is 0.5cm.
Performance characterization is carried out between the connection of compliant conductive made from comparative example 1-3, the results are shown in Table 3.
Wherein, length refers to compliant conductive connector drawn 10000 times length after stretching；Stretching resistance, washing resistance,
Bending resistance and fold resistance respectively refer to compliant conductive connector drawn 10000 times, washing 100 times, bending 100000 times and
Fold 1000000 resistance values.
The performance of compliant conductive connector in 3. comparative example 1-3 of table
As it can be seen that embodiment 1 has better draftability, washing performance, bendability and folding property compared to comparative example 1-3.
The manufacturing process of the compliant conductive connector 100 of the utility model is summarized as follows:
Firstly, providing basal layer 1；
Then, lamination forms adhesive force and improves layer 2 on basal layer 1；
Then, lamination on layer 2 is improved in adhesive force form printed conductive layer 3；And
Then, lamination forms encapsulated layer 4 on conductive layer 3.
Here, lamination can be brushing, roller coating, printing, printing or spray printing etc. into layer process.
Specifically, basal layer 1 can be preformed product, by removing surface, the processes such as cut out, be heat-treated and obtain；It is attached
Put forth effort improve layer 2 can the external coating of basal layer 1 specify thickness, each brushing thickness at 5-10 micron, dry after again into
Row is brushed until reaching expected thickness；Conductive layer 3 can be made up on the basis of adhesive force improves layer 2 of three kinds of methods, respectively
By being made using printing, intaglio printing or using template auxiliary spray printing；Encapsulated layer 4 can pass through spray printing or brush on conductive layer 3
It applies, roller coating form is made.
Illustrate the specific manufacturing process of the compliant conductive connector according to a specific example below:
Step 1: basal layer 1 being cut out, the dirt and impurity on surface are removed, and substrate is fixed；
Step 2: improving the material of layer 2 using flat painting machine or bar spreader brushing adhesive force on 1 surface of basal layer, every time
Brushing thickness is at 5-10 microns, and using air dry oven dry solidification or dry solidification under field conditions (factors), it is dry after again into
Row is brushed until reaching expected thickness；
Step 3: under the inert gas shieldings such as nitrogen, argon gas, carbon dioxide, helium or vacuum condition, being beaten using plane
The material of conductive layer 3 is transferred to the surface that adhesive force improves layer 2 by the modes such as print, spray printing, intaglio printing；
Step 4: by the material of prepared encapsulated layer 4 to spray, brush, the methods of showering is transferred to described in step 3
The surface of conductive layer 3, and solidify using ultraviolet light or solidified with air dry oven or solidified under field conditions (factors).
There is good tensility and conductivity on the whole by the compliant conductive connector 100 that the above method makes,
The use demand of intelligent clothing and intelligent wearable device can sufficiently be met.
Although some embodiments of the utility model general plotting have been shown and have illustrated, those of ordinary skill in the art will
Understand, in the case where the principle and spirit without departing substantially from the utility model general plotting, these embodiments can be made a change, this
The range of utility model is limited with claim and their equivalent.
Claims (12)
1. a kind of conducting connecting part, which is characterized in that the conducting connecting part successively includes:
Basal layer；
The adhesive force being set on the basal layer improves layer；
The conductive layer being set on the adhesive force improvement layer；And
The encapsulated layer being set on the conductive layer.
2. conducting connecting part according to claim 1, which is characterized in that base layer thickness 0.02-1mm, adhesive force change
Into layer with a thickness of 0.01-0.2mm, conductive layer thickness 0.05-0.3mm, encapsulated layer is with a thickness of 0.1-0.5mm.
3. conducting connecting part according to claim 2, which is characterized in that base layer thickness 0.1-0.15mm.
4. conducting connecting part according to claim 2, which is characterized in that adhesive force improves layer with a thickness of 0.04-0.05mm.
5. conducting connecting part according to claim 2, which is characterized in that conductive layer thickness 0.1-0.2mm.
6. conducting connecting part according to claim 2, which is characterized in that encapsulated layer is with a thickness of 0.2-0.3mm.
7. conducting connecting part according to claim 1, which is characterized in that the basal layer includes high polymer elastic body thin film
Or the textile fabric prepared by elastomer；
The conductive layer includes low-melting-point metal or alloy substrate, wherein being dispersed with conductive enhancing particle；
The encapsulated layer includes curable liquid encapsulating material.
8. conducting connecting part according to claim 7, which is characterized in that the conductive enhancing particle is with the shape of physical blending
Formula is evenly distributed in the low-melting-point metal or alloy.
9. conducting connecting part according to claim 1-8, which is characterized in that the basal layer, the adhesive force
Improving layer and the encapsulated layer has approximate elasticity modulus.
10. conducting connecting part according to claim 1-8, which is characterized in that the fracture of the conducting connecting part
Elongation is 30%-500%, elasticity modulus 10KPa-1000MPa.
11. conducting connecting part according to claim 10, which is characterized in that the elongation at break of the conducting connecting part is
100%-300%, elasticity modulus 1MPa-100MPa.
12. conducting connecting part according to claim 1, which is characterized in that the conductivity of the conductive layer is 5*105-8*
106S/m；Alternatively, the sheet resistance of the conducting connecting part is 0.01m Ω/sq-100 Ω/sq.
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| CN201820254761.3U CN208760136U (en) | 2018-02-12 | 2018-02-12 | Conducting connecting part |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108274865A (en) * | 2018-02-12 | 2018-07-13 | 北京梦之墨科技有限公司 | Conducting connecting part and its manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108274865A (en) * | 2018-02-12 | 2018-07-13 | 北京梦之墨科技有限公司 | Conducting connecting part and its manufacturing method |
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