CN208748437U - A kind of stamping resistance corrugated board being packed for - Google Patents
A kind of stamping resistance corrugated board being packed for Download PDFInfo
- Publication number
- CN208748437U CN208748437U CN201821458769.8U CN201821458769U CN208748437U CN 208748437 U CN208748437 U CN 208748437U CN 201821458769 U CN201821458769 U CN 201821458769U CN 208748437 U CN208748437 U CN 208748437U
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- China
- Prior art keywords
- semi
- enhancement layer
- arc
- circular groove
- support chip
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of stamping resistance corrugated boards being packed for, its key points of the technical solution are that enhancement layer is wave-shaped, buffer bar is equipped at the trough of enhancement layer, the buffer bar is that hardboard is crimped into cylindric, trigone column is additionally provided in the buffer bar, the enhancement layer is divided into surface layer and bottom, the bottom crest location is equipped with semi-circular groove, the surface layer is equipped with the semi-cylindrical hill cooperated with semi-circular groove, semi-circular groove radius is less than the radius of semi-cylindrical hill, the bottom wave trough position is equipped with arc-like sheet, the arc-like sheet is in M shape, the utility model aim is to provide a kind of structurally reasonable simple, it is practical, resistance to compression cushioning ability is strong, stable structure, effect reduces external force to the influence power of core plate, prevent the high-strength corrugated board of core plate stress deformation.
Description
Technical field
The utility model relates to a kind of paperboard arts, more specifically, it relates to a kind of stamping resistance watt being packed for
Corrugated paper board.
Background technique
Corrugated board is the adherend of a multilayer, it is at least made of one layer of waveform core layer and a layer paperboard.Corrugation
Cardboard has very high mechanical strength, can be to being fallen by the collision in cargo handling process and falling, mainly for the manufacture of carton, carton
Sandwich and delicate articles outer packing.
Corrugated board structure includes upper cardboard, lower cardboard and core plate at present, core plate be placed in cardboard and lower cardboard it
Between, if corrugated board stress causes the structure of core plate to deform or collapse, external force can be to the article in corrugated fibre box
The problem of damaging, therefore how reducing impact force of the external force to core plate is that industry technical staff is to be solved.
Utility model content
In view of the deficienciess of the prior art, the utility model is a kind of structurally reasonable simple in being designed to provide, it is real
Strong with property, resistance to compression cushioning ability is strong, stable structure, and effect reduces external force to the influence power of core plate, prevents core plate stress deformation
High-strength corrugated board.
To achieve the above object, the utility model provides following technical solution: a kind of stamping resistance corrugated paper being packed for
Plate, including upper cardboard, core plate and lower cardboard, core plate are placed between cardboard and lower cardboard, it is characterized in that: the upper paper
With being equipped with enhancement layer between core plate, enhancement layer is wave-shaped for plate, lower cardboard, and buffer bar, institute are equipped at the trough of enhancement layer
Stating buffer bar is hardboard curling into cylindric, trigone column is additionally provided in the buffer bar, the enhancement layer is divided into surface layer
And bottom, the bottom crest location are equipped with semi-circular groove, the surface layer is equipped with the semi-cylindrical hill cooperated with semi-circular groove,
Semi-circular groove radius is less than the radius of semi-cylindrical hill, and the bottom wave trough position is equipped with arc-like sheet, and the arc-like sheet is in M word
Shape.
By using above-mentioned technical proposal, it is configured first with upper cardboard, lower cardboard and core plate, then utilizes
Centre setting enhancement layer, carries out reinforcement intensity in inside, and enhancement layer is arranged to the wavy waveform that can use to have
Help internal damping, then by being equipped with buffer bar at the trough of enhancement layer, guarantee it is internal being capable of large contact area and preferably
Buffering, and the buffer bar is that hardboard crimps, and is capable of forming an internal curling and buffers, then trigone column is filled
Inside buffer bar, triangle has preferable stability, can provide stronger support effect, the enhancement layer point in inside
For surface layer and bottom, the bottom crest location is equipped with semi-circular groove, and the surface layer is equipped with the semicircle cooperated with semi-circular groove
Shape protrusion, semi-circular groove radius are less than the radius of semi-cylindrical hill, form a good cooperation, when hitting,
Because semi-cylindrical hill can not be all put into semi-circular groove, inside generates certain air, when moment squeezes
It waits, internal gas is not easy to exclude, and forms internal air cushion, improves integrated buffer ability, is equipped with arc in bottom wave trough position
Shape piece, the arc-like sheet are in M shape, the support and shock resistance effect of bottom are carried out using arc-like sheet, subsequently by being arranged to M
Shape can play good support and buffer capacity.
The utility model is further arranged to: the arc-like sheet includes the first support chip, the second support chip and buffer substrate tablet, is delayed
Punching is placed between the first support chip and the second support chip, and buffer substrate tablet is V-shaped, and glue is filled in the V word mouth of buffer substrate tablet.
By using above-mentioned technical proposal, by being filled with glue in the V word mouth of buffer substrate tablet, filled completely using glue,
It is practical to product when resistance to compression because after glue itself has been done, just having certain elasticity, it can be improved inner elastomeric
Buffering improves whole impact resistance.
The utility model is further arranged to: being equipped on first support chip and the second support chip and is connect with buffer substrate tablet
Arc strip, the arc strip opening direction is identical as the opening direction of buffer substrate tablet.
By using above-mentioned technical proposal, arc strip can be played when receiving extruding, be played in internal design
One reversed support, and then guarantee integrated buffer ability.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model embodiment.
Specific embodiment
The utility model embodiment is described further referring to Fig.1.
A kind of stamping resistance corrugated board being packed for, including upper cardboard 101, core plate 103 and lower cardboard 102, core plate
103 are placed between cardboard 101 and lower cardboard 102, it is characterized in that: the upper cardboard 101, lower cardboard 102 with core plate 103 it
Between be equipped with enhancement layer, enhancement layer is wave-shaped, at the trough of enhancement layer be equipped with buffer bar 201, the buffer bar 201 be cardboard
Coiled sheet Qu Ercheng is cylindric, and trigone column 301 is additionally provided in the buffer bar 201, and the enhancement layer is divided into surface layer 401 and bottom
501,501 crest location of bottom is equipped with semi-circular groove 502, and the surface layer 401 is equipped with half cooperated with semi-circular groove 502
Circular protrusions 402,502 radius of semi-circular groove are less than the radius of semi-cylindrical hill 402, and 501 wave trough position of bottom is equipped with arc
Shape piece, the arc-like sheet are in M shape.
By using above-mentioned technical proposal, it is configured first with upper cardboard 101, lower cardboard 102 and core plate 103,
Then utilize and enhancement layer be set in centre, carry out reinforcement intensity in inside, and by enhancement layer be arranged to it is wavy can benefit
Facilitate internal damping with waveform, then by being equipped with buffer bar 201 at the trough of enhancement layer, guarantees that inside larger can connect
The long-pending and preferable buffering of contacting surface, and the buffer bar 201 is that hardboard crimps, and is capable of forming internal curling buffering,
Trigone column 301 is filled in inside buffer bar 201 again, triangle has preferable stability, can provide in inside stronger
Support effect, the enhancement layer is divided into surface layer 401 and bottom 501, and 501 crest location of bottom is equipped with semi-circular groove 502,
The surface layer 401 is equipped with the semi-cylindrical hill 402 cooperated with semi-circular groove 502, and 502 radius of semi-circular groove is less than semicircle convex
402 radius is played, a good cooperation is formed, when hitting, because semi-cylindrical hill 402 can not all be put
Enter in semi-circular groove 502, so internal generate certain air, when squeezing moment, internal gas is not easy to exclude, and is formed
Internal air cushion improves integrated buffer ability, is equipped with arc-like sheet in 501 wave trough position of bottom, the arc-like sheet is in M word
Shape can be played good using the support and shock resistance effect that arc-like sheet carries out bottom subsequently by being arranged to M shape
Support and buffer capacity.
The utility model is further arranged to: the arc-like sheet is gentle including the first support chip 601, the second support chip 602
Punching 603, buffer substrate tablet 603 are placed between the first support chip 601 and the second support chip 602, and buffer substrate tablet 603 is V-shaped, buffer substrate tablet
Glue 701 is filled in 603 V word mouth.
Glue is utilized by being filled with glue 701 in the V word mouth of buffer substrate tablet 603 by using above-mentioned technical proposal
701 fillings are full, practical to product when resistance to compression because just having certain elasticity after glue 701 has been done in itself, energy
It enough improves inner elastomeric buffering and improves whole impact resistance.
The utility model is further arranged to: being equipped with and is buffered on first support chip 601 and the second support chip 602
The arc strip 801 that piece 603 connects, 801 opening direction of arc strip are identical as the opening direction of buffer substrate tablet 603.
By using above-mentioned technical proposal, arc strip 801 can play when receiving extruding in internal design,
A reversed support is played, and then guarantees integrated buffer ability.
The above is only the preferred embodiment of the present invention, is not intended to limit the utility model, the skill of this field
Art personnel carry out common variations and alternatives within the scope of technical solutions of the utility model should be included in the guarantor of the utility model
It protects in range.
Claims (3)
1. a kind of stamping resistance corrugated board being packed for, including upper cardboard, core plate and lower cardboard, core plate be placed in cardboard and
Between lower cardboard, it is characterized in that: the upper cardboard, lower cardboard are with being equipped with enhancement layer between core plate, enhancement layer is wave-shaped,
Buffer bar is equipped at the trough of enhancement layer, the buffer bar is hardboard curling into cylindric, is additionally provided in the buffer bar
Trigone column, the enhancement layer are divided into surface layer and bottom, and the bottom crest location is equipped with semi-circular groove, and the surface layer is equipped with
With the semi-cylindrical hill of semi-circular groove cooperation, semi-circular groove radius is less than the radius of semi-cylindrical hill, the bottom wave trough position
Equipped with arc-like sheet, the arc-like sheet is in M shape.
2. a kind of stamping resistance corrugated board being packed for according to claim 1, it is characterized in that: the arc-like sheet includes the
One support chip, the second support chip and buffer substrate tablet, buffer substrate tablet are placed between the first support chip and the second support chip, and buffer substrate tablet is V-shaped
Shape, the V word mouth of buffer substrate tablet is interior to be filled with glue.
3. a kind of stamping resistance corrugated board being packed for according to claim 2, it is characterized in that: first support chip and
The arc strip connecting with buffer substrate tablet, the opening direction phase of the arc strip opening direction and buffer substrate tablet are equipped on second support chip
Together.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821458769.8U CN208748437U (en) | 2018-09-06 | 2018-09-06 | A kind of stamping resistance corrugated board being packed for |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821458769.8U CN208748437U (en) | 2018-09-06 | 2018-09-06 | A kind of stamping resistance corrugated board being packed for |
Publications (1)
Publication Number | Publication Date |
---|---|
CN208748437U true CN208748437U (en) | 2019-04-16 |
Family
ID=66083099
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201821458769.8U Expired - Fee Related CN208748437U (en) | 2018-09-06 | 2018-09-06 | A kind of stamping resistance corrugated board being packed for |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN208748437U (en) |
-
2018
- 2018-09-06 CN CN201821458769.8U patent/CN208748437U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190416 Termination date: 20200906 |