CN208747626U - Sensor package structure and pressure sensor - Google Patents
Sensor package structure and pressure sensor Download PDFInfo
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- CN208747626U CN208747626U CN201821334916.0U CN201821334916U CN208747626U CN 208747626 U CN208747626 U CN 208747626U CN 201821334916 U CN201821334916 U CN 201821334916U CN 208747626 U CN208747626 U CN 208747626U
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- pressure sensor
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- cavity
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 59
- 239000000084 colloidal system Substances 0.000 claims abstract description 50
- 239000000758 substrate Substances 0.000 claims abstract description 36
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 10
- 239000000741 silica gel Substances 0.000 claims description 10
- 229910002027 silica gel Inorganic materials 0.000 claims description 10
- 239000004033 plastic Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 239000000446 fuel Substances 0.000 claims description 4
- 239000010705 motor oil Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 abstract description 27
- 238000000034 method Methods 0.000 abstract description 27
- 238000010586 diagram Methods 0.000 description 11
- 238000003466 welding Methods 0.000 description 8
- 230000001681 protective effect Effects 0.000 description 6
- 238000007789 sealing Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000007 visual effect Effects 0.000 description 4
- 238000001723 curing Methods 0.000 description 3
- 238000001727 in vivo Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 238000004886 process control Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
The utility model discloses a kind of sensor-packaging structure and pressure sensors, it is related to sensor packaging techniques field, the sensor-packaging structure includes circuit base plate, Prefabricated substrate, MEMS pressure sensor, first colloid, asic chip and the second colloid, Prefabricated substrate includes bottom plate and the side wall that connect with the bottom plate, the bottom plate and side wall surround the cavity of a upper end opening, MEMS pressure sensor is set in the cavity, MEMS pressure sensor and Prefabricated substrate are electrically connected, MEMS pressure sensor is packaged in the cavity by the first colloid, asic chip and the circuit base plate are electrically connected, the bottom plate and circuit base plate of Prefabricated substrate are electrically connected, asic chip and Prefabricated substrate are packaged on the circuit base plate by the second colloid.The sensor-packaging structure and pressure sensor high reliablity, and MEMS pressure sensor does not need prefabricated certain moduli tool in advance in encapsulation process, greatly reduces the development cost of early period.
Description
Technical field
The present invention relates to sensor packaging techniques field, in particular to a kind of sensor-packaging structure and pressure sensor.
Background technique
Pressure sensor is to experience pressure signal, and can be converted into pressure signal according to certain rule available defeated
The device or device of electric signal out, MEMS (Microelectro Mechanical Systems；MEMS) sensor
It is the novel sensor manufactured using microelectronics and micromachining technology.MEMS sensor and traditional sensor phase
Than, have it is small in size, light weight and cost is low, low in energy consumption, high reliablity, suitable for mass production, be easily integrated and realizes intelligently
The characteristics of change, allows it to complete the irrealizable function of certain tradition machinery sensor institutes.
Based on the above characteristic, MEMS pressure sensor is all applied in medical treatment, automobile, field of taking pictures, such as automobile
Tire pressure sensor, fuel pressure transmitter, engine oil pressure sensor, the admission line pressure sensor in field.
Wherein, MEMS pressure sensor needs to arrange in pairs or groups a specific integrated circuit (Application Specific in application
Integrated Circuit；ASIC the conditioning of signal) is carried out, the stabilization that final output MEMS pressure sensor circuit needs can
The signal leaned on, in order to protect MEMS pressure sensor and ASIC not by external environmental interference, need to MEMS pressure sensor and
ASIC is packaged.
Existing MEMS pressure sensor and the assembled package of asic chip there are mainly two types of mode, 1, precast frame envelope
Dress scheme, first prefabricated plastic packaging frame, forms cavity, asic chip and the welding of MEMS sensor patch is carried out in the cavity, in chamber
Protective glue protection asic chip and MEMS sensor are filled in vivo.2, box dam encapsulation scheme first completes the welding of asic chip patch,
Need to increase box dam when encapsulating asic chip to reserve the cavity of MEMS sensor encapsulation, box dam is not filled out in region by plastic packaging material
It fills, completes the welding of MEMS sensor patch in the cavity later.Above-mentioned first way manufacturing process flow is relatively easy, but by
It in all chip and sealing wire is protected by soft protective glue, reliability is relatively weak, multiple especially for those
Miscellaneous encapsulation, such as multi-chip package or the encapsulation of more sealing wires, are extremely difficult to the requirement of high reliability, can not be competent at automobile
Level security related application.Although above-mentioned second way reliability will make moderate progress with respect to precast frame scheme, process phase
To more complicated, the process control needs of encapsulation are also higher than first way, for example need to increase this process of box dam.
Summary of the invention
The purpose of the present invention is to provide a kind of sensor-packaging structure and pressure sensor, the sensor-packaging structure and
Pressure sensor high reliablity, and MEMS pressure sensor does not need prefabricated certain moduli tool in advance in encapsulation process, greatly
The development cost of early period is reduced greatly.
The present invention is achieved by the following technical solutions:
The first aspect of the present invention provides a kind of sensor-packaging structure, including circuit base plate, Prefabricated substrate, MEMS pressure
Sensor, the first colloid, asic chip, the second colloid；
The Prefabricated substrate includes bottom plate and the side wall that connect with the bottom plate, and the bottom plate and the side wall surround on one
The cavity of end opening, the MEMS pressure sensor are set in the cavity, the MEMS pressure sensor with it is described prefabricated
Electrical property of substrate connection, the MEMS pressure sensor are packaged in the cavity by the first colloid；
The asic chip and the circuit base plate are electrically connected, the bottom plate of the Prefabricated substrate and circuit base plate electricity
Property connection, the asic chip and the Prefabricated substrate are packaged on the circuit base plate by the second colloid.
Sensor-packaging structure as described above, first colloidal materials are soft silica gel, and second colloidal materials are
Epoxy resin.
Sensor-packaging structure as described above, first colloid are ultraviolet curing type silica gel or thermohardening type silicon
Glue.
Sensor-packaging structure as described above further includes lid, and the lid is packaged in the top of the side wall, the lid
Body part corresponding with the upper surface of first colloid has opening.
Sensor-packaging structure as described above, the lid are metal cap body or plastic cover.
Sensor-packaging structure as described above, the upper surface of the lid are plane, the upper surface of the lid with it is described
The upper surface of second colloid is coplanar.
The second aspect of the present invention provides a kind of pressure sensor, and the pressure sensor includes sensor as described above
Encapsulating structure.
Pressure sensor as described above, the pressure sensor be automobile tire pressure sensor, fuel pressure transmitter,
One of engine oil pressure sensor or admission line pressure sensor.
In sensor of the invention encapsulating structure, MEMS pressure sensor is packaged in the chamber of Prefabricated substrate by the first colloid
The first packaging body is formed in vivo, and the first packaging body and asic chip encapsulate to form the second packaging body, reliability by the second colloid
Height, and sensor-packaging structure does not need prefabricated certain moduli tool in advance in encapsulation process, greatly reduces packaging cost.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Bright some embodiments for those of ordinary skill in the art without creative efforts, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the package structure diagram of existing MEMS pressure sensor and asic chip；
Fig. 2 is the package structure diagram of existing MEMS pressure sensor and asic chip；
Fig. 3 is structural schematic diagram of the sensor-packaging structure provided in an embodiment of the present invention under a visual angle；
Fig. 4 is structural representation of the first packaging body of sensor-packaging structure provided in an embodiment of the present invention under a visual angle
Figure；
Fig. 5 is structural schematic diagram of the sensor-packaging structure provided in an embodiment of the present invention in encapsulation process；
Fig. 6 is structural schematic diagram of the sensor-packaging structure provided in an embodiment of the present invention in encapsulation process.
Description of symbols:
1- circuit base plate；
2-MEMS pressure sensor；
3-MEMS pressure sensor；
The first colloid of 4-；
5-ASIC chip；
The second colloid of 6-；
7- lid
8- opening；
21- bottom plate；
22- side wall；
23- cavity.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
Every other embodiment obtained without creative efforts, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that, term " includes " used herein and " having " and they
Any deformation, it is intended that cover it is non-exclusive include, for example, containing the process, method of a series of steps or units, being
System, product or equipment those of are not necessarily limited to be clearly listed step or unit, but may include be not clearly listed or
For the intrinsic other step or units of these process, methods, product or equipment.In addition, term " first ", " second " are only used for
Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.
Fig. 1 is the package structure diagram of existing MEMS pressure sensor and asic chip, and Fig. 2 is existing MEMS pressure biography
The package structure diagram of sensor and asic chip please refers to Fig. 1, shown in 2, existing MEMS pressure sensor and asic chip
Assembled package there are mainly two types of mode, 1, precast frame encapsulation scheme, first prefabricated plastic packaging frame, forms cavity, in cavity
Interior progress asic chip 5 and the welding of 3 patch of MEMS pressure sensor, fill protective glue protection asic chip 5 and MEMS in the cavity
Pressure sensor 3.2, box dam encapsulation scheme needs to increase box dam when encapsulating asic chip 5 to reserve MEMS pressure sensor 3
The cavity of encapsulation first completes the welding of 5 patch of asic chip, and box dam is not filled in region by plastic packaging material, cavity is reserved, later in chamber
The welding of 3 patch of MEMS pressure sensor is completed in vivo, fills protective glue protection MEMS pressure sensor 3.Above-mentioned first way system
Make that process flow is relatively easy, but since all chip and sealing wire are protected by protective glue, reliability is relatively
Weakness is extremely difficult to high reliability especially for those complicated encapsulation, such as multi-chip package or the encapsulation of more sealing wires
Requirement, automotive grade safety-relevant applications can not be competent at.Although above-mentioned second way reliability is wanted with respect to precast frame scheme
It makes moderate progress, but process is relatively complicated, the process control needs of encapsulation are also higher than first way, for example need to increase
Add this process of box dam.
The present invention is based on problem above to propose a kind of sensor-packaging structure and pressure sensor.
The part term in the application is explained below, so as to those skilled in the art understand that.
MEMS pressure sensor is a kind of thin-film component, deformation when being under pressure.It can use deformeter (resistance pressure type sense
Survey) this deformation is measured, it can also be measured by the variation of distance between two faces of capacitance sensing.
ASIC is a kind of integrated circuit designed for special purpose.Refer to and specific user is answered to require and specific electron system
The needs of system and the integrated circuit for designing, manufacturing.The characteristics of ASIC is the demand towards specific user, and ASIC is in batch production
With volume is smaller, power consumption is lower, reliability improves, performance improves, confidentiality enhancing, cost drop compared with universal integrated circuit
Low advantage.
Surface patch, be it is a kind of by no pin or short leg surface-assembled component be mounted on printed circuit board surface or
On the surface of other substrates, the circuit load technology of welding assembly is subject to by the methods of reflow welding or immersed solder.
It is situated between in detail to sensor-packaging structure provided by the invention and pressure sensor combined with specific embodiments below
It continues.
Embodiment one:
Fig. 3 is structural schematic diagram of the sensor-packaging structure provided in an embodiment of the present invention under a visual angle, and Fig. 4 is this hair
Structural schematic diagram of first packaging body of the sensor-packaging structure that bright embodiment provides under a visual angle, please refers to Fig. 3,4 institutes
Show, the sensor-packaging structure of the present embodiment include circuit base plate 1, Prefabricated substrate 2, MEMS pressure sensor 3, the first colloid 4,
Asic chip 5, the second colloid 6；The Prefabricated substrate 2 includes bottom plate 21 and the side wall 22 connecting with the bottom plate 21, the bottom
Plate 21 and the side wall 22 surround the cavity 23 of a upper end opening, and 3 device of MEMS pressure sensing is set in the cavity 23,
The MEMS pressure sensor 3 is electrically connected with the Prefabricated substrate 2, and the MEMS pressure sensor 3 passes through 4 envelope of the first colloid
Loaded in the cavity 23；
The asic chip 5 is electrically connected with the circuit base plate 1, the bottom plate 21 and the route of the Prefabricated substrate 2
Substrate 1 is electrically connected, and the asic chip 5 and the Prefabricated substrate 2 are packaged on the circuit base plate 1 by the second colloid 6.
In the present embodiment, the circuit base plate 1, Prefabricated substrate 2 are generally printed circuit board, and the Prefabricated substrate 2 includes
Bottom plate 21 and the side wall 22 connecting with the bottom plate, insole board 21 and circuit base plate 1 are electrically connected, MEMS pressure in the present embodiment
Power sensing 3 is packaged in the cavity that bottom plate 21 and side wall 22 are formed, the present embodiment to the size of the bottom plate 21 and side wall 22 not
It is particularly limited.
In the present embodiment, MEMS pressure sensor 3 is packaged in cavity 23 and forms the first encapsulation by first colloid 4
Asic chip 5 and the first packaging body are packaged on circuit base plate 1 by body, the second colloid 6, in the present embodiment by asic chip 5 with
And MEMS pressure sensor 3 encapsulate purpose be make asic chip 5 and MEMS pressure sensor 3 not by external environment interfere with
And it can be used in a variety of limited space scenes.Wherein, the first colloid 4 is used for package of MEMS pressure sensor 3, the first glue
Body 4 is generally soft protective glue, protects MEMS pressure sensor 3 and conducts extraneous pressure during working sensor, the
Two colloids 6 are generally plastic packaging glue, and for encapsulating asic chip 5 and the first packaging body, the present embodiment is to first colloid 4 and the
The concrete form of two colloids 6 does not do specifically limited.Optionally, the first colloid can be ultraviolet curing type silica gel or heat cure
Type silica gel, the second colloid 6 can be epoxy resin.
Preferably, in order to further protect pressure sensor packaging structure, which further includes lid 7, the lid
Body 7 is packaged in the top of the side wall 22, and the lid 7 part corresponding with the upper surface of first colloid 4, which has, opens
Mouth 8.By the way that opening 8 is arranged on lid 7, ambient pressure can be transmitted well.
Optionally, in the present embodiment, the lid 7 can be metal cap body or plastic cover.
Further, the upper surface of the lid 7 is plane, the upper surface of the lid 7 and second colloid 6
Upper surface is coplanar, convenient for carrying out subsequent encapsulation to mounting structure.
In the sensor-packaging structure of the present embodiment, MEMS pressure sensor is packaged in Prefabricated substrate by the first colloid
The first packaging body is formed in cavity, the first packaging body and asic chip encapsulate to form the second packaging body by the second colloid, reliably
Property it is high, and pressure sensor packaging structure does not need prefabricated certain moduli tool in advance in encapsulation process, greatly reduces envelope
Dress up this.
Fig. 5 is structural schematic diagram of the sensor-packaging structure provided in an embodiment of the present invention in encapsulation process, and Fig. 6 is this
Structural schematic diagram of the sensor-packaging structure that inventive embodiments provide in encapsulation process, please refers to shown in Fig. 3-6, this reality
Apply the packaging method of the sensor-packaging structure of example the following steps are included:
A circuit base plate 1 and a Prefabricated substrate 2 are provided, the Prefabricated substrate 2 includes bottom plate 21 and connects with the bottom plate 21
The side wall 22 connect, the bottom plate 21 and the side wall 22 surround the cavity 23 of a upper end opening；
MEMS pressure sensor 3 is placed in the cavity 23, by the MEMS pressure sensor 3 and the Prefabricated substrate
2 are electrically connected, and the first colloid 4 is injected in the cavity 23, form the first packaging body；
Asic chip 5 and the first packaging body are electrically connected with circuit base plate 1；
Asic chip 5 and first packaging body are packaged on the circuit base plate 1 by the second colloid 6 and form second
Packaging body.
The first packaging body is electrically connected in a manner of surface patch with circuit base plate in the present embodiment, described in the present embodiment
The packaged type of asic chip may include following two:
1, the patch in a manner of surface patch of asic chip 5 is welded by Reflow Soldering, this mode later on circuit base plate 1
Process is simple, but difficult realization stacked package.
2, asic chip 5 and other non-pressure MEMS sensors beat 1 electricity of sealing wire mode and circuit base plate by patch
Connection, this mode process is compared with the first complexity, but early period, design comparison was simple, and can be made with simple realization stacked package
Encapsulation integrated level is higher, and package area is smaller.
Technical staff can select above two mode to asic chip and non-pressure MEMS sensor according to the actual situation
It is packaged.
Preferably, 4 material of the first colloid is soft silica gel, and 6 material of the second colloid is epoxy resin, wherein the
Colloid 4 conducts extraneous pressure during working sensor, and the present embodiment does not do the concrete form of first colloid 4
Specifically limited, optionally, the first colloid 4 can be ultraviolet curing type silica gel or thermohardening type silica gel.
Further, in this embodiment MEMS pressure sensor 3 is placed in the cavity 23 described, by the MEMS
Pressure sensor 3 and the Prefabricated substrate 2 are electrically connected, and the first colloid 4 is injected in the cavity 23, form the first packaging body
Later further include: encapsulate lid 7 on the top of the side wall 22, the lid 7 is corresponding with the upper surface of first colloid 4
Part have opening 8.The present embodiment improves the reliability of entire encapsulating structure by setting lid 7.
Further, the upper surface of the lid 7 is plane, the upper surface of the lid 7 and second colloid 6
Upper surface is coplanar, convenient for carrying out subsequent encapsulation to the second packaging body.
MEMS pressure sensor is packaged in prefabricated base by the first colloid in the pressure sensor package method of the present embodiment
In the cavity that plate is formed, the first packaging body and the second packaging body can synchronize encapsulation, can greatly shorten entire manufacturing week
Phase, the first colloid are packaged in the cavity of Prefabricated substrate formation, special prefabricated mould are not needed in encapsulation process, is dropped significantly
The low development cost of early period.
Embodiment two:
The present embodiment provides a kind of pressure sensor, which includes the encapsulation knot of sensor described in embodiment one
Structure.
Further, the pressure sensor of the present embodiment can be the tire pressure sensor of automotive field, fuel pressure
Sensor, engine oil pressure sensor, admission line pressure sensor.
The pressure sensor of the present embodiment, MEMS pressure sensor are packaged in the cavity of Prefabricated substrate by the first colloid
The first packaging body is formed, the first packaging body is subsequent to encapsulate the final encapsulation body high reliablity to be formed with asic chip, and encapsulates
Prefabricated mould in advance is not needed in the process, and packaging cost is low.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821334916.0U CN208747626U (en) | 2018-08-17 | 2018-08-17 | Sensor package structure and pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821334916.0U CN208747626U (en) | 2018-08-17 | 2018-08-17 | Sensor package structure and pressure sensor |
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| Publication Number | Publication Date |
|---|---|
| CN208747626U true CN208747626U (en) | 2019-04-16 |
Family
ID=66080645
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| CN201821334916.0U Active CN208747626U (en) | 2018-08-17 | 2018-08-17 | Sensor package structure and pressure sensor |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108726469A (en) * | 2018-08-17 | 2018-11-02 | 宁波琻捷电子科技有限公司 | Sensor-packaging structure and method |
| CN116193972A (en) * | 2023-04-27 | 2023-05-30 | 宁波中车时代传感技术有限公司 | Sensor preparation method and structure |
-
2018
- 2018-08-17 CN CN201821334916.0U patent/CN208747626U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108726469A (en) * | 2018-08-17 | 2018-11-02 | 宁波琻捷电子科技有限公司 | Sensor-packaging structure and method |
| CN116193972A (en) * | 2023-04-27 | 2023-05-30 | 宁波中车时代传感技术有限公司 | Sensor preparation method and structure |
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Address after: Floor 14, Building A, Chuangzhi Building, No. 17 Xinghuo Road, Jiangbei New District, Nanjing, Jiangsu Province, 211800 Patentee after: Wanjie Electronic Technology (Jiangsu) Co.,Ltd. Country or region after: China Address before: 14th Floor, Building A, Chuangzhi Building, No. 17 Xinghuo Road, Jiangbei New District, Nanjing City, Jiangsu Province Patentee before: Nanjing yingruichuang Electronic Technology Co.,Ltd. Country or region before: China |