CN208738606U

CN208738606U - A kind of mode of laser group and terminal device

Info

Publication number: CN208738606U
Application number: CN201821622578.0U
Authority: CN
Inventors: 张百成; 游兴龙; 彭侃; 黄大帅; 程才权
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2018-09-30
Filing date: 2018-09-30
Publication date: 2019-04-12
Anticipated expiration: 2028-09-30

Abstract

This application involves field of photoelectric technology, providing a kind of mode of laser group and terminal device, mode of laser group includes bracket component and laser module, and bracket component is at least used for fixed laser component, and laser module is for generating laser；Bracket component includes substrate, interconnecting piece and bracket, and interconnecting piece is set on substrate, and bracket is connect with interconnecting piece；Substrate, interconnecting piece and bracket form bracket cavity, and bracket offers carrier openings, and bracket cavity and carrier openings penetrate through；Laser module is set in bracket cavity, and the light-emitting surface of laser module is towards carrier openings；Bracket is connected with substrate by interconnecting piece, bracket does not form on substrate directly, therefore bracket can separate synchronous progress with the production of substrate, and manufacturing process and assembling process are more flexible, can shorten the fabrication cycle of bracket component greatly；When there is the damage of bracket or substrate, it is only necessary to which the bracket or substrate of corresponding replacement damage, processing mode is flexible, and cost of manufacture also can be effectively reduced.

Description

Laser module and terminal equipment

Technical Field

The application relates to the technical field of photoelectricity, and more particularly relates to a laser module and a terminal device.

Background

The field of optoelectronics is an application area created by combining Electronics (Electronics) and Optics (Optics), and laser modules are a very important class of devices in this area. The laser module has the advantages of high output power, high transmission speed, small light-emitting angle, narrow frequency spectrum (small dispersion) and the like, and can be applied to a plurality of technical fields, for example, the laser module can be used for medium-distance and long-distance transmission in optical fiber communication. With the development of the 3D sensing technology, the laser module is gradually applied to the field of consumer electronics as a light source, and has a wide application prospect.

The optical module generally includes a bracket assembly and a laser assembly, the bracket assembly includes a base and a housing, the housing is disposed on the base, and the laser assembly is disposed in an accommodating space formed by the housing and the base. However, when the assembly of the bracket assembly is performed on the existing optical module, the adopted scheme is to directly inject the housing on the base, so that the molding cycle is long, the cost is high, and the flexibility is poor.

SUMMERY OF THE UTILITY MODEL

An object of this application is to provide a laser module to solve the technical problem that the bracket component shaping cycle that exists among the prior art is long, with high costs, the flexibility is poor.

In order to achieve the purpose, the technical scheme adopted by the application is as follows: the laser module comprises a bracket component and a laser component;

the bracket assembly comprises a substrate, a connecting part and a bracket, wherein the connecting part is arranged on the substrate, and the bracket is connected with the connecting part;

the base plate, the connecting part and the bracket form a bracket accommodating cavity, the bracket is provided with a bracket opening, and the bracket accommodating cavity is communicated with the bracket opening;

the laser assembly is arranged in the support cavity, and the light emitting surface of the laser assembly faces the support opening.

In one embodiment, the connecting portion comprises glue by which the bracket is connected to the substrate.

In one embodiment, a substrate groove is formed in the surface of the substrate, the glue is attached to the bottom of the substrate groove, and the width of the substrate groove is not less than the width of the glue.

In one embodiment, the thickness of the glue is adapted to the depth of the substrate groove.

In one embodiment, the substrate is a ceramic substrate or a metal substrate.

In one embodiment, the laser assembly is disposed on a surface of the substrate;

or,

the bracket cavity is internally provided with a heat radiating piece, the heat radiating piece is connected with the substrate, and the laser component is arranged on the heat radiating piece.

In one embodiment, the laser module further includes an optical monitoring component, and the optical monitoring component is disposed in the holder cavity and is configured to monitor the laser intensity of the laser component.

In one embodiment, the laser assembly includes a vertical cavity surface emitting laser and/or an edge emitting semiconductor laser.

In one embodiment, the laser module further includes an optical adjustment unit, and the optical adjustment unit is disposed on the light exit path of the laser module and connected to the bracket.

In one embodiment, the optical conditioning unit comprises a collimating optical element and a diffractive optical element;

the collimating optical element and the diffractive optical element are both arranged on a light-emitting path of the laser assembly, and the diffractive optical element is arranged on one side, far away from the laser assembly, of the collimating optical element.

In one embodiment, the optical adjustment unit includes a light uniformizer;

the light equalizing sheet is arranged on the light emitting path of the laser assembly and connected with the support.

In one embodiment, the optical conditioning unit further comprises a reflective film;

the reflecting film is arranged on one side of the light equalizing sheet close to the laser assembly;

and the reflecting film is provided with a reflecting film through hole for the light beam of the laser assembly to be emitted.

In one embodiment, a transparent protective layer is further provided on a side of the optical adjustment unit away from the laser assembly.

In one embodiment, a side of the optical adjustment unit close to the laser assembly is further provided with an optical filter.

The application further aims to provide a terminal device which comprises the laser module.

The application provides a pair of laser module's beneficial effect lies in:

(1) design and independent preparation to support and base plate are involved in the manufacturing process of bracket component, because the support is not directly fashioned on the base plate, so the preparation of support and base plate can be separately gone on in step, can arrange the production of support and base plate as required, and the manufacturing process is more nimble, also can shorten the preparation cycle of bracket component greatly.

(2) Because support and base plate are makeed respectively in the bracket component and are obtained, consequently also can make the standard component of support and base plate, again according to required bracket component shape with support and base plate assemble can, the manufacturing process is nimble various, and is favorable to reducing the cost of manufacture of bracket component.

(3) When the shape of the bracket component needs to be changed, the assembly form of the bracket and the substrate only needs to be changed, for example, the connection position of the bracket and the substrate is changed; or when the structure of the substrate or the bracket needs to be changed, the substrate or the bracket only needs to be redesigned and manufactured independently, and the substrate, the bracket and the injection molding mold of the substrate and the bracket do not need to be redesigned simultaneously, so that the whole design and manufacturing process is greatly simplified, and the manufacturing cost is reduced.

(4) When assembling support and base plate, because both are connected through connecting portion, consequently support and base plate are not the lug connection to need not consider the material matching problem of support and base plate, the selection of support and base plate is more extensive, and connecting portion only need with support and base plate connection can, select various, consequently whole design and manufacturing process are more nimble.

(5) Because the bracket and the substrate are separately and independently manufactured, when the laser module is assembled, the bracket can be connected to the substrate through the connecting part, and then the laser assembly is accommodated in the bracket accommodating cavity; the laser component can be fixed firstly, and then the support is connected with the substrate, so that the manufacturing process is more flexible. When the damage of the support or the substrate occurs in the assembling process, the damaged support or substrate only needs to be replaced correspondingly, the processing mode is flexible, and the manufacturing cost can be effectively reduced.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an example of a laser module according to an embodiment of the present disclosure;

fig. 2 is a first schematic structural diagram of a laser module according to an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of a substrate of a laser module according to an embodiment of the present disclosure;

fig. 4 is a first schematic structural diagram illustrating a substrate of a laser module according to an embodiment of the present disclosure having a connection portion;

fig. 5 is a second schematic structural diagram illustrating a substrate of a laser module according to an embodiment of the present disclosure, the substrate having a connection portion;

fig. 6 is a schematic structural diagram of a substrate of a laser module according to an embodiment of the present disclosure;

fig. 7 is a third schematic structural view illustrating a substrate of a laser module according to an embodiment of the present disclosure having a connection portion;

fig. 8 is a fourth schematic structural view illustrating a substrate of a laser module according to an embodiment of the present disclosure having a connection portion;

fig. 9 is a schematic structural view of a laser module provided with a heat sink according to an embodiment of the present disclosure;

FIG. 10 is a first schematic structural diagram of a laser module provided with an optical monitoring assembly according to an embodiment of the present disclosure;

fig. 11 is a schematic structural diagram of a laser module provided with an optical monitoring assembly according to an embodiment of the present disclosure;

fig. 12 is a first schematic structural diagram illustrating a laser module provided with a pin unit according to an embodiment of the present disclosure;

fig. 13 is a second schematic structural diagram illustrating a laser module provided with a pin unit according to an embodiment of the present disclosure;

fig. 14 is a first schematic structural diagram illustrating a laser module provided with an optical adjustment unit according to an embodiment of the present disclosure;

fig. 15 is a second schematic structural diagram illustrating a laser module provided with an optical adjustment unit according to an embodiment of the present disclosure;

fig. 16 is a schematic structural diagram three illustrating a laser module provided with an optical adjustment unit according to an embodiment of the present disclosure;

fig. 17 is a fourth schematic structural diagram illustrating a laser module provided with an optical adjustment unit according to an embodiment of the present disclosure;

fig. 18 is a schematic structural diagram of a laser module provided with an optical adjustment unit according to an embodiment of the present disclosure;

fig. 19 is a schematic structural diagram of a laser module provided with an optical filter according to an embodiment of the present disclosure;

fig. 20 is a first schematic structural view illustrating a laser module provided with a transparent protection layer according to an embodiment of the present disclosure;

fig. 21 is a second schematic structural view illustrating a laser module provided with a transparent protection layer according to an embodiment of the present disclosure;

fig. 22 is a second schematic structural diagram of a laser module according to an embodiment of the present application.

Wherein, in the figures, the respective reference numerals:

10-a laser module; 11-a bracket assembly;

110-a stent cavity; 111-a substrate;

1111-substrate groove; 112-a connecting portion;

113-a scaffold; 1130-a bracket opening;

114-a heat sink;

115-pin unit; 1151-first pin;

1152-a second pin; 1153-third pin;

1154-fourth pin; 12-a laser assembly;

13-a light monitoring assembly; 14-a control assembly;

15-an optical conditioning unit; 151-collimating optics;

152-a diffractive optical element; 153-homogenizing plate;

154-a reflective film; 1541-reflective film via holes;

16-an optical filter; 17-transparent protective layer.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positions based on the orientations or positions shown in the drawings, and are for convenience of description only and not to be construed as limiting the technical solution. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.

Referring to fig. 2, a laser module 10 includes a bracket assembly 11 and a laser assembly 12, wherein the bracket assembly 11 is at least used for fixing the laser assembly 12, and the laser assembly 12 is used for generating laser. The bracket assembly 11 includes a substrate 111, a connecting portion 112 and a bracket 113, wherein the connecting portion 112 is disposed on the substrate 111, and the bracket 113 is connected to the connecting portion 112; the base plate 111, the connecting portion 112 and the bracket 113 form a bracket accommodating cavity 110, the bracket 113 is provided with a bracket opening 1130, and the bracket accommodating cavity 110 is communicated with the bracket opening 1130; the laser assembly 12 is disposed in the holder cavity 110, and a light emitting surface of the laser assembly 12 faces the holder opening 1130.

When assembling the laser module 10, the assembly of the bracket assembly 11 may be completed first, and then the laser assembly 12 is accommodated in the bracket cavity 110; or the laser module 12 may be fixed first, and then the bracket 113 is fixedly connected to the substrate 111; when assembling the bracket assembly 11, the connecting portion 112 is first fixedly connected to the predetermined position of the substrate 111, and then the bracket 113 is connected to the connecting portion 112, so as to connect the bracket 113 to the substrate 111.

When assembling the laser module 10, the bracket assembly 11 needs to be assembled. Referring to fig. 1, a conventional laser module 10 generally adopts the following steps when assembling a bracket assembly 11: firstly, designing a substrate 111 and a bracket 113, wherein the substrate 111 and the bracket 113 need to be matched; considering that the bracket 113 needs to be directly injection-molded on the substrate 111, a mold for injection molding needs to be designed; after the mold is designed, opening the mold; injection molding is then performed using the mold so that the mount 113 can be directly molded on the base plate 111, thereby obtaining the mount assembly 11. Therefore, at least the following problems need to be involved in the manufacturing process of the bracket assembly 11:

(1) the whole manufacturing process involves the design of the substrate 111 and the bracket 113, the manufacturing of the substrate 111, the development of an injection mold and the injection molding of the bracket 113, and the whole manufacturing cycle is long. In addition, since the bracket 113 needs to be molded on the substrate 111, the bracket 113 needs to be injection molded after the substrate 111 is designed and manufactured, which further prolongs the manufacturing period and increases the manufacturing cost.

(2) Since the bracket 113 needs to be injection molded on the substrate 111, it is necessary to consider whether the material of the bracket 113 matches the material of the substrate 111, the influence of the injection temperature on the substrate 111, and the problem of cold shrinkage during the cooling process after the bracket 113 is injection molded on the substrate 111. For example, if the material of the substrate 111 does not match the material of the support 113, the support 113 may not be well formed on the surface of the substrate 111, resulting in poor forming quality and failure to obtain the desired support assembly 11. Since the molding is performed on the surface of the substrate 111, it is necessary to consider the influence of the molding temperature of the holder 113 on the substrate 111, and whether or not the substrate 111 can withstand the molding temperature of the holder 113. In the cooling process after the injection molding is finished, if the coefficient of expansion with heat and contraction with cold of the substrate 111 is not matched with the coefficient of expansion with heat and contraction with cold of the bracket 113, when the substrate is cooled to room temperature, the degree of contraction with cold of the substrate 111 is different from the degree of contraction with cold of the bracket 113, so that the bracket 113 falls off from the substrate 111. Therefore, the factors to be considered are many, the design and manufacturing process is complicated and long, and the manufacturing cost is high.

(3) When the structure of the bracket assembly 11 needs to be modified, the substrate 111 and the bracket 113 need to be redesigned, the injection mold needs to be redesigned and manufactured, and the injection molding needs to be performed again, and when the manufactured bracket assembly 11 does not meet the requirement, the above process needs to be repeated until the required bracket assembly 11 is finally obtained. Therefore, the above process needs to be repeated when the bracket assembly 11 changes one shape, even if the change is little, the injection mold needs to be redesigned and manufactured, the mold opening flexibility is poor, the manufacturing period is greatly prolonged, and the manufacturing cost is increased.

(4) Since the bracket 113 is directly injection-molded on the surface of the substrate 111, when the laser module 11 is manufactured, the bracket assembly 11 needs to be manufactured first, and then the laser module 12 needs to be fixed on the surface of the substrate 111, so that the manufacturing process is not flexible. However, once a part of the bracket assembly 11 is damaged during the manufacturing process, the whole bracket assembly 11 cannot be used and recycled, which increases the manufacturing cost.

The application adopts another completely different design idea: referring to fig. 2, the frame 113 of the frame assembly 11 is not directly formed on the substrate 11, but is separately designed and fabricated, and then the frame assembly 11 is connected by the connecting portion 112. Compared with the prior bracket assembly 11, the bracket assembly has at least the following advantages:

(1) the design and the independent manufacture of the bracket 113 and the substrate 111 are involved in the manufacturing process of the bracket assembly 11, and the bracket 113 is not directly molded on the substrate 111, so the manufacture of the bracket 113 and the substrate 111 can be separately and synchronously performed, the production of the bracket 113 and the substrate 111 can be arranged according to the requirement, the manufacturing process is more flexible, and the manufacturing period of the bracket assembly 11 can be greatly shortened.

(2) Because the bracket 113 and the substrate 111 in the bracket assembly 11 are manufactured respectively, standard parts of the bracket 113 and the substrate 111 can be manufactured, and then the bracket 113 and the substrate 111 are assembled according to the shape of the required bracket assembly 11, so that the manufacturing process is flexible and various, and the manufacturing cost of the bracket assembly 11 is reduced.

(3) When the shape of the bracket assembly 11 needs to be changed, it is only necessary to change the assembly form of the bracket 113 and the base plate 111, for example, the connection position between the bracket 113 and the base plate 111 is changed; or when the structure of the substrate 111 or the bracket 113 needs to be changed, the substrate 111 or the bracket 113 only needs to be redesigned and manufactured independently, and the substrate 111, the bracket 113 and the injection molding mold of the substrate 111 and the bracket 113 do not need to be redesigned at the same time, so that the whole design and manufacturing process is greatly simplified, and the manufacturing cost is reduced.

(4) When the bracket 113 and the substrate 111 are assembled, the bracket 113 and the substrate 111 are connected through the connecting part 112, so that the bracket 113 and the substrate 111 are not directly connected, the material matching problem of the bracket 113 and the substrate 111 does not need to be considered, the selection of the bracket 113 and the substrate 111 is wider, the connecting part 112 only needs to connect the bracket 113 and the substrate 111, the selection is diversified, and the whole design and manufacturing process is more flexible.

(5) Since the bracket 113 and the substrate 111 are separately and independently manufactured, when the laser module 10 is assembled, the bracket 113 may be connected to the substrate 111 through the connecting portion 112, and then the laser module 12 is accommodated in the bracket cavity 110; the laser module 12 can be fixed first, and then the bracket 113 is connected with the substrate 111, so that the manufacturing process is more flexible. When the support 113 or the substrate 111 is damaged in the assembling process, only the damaged support 113 or the damaged substrate 111 needs to be replaced correspondingly, the processing mode is flexible, and the manufacturing cost can be effectively reduced.

Further, the connecting portion 112 includes glue, and the bracket 113 is connected with the substrate 111 by the glue. The glue may be a high viscosity glue so that the bracket 113 can be firmly fixed on the substrate 111; considering that the laser module 12 in the laser module 10 generates a large amount of heat during use, which results in a temperature increase of the whole laser module 10, the glue may be a high temperature-resistant glue, thereby ensuring that the support 113 can be firmly connected to the substrate 111 at both high temperature and low temperature. The glue may be disposed at any position on the surface of the substrate 111 as required, as long as the bracket 113 can be connected and fixed with the substrate 111. The glue may be any type of glue as long as the bracket 113 and the substrate 111 can be connected, and may be, for example, a composite structural adhesive, a polymer adhesive, a high temperature resistant adhesive, a pressure sensitive adhesive, a hot melt adhesive, or the like, which is not limited herein. Of course, in other embodiments, the connecting portion 112 may be other types of components as long as it can connect the bracket 113 and the substrate 111, and is not limited to the above case.

Referring to fig. 3, further, in order to better position the bonding position of the glue, a substrate groove 1111 is formed in the surface of the substrate 111, the glue is bonded to the bottom of the substrate groove 1111, and the width of the substrate groove 1111 is not less than the width of the glue, so that when the glue is bonded, the position is more definite, the operation is more convenient, and the product quality of the bracket assembly 11 is improved.

Referring to fig. 3, in one embodiment, the substrate recess 1111 is opened near the edge of the substrate 111, the substrate recess 1111 includes a bottom and two sidewalls at two sides of the bottom, and the glue is attached to the bottom. When the bracket 113 is connected to the substrate 111, the bottom of the bracket 113 can be received in the substrate recess 1111, so that the bracket 113 can be positioned and limited, which is beneficial to the connection between the bracket 113 and the substrate.

Referring to fig. 6, in one embodiment, the substrate recess 1111 is opened at an edge of the substrate 111, and the substrate recess 1111 includes a bottom and a sidewall at one side of the bottom, and the glue is adhered to the bottom. At the moment, the processing of the substrate groove 1111 is simpler and more convenient; when the bracket 113 is connected to the substrate 111, the outer sidewall of the bracket 113 may be flush with the outer sidewall of the substrate 111, and the size of the bracket 113 is adapted to the size of the substrate 111, so that the bracket assembly 11 is more compact, thereby avoiding the oversize of the substrate 111, and contributing to reducing the overall size of the bracket assembly 11.

It should be understood that the substrate recess 1111 may be opened at other positions of the substrate 111, and is not limited to the above.

In one embodiment, the width of the glue is adapted to the width of the substrate groove 1111, and the glue fills the bottom of the substrate groove 1111 in the width direction, and the width of the bottom of the bracket 113 is adapted to the width of the glue, thereby ensuring that the entire bottom of the bracket 113 can be connected to the substrate 111 through the glue. Of course, in other embodiments, the width of the glue may be smaller than the width of the substrate groove 1111, and the width of the bottom of the bracket 113 may also be larger or smaller than the width of the glue, which is not limited herein.

Referring to fig. 4 and 7, in one embodiment, the glue has a thickness corresponding to the depth of the substrate recess 1111, and the upper surface of the glue is flush with the surface of the substrate 111, and when the bracket 113 is coupled with the glue, the bottom of the bracket 113 is flush with the surface of the substrate 111. Of course, in other embodiments, the thickness of the glue may be smaller than the depth of the substrate recess 1111 (see fig. 5 and 8), and when the bracket 113 is connected with the glue, the bottom of the bracket 113 may be accommodated in the substrate recess 1111, which is helpful for positioning the bracket 113.

Referring to fig. 2, in an embodiment, the substrate recess 1111 is opened at an edge of the substrate 111, the substrate recess 1111 includes a bottom and a sidewall at one side of the bottom, the glue is attached to the bottom, a width of the glue is the same as a width of the substrate recess 1111, a thickness of the glue is the same as a depth of the substrate recess 1111, and a bottom of the bracket 113 is the same as a width of the glue, so that the width of the bracket 1111 is the same as the width of the substrate recess 1111, when the bracket 113 is connected to the substrate 111, an outer sidewall of the bracket 113 may be flush with an outer sidewall of the substrate 111, and a bottom of the bracket 113 is flush with a surface of the substrate 111, thereby ensuring a stable connection between the bracket 113 and the substrate 111, and the size of the bracket 113 is adapted to the size of the substrate 111, so that the bracket assembly 11.

In one embodiment, the bracket 113 may be made of plastic, and may be directly injection molded through a mold during manufacturing, so that the manufacturing method is simple, the cost is low, and mass manufacturing is facilitated. The substrate 111 needs to have good heat dissipation performance so as to quickly conduct heat generated by the laser module 12 during operation to the outside of the holder assembly 11. The substrate 111 may be a ceramic substrate, that is, the substrate 111 is made of a ceramic material, for example, an aluminum nitride ceramic substrate, which has good thermal conductivity. The substrate 111 may also be a metal substrate, i.e., the substrate 111 is made of a metal material, thereby having excellent heat conductive properties. Of course, the substrate 111 may be made of other materials with good thermal conductivity, and is not limited to the above.

Referring to fig. 2, in an embodiment, the laser assembly 12 is disposed on the surface of the substrate 111, and at this time, the laser assembly 12 is attached to the surface of the substrate 111, and heat generated by the laser assembly 12 during operation can be rapidly conducted to the outside of the bracket assembly 11 through the substrate 111 in contact with the laser assembly 12, so as to prevent the laser assembly 12 from being degraded or even damaged due to overheating, ensure that the laser assembly 12 has a good and stable working environment, and prolong the service life.

Referring to fig. 9, in one embodiment, the bracket assembly 11 further includes a heat dissipation member 114 disposed in the bracket cavity 110, the heat dissipation member 114 is connected to the substrate 111, and the laser assembly 12 is disposed on the heat dissipation member 114. The heat dissipation member 114 may be made of any material with good heat dissipation performance, such as metal, ceramic material, etc., and is not limited herein. By providing the heat dissipation member 114, heat of the laser module 12 can be conducted quickly, and the heat dissipation effect is better.

In one embodiment, the Laser module 12 includes a Vertical-cavity surface-Emitting Laser (VCSEL), and has the characteristics of small volume, circular output light spot, single longitudinal mode output, small threshold current, low price, easy integration into a large-area array, and the like, and the VCSEL has a very wide application prospect as the Laser module 12 in the Laser module 10. For example, it plays a role in the field of communications and consumer electronics 3D sensing. In the field of optical communication, laser emitted by the laser module 10 using VCSEL serves as a carrier, and image information, and then voice information, etc. can be transmitted. In the field of consumer electronics 3D sensing, a VCSEL laser module 10 is used to emit a light signal and then receive a light signal from an object with a sensor to detect a distance from the object, so that three-dimensional information of the object can be sensed. Of course, it can be applied to other technical fields, and is not limited to the above case. Alternatively, the laser wavelength band of the VCSEL may be 800nm to 950nm, for example, 810nm, 850nm, 940nm, etc. It should be understood that in other embodiments, the laser assembly 12 may also be an edge emitting semiconductor laser or other type of laser, without limitation.

Referring to fig. 10, further, in some usage scenarios, the intensity of the laser generated by the laser component 12 needs to be monitored, at this time, the laser module 10 further includes an optical monitoring component 13, and the optical monitoring component 13 is disposed in the holder cavity 110, preferably directly and fixedly connected to the surface of the substrate 111, and is located on one side of the laser component 12, and is configured to receive the laser generated by the laser component 12. At this moment, the laser module 10 further includes a control component 14, the laser component 12 and the optical monitoring component 13 are both connected to the control component 14, the control component 14 can control the working state of the laser component 12, and at the same time, can receive the signal of the optical monitoring component 13, and adjust the working state of the laser component 12 according to the signal. It should be understood that the number of the light monitoring assemblies 13 may be one, may be plural; when the number thereof is one, it is located on one side of the laser assembly 12; referring to fig. 11, when the number of the optical monitoring elements 13 is plural, the optical monitoring elements 13 may be distributed at different positions in the holder cavity 110, so as to monitor the laser intensity generated by the laser element 12 at different positions, and the control element 14 may adjust the working state of the laser element 12 more accurately according to the laser intensity signals at these different positions.

In one embodiment, the optical monitoring component 13 may be a photodiode, a part (main part) of the laser light generated by the laser component 12 is emitted out through the bracket opening 1130, a part of the laser light is emitted to the photodiode, the photodiode receives the laser light and generates a corresponding electrical signal, and the control component 14 receives the electrical signal of the photodiode, obtains the intensity of the laser light generated by the laser component 12, and adjusts the intensity of the laser light of the laser component 12 as required, so that the laser light meets different use requirements. It should be understood that the optical monitoring assembly 13 may be other components, and is not limited to the above.

Referring to fig. 12 and 13, the holder assembly 11 further includes a pin unit 115, and the pin unit 115 is connected to the substrate 111 and extends from the outside of the substrate 111 to the holder cavity 110, so as to ensure that the laser assembly 12 and the optical monitoring assembly 13 can be connected to the control assembly 14 disposed outside the holder cavity 110 through the pin unit 115.

Referring to fig. 12, in one embodiment, the pin unit 115 includes three pins, namely a first pin 1151, a second pin 1152 and a third pin 1153, wherein the first pin 1151 and the second pin 1152 are respectively connected to the laser module 12 and the optical monitoring module 13, and the third pin 1153 is a common pin which is connected to both the laser module 12 and the optical monitoring module 13; while three pins are connected to the control assembly 14. Of course, as the number of optical monitoring assemblies 13 increases, the number of pins also increases accordingly. Assuming that the number of the optical monitoring assemblies 13 is M, and the number of the laser assemblies 12 is 1, the number of the pins is M +2, all the optical monitoring assemblies 13 and the laser assemblies 12 share one pin, and each optical monitoring assembly 13 or laser assembly 12 is also connected with one pin separately.

Referring to fig. 13, in an embodiment, the pin unit 115 includes four pins, namely a first pin 1151, a second pin 1152, a third pin 1143 and a fourth pin 1154, wherein the first pin 1151 and the third pin 1153 are connected to the laser module 12, and the second pin 1152 and the fourth pin 1154 are connected to the optical monitoring module 13; while four pins are connected to the control assembly 14. Of course, as the number of optical monitoring assemblies 13 increases, the number of pins also increases accordingly. Assuming that the number of the optical monitoring assemblies 13 is M and the number of the laser assemblies 12 is 1, the number of the pins is 2(M +1), and two pins are connected to all the optical monitoring assemblies 13 and the laser assemblies 12.

Referring to fig. 14, further, the laser module 10 further includes an optical adjusting unit 15, where the optical adjusting unit 15 is disposed in the holder cavity 110 near the holder opening 1130, and is used for adjusting the laser generated by the laser component 12, and then the laser is emitted from the holder opening 1130, so as to obtain the laser required in different application scenarios. The bracket 113 is provided with a bracket step 1131 near the bracket opening 1130, and two ends of the optical adjustment unit 15 may be fixed to the bracket step 1131 by glue or by other methods, which is not limited herein.

Referring to fig. 15, in an embodiment, the Optical adjustment unit 15 includes a collimating Optical element 151 and a Diffractive Optical Element (DOE) 152, and the Diffractive Optical element 152 is disposed on a side of the collimating Optical element 151 away from the laser assembly 12, so that the laser generated by the laser assembly 12 passes through the collimating Optical element 151 and the Diffractive Optical element 152 in sequence and is emitted. Wherein the collimating optical element 151 is used for collimating the laser light generated by the laser component 12, so that the laser light can be incident to the diffractive optical element 152 in a preferred direction; the diffractive optical element 152 is used for shaping laser, and the laser can be emitted after a specific pattern is formed by designing the texture of the diffractive optical element 152. For example, the laser component 12 can be used in the field of 3D imaging technology, and the laser component 12 can be used as a structural light source to project a dot matrix to a space, so that the laser component can be used for portrait recognition and the like, and has a wide application prospect. The collimating optical element 151 and the diffractive optical element 152 may be separately stacked or coupled together, for example, the diffractive optical element 152 may be coupled to the surface of the collimating optical element 151, so as to reduce the occupied volume and facilitate the miniaturization of the laser module 10.

Referring to fig. 16, in one embodiment, since the divergence angle of the laser light generated by the laser assembly 12 is small, the laser assembly 12 may have a larger emitting range when emitting the laser light, and the laser light is more uniformly distributed, so that the light uniformizing sheet 153 is required to be disposed at the bracket opening 1130. The light uniformizing sheet 153 may be made of a transparent layer (e.g., a glass layer, a transparent ceramic layer, a silica gel layer, etc.) containing a diffusion material, and the ratio of the diffusion material is adjusted, so that the light emitting angle of the laser module 10 can be adjusted. In general, the light emission angle of the laser module 10 increases as the amount of the diffusing material increases. Alternatively, when laser assembly 12 includes a VCSEL, laser module 10 has an emission angle of 10 ° to 120 °.

Referring to fig. 17 and 18, further, it is considered that after the laser enters the light equalizing sheet 153, the laser is continuously reflected in the light equalizing sheet 153, wherein a part of the laser is reflected back to the holder cavity 110 and cannot exit, and a part of the laser is also reflected to both sides to cause loss. In order to reduce the loss of laser light and increase the light extraction rate, the optical adjustment unit further includes a reflective film 154, the reflective film 154 is disposed on one side of the light homogenizing plate 153 close to the laser module 12, and a reflective film through hole 1541 for emitting the laser light of the laser module 12 is disposed on the reflective film 154; meanwhile, the reflective film 154 is disposed on both sides of the light uniformizing sheet 153. Since the laser light generated by the laser module 12 has a small angle range, the reflective film through hole 1541 only needs to be formed in the reflective film 154 at a position corresponding to the laser light of the laser module 12. At this time, the laser of the laser assembly 12 can be smoothly emitted to the light equalizing sheet 153 through the reflective film through hole 1541, and part of the laser in the light equalizing sheet 153 can be reflected to the light equalizing sheet 153 when being reflected to the reflective film 154, so that the laser is finally emitted from the bracket opening 1130, the light emitting rate is effectively improved, and the loss of the laser is reduced.

Referring to fig. 19, further, it is considered that, in the laser generated by the laser assembly 12, there may be a partial band of laser that is not needed for practical use, and therefore, the laser in the unnecessary band needs to be filtered, so as to ensure that the emitted laser only includes the laser in a specific band, which meets the use requirements of different scenes. In this case, the laser module 10 further includes a filter 16, and the filter 16 is disposed on a side of the optical adjustment unit 15 close to the laser assembly 12. When the laser with different wave bands needs to be filtered, only the corresponding optical filter 16 needs to be replaced, and the operation is simple and convenient.

Further, the laser module 10 further includes a transparent protection layer 17, and the transparent protection layer 17 is disposed on a side of the optical adjustment unit 15 away from the laser assembly 12. Referring to fig. 20, the transparent protection layer 17 may be disposed on the surface of the optical adjustment unit 15, and the upper surface of the transparent protection layer is flush with the bracket opening 1130 or lower than the upper surface of the bracket opening 110, or disposed outside the bracket opening 110, and two ends of the transparent protection layer are connected to the upper surface of the bracket 113 (see fig. 21), so as to protect each component accommodated in the bracket cavity 110 well; the transparent protective layer 17 may be glass or other material as long as it can protect and allow laser light to exit.

Referring to fig. 22, in an embodiment, a filter 16, an optical adjustment unit 15, and a transparent protection layer 17 are sequentially disposed at a position of the bracket opening 1130 from a side close to the laser assembly 12 to the outside, the optical adjustment unit 15 includes a reflective film 154, a light equalizing sheet 153, a collimating optical element 151, and a diffractive optical element 152, which are sequentially disposed, laser generated by the laser assembly 12 is sequentially filtered by the filter 16, passes through a reflective film through hole 1540, equalizes light by the light equalizing sheet 153, is collimated by the collimating optical element 151, and is emitted after passing through the diffractive optical element 152, and the emitted laser may be a dot matrix pattern or other types of patterns or light beams, which is not limited herein.

The present embodiment further aims to provide a terminal device, which includes the laser module 10. The terminal device may be a consumer electronic device, such as a mobile smart terminal. The laser module 10 may include a VCSEL, which mainly generates infrared light, and the laser module 10 may be an infrared light source of a 3D camera in a terminal device to generate an infrared light dot matrix.

The 3D camera includes an infrared image sensor and an image processing chip, in addition to the laser module 10. When the 3D camera works, the laser module 10 generates an infrared light dot matrix, the infrared light is reflected by a target object (such as a hand or a face) and then is received by the infrared image sensor, and image information is used for calculating the position (Z axis, namely depth direction) of the target object; meanwhile, a visible light image sensor of the terminal equipment collects image information of a target object in a two-dimensional plane (an X axis and a Y axis); the information of the two image sensors is gathered to a special image processing chip, so that the three-dimensional data of the target object is obtained, and spatial positioning is realized. Therefore, the laser module 10 has an incomparable important role for a 3D camera.

Of course, the laser assembly 12 of the laser module 10 may be any other laser, and is not limited herein.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. The utility model provides a laser module which characterized in that: comprises a bracket component and a laser component;

2. The laser module of claim 1, wherein: the connecting part comprises glue, and the support is connected with the substrate through the glue.

3. The laser module of claim 2, wherein: the substrate is characterized in that a substrate groove is formed in the surface of the substrate, the glue is attached to the bottom of the substrate groove, and the width of the substrate groove is not smaller than the width of the glue.

4. The laser module of claim 3, wherein: the thickness of the glue is adapted to the depth of the substrate groove.

5. The laser module of claim 1, wherein: the substrate is a ceramic substrate or a metal substrate.

6. The laser module of claim 1, wherein: the laser assembly is arranged on the surface of the substrate;

or,

7. The laser module of claim 1, wherein: the laser module further comprises a light monitoring assembly, and the light monitoring assembly is arranged in the support containing cavity and used for monitoring the laser intensity of the laser assembly.

8. The laser module of any of claims 1-7, wherein: the laser assembly includes a vertical cavity surface emitting laser and/or an edge emitting semiconductor laser.

9. The laser module of claim 8, wherein: the laser module further comprises an optical adjusting unit, and the optical adjusting unit is arranged on the light emitting path of the laser assembly and connected with the support.

10. The laser module of claim 9, wherein: the optical adjustment unit includes a collimating optical element and a diffractive optical element;

11. The laser module of claim 9, wherein: the optical adjusting unit comprises a light homogenizing sheet;

12. The laser module of claim 11, wherein: the optical adjustment unit further includes a reflective film;

13. The laser module of claim 9, wherein: and a transparent protective layer is further arranged on one side of the optical adjusting unit, which is far away from the laser assembly.

14. The laser module of claim 9, wherein: and an optical filter is also arranged on one side of the optical adjusting unit, which is close to the laser component.

15. A terminal device characterized by: comprising a laser module according to any of claims 1 to 14.