CN208737489U - Fingerprint mould group and display equipment - Google Patents
Fingerprint mould group and display equipment Download PDFInfo
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- CN208737489U CN208737489U CN201821398745.8U CN201821398745U CN208737489U CN 208737489 U CN208737489 U CN 208737489U CN 201821398745 U CN201821398745 U CN 201821398745U CN 208737489 U CN208737489 U CN 208737489U
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- fingerprint
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- fingerprint recognition
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Abstract
The present disclosure provides a kind of fingerprint mould groups and display equipment.Fingerprint mould group includes substrate, multiple fingerprint recognition components, fingerprint chip and multiple metal wires.Substrate has the cog region of fingerprint for identification and the non-identifying area positioned at the periphery of cog region.Fingerprint recognition component is set in the cog region of substrate.Fingerprint chip is set in the non-identifying area of substrate.Each fingerprint recognition component is electrically connected to fingerprint chip by corresponding metal wire.This announcement can increase fingerprint recognition area, realize full screen fingerprint recognition by the fingerprint chip in the fingerprint recognition component that is set in the cog region of substrate and the non-identifying area for being set to substrate.
Description
[technical field]
This announcement is related to a kind of fingerprint recognition field, in particular to a kind of fingerprint mould group and display equipment.
[background technique]
Fingerprint is to be formed by lines by concave-convex skin in the finger pulp of human finger end, since fingerprint repetitive rate is minimum,
About 1/15000000000th, therefore can be used to carry out identification.Capacitance type fingerprint recognition principle is based on the skin being recessed in finger pulp
The capacitor that skin and the skin of protrusion are incuded is variant, presses the capacitance difference incuded on Fingerprint Identification Unit by acquisition finger
It is different, the pattern of fingerprint can be restored, and then carry out identification of fingerprint.
In the prior art, the fingerprint identification technology scheme for showing equipment is the side in the front or the back side in display equipment
Frame, such as 10mm2Finite region, increase a fingerprint recognition device, fingerprint recognition device identifies that area is small, and fingerprint recognition is only
It can be completed on fingerprint recognition device, and be confined to the finite region 10mm of frame2Within carry out, do not have flexibility.In addition,
Additional fingerprint recognition device will increase the cost of display equipment and increase the frame size of display equipment.
Therefore it is in need a kind of fingerprint mould group and display equipment be provided, it is of the existing technology to solve the problems, such as.
[utility model content]
In order to solve the above technical problems, one kind of this announcement is designed to provide a kind of fingerprint mould group and display equipment,
Can by the fingerprint chip in the fingerprint recognition component that is set in the cog region of substrate and the non-identifying area for being set to substrate,
Increase fingerprint recognition area, realizes full screen fingerprint recognition.
To reach above-mentioned purpose, this announcement provides fingerprint mould group.The fingerprint mould group includes substrate, multiple fingerprint recognition structures
Part, fingerprint chip and multiple metal wires.The substrate has the cog region of fingerprint for identification and positioned at the cog region
The non-identifying area of periphery.The fingerprint recognition component is set in the cog region of the substrate.The fingerprint chip setting
In in the non-identifying area of the substrate.Each fingerprint recognition component is electrically connected to the fingerprint core by corresponding metal wire
Piece.
In this announcement embodiment therein, the material of the fingerprint recognition component includes that vulcanized lead, indium antimonide, germanium are mixed
Miscellaneous gold, Ge-doped mercury, lead tin telluride or mercury cadmium telluride.
In this announcement embodiment therein, the fingerprint recognition component is arranged in arrays.
This announcement also provides display equipment.The display equipment include the fingerprint mould group of successively stacking, display panel and
Backlight module.The fingerprint mould group includes substrate, multiple fingerprint recognition components, fingerprint chip and multiple metal wires.The base
Plate has the cog region of fingerprint for identification and the non-identifying area positioned at the periphery of the cog region.The fingerprint recognition component is set
It is placed in the cog region of the substrate.The fingerprint chip is set in the non-identifying area of the substrate.Each finger
Line identification means are electrically connected to the fingerprint chip by corresponding metal wire.
In this announcement embodiment therein, the material of the fingerprint recognition component includes that vulcanized lead, indium antimonide, germanium are mixed
Miscellaneous gold, Ge-doped mercury, lead tin telluride or mercury cadmium telluride.
In this announcement embodiment therein, the fingerprint recognition component is arranged in arrays.
In this announcement embodiment therein, the backlight module includes light guide plate, white light emitting diode and infrared
Light-emitting diode, the white light emitting diode and the infrared light emitting diodes are set to the side of the light guide plate.
In this announcement embodiment therein, the display equipment further includes the first light guide plate and infrared light light-emitting diodes
Pipe, first light guide plate are set between the display panel and the fingerprint mould group, and the infrared light emitting diodes are set
It is placed in the side of first light guide plate, the backlight module includes white light emitting diode and the second light guide plate, the white light
Light emitting diode is set to the side of second light guide plate.
In this announcement embodiment therein, the display equipment further includes the first optical adhesive layer, cover board and the second light
Glue-line is learned, first optical adhesive layer is arranged between the fingerprint mould group and the display panel, and the cover board is set to described
In fingerprint mould group and second optical adhesive layer is set between the cover board and the fingerprint mould group.
In this announcement embodiment therein, the display panel include the upper polaroid of successively stacking, first substrate,
Liquid crystal layer, the second substrate and down polaroid.
It, can be by being set in the cog region of substrate due to the fingerprint mould group and display equipment in this revealed embodiment
Fingerprint recognition component and the fingerprint chip that is set in the non-identifying area of substrate, increase fingerprint recognition area, realize full frame
Curtain fingerprint recognition.In addition, the frame of display equipment can also be effectively reduced, is conducive to show equipment lifting screen accounting, be conducive to full frame
Curtain design.
For the above content of this announcement can be clearer and more comprehensible, preferred embodiment is cited below particularly, and cooperate institute's accompanying drawings, makees
Detailed description are as follows:
[Detailed description of the invention]
Fig. 1 shows the structural schematic diagram of the fingerprint mould group according to an embodiment of this announcement；
Fig. 2 shows the structural schematic diagram of the display equipment of the embodiment according to this announcement；And
Fig. 3 shows the structural schematic diagram of the display equipment of another embodiment according to this announcement.
[specific embodiment]
In order to which the above-mentioned and other purposes of this announcement, feature, advantage can be clearer and more comprehensible, it is excellent that spy is hereafter lifted into this announcement
Embodiment is selected, and cooperates institute's accompanying drawings, is described in detail below.Furthermore the direction term that this announcement is previously mentioned, such as above and below,
Top, bottom, front, rear, left and right, inside and outside, side layer, around, center, it is horizontal, laterally, vertically, longitudinally, axial direction, radial direction, top layer or
Lowest level etc. is only the direction with reference to annexed drawings.Therefore, the direction term used be to illustrate and understand this announcement, and
It is non-to limit this announcement.
The similar unit of structure is to be given the same reference numerals in the figure.
Referring to Fig.1, according to the structural schematic diagram of the fingerprint mould group of an embodiment of this announcement.
As shown in Figure 1, the fingerprint mould group 10 of this revealed embodiment includes substrate 12, multiple fingerprint recognition components 14, refers to
Line chip 16 and multiple metal wires 18.Substrate 12 has the cog region 121 of fingerprint for identification and positioned at the outer of cog region 121
The non-identifying area 122 enclosed.Fingerprint recognition component 14 is set in the cog region 121 of substrate 12.Fingerprint chip 16 is set to substrate
In 12 non-identifying area 122.Each fingerprint recognition component 14 is electrically connected to fingerprint chip 16 by corresponding metal wire 18.Originally it takes off
Showing fingerprint recognition component 14 in the cog region 121 by being set to substrate 12 and can be set to the non-identifying area of substrate 12
Fingerprint chip 16 in 122 increases fingerprint recognition area, realizes full screen fingerprint recognition.
Specifically, the material of fingerprint recognition component 14 includes photoelectric material.Photoelectric material includes vulcanized lead, indium antimonide, germanium
Doping gold, Ge-doped mercury, lead tin telluride or mercury cadmium telluride etc. are used for the infrared light detecting material of infrared detector.Fingerprint recognition component
14 is arranged in arrays.Fingerprint recognition component 14 is, for example, the minimum fingerprint identification unit in cog region 121.
Specifically, one end of each metal wire 18 is electrically connected corresponding fingerprint recognition component 14, each metal wire 18 it is another
One end is electrically connected fingerprint chip 16.Cog region 121 and non-identifying area 122 of each metal wire 18 across substrate 12.
Specifically, fingerprint recognition component 14 determines the size of current generated, the electricity of generation by absorbing the quantity of infrared light
It flows through and fingerprint chip 16 is flowed by metal wire 18.Fingerprint chip 16 analyzes the electric current relative size of each fingerprint recognition component 14,
Calculate fingerprint lines image.
Referring to Fig. 2, according to the structural schematic diagram of the display equipment of an embodiment of this announcement.
As indicated with 2, the display equipment 20 of this revealed embodiment includes successively the fingerprint mould group 10 of stacking, display panel 22
And backlight module 24.The specific structure of fingerprint mould group 10 and to make flowing mode as described in Figure 1, is not repeated to describe herein.
Backlight module 24 includes white light emitting diode 241 and infrared light emitting diodes 242.Specifically, backlight module
24 include light guide plate 243, and white light emitting diode 241 and infrared light emitting diodes 242 are set to the side of light guide plate 243.
Specifically, display equipment 20 further includes the first optical adhesive layer 26, the second optical cement 27 and cover board 28.First optical cement
Layer 26 is arranged between fingerprint mould group 10 and display panel 22.First optical adhesive layer 26 is to cohere fingerprint mould group 10 and display panel
22, it is stably fixed to fingerprint mould group 10 on display panel 22.Cover board 28 is set in fingerprint mould group 10, to protect fingerprint
Mould group 10.Second optical adhesive layer 27 is set between cover board 28 and fingerprint mould group 10.Second optical adhesive layer 27 is to cohere cover board
28 with fingerprint mould group 10, be stably fixed to cover board 28 in fingerprint mould group 10, to protect fingerprint mould group 10.
Specifically, the first optical adhesive layer 26 and the second optical adhesive layer 27 are, for example, optical clear adhesive (Optically
Clear Adhesive,OCA)。
Specifically, display panel 22 includes the successively upper polaroid 222 of stacking, shielded layer 223, first substrate 224, liquid crystal
Layer 226, the second substrate 228 and down polaroid 230.First substrate 224 is oppositely arranged with the second substrate 228.Liquid crystal layer 226 presss from both sides
Between first substrate 224 and the second substrate 228.In the present embodiment, first substrate 224 be include filter layer 225
Colored filter (color filter, CF) substrate, the second substrate 228 be thin film transistor (TFT) (thin film transistor,
TFT) substrate.Upper polaroid 222 is set between fingerprint mould group 10 and first substrate 224, and down polaroid 230 is set to backlight mould
Between block 24 and the second substrate 228.Upper polaroid 222 can be such that polarization direction passes through along the light of first direction, and lower polarisation
Piece 230 can be such that polarization direction passes through along the light of the second direction vertical with first direction.
Specifically, backlight module 24 can be sent out simultaneously by white light emitting diode 241 and infrared light emitting diodes 242
Penetrate uniform white visible light 40 and uniform infrared light 50.Uniform infrared light is irradiated to the fingerprint in fingerprint mould group 10 upwards
When on identification means 14, all fingerprint recognition components 14 generate the identical electric current of size, and electric current at this time is benchmark electric current
(baseline), the reference current of the record of fingerprint chip 16 at this time.When there is finger touch on cover board 28, fingerprint lines is to infrared
The reflected intensity of light is different, causes the intensity on the Infrared irradiation to different fingerprint recognition components 14 of reflection different,
Electric current at this time is induced current (rawdata), the induced current of the record of fingerprint chip 16 at this time.The electric current that fingerprint generates is equal to
The difference of induced current and reference current.The difference of induced current and reference current is converted into fingerprint image by fingerprint chip 16.
Referring to Fig. 3, according to the structural schematic diagram of the display equipment of another embodiment of this announcement.
As indicated at 3, the display equipment 30 of this revealed embodiment includes successively the fingerprint mould group 10 of stacking, display panel 32
And backlight module 34.The specific structure of fingerprint mould group 10 and to make flowing mode as described in Figure 1, is not repeated to describe herein.
Specifically, display equipment 30 further includes the first light guide plate 35 and infrared light emitting diodes 36, the first light guide plate 35
It being set between display panel 32 and fingerprint mould group 10, infrared light emitting diodes 36 are set to the side of the first light guide plate 35,
Backlight module 34 includes white light emitting diode 342.
Specifically, backlight module 34 includes the second light guide plate 344, and white light emitting diode 342 is set to the second light guide plate
344 side.
Specifically, display equipment 30 further includes the first optical adhesive layer 37, the second optical cement 38 and cover board 39.First optical cement
Layer 37 is arranged between fingerprint mould group 10 and display panel 32.First optical adhesive layer 37 is to cohere fingerprint mould group 10 and display panel
32, it is stably fixed to fingerprint mould group 10 on display panel 32.Cover board 39 is set in fingerprint mould group 10, to protect fingerprint
Mould group 10.Second optical adhesive layer 38 is set between cover board 39 and fingerprint mould group 10.Second optical adhesive layer 38 is to cohere cover board
39 with fingerprint mould group 10, be stably fixed to cover board 39 in fingerprint mould group 10, to protect fingerprint mould group 10.
Specifically, the first optical adhesive layer 37 and the second optical adhesive layer 38 are, for example, optical clear adhesive (Optically
Clear Adhesive,OCA)。
Specifically, display panel 32 includes the successively upper polaroid 322 of stacking, shielded layer 323, first substrate 324, liquid crystal
Layer 326, the second substrate 328 and down polaroid 330.First substrate 324 is oppositely arranged with the second substrate 328.Liquid crystal layer 326 presss from both sides
Between first substrate 324 and the second substrate 328.In the present embodiment, first substrate 324 be include filter layer 325
Colored filter (color filter, CF) substrate, the second substrate 328 be thin film transistor (TFT) (thin film transistor,
TFT) substrate.First light guide plate 35 is set between upper polaroid 322 and fingerprint mould group 10.Upper polaroid 322 is set to fingerprint
Between mould group 10 and first substrate 324, down polaroid 330 is set between backlight module 24 and the second substrate 328.Upper polaroid
322 can be such that polarization direction passes through along the light of first direction, and down polaroid 330 can make polarization direction edge and first direction
The light of vertical second direction passes through.
Specifically, wherein the white light emitting diode 342 of backlight module 34 emits uniform white visible light 40.Upper inclined
The first light guide plate 35 between mating plate 322 and fingerprint mould group 10 by the point light source of infrared light emitting diodes 36 be converted into uniformly to
The area source of upper irradiation.When uniform infrared light 50 is irradiated to upwards on the fingerprint recognition component 14 in fingerprint mould group 10, own
Fingerprint recognition component 14 generate the identical electric current of size, electric current at this time is benchmark electric current (baseline), fingerprint chip
The reference current of 16 records at this time.When there is finger touch on cover board 39, fingerprint lines is different to the reflected intensity of infrared light,
Cause the intensity on the Infrared irradiation to different fingerprint recognition components 14 of reflection different, electric current at this time is induced current
(rawdata), the induced current of the record of fingerprint chip 16 at this time.The electric current that fingerprint generates is equal to induced current and reference current
Difference.The difference of induced current and reference current is converted into fingerprint image by fingerprint chip 16.
In conclusion due to fingerprint mould group and display equipment in this revealed embodiment, it can be by being set to substrate
Cog region in fingerprint recognition component and the fingerprint chip that is set in the non-identifying area of substrate, increase fingerprint recognition face
Product realizes full screen fingerprint recognition.In addition, the frame of display equipment can also be effectively reduced, be conducive to show that equipment lifting screen accounts for
Than being conducive to full screen and designing.
Although this announcement, those skilled in the art have shown and described relative to one or more implementations
It will be appreciated that equivalent variations and modification based on the reading and understanding to the specification and drawings.This announcement includes all such repairs
Change and modification, and is limited only by the scope of the following claims.In particular, to various functions executed by the above components, use
It is intended to correspond in the term for describing such component and executes the specified function of the component (such as it is functionally of equal value
) random component (unless otherwise instructed), even if in structure with execute the exemplary of this specification shown in this article and realize
The open structure of function in mode is not equivalent.In addition, although the special characteristic of this specification is relative to several realization sides
Only one in formula is disclosed, but this feature can with such as can be for a given or particular application expectation and it is advantageous
One or more other features combinations of other implementations.Moreover, with regard to term " includes ", " having ", " containing " or its deformation
For being used in specific embodiments or claims, such term is intended to wrap in a manner similar to the term " comprising "
It includes.
The above is only the preferred embodiments of this announcement, it is noted that for those of ordinary skill in the art, is not departing from
Under the premise of this announcement principle, several improvements and modifications can also be made, these improvements and modifications also should be regarded as the guarantor of this announcement
Protect range.
Claims (10)
1. a kind of fingerprint mould group, which is characterized in that the fingerprint mould group includes:
Substrate has the cog region of fingerprint for identification and the non-identifying area positioned at the periphery of the cog region；
Multiple fingerprint recognition components, are set in the cog region of the substrate；
Fingerprint chip is set in the non-identifying area of the substrate；And
Multiple metal wires, each fingerprint recognition component are electrically connected to the fingerprint chip by corresponding metal wire.
2. fingerprint mould group according to claim 1, which is characterized in that the material of the fingerprint recognition component includes vulcanization
Lead, indium antimonide, Ge-doped gold, Ge-doped mercury, lead tin telluride or mercury cadmium telluride.
3. fingerprint mould group described in any one of -2 according to claim 1, which is characterized in that the fingerprint recognition component is in matrix
Arrangement.
4. a kind of display equipment, comprising:
Successively fingerprint mould group, display panel and the backlight module of stacking, which is characterized in that the fingerprint mould group includes:
Substrate has the cog region of fingerprint for identification and the non-identifying area positioned at the periphery of the cog region；
Multiple fingerprint recognition components, are set in the cog region of the substrate；
Fingerprint chip is set in the non-identifying area of the substrate；And
Multiple metal wires, each fingerprint recognition component are electrically connected to the fingerprint chip by corresponding metal wire.
5. display equipment according to claim 4, which is characterized in that the material of the fingerprint recognition component includes vulcanization
Lead, indium antimonide, Ge-doped gold, Ge-doped mercury, lead tin telluride or mercury cadmium telluride.
6. the display equipment according to any one of claim 4-5, which is characterized in that the fingerprint recognition component is in matrix
Arrangement.
7. display equipment according to claim 4, which is characterized in that the backlight module includes light guide plate, white-light emitting
Diode and infrared light emitting diodes, the white light emitting diode and the infrared light emitting diodes are set to described lead
The side of tabula rasa.
8. display equipment according to claim 4, which is characterized in that further include the first light guide plate and infrared light light-emitting diodes
Pipe, first light guide plate are set between the display panel and the fingerprint mould group, and the infrared light emitting diodes are set
It is placed in the side of first light guide plate, the backlight module includes white light emitting diode and the second light guide plate, the white light
Light emitting diode is set to the side of second light guide plate.
9. display equipment according to claim 4, which is characterized in that further include the first optical adhesive layer, cover board and the second light
Glue-line is learned, first optical adhesive layer is arranged between the fingerprint mould group and the display panel, and the cover board is set to described
In fingerprint mould group and second optical adhesive layer is set between the cover board and the fingerprint mould group.
10. display equipment according to claim 4, which is characterized in that the display panel includes the upper inclined of successively stacking
Mating plate, first substrate, liquid crystal layer, the second substrate and down polaroid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821398745.8U CN208737489U (en) | 2018-08-28 | 2018-08-28 | Fingerprint mould group and display equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821398745.8U CN208737489U (en) | 2018-08-28 | 2018-08-28 | Fingerprint mould group and display equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208737489U true CN208737489U (en) | 2019-04-12 |
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ID=66031647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821398745.8U Active CN208737489U (en) | 2018-08-28 | 2018-08-28 | Fingerprint mould group and display equipment |
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| CN (1) | CN208737489U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108846391A (en) * | 2018-08-28 | 2018-11-20 | 武汉华星光电技术有限公司 | Fingerprint mould group and display equipment |
-
2018
- 2018-08-28 CN CN201821398745.8U patent/CN208737489U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108846391A (en) * | 2018-08-28 | 2018-11-20 | 武汉华星光电技术有限公司 | Fingerprint mould group and display equipment |
| WO2020042394A1 (en) * | 2018-08-28 | 2020-03-05 | 武汉华星光电技术有限公司 | Fingerprint module and display device |
| CN108846391B (en) * | 2018-08-28 | 2023-12-05 | 武汉华星光电技术有限公司 | Fingerprint module and display device |
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