CN208736606U - Band damping pressure sensor - Google Patents

Band damping pressure sensor Download PDF

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Publication number
CN208736606U
CN208736606U CN201821620531.0U CN201821620531U CN208736606U CN 208736606 U CN208736606 U CN 208736606U CN 201821620531 U CN201821620531 U CN 201821620531U CN 208736606 U CN208736606 U CN 208736606U
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China
Prior art keywords
pressure
joint
injection molding
hole
pilot
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Application number
CN201821620531.0U
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Chinese (zh)
Inventor
张胜武
姚勤斌
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CHANGZHOU MATCH-WELL PRESSURE CONTROL TECHNOLOGY Co Ltd
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CHANGZHOU MATCH-WELL PRESSURE CONTROL TECHNOLOGY Co Ltd
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Priority to CN201821620531.0U priority Critical patent/CN208736606U/en
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Abstract

The utility model discloses a kind of band damping pressure sensors, including shell and injection molding joint, the injection molding joint grafting is in the shell, the upper of the injection molding joint intracavitary is provided with contact pin, it is intracavitary under the injection molding joint to be provided with modular pressure, the contact pin is connected by FPC line with modular pressure, the cavity of resorption bottom of the injection molding joint is provided with pressure guiding joint, the top of the pressure guiding joint is connected to the cavity of resorption bottom of injection molding joint, the through-hole penetrated through at the top and bottom of it is provided in the pressure guiding joint, the bottom of the shell is provided with connecting hole, pilot copper pipe is provided in the connecting hole, the pilot copper pipe is connected to the bottom of pressure guiding joint, the pilot copper pipe is along it axially through there is impulse through-hole, close to one end of connecting hole, riveting has damper in the impulse through-hole.The utility model provides a kind of band damping pressure sensor, it can protect the modular pressure in pressure sensor and is not impacted and damaged by instantaneous pressure.

Description

Band damping pressure sensor
Technical field
The utility model relates to a kind of band damping pressure sensors, belong to pressure sensor technique field.
Background technique
Currently, pressure acts directly on the front surface of modular pressure by conduit in erosion-resisting ceramic pressure sensor, Modular pressure Ceramics diaphragm, pressure make ceramic diaphragm generate small deformation, and thick-film resistor is printed on the back of ceramic diaphragm Face connects into a Wheatstone bridge (closing bridge), due to the piezoresistive effect of varistor, makes electric bridge generation one and pressure at just The highly linear of ratio, to driving voltage also directly proportional voltage signal.
But when over-voltage or liquid hit phenomenon occurs in air conditioning pressure system, the instantaneous pressure of generation will lead to modular pressure Damage.
Summary of the invention
Technical problem to be solved in the utility model is to overcome the deficiencies of existing technologies, and provides a kind of band damping pressure Sensor, it can protect the modular pressure in pressure sensor and is not impacted and damaged by instantaneous pressure.
In order to solve the above-mentioned technical problem, the technical solution of the utility model is:
A kind of band damping pressure sensor, including shell and injection molding joint, the injection molding joint grafting are in the shell, described Injection molding joint it is upper it is intracavitary be provided with contact pin, intracavitary under the injection molding joint to be provided with modular pressure, the contact pin passes through FPC Line is connected with modular pressure, and the cavity of resorption bottom of the injection molding joint is provided with pressure guiding joint, the top of the pressure guiding joint and note The cavity of resorption bottom connection of connector is moulded, is provided with the through-hole penetrated through at the top and bottom of it, the bottom of the shell in the pressure guiding joint Portion is provided with connecting hole, pilot copper pipe is provided in the connecting hole, the pilot copper pipe is connected to the bottom of pressure guiding joint, described For pilot copper pipe along it axially through there is impulse through-hole, riveting in the impulse through-hole close to one end of connecting hole has damper.
Further, the damper is particle pulse damper, if being formed between the particle that the damper is included Dry miniature duct.
Using above-mentioned technical proposal, damper is riveted on inside pilot copper pipe by the utility model, when air conditioning pressure system When over-voltage or liquid hit phenomenon occurs in system, plays the role of buffering, the modular pressure in pressure sensor is protected not pressed by moment Power is impacted and is damaged, and the utility model uses copper pipe welded structure, easy to use, flexible for installation, solid without special installation Determine mode.
Detailed description of the invention
Fig. 1 is the schematic cross-sectional view with damping pressure sensor of the utility model.
Specific embodiment
In order to make the content of the utility model be easier to be clearly understood, below according to specific embodiment and combine attached Figure, is described in further detail the utility model.
As shown in Figure 1, a kind of band damping pressure sensor, including shell 9 and injection molding joint 1,1 grafting of injection molding joint In shell 9, the injection molding joint 1 it is upper it is intracavitary be provided with contact pin 2, it is intracavitary under the injection molding joint 1 to be provided with pressure mould Block 4, the contact pin 2 are connected by FPC line 3 with modular pressure 4, and the cavity of resorption bottom of the injection molding joint 1 is provided with pressure guiding joint, The top of the pressure guiding joint is connected to the cavity of resorption bottom of injection molding joint 1, be provided in the pressure guiding joint perforation its top and The through-hole of bottom is provided with seal washer 8 at the top and bottom of the pressure guiding joint, and the periphery of the pressure guiding joint side wall is set It is equipped with O-ring gasket 5, the bottom of the shell 9 is provided with connecting hole, and pilot copper pipe 10, the pilot are welded in the connecting hole Copper pipe 10 is connected to the bottom of pressure guiding joint, and the pilot copper pipe 10 is along it axially through having impulse through-hole, the impulse through-hole One end riveting of interior close connecting hole has damper 6, and the pressure of air conditioning pressure system is by pilot copper pipe 10 using damper 6 Buffering, act on the front surface of modular pressure 4.
As shown in Figure 1, the damper 6 is particle pulse damper, formed between the particle that the damper 6 is included There are several miniature ducts, the miniature duct can make the pressure of air conditioning pressure system is smooth to pass through, not influence the biography of pressure It passs.
Particular embodiments described above, to the utility model solve the technical issues of, technical scheme and beneficial effects into It has gone further description, it should be understood that the foregoing is merely specific embodiment of the utility model, and has not had to In limitation the utility model, within the spirit and principle of the utility model, any modification, equivalent substitution and improvement done Deng should be included within the scope of protection of this utility model.

Claims (2)

1. a kind of band damping pressure sensor, including shell (9) and injection molding joint (1), the injection molding joint (1) are plugged on shell (9) in, the injection molding joint (1) it is upper it is intracavitary be provided with contact pin (2), it is intracavitary under the injection molding joint (1) to be provided with pressure Module (4), the contact pin (2) are connected by FPC line (3) with modular pressure (4), and the cavity of resorption bottom of the injection molding joint (1) is set It is equipped with pressure guiding joint, the top of the pressure guiding joint is connected to the cavity of resorption bottom of injection molding joint (1), setting in the pressure guiding joint There is through-hole of the perforation at the top and bottom of it, it is characterised in that: the bottom of the shell (9) is provided with connecting hole, in the connecting hole It is provided with pilot copper pipe (10), the pilot copper pipe (10) is connected to the bottom of pressure guiding joint, and the pilot copper pipe (10) is along it Axially through there is impulse through-hole, riveting in the impulse through-hole close to one end of connecting hole has damper (6).
2. band damping pressure sensor according to claim 1, it is characterised in that: the damper (6) is particle pulse Damper is formed with several miniature ducts between the particle that the damper (6) is included.
CN201821620531.0U 2018-09-30 2018-09-30 Band damping pressure sensor Active CN208736606U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821620531.0U CN208736606U (en) 2018-09-30 2018-09-30 Band damping pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821620531.0U CN208736606U (en) 2018-09-30 2018-09-30 Band damping pressure sensor

Publications (1)

Publication Number Publication Date
CN208736606U true CN208736606U (en) 2019-04-12

Family

ID=66035042

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821620531.0U Active CN208736606U (en) 2018-09-30 2018-09-30 Band damping pressure sensor

Country Status (1)

Country Link
CN (1) CN208736606U (en)

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