CN208721955U - A kind of backlight module and liquid crystal display panel - Google Patents
A kind of backlight module and liquid crystal display panel Download PDFInfo
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- CN208721955U CN208721955U CN201821542187.8U CN201821542187U CN208721955U CN 208721955 U CN208721955 U CN 208721955U CN 201821542187 U CN201821542187 U CN 201821542187U CN 208721955 U CN208721955 U CN 208721955U
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Abstract
The utility model discloses a kind of backlight module and liquid crystal display panels.The backlight module includes circuit board and at least one back light, the back light is set on the circuit board, and the back light and the circuit board electrical connection, the circuit board drives the back light to shine, further include: at least one Peltier refrigeration unit, the Peltier refrigeration unit is integrated in the circuit board, and the Peltier refrigeration unit is arranged in a one-to-one correspondence with the back light, and the Peltier refrigeration unit includes at least one cold terminal electrodes；The cold terminal electrodes are set between the back light and the circuit board.Backlight module provided by the utility model reduces back light temperature using the effect of cold end refrigeration, solves the problems, such as that the back light bad temperature that radiates is excessively high by the way that the cold terminal electrodes in Peltier refrigeration unit are set between back light and circuit board.
Description
Technical field
The utility model embodiment is related to field of display technology more particularly to a kind of backlight module and liquid crystal display panel.
Background technique
With the development of science and technology, the volume of display is more and more frivolous, the planes such as liquid crystal display, electroluminescent display
Display becomes mainstream gradually, wherein liquid crystal display is due to low operating voltage, radiationless line, light-weight and volume
The advantages that small, has been increasingly becoming the mainstream in market.Display module in liquid crystal display device structure itself does not shine, it is therefore desirable to
Light source is provided using backlight module.
In above-mentioned backlight module, according to the position of light source, can be divided into two major classes: one is sidelight type backlight module,
Another kind of is down straight aphototropism mode set.The light source of sidelight type backlight module is set to the edge of backlight module, what light source was issued
Light is absorbed after entering light guide plate, is spread again by site, then uniform after the optical diaphragms such as diffuser plate and reflector plate again
Ground is irradiated in the display module of liquid crystal display.The light source of down straight aphototropism mode set is set to the bottom surface of backlight module, light source
The light issued via being equably irradiated in the display module of liquid crystal display panel after the optical diaphragms such as reflector plate and diffuser plate,
Light guide plate, therefore smooth conductibility with higher are had no, and can be applied to the liquid crystal display of larger size.
At this stage as people are higher and higher to display product brightness requirement, in order to promote brightness, the back of liquid crystal display
The scheme of plurality of LEDs or great power LED is used in optical mode group.And since the light efficiency of LED is lower, when work, can generate a large amount of
Heat, accordingly, it is possible to the problem for causing the heat dissipation such as light guide plate melting, optical diaphragm heated bending bad.
Utility model content
The utility model provides a kind of backlight module and liquid crystal display panel prolongs to improve backlight module heat dissipation performance
The service life of long liquid crystal display panel.
In a first aspect, the utility model embodiment provides a kind of backlight module, including circuit board and at least one backlight
Light source, the back light are set on the circuit board, and the back light and the circuit board electrical connection, the electricity
Road plate drives the back light to shine, further includes:
At least one Peltier refrigeration unit, the Peltier refrigeration unit is integrated in the circuit board, and the pa
You are arranged in a one-to-one correspondence patch refrigeration unit with the back light, and the Peltier refrigeration unit includes at least one cold end electricity
Pole；
The cold terminal electrodes are set between the back light and the circuit board.
Further, the Peltier refrigeration unit further include: at least one hotter side electrode, at least one n-type semiconductor,
At least one p-type semiconductor and a Power Supply Assembly；
Each cold terminal electrodes, each hotter side electrode, each n-type semiconductor and each p-type semiconductor are according to N-shaped
Semiconductor, cold terminal electrodes, p-type semiconductor, hotter side electrode, n-type semiconductor ... sequence be sequentially connected electrically, the power supply group
Part is electrically connected with the cold terminal electrodes and the hotter side electrode, forms connected loop.
Further, the circuit board further includes circuit board main body, and the circuit board body includes parallel to each other first
Surface and second surface；
Each n-type semiconductor and each p-type semiconductor include the first end and second end being oppositely arranged；
At least one described n-type semiconductor and at least one described p-type semiconductor are alternately arranged to form half along first direction
Conductor queue, the semiconductor queue are integrated in the circuit board body, and the first surface is by each n-type semiconductor
First end and the first end of each p-type semiconductor expose, the second surface by the second end of each n-type semiconductor and
The second end of each p-type semiconductor is exposed；
The cold terminal electrodes are set on the first surface, and connect the first end for being disposed adjacent the n-type semiconductor
With the first end of the p-type semiconductor；
The hotter side electrode is set on the second surface, and connects the second end for being disposed adjacent the n-type semiconductor
With the second end of the p-type semiconductor.
Further, the Power Supply Assembly includes anode and cathode；
The head of the queue of the semiconductor queue is the n-type semiconductor, and tail of the queue is the p-type semiconductor；
The anode be located at the corresponding hotter side electrode electrical connection of the n-type semiconductor of head of the queue, the cathode be located at
The corresponding hotter side electrode electrical connection of the p-type semiconductor of tail of the queue；Alternatively,
The head of the queue of the semiconductor queue is the p-type semiconductor, and tail of the queue is the n-type semiconductor；
The anode be located at the corresponding cold terminal electrodes electrical connection of the p-type semiconductor of head of the queue, the cathode be located at
The corresponding cold terminal electrodes electrical connection of the n-type semiconductor of tail of the queue.
Further, the Power Supply Assembly includes anode and cathode；
The head of the queue and tail of the queue of the semiconductor queue are the n-type semiconductor；
The anode be located at the corresponding hotter side electrode electrical connection of the n-type semiconductor of head of the queue, the cathode be located at
The corresponding cold terminal electrodes electrical connection of the n-type semiconductor of tail of the queue.
Further, the Power Supply Assembly includes anode and cathode；
The head of the queue and tail of the queue of the semiconductor queue are the p-type semiconductor；
The anode be located at the corresponding cold terminal electrodes electrical connection of the p-type semiconductor of head of the queue, the cathode be located at
The corresponding hotter side electrode electrical connection of the p-type semiconductor of tail of the queue.
Further, the material of the cold terminal electrodes and the hotter side electrode is metal.
It further, further include backboard；
The backboard is set to the side that the circuit board deviates from the back light, and the hotter side electrode is embedded in described
In backboard.
Further, the back veneer material is aluminium or stainless steel.
Second aspect, the utility model embodiment additionally provide a kind of liquid crystal display panel, including as first aspect is any
Backlight module described in further includes array substrate, liquid crystal layer and color membrane substrates positioned at the backlight module light emission side.
The utility model embodiment in the circuit board of backlight module by integrating Peltier refrigeration unit, by by Paar
Cold terminal electrodes in patch refrigeration unit are set between back light and circuit board, reduce backlight light using the effect of cold end refrigeration
Source temperature, solve existing display panel because back light radiate it is bad, temperature it is excessively high caused by light guide plate melting, optical film
Even if the problem of piece heated bending etc. will not be due to realize high brightness liquid crystal display panel using excessive back light
Heat dissipation is uneven and causes backlight module temperature too high, and each component avoided in backlight module is deformed because temperature is too high,
Ensure liquid crystal display panel product yield with higher and longer service life.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram for backlight module that the utility model embodiment one provides；
Fig. 2 is sectional structure chart of the backlight module shown in Fig. 1 along AA '；
Fig. 3 is the concrete structure schematic diagram of backlight module shown in FIG. 1；
Fig. 4 is a kind of structural schematic diagram for backlight module that the utility model embodiment two provides；
Fig. 5 is a kind of structural schematic diagram for backlight module that the utility model embodiment three provides；
Fig. 6 is a kind of structural schematic diagram for backlight module that the utility model embodiment four provides；
Fig. 7 is a kind of structural schematic diagram for liquid crystal display panel that the utility model embodiment five provides.
11- circuit board, 111- circuit board main body, the first surface of 1111- circuit board body, 1112- circuit board body
Second surface, 12- back light, 13- Peltier refrigeration unit, 131- cold terminal electrodes, 132- hotter side electrode, 133-n type are partly led
Body, 134-p type semiconductor, 135- Power Supply Assembly, 14- backboard, 21- backlight module, 22- array substrate, 23- liquid crystal layer, 24- are color
Ilm substrate, 100- first direction.
Specific embodiment
Further to illustrate that the utility model is the technical means and efficacy reaching predetermined purpose of utility model and being taken,
Below in conjunction with attached drawing and preferred embodiment, to according to the utility model proposes a kind of backlight module and liquid crystal display panel tool
Body embodiment, structure, feature and its effect, detailed description is as follows.
Embodiment one
Fig. 1 is a kind of structural schematic diagram for backlight module that the utility model embodiment one provides, and Fig. 2 is back shown in Fig. 1
Optical mode group is along the sectional structure chart of AA ', and with reference to Fig. 1 and Fig. 2, which includes circuit board 11 and at least one back light
12, back light 12 is set on circuit board 11, and back light 12 is electrically connected (not shown), circuit with circuit board 11
Plate 11 drives back light 12 to shine, backlight module further include: at least one Peltier refrigeration unit 13, Peltier refrigeration unit
13 are integrated in circuit board 11, and Peltier refrigeration unit 13 is arranged in a one-to-one correspondence with back light 12, Peltier refrigeration unit
13 include at least one cold terminal electrodes 131, and cold terminal electrodes 131 are set between back light 12 and circuit board 11.
Wherein, Peltier refrigeration unit 13 ought be made up of electric current different conductors using paltie effect
When circuit, in addition to generating irreversible Joule heat, in the joint of different conductor as the difference of current direction can occur respectively
Heat absorption, exothermic phenomenon.Wherein heat absorbing end may be defined as cold end, and release end of heat may be defined as hot end, your effect of pa note realizes cold
The heat at end is transferred to hot end, has achieved the effect that cold junction temperature reduction, that is, has realized refrigeration.
The backlight module that the utility model embodiment one provides, by integrating Peltier system in the circuit board of backlight module
Cold terminal electrodes in Peltier refrigeration unit are set between back light and circuit board by cold unit, utilize cold end refrigeration
Effect reduces back light temperature, solves existing display panel because back light heat dissipation is bad, temperature is excessively high to cause leaded light
The problems such as plate melting, optical diaphragm heated bending, even if realize high brightness liquid crystal display panel using excessive back light,
Backlight module temperature will not be caused too high since heat dissipation is uneven, avoid each component in backlight module due to temperature is too high
It is deformed, it is ensured that liquid crystal display panel product yield with higher and longer service life.
It should be noted that the backlight module that the utility model embodiment one provides is down straight aphototropism mode set, the backlight
Multiple back lights 12 in mould group are set on the circuit board 11 of planar, this is only the specific example of the application, rather than
Limitation to the application.In actual setting, the structure that backlight module can also be arranged is side entering type structure, wherein backlight mould
Group further includes light guide plate and reflector plate, and the side of light guide plate or opposite two sides are provided with multiple back lights, and back light is set
It is placed on the circuit board of strip, and corresponding each back light, a Peltier refrigeration unit, backlight is integrated in circuit board
The light of light source outgoing provides uniform backlight by light guide plate and reflector plate for liquid crystal display die set.Back light 12 is optional
Select LED chip.
There are many specific design schemes of Peltier refrigeration unit.Fig. 3 is that the specific structure of backlight module shown in FIG. 1 shows
It is intended to, with reference to Fig. 1 and Fig. 3, Peltier refrigeration unit 13 further include: at least one hotter side electrode 132, at least one N-shaped are partly led
Body 133, at least one p-type semiconductor 134 and a Power Supply Assembly 135；Each cold terminal electrodes 131, each hotter side electrode 132, each N-shaped
Semiconductor 133 and each p-type semiconductor 134 are partly led according to n-type semiconductor, cold terminal electrodes, p-type semiconductor, hotter side electrode, N-shaped
Body ... sequence be sequentially connected electrically, Power Supply Assembly 135 is electrically connected with cold terminal electrodes 131 and/or hotter side electrode 132, formed connect
Logical circuit.
With continued reference to Fig. 3, optionally, circuit board includes circuit board main body 111, and circuit board body 111 includes parallel to each other
First surface 1111 and second surface 1112；Each n-type semiconductor 133 and each p-type semiconductor 134 include the be oppositely arranged
One end and second end；At least one n-type semiconductor 133 and at least one p-type semiconductor 134 are alternately arranged along first direction 100
Semiconductor queue is formed, semiconductor queue is integrated in circuit board body 111, and first surface 1111 is by each n-type semiconductor
The first end of first end and each p-type semiconductor is exposed, and second surface 1112 is by the second end of each n-type semiconductor 133 and each p-type half
The second end of conductor 134 is exposed；Cold terminal electrodes 131 are set on first surface 1111, and connect the n-type semiconductor being disposed adjacent
133 first end and the first end of p-type semiconductor 134；Hotter side electrode 132 is set on second surface 1112, and is connected adjacent
The second end of the n-type semiconductor 133 of setting and the second end of p-type semiconductor.
Alternately arranged queue form is set by n-type semiconductor 133 and p-type semiconductor 134, circuit can be efficiently used
The inner space of plate main body 111 facilitates the heat dissipation effect for increasing backlight module to increase the number of cold terminal electrodes.
Optionally, the material of cold terminal electrodes and hotter side electrode is metal.Cold terminal electrodes and hotter side electrode use heat dissipation performance
Preferable metal is electrode, can effectively transmit heat, improve the refrigeration effect of back light, it helps hotter side electrode dissipates
Heat avoids hotter side electrode temperature excessively high, and the bad problem such as optical diaphragm deformation in backlight module is caused to occur.With continued reference to Fig. 3,
Further, also settable backboard 14 in backlight module；Backboard 14 is set to the side that circuit board 11 deviates from back light 12, heat
Termination electrode 132 is embedded in backboard 14.Optionally, back veneer material is aluminium or stainless steel.By using the backboard of aluminium and stainless steel,
The heat for the hotter side electrode 132 being embedded in backboard 14 can be effectively spread, auxiliary hotter side electrode 132 radiates.In addition to this, it carries on the back
Plate 14 can also play the role of supporting backlight module.
Further, the connection type of Power Supply Assembly and semiconductor can be designed according to actual circuit board, such as Fig. 3 institute
Show, Power Supply Assembly 135 includes anode and cathode；The head of the queue of semiconductor queue is n-type semiconductor 133, and tail of the queue is p-type semiconductor
134；Anode hotter side electrode 132 corresponding with the n-type semiconductor 133 of head of the queue is located at is electrically connected, cathode and the p-type half for being located at tail of the queue
The electrical connection of the corresponding hotter side electrode 132 of conductor 134；That is two hotter side electrodes 132 of Power Supply Assembly 135 and semiconductor queue both ends
Electrical connection constitutes connected loop, is freezed by paltie effect.
Operating temperature when the present embodiment also works normally back light has carried out numerical value calculating, is with operating current
For the LED chip of 40mA, LED chip power PLED=0.18W, in actual work, chip pin can be due to thermal resistances itself
Generating heat causes pin temperature to rise, and actual measurement can obtain chip in normal work, the temperature T of chip pinPinFor
66.33 DEG C, in addition to pin, the thermal resistance of PN junction to solder joint in chip will lead to the raising of chip self-temperature, Rjc=25 DEG C/W, because
This, according to formula TJ=Rjc×PLED+TPin, the temperature T of LEDJThen be 70.83 DEG C, it is clear that LED chip at work, temperature
It can sharply increase.
By backlight module include 21 operating currents for the LED chip of 40mA for, then according to formula QBackboard=PLED×ηBackboard
×ηLED× N, wherein ηBackboardFor the thermal conductivity of backboard, ηLEDFor the thermal conductivity of LED chip, N is LED chip number, can by calculating
Obtain QBackboardFor 0.6615KJ, and then by formula Δ t=QBackboard/ η hA, wherein h is convection coefficient, and h=10, A are backlight module
Area, η be backboard thermal conductivity, be calculated backboard caused by LED rising temperature Δ t be 17.64 DEG C, then by Ts=
Ta+ Δ t, wherein TaIt is 25 DEG C of room temperature, backboard temperature T can be obtainedsIt is 42.64 DEG C, that is, includes the backlight of the LED chip of 21 40mA
When mould group works normally, backboard temperature is up to 42.64 DEG C.
Operating current when the utility model embodiment also effectively freezes to Peltier refrigeration unit to LED chip carries out
Detailed calculating, for LED chip being freezed to 25 DEG C of room temperature, LED chip need to discharge heat W=c × m × (TJ-T25℃),
Wherein thus ceramic C=750J/kg DEG C of specific heat capacity, LED core tablet quality m=0.0003kg can be calculated, and discharge heat W=
9.30J.Therefore the refrigerating capacity Q of Peltier refrigeration unitp=W=9.30J, by formula QP=αp·TIt is coldI can calculate Peltier system
The operating current of cold unit, wherein Peltier refrigeration unit uses bismuth tellurium semiconductor, thermoelectromotive force αp=20V/K, pa
You are patch refrigeration unit cold junction temperature TIt is cold=25 DEG C, operating current I=18.6mA can be calculated as a result,.I.e. by can be calculated,
If the cold junction temperature that Peltier refrigeration unit is arranged is 25 DEG C, 9.30J refrigerating capacity can be realized when operating current I is 18.6mA,
By the T of LEDJTemperature is down to 25 DEG C.
Embodiment two
Fig. 4 is a kind of structural schematic diagram for backlight module that the utility model embodiment two provides, compared with embodiment one,
In the present embodiment, Power Supply Assembly is different from the connection type of semiconductor.Specifically, with reference to Fig. 4, the circuit board 11 of the backlight module
It is internally provided with semiconductor queue, the head of the queue of the semiconductor queue is p-type semiconductor 134, and tail of the queue is n-type semiconductor；Power supply group
The anode of part 135 cold terminal electrodes 131 corresponding with the p-type semiconductor 134 of head of the queue is located at are electrically connected, the cathode of Power Supply Assembly 135
Cold terminal electrodes 131 corresponding with the n-type semiconductor 133 of tail of the queue is located at are electrically connected.
The backlight module that the utility model embodiment two provides, by integrating Peltier system in the circuit board of backlight module
Cold unit utilizes cold end system by the way that the cold terminal electrodes in Peltier refrigeration unit are set between back light and circuit board
Cold effect reduces back light temperature, solves existing display panel because back light heat dissipation is bad, temperature is excessively high to be caused
Light guide plate melting, optical diaphragm heated bending the problems such as, even if realizing high brightness liquid crystal display panel using excessive backlight
When light source, backlight module temperature will not be caused too high since heat dissipation is uneven, avoid each component in backlight module because of temperature
Du Taigao and be deformed, it is ensured that liquid crystal display panel product yield with higher and longer service life.
Embodiment three
Fig. 5 is a kind of structural schematic diagram for backlight module that the utility model embodiment three provides, compared with embodiment one,
In the present embodiment, Power Supply Assembly is different from the connection type of semiconductor.Specifically, with reference to Fig. 5, the circuit board 11 of the backlight module
It is internally provided with semiconductor queue, the head of the queue and tail of the queue of the semiconductor queue are n-type semiconductor 133；Power Supply Assembly 135 is just
Pole is electrically connected with the corresponding hotter side electrode 132 of the n-type semiconductor 133 of head of the queue is located at, the cathode of Power Supply Assembly 135 be located at tail of the queue
The corresponding cold terminal electrodes 131 of n-type semiconductor be electrically connected.
The backlight module that the utility model embodiment three provides, by integrating Peltier system in the circuit board of backlight module
Cold unit utilizes cold end system by the way that the cold terminal electrodes in Peltier refrigeration unit are set between back light and circuit board
Cold effect reduces back light temperature, solves existing display panel because back light heat dissipation is bad, temperature is excessively high to be caused
Light guide plate melting, optical diaphragm heated bending the problems such as, even if realizing high brightness liquid crystal display panel using excessive backlight
When light source, backlight module temperature will not be caused too high since heat dissipation is uneven, avoid each component in backlight module because of temperature
Du Taigao and be deformed, it is ensured that liquid crystal display panel product yield with higher and longer service life.
Example IV
Fig. 6 is a kind of structural schematic diagram for backlight module that the utility model embodiment four provides, compared with embodiment one,
In the present embodiment, Power Supply Assembly is different from the connection type of semiconductor.Specifically, with reference to Fig. 6, the circuit board 11 of the backlight module
It is internally provided with semiconductor queue, the head of the queue and tail of the queue of the semiconductor queue are p-type semiconductor 134；Power Supply Assembly 135 is just
Pole is electrically connected with the corresponding cold terminal electrodes 131 of the p-type semiconductor 133 of head of the queue are located at, the cathode of Power Supply Assembly 135 be located at tail of the queue
The corresponding hotter side electrode 132 of p-type semiconductor be electrically connected.
The backlight module that the utility model embodiment four provides, by integrating Peltier system in the circuit board of backlight module
Cold unit utilizes cold end system by the way that the cold terminal electrodes in Peltier refrigeration unit are set between back light and circuit board
Cold effect reduces back light temperature, solves existing display panel because back light heat dissipation is bad, temperature is excessively high to be caused
Light guide plate melting, optical diaphragm heated bending the problems such as, even if realizing high brightness liquid crystal display panel using excessive backlight
When light source, backlight module temperature will not be caused too high since heat dissipation is uneven, avoid each component in backlight module because of temperature
Du Taigao and be deformed, it is ensured that liquid crystal display panel product yield with higher and longer service life.
Embodiment five
The utility model embodiment five additionally provides a kind of liquid crystal display panel, and Fig. 7 is that the utility model embodiment five mentions
A kind of structural schematic diagram of the liquid crystal display panel supplied, with reference to Fig. 7, which includes such as the utility model embodiment
Any backlight module 21 provided, further includes the display module opposed with backlight module 21.The display module includes array base
Plate 22, liquid crystal layer 23 and color membrane substrates 24.
The liquid crystal display panel that the utility model embodiment five provides, by integrating Paar in the circuit board of backlight module
Refrigeration unit is pasted, by the way that the cold terminal electrodes in Peltier refrigeration unit are set between back light and circuit board, utilization is cold
The effect of end refrigeration reduces back light temperature, solves existing display panel because back light heat dissipation is bad, temperature is excessively high
The problems such as caused light guide plate melting, optical diaphragm heated bending, even if realizing high brightness liquid crystal display panel using excessive
When back light, backlight module temperature will not be caused too high since heat dissipation is uneven, avoid each component in backlight module
It is deformed because temperature is too high, it is ensured that liquid crystal display panel product yield with higher and longer service life.
The above descriptions are merely preferred embodiments of the present invention, not makees in any form to the utility model
Limitation be not intended to limit the utility model although the utility model has been disclosed with preferred embodiment as above, it is any ripe
Professional and technical personnel is known, is not being departed within the scope of technical solutions of the utility model, when in the technology using the disclosure above
Hold the equivalent embodiment made a little change or be modified to equivalent variations, but all without departing from technical solutions of the utility model
Hold, any simple modification, equivalent change and modification made by the above technical examples according to the technical essence of the present invention, still
It is within the scope of the technical solutions of the present invention.
Claims (10)
1. a kind of backlight module, including circuit board and at least one back light, the back light are set to the circuit board
On, and the back light and the circuit board electrical connection, the circuit board drive the back light to shine, and feature exists
In, further includes:
At least one Peltier refrigeration unit, the Peltier refrigeration unit is integrated in the circuit board, and the Peltier
Refrigeration unit is arranged in a one-to-one correspondence with the back light, and the Peltier refrigeration unit includes at least one cold terminal electrodes；
The cold terminal electrodes are set between the back light and the circuit board.
2. backlight module according to claim 1, which is characterized in that the Peltier refrigeration unit further include: at least one
A hotter side electrode, at least one n-type semiconductor, at least one p-type semiconductor and a Power Supply Assembly；
Each cold terminal electrodes, each hotter side electrode, each n-type semiconductor and each p-type semiconductor are partly led according to N-shaped
Body, cold terminal electrodes, p-type semiconductor, hotter side electrode, n-type semiconductor ... sequence be sequentially connected electrically, the Power Supply Assembly with
The cold terminal electrodes and/or hotter side electrode electrical connection, form connected loop.
3. backlight module according to claim 2, which is characterized in that the circuit board further includes circuit board main body, described
Circuit board body includes first surface and second surface parallel to each other；
Each n-type semiconductor and each p-type semiconductor include the first end and second end being oppositely arranged；
At least one described n-type semiconductor and at least one described p-type semiconductor are alternately arranged to form semiconductor along first direction
Queue, the semiconductor queue are integrated in the circuit board body, and the first surface is by the of each n-type semiconductor
The first end of one end and each p-type semiconductor is exposed, and the second surface is by the second end of each n-type semiconductor and each institute
The second end for stating p-type semiconductor is exposed；
The cold terminal electrodes are set on the first surface, and connect the first end of the n-type semiconductor being disposed adjacent and
The first end of the p-type semiconductor；
The hotter side electrode is set on the second surface, and connect the second end of the n-type semiconductor being disposed adjacent and
The second end of the p-type semiconductor.
4. backlight module according to claim 3, it is characterised in that:
The Power Supply Assembly includes anode and cathode；
The head of the queue of the semiconductor queue is the n-type semiconductor, and tail of the queue is the p-type semiconductor；
The anode is electrically connected with the corresponding hotter side electrode of the n-type semiconductor of head of the queue is located at, the cathode with positioned at tail of the queue
The p-type semiconductor corresponding hotter side electrode electrical connection；Alternatively,
The head of the queue of the semiconductor queue is the p-type semiconductor, and tail of the queue is the n-type semiconductor；
The anode is electrically connected with the corresponding cold terminal electrodes of the p-type semiconductor of head of the queue are located at, the cathode with positioned at tail of the queue
The n-type semiconductor corresponding cold terminal electrodes electrical connection.
5. backlight module according to claim 3, it is characterised in that:
The Power Supply Assembly includes anode and cathode；
The head of the queue and tail of the queue of the semiconductor queue are the n-type semiconductor；
The anode is electrically connected with the corresponding hotter side electrode of the n-type semiconductor of head of the queue is located at, the cathode with positioned at tail of the queue
The n-type semiconductor corresponding cold terminal electrodes electrical connection.
6. backlight module according to claim 3, it is characterised in that:
The Power Supply Assembly includes anode and cathode；
The head of the queue and tail of the queue of the semiconductor queue are the p-type semiconductor；
The anode is electrically connected with the corresponding cold terminal electrodes of the p-type semiconductor of head of the queue are located at, the cathode with positioned at tail of the queue
The p-type semiconductor corresponding hotter side electrode electrical connection.
7. backlight module according to claim 2, which is characterized in that the material of the cold terminal electrodes and the hotter side electrode
For metal.
8. backlight module according to claim 7, which is characterized in that further include backboard；
The backboard is set to the side that the circuit board deviates from the back light, and the hotter side electrode is embedded in the backboard
In.
9. backlight module according to claim 8, which is characterized in that the back veneer material is aluminium or stainless steel.
10. a kind of liquid crystal display panel, which is characterized in that including such as described in any item backlight modules of claim 1-9, also wrap
Include array substrate, liquid crystal layer and the color membrane substrates positioned at the backlight module light emission side.
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| CN201821542187.8U CN208721955U (en) | 2018-09-20 | 2018-09-20 | A kind of backlight module and liquid crystal display panel |
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| CN201821542187.8U CN208721955U (en) | 2018-09-20 | 2018-09-20 | A kind of backlight module and liquid crystal display panel |
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| CN112038745A (en) * | 2020-08-17 | 2020-12-04 | 中国人民解放军空军工程大学 | Active phased array radar antenna array surface autonomous heat dissipation device based on Peltier effect |
| CN114442355A (en) * | 2020-10-30 | 2022-05-06 | 北京京东方传感技术有限公司 | Window device and window system |
| US11374156B2 (en) * | 2019-11-15 | 2022-06-28 | Tcl China Star Optoelectronics Technology Co., Ltd. | Backlight module and manufacturing method of same |
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- 2018-09-20 CN CN201821542187.8U patent/CN208721955U/en active Active
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| CN111105713A (en) * | 2019-12-20 | 2020-05-05 | 京东方科技集团股份有限公司 | Foldable display module, display device and heat dissipation method |
| US11257402B2 (en) | 2019-12-20 | 2022-02-22 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Foldable display module, method of manufacturing foldable display module, display apparatus and heat dissipation method |
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Address after: 215301 No. 1, Longteng Road, Kunshan Development Zone, Jiangsu, Suzhou Patentee after: Kunshan Longteng Au Optronics Co Address before: 215301 No. 1, Longteng Road, Kunshan Development Zone, Jiangsu, Suzhou Patentee before: Kunshan Longteng Optronics Co., Ltd. |