CN208718123U - A kind of compound thermal insulation thermal insulation board with honeycomb - Google Patents
A kind of compound thermal insulation thermal insulation board with honeycomb Download PDFInfo
- Publication number
- CN208718123U CN208718123U CN201821101788.5U CN201821101788U CN208718123U CN 208718123 U CN208718123 U CN 208718123U CN 201821101788 U CN201821101788 U CN 201821101788U CN 208718123 U CN208718123 U CN 208718123U
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- thermal insulation
- insulation board
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- honeycomb
- lower layer
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Abstract
The utility model relates to a kind of, and the compound thermal insulation thermal insulation board with honeycomb includes: upper layer thermal insulation board, intermediate air thermal insulation layer, lower layer's thermal insulation board, upper layer thermal insulation board, intermediate air thermal insulation layer, lower layer's thermal insulation board is from top to bottom successively bonded together by sealing strip, thermal insulation board and lower layer's thermal insulation board inside are honeycomb at the middle and upper levels for it, the upper and lower surfaces of upper layer thermal insulation board and lower layer's thermal insulation board all coat and are provided with high reflectivity coating or aluminium foil, the compound thermal insulation thermal insulation board with honeycomb in the application has both light-weight, heat-insulating efficiency is high, a variety of advantages that preparation process is simply readily produced, environment suitable for various heat-insulated demands.
Description
Technical field
The utility model relates to heat-barrier material technical field more particularly to a kind of compound thermal insulation separations with honeycomb
Hot plate.
Background technique
Building energy conservation needs to be thermally shielded the building structure such as roof, wall, door and window, prevents scattering and disappearing to save for heat
Energy consumption, the workshop of such as agricultural silo, industrial placement instrument or machining require to keep constant indoor temperature, these are built
It builds in severe cold, extremely hot season, it is higher to the thermal requirements of building, and it is traditionally used for the guarantor of the alien invasion structure of these buildings
Adiabator is often excessively thick and heavy, causes to build load too high, adversely affect to fabric structure intensity, to overcome above-mentioned lack
Point proposes this technology.
Utility model content
In order to solve the deficiencies in the prior art, the utility model provides a kind of compound insulation with honeycomb
Plate, the compound thermal insulation thermal insulation board can effectively mitigate the weight of heat-barrier material, promote heat-insulating efficiency.
Compound thermal insulation thermal insulation board with honeycomb includes:
Upper layer thermal insulation board, intermediate air thermal insulation layer, lower layer's thermal insulation board,
The upper layer thermal insulation board, the intermediate air thermal insulation layer, lower layer's thermal insulation board by sealing strip from top to bottom according to
It is secondary to be bonded together,
It is wherein honeycomb inside the upper layer thermal insulation board and lower layer's thermal insulation board, the upper layer thermal insulation board and described
The upper and lower surfaces of lower layer's thermal insulation board all coat and are provided with high reflectivity coating or aluminium foil.
Further, the high reflectivity coating or aluminium foil by spraying or binder be bonded in the upper layer thermal insulation board and
The upper and lower surfaces of lower layer's thermal insulation board.
Further, the upper layer thermal insulation board and lower layer's thermal insulation board be selected from glass mat, asbestos board, rock wool board,
One of polyurethane foam plastics plate, Vestolit plate, inorganic silicate material plate.
The utility model has the following beneficial effects:
1) the compound thermal insulation thermal insulation board is light-weight, and preparation process is simple, is readily produced.
2) the compound thermal insulation thermal insulation board thermal resistance is big, and heat-insulating efficiency is high, is applicable to the environment of various heat-insulated demands, has
Wide application prospect.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the compound thermal insulation thermal insulation board with honeycomb.
Specific embodiment
With reference to the compound thermal insulation thermal insulation board shown in FIG. 1 with honeycomb, honeycomb is had in the present embodiment
Compound thermal insulation thermal insulation board include:
Upper layer thermal insulation board 1, intermediate air thermal insulation layer 2, lower layer's thermal insulation board 3,
The upper layer thermal insulation board 1, the intermediate air thermal insulation layer 2, lower layer's thermal insulation board 3 by sealing strip 6 by up to
Under be successively bonded together,
It is at the middle and upper levels honeycomb 4, upper layer thermal insulation board 1 and lower layer's thermal insulation board 2 inside thermal insulation board 1 and lower layer's thermal insulation board 3
Upper and lower surfaces all coat and be provided with high reflectivity coating or aluminium foil 5.
Specifically, high reflectivity coating or aluminium foil 5 are by spraying or binder is bonded in upper layer thermal insulation board 1 and lower layer is heat-insulated
The upper and lower surfaces of plate 3.
Specifically, honeycomb can be set in the inside of upper layer thermal insulation board 1 or 3 inside of lower layer's thermal insulation board or be arranged simultaneously
Inside upper layer thermal insulation board 1 and lower layer's thermal insulation board 3.
Specifically, upper layer thermal insulation board 1 and lower layer's thermal insulation board 3 are selected from glass mat, asbestos board, rock wool board, polyurethane foam
One of foam plastic plate, Vestolit plate, inorganic silicate material plate.
Since the upper and lower surfaces of upper layer thermal insulation board 1 and lower layer's thermal insulation board 3 are arranged in high reflection aluminium foil 5, it can
To realize the higher order reflection radiated for indoor infrared (at least 4 grades reflections), the radiation effects of light is reduced, thermal energy is reduced
It dissipates, while being provided with intermediate air thermal insulation layer 2 between upper layer thermal insulation board 1 and lower layer's thermal insulation board 3, for thermally conductive caused by the temperature difference
There is good inhibiting effect with convective heat transfer, the compound thermal insulation separation with honeycomb under comprehensive function, in the application
Hot plate can be such that the indoor heat transfer with outdoor substantially weakens, simultaneously because the application is at the middle and upper levels in thermal insulation board 1 and lower layer's thermal insulation board 3
Portion uses honeycomb structure, and it is further that honeycomb structure is additionally formed air interlayer in upper layer thermal insulation board 1 and lower layer's thermal insulation board 3
Increase thermal conduction resistance while also reducing the weight of thermal insulation thermal insulation board entirety, therefore, in the application with honeycomb
Compound thermal insulation thermal insulation board has both a variety of advantages that light-weight, heat-insulating efficiency is high, preparation process is simply readily produced, and is suitable for each
The environment of the heat-insulated demand of kind.
The above-mentioned embodiments merely express the embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
Therefore it cannot be interpreted as that a limitation on the scope of the patent of the present invention.It should be pointed out that for the ordinary skill of this field
For personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, such as by simply increasing
In addition the number of plies or change upper and lower surface material etc. of lower thermal insulation board, these are all within the protection scope of the present invention.Therefore, originally
The scope of protection shall be subject to the appended claims for utility model patent.
Claims (3)
1. a kind of compound thermal insulation thermal insulation board with honeycomb, comprising:
Upper layer thermal insulation board, intermediate air thermal insulation layer, lower layer's thermal insulation board,
The upper layer thermal insulation board, the intermediate air thermal insulation layer, lower layer's thermal insulation board are from top to bottom successively glued by sealing strip
It ties together,
It is wherein honeycomb, the upper layer thermal insulation board and the lower layer inside the upper layer thermal insulation board and lower layer's thermal insulation board
The upper and lower surfaces of thermal insulation board all coat and are provided with high reflectivity coating or aluminium foil.
2. the compound thermal insulation thermal insulation board according to claim 1 with honeycomb, the high reflectivity coating or aluminium
Foil is bonded in the upper and lower surfaces of the upper layer thermal insulation board and lower layer's thermal insulation board by spraying or binder.
3. the compound thermal insulation thermal insulation board according to claim 1 with honeycomb, the upper layer thermal insulation board and described
Lower layer's thermal insulation board is selected from glass mat, asbestos board, rock wool board, polyurethane foam plastics plate, Vestolit plate, nothing
One of machine silicate material plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821101788.5U CN208718123U (en) | 2018-07-12 | 2018-07-12 | A kind of compound thermal insulation thermal insulation board with honeycomb |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821101788.5U CN208718123U (en) | 2018-07-12 | 2018-07-12 | A kind of compound thermal insulation thermal insulation board with honeycomb |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208718123U true CN208718123U (en) | 2019-04-09 |
Family
ID=65973134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821101788.5U Active CN208718123U (en) | 2018-07-12 | 2018-07-12 | A kind of compound thermal insulation thermal insulation board with honeycomb |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208718123U (en) |
-
2018
- 2018-07-12 CN CN201821101788.5U patent/CN208718123U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211202 Address after: 102101 1780, building 27, yard 8, Fenggu 4th Road, Yanqing garden, Zhongguancun, Yanqing District, Beijing Patentee after: BEIJING WEILAI LANTIAN TECHNOLOGY Co.,Ltd. Address before: 2403, floor 24, building 2, No. 1, Shangdi Information Road, Haidian District, Beijing 100085 Patentee before: BEIJING AIER LYUNENG TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right |