CN208706453U - A kind of capacitor connected using thin film capacitor with varistor - Google Patents
A kind of capacitor connected using thin film capacitor with varistor Download PDFInfo
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- CN208706453U CN208706453U CN201821522606.1U CN201821522606U CN208706453U CN 208706453 U CN208706453 U CN 208706453U CN 201821522606 U CN201821522606 U CN 201821522606U CN 208706453 U CN208706453 U CN 208706453U
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- film capacitor
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Abstract
A kind of capacitor connected using thin film capacitor with varistor includes: thin film capacitor structure, piezo-resistor structure, the first tie point and the second tie point, piezo-resistor structure is set to below thin film capacitor structure, thin film capacitor structure is connect with piezo-resistor structure left end by the first tie point, and thin film capacitor structure is connect with piezo-resistor structure right end by the second tie point.Wherein, thin film capacitor structure includes: capacitance inner core, the first Zinc-tin alloy layer, the second Zinc-tin alloy layer, insulating cement belt, the first lead-out wire and the second lead-out wire.The utility model is compared with traditional technology; pass through the capacitor connected using thin film capacitor with varistor; realize that product protective film capacitor in the case where there is larger current is injury-free; after being connected simultaneously by thin film capacitor with varistor; it is mounted directly on an electronic device; reduce the process installed twice, can effectively fix the resistance to shock that product has been significantly greatly increased on an electronic device.
Description
Technical field
The utility model relates to a kind of capacitors, and in particular to a kind of electricity connected using thin film capacitor with varistor
Container.
Background technique
During mating various electronic equipments, the requirement due to various electronic equipments to capacitor filtering is increasingly
Height, while guaranteeing to damage after exception occurs in use in thin film capacitor again.
To solve the above-mentioned problems, we are made that a series of improvement.
Utility model content
The purpose of the utility model is to provide a kind of capacitor connected using thin film capacitor with varistor, with
Overcome disadvantages mentioned above present in the prior art and deficiency.
A kind of capacitor connected using thin film capacitor with varistor includes: thin film capacitor structure, varistor
Structure, the first tie point and the second tie point, the piezo-resistor structure are set to below thin film capacitor structure, the thin-film electro
Structure of container is connect with piezo-resistor structure left end by the first tie point, the thin film capacitor structure and piezo-resistor structure
Right end is connected by the second tie point；
Wherein, the thin film capacitor structure include: capacitance inner core, the first Zinc-tin alloy layer, the second Zinc-tin alloy layer, absolutely
Edge adhesive tape layer, the first lead-out wire and the second lead-out wire, the capacitance inner core left end are connect with the first Zinc-tin alloy layer, the capacitor
Inner core right end is connect with the second Zinc-tin alloy layer, and the insulating cement belt is connect with capacitance inner core outer surface, and described first draws
Line is connect with the first Zinc-tin alloy layer, and second lead-out wire is connect with the second Zinc-tin alloy layer, and the insulating cement belt is circle
Column construction, first lead-out wire and the second lead-out wire are linear structure.
Further, the piezo-resistor structure includes: varistor, third lead-out wire and the 4th lead-out wire, the third
Lead-out wire one end is connect with varistor, and the third lead-out wire other end is connect by the first tie point with the first lead-out wire,
Described 4th lead-out wire one end is connect with varistor, and the 4th lead-out wire other end is drawn by the second tie point and second
Line connection, the third lead-out wire and the 4th lead-out wire are bending structure.
The utility model has the beneficial effects that
The utility model is real by the capacitor connected using thin film capacitor with varistor compared with traditional technology
Existing product protective film capacitor in the case where there is larger current is injury-free, while passing through thin film capacitor and pressure-sensitive electricity
After resistance connection, be mounted directly reduces the process installed twice on an electronic device, can effectively fix on an electronic device,
The resistance to shock of product has been significantly greatly increased.
Detailed description of the invention:
Fig. 1 is the structural schematic diagram of the utility model.
Appended drawing reference:
Thin film capacitor structure 100, capacitance inner core 110, the first Zinc-tin alloy 120, the second Zinc-tin alloy layer 130, insulation
Adhesive tape layer 140, the first lead-out wire 150 and the second lead-out wire 160.
Piezo-resistor structure 200, varistor 210, third lead-out wire 220, the 4th lead-out wire 230, the first tie point 300
With the second tie point 400.
Specific embodiment
Below in conjunction with specific embodiment, progress explanation is made to the utility model.It should be understood that following embodiment is merely to illustrate
The utility model is not for restriction the scope of the utility model.
Embodiment 1
Fig. 1 is the structural schematic diagram of the utility model.
As shown in Figure 1, a kind of capacitor connected using thin film capacitor with varistor includes: thin film capacitor structure
100, piezo-resistor structure 200, the first tie point 300 and the second tie point 400, piezo-resistor structure 200 are set to thin-film capacitor
100 lower section of device structure, thin film capacitor structure 100 is connect with 200 left end of piezo-resistor structure by the first tie point 300, thin
Membrane capacitance structure 100 is connect with 200 right end of piezo-resistor structure by the second tie point 400.
Wherein, thin film capacitor structure 100 includes: capacitance inner core 110, the first Zinc-tin alloy 120, the second Zinc-tin alloy layer
130, insulating cement belt 140, the first lead-out wire 150 and the second lead-out wire 160,110 left end of capacitance inner core and the first Zinc-tin alloy
Layer 120 connects, and 110 right end of capacitance inner core is connect with the second Zinc-tin alloy layer 130, outside insulating cement belt 140 and capacitance inner core 110
Surface connection, the first lead-out wire 150 are connect with the first Zinc-tin alloy layer 120, the second lead-out wire 160 and the second Zinc-tin alloy layer
130 connections, insulating cement belt 140 are cylindrical structure, and the first lead-out wire 150 and the second lead-out wire 160 are linear structure.
Piezo-resistor structure 200 includes: varistor 210, third lead-out wire 220 and the 4th lead-out wire 230, and third is drawn
220 one end of line is connect with varistor 210, and 220 other end of third lead-out wire passes through the first tie point 300 and the first lead-out wire
150 connections, 230 one end of the 4th lead-out wire are connect with varistor 210, and 230 other end of the 4th lead-out wire passes through the second tie point
400 connect with the second lead-out wire 160, and third lead-out wire 220 and the 4th lead-out wire 230 are bending structure.
The working principle of the utility model is that the first Zinc-tin alloy layer 120 is connected with the left end of capacitance inner core 110, second
Zinc-tin alloy layer 130 is connected with the right end of capacitance inner core 110, the first Zinc-tin alloy layer 120 and the connection of the first lead-out wire 150, the
Two Zinc-tin alloy layers 130 and the connection of the second lead-out wire 160.The left end of varistor 210 and third lead-out wire 220 connect, pressure-sensitive
The right end of resistance 210 and the connection of the 4th lead-out wire 230.First lead-out wire 150 and third lead-out wire 220 connect, the second lead-out wire
160 and the 4th lead-out wire 230 connect.First lead-out wire 150, the second lead-out wire 160 are linear structure, 220 He of third lead-out wire
4th lead-out wire 230 is warp architecture.
First lead-out wire, 150 one end is connect with the first Zinc-tin alloy layer 120, and the other end is connect with third lead-out wire 220, and
Composition one shares end, connect with electronic equipment.
Second lead-out wire, 160 one end is connect with the second Zinc-tin alloy layer 130, and the other end is connect with the 4th lead-out wire 230, and
Composition one shares end, connect with electronic equipment.
Third lead-out wire 220 is warp architecture, and one end is connect with varistor 210, and other end 90-degree bent and first is drawn
Line 150 connects, and forms one and share end, connect with electronic equipment.
4th lead-out wire 230 is warp architecture, and one end is connect with varistor 210, and other end 90-degree bent and second is drawn
Line 160 connects, and connect with electronic equipment.
First lead-out wire 150 forms the first tie point 300 after connecting with the mode of the soldering of third lead-out wire 220, and two
Lead-out wire is in flat shape.
Second lead-out wire 160 forms the second tie point 400 after connecting with the mode of the scolding tin of third lead-out wire 230, and two
Lead-out wire is in flat shape.Varistor 210 is located at the lower section of thin film capacitor structure 100.
The advantages of designing in this way is, easy for installation first, and traditional installation method is by thin film capacitor structure 100 and pressure
Quick resistance 210 is installed separately, and needs 4 lead-out wires, and there are two the utility model, it is 150 He of the first lead-out wire respectively
Third lead-out wire 220 forms a lead-out wire with the first tie point 300, and similarly the second lead-out wire 160 and the 4th draws
Outlet 230, which forms one, has the second tie point 400.Secondly, structurally reasonable, the utility model uses the side of solder furnace soldering
Method can effectively ensure that the first tie point 300 and the second tie point 400 are connected firmly, while use the lead-out wire of bending structure,
It can be directly fixedly connected with electronic equipment internal, anti-seismic performance is strong, not easily to fall off.Finally, with strong points, the utility model is non-general
With property capacitor, but it is directed to the capacitor of electronic apparatus system, structure can be such that electronic equipment filter capacity occurs in equipment
The normal work of thin film capacitor is effectively protected in the case where larger current.
Specific embodiment of the present utility model is illustrated above, but the utility model is not limited thereto, only
The objective of the utility model is not departed from, the utility model there can also be various change.
Claims (2)
1. a kind of capacitor connected using thin film capacitor with varistor characterized by comprising thin film capacitor structure
(100), piezo-resistor structure (200), the first tie point (300) and the second tie point (400), the piezo-resistor structure
(200) it is set to below thin film capacitor structure (100), the thin film capacitor structure (100) and piezo-resistor structure (200) are left
End is connected by the first tie point (300), and the thin film capacitor structure (100) passes through with piezo-resistor structure (200) right end
Second tie point (400) connection；
Wherein, the thin film capacitor structure (100) includes: capacitance inner core (110), the first Zinc-tin alloy layer (120), the second zinc
Tin alloy layers (130), insulating cement belt (140), the first lead-out wire (150) and the second lead-out wire (160), the capacitance inner core
(110) left end is connect with the first Zinc-tin alloy layer (120), capacitance inner core (110) right end and the second Zinc-tin alloy layer (130)
Connection, the insulating cement belt (140) connect with capacitance inner core (110) outer surface, first lead-out wire (150) and the first zinc
Tin alloy layers (120) connection, second lead-out wire (160) connect with the second Zinc-tin alloy layer (130), the insulating cement belt
It (140) is cylindrical structure, first lead-out wire (150) and the second lead-out wire (160) are linear structure.
2. a kind of capacitor connected using thin film capacitor with varistor according to claim 1, it is characterised in that:
The piezo-resistor structure (200) includes: varistor (210), third lead-out wire (220) and the 4th lead-out wire (230), described
Third lead-out wire (220) one end is connect with varistor (210), and third lead-out wire (220) other end passes through the first connection
Point (300) is connect with the first lead-out wire (150), and the 4th lead-out wire (230) one end is connect with varistor (210), described
4th lead-out wire (230) other end is connect by the second tie point (400) with the second lead-out wire (160), the third lead-out wire
(220) and the 4th lead-out wire (230) is bending structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821522606.1U CN208706453U (en) | 2018-09-18 | 2018-09-18 | A kind of capacitor connected using thin film capacitor with varistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821522606.1U CN208706453U (en) | 2018-09-18 | 2018-09-18 | A kind of capacitor connected using thin film capacitor with varistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208706453U true CN208706453U (en) | 2019-04-05 |
Family
ID=65946911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821522606.1U Expired - Fee Related CN208706453U (en) | 2018-09-18 | 2018-09-18 | A kind of capacitor connected using thin film capacitor with varistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208706453U (en) |
-
2018
- 2018-09-18 CN CN201821522606.1U patent/CN208706453U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190405 Termination date: 20200918 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |