CN208704958U - A kind of packaging system of surface acoustic wave sensor - Google Patents
A kind of packaging system of surface acoustic wave sensor Download PDFInfo
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- CN208704958U CN208704958U CN201821204697.4U CN201821204697U CN208704958U CN 208704958 U CN208704958 U CN 208704958U CN 201821204697 U CN201821204697 U CN 201821204697U CN 208704958 U CN208704958 U CN 208704958U
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- acoustic wave
- surface acoustic
- wave sensor
- circuit board
- packaging system
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Abstract
The utility model relates to a kind of packaging system of surface acoustic wave sensor, device includes: a PCB circuit board, external circuits and SAW device；Wherein, PCB circuit board includes middle layer, and is arranged fluted；External circuits are placed on PCB circuit board upper surface, and SAW device is placed in groove, and the SAW device is connected by the middle layer of PCB circuit board with external circuits.The utility model proposes packaging system, can make surface acoustic wave sensor integration and microminaturization, be conducive to surface acoustic wave sensor Installation And Test.
Description
Technical field
The utility model relates to sensor encapsulation field more particularly to a kind of packaging systems of surface acoustic wave sensor.
Background technique
One kind that surface acoustic wave is British scientist Rayleigh to be found during the late 19th century studying seismic wave is in earth's surface
The sound wave that face is propagated.In recent decades, as understanding of the people to surface acoustic wave is deeper and deeper, the application of surface acoustic wave techniques
It is more and more extensive.It is right in communication process from the excitation principle of surface acoustic wave it is found that surface acoustic wave is propagated along piezoelectric substrate surface
The physics of acting piezoelectric plane of crystal and chemistry are extremely sensitive, thus make miscellaneous high sensitive sensor, form SAW
Another emerging market of technology, i.e. intelligent sensing application, and start to be widely used in such as temperature, the automatic control of pressure etc.
Sensor, clinical medicine apply (biosensor), industry, business and Military Application (gas).Skill is sensed relative to other
Art, the sensor of surface acoustic wave have the characteristics that simple quick response, structure, strong antijamming capability, small in size, at low cost, spy
It is not the also unique advantage with passive (the powering without battery) of sensor and long-range monitoring (wireless transmission), therefore from upper
Century 70 is still in the ascendant to come at present, and surface acoustic wave sensor is important development technology therein.
The encapsulation for surface acoustic wave sensor currently on the market, wherein surface acoustic wave sensor and external circuits are most
Discrete package, not in view of the design of the integration of sensor and micromation, and existing surface acoustic wave sensor encapsulates knot
Structure is unfavorable for Installation And Test, and the service life is shorter, and functional structure is easy to be affected by the external environment.
Utility model content
To solve the above-mentioned problems, the utility model proposes a kind of packaging systems of surface acoustic wave sensor.
The utility model provides a kind of packaging system of surface acoustic wave sensor, comprising: a PCB circuit board, external
Circuit and SAW device；Wherein, the PCB circuit board includes middle layer, and is arranged fluted；The external circuits are put
It sets in the PCB circuit board upper surface, the SAW device is placed in the groove, the SAW device is logical
The middle layer for crossing the PCB circuit board is connected with the external circuits.
Preferably, the SAW device includes piezo-electric crystal, interdigital transducer, the first reflector and the second reflection
Device；The interdigital transducer, first reflector and second reflector are successively from left to right deposited in the piezo crystals
Body upper surface.
Preferably, the external circuits include: matching network circuit and antenna, are used for reception and electromagnetic signals,
And it is matched with the impedance of the interdigital transducer.
Preferably, the matching network circuit includes: matching inductance L and matching capacitance C；In the matching network circuit
There is two lines road, the matching inductance L series connection is in a wherein route, and the matching capacitance C is connected in two lines road, separately
One line-to-ground.
Preferably, make turmeric processing in the PCB circuit board upper surface of the groove surrounding.
Preferably, further includes: pad and pad；The pad and the pad are symmetrically placed on the surface acoustic wave device
Part both sides, and two output ends of the SAW device are connected to, then pass through the PCB circuit board middle layer and institute
State external circuits conducting.
Preferably, further includes: encapsulation pipe cap, the encapsulation pipe cap, for carrying out Vacuum Package to groove.
The utility model proposes packaging system, can make surface acoustic wave sensor integration and microminaturization, be conducive to sound
Surface wave sensor Installation And Test.
Detailed description of the invention
Figure 1A and Figure 1B is a kind of packaging system structure of surface acoustic wave sensor provided by the embodiment of the utility model
Sectional view and top view；
Fig. 2 is the structural schematic diagram of matching network circuit in external circuits provided by the embodiment of the utility model；
Fig. 3 is the structural schematic diagram of SAW device provided by the embodiment of the utility model.
Specific embodiment
To make the technical solution of the utility model embodiment and becoming apparent from for advantage expression, below by attached drawing and implementation
Example, is described in further detail the technical solution of the utility model.
Figure 1A and Figure 1B is a kind of packaging system structure of surface acoustic wave sensor provided by the embodiment of the utility model
Sectional view and top view.Such as a kind of packaging system of Fig. 1 surface acoustic wave sensor illustrated comprising: a PCB circuit board 1,
External circuits 2 and SAW device 6.
External circuits 2 are placed on the right one third region in 1 upper surface of PCB circuit board, then in 1 Zuo Sanfen of PCB circuit board
Two regions in dig out a cuboid groove 7, for placing SAW device 6, last SAW device 6 passes through PCB
The middle layer of circuit board 1 is connected with external circuits 2.
In one embodiment, the long 32mm of PCB circuit board 1, wide 10mm, the long 18mm of the groove 7 dug out, wide 8mm.?
Turmeric processing is made in 1 upper surface of PCB circuit board of 7 surrounding of groove, and obtaining a width is 1mm, with a thickness of the heavy of 0.2mm~0.5mm
Gold 3.
External circuits 2 include matching network circuit 201 and antenna, for receive and electromagnetic signals, and with it is interdigital
The impedance of energy converter 602 is matched.
Wherein, matching network circuit 201 includes matching inductance L and matching capacitance C, has two in matching network circuit 201
Route, matching inductance L connect in a wherein route, and matching capacitance C is connected in two lines road, and another route connects
Ground.Matching network circuit 201 is connected between antenna and SAW device 6, for adjusting interdigital in SAW device 6 change
Impedance between energy device 602 and antenna, when the impedance between interdigital transducer 602 and antenna matches, electromagnetic wave signal is external
The loss and distortion transmitted in circuit 2 are minimum.
Preferably, columnar antenna or chip aerial can be selected in antenna.
SAW device 6 is in the utility model embodiment, using reflective delay line structure, structure such as Fig. 3 institute
Show, comprising: piezo-electric crystal 601, interdigital transducer 602, the first reflector 603 and the second reflector 604.Wherein, interdigital transducing
Device 602, the first reflector 603 and the second reflector 604 are deposited on piezo-electric crystal 601 using semiconductor technology, interdigital transducing
The middle layer that two output ends of device 602 pass through PCB circuit board 1 respectively is connected with external circuits 2.
Preferably, 6 frequency of SAW device is set as 890M in the utility model embodiment.
Preferably, piezo-electric crystal 601 selects YZ-LiNb03, a length of 15mm, width 4mm.
Preferably, the electrode number of interdigital transducer 602 is 20 pairs, and each finger width is 1.101 μm, and electrode film thickness is
300nm, each finger spacing are 1.101 μm, and sound aperture is 1586.160 μm.
Preferably, the first reflector 603 uses short-circuiting reflection grid-type, and electrode number is 7 pairs, and each finger width is
1.101 μm, electrode film thickness 300nm, each finger spacing is 1.101 μm, and sound aperture is 440.600 μm.
Preferably, the second reflector 604 uses short-circuiting reflection grid-type, and electrode number is 8.5 pairs, and each finger width is
1.101 μm, electrode film thickness 300nm, each finger spacing is 1.101 μm, and sound aperture is 440.600 μm.
Wherein, interdigital transducer 602, the first reflector 603 and the second reflector 604 are successively from left to right deposited in piezoelectricity
601 upper surface of crystal, 854 λ (λ is corresponding wave length of sound) when interdigital transducer 602 is at a distance from the first reflector 603, first
A reflector 12 is 66.75 λ at a distance from second reflector 13.
In one embodiment, the utility model further include: pad 4 and pad 5.Wherein pad 4 and pad 5 are symmetrically put
It sets on 6 both sides of SAW device, and is connected to two output ends of SAW device 6, then pass through PCB circuit board 1
Middle layer and external circuits 2 are connected.
In one embodiment, the thickness between 1 bottom of 7 bottom of groove and PCB circuit board be set as 0.1mm~
0.5mm sets 0.1mm for this thickness to obtain the biggish sensitivity of surface acoustic wave sensor.
In one embodiment, the utility model further include: encapsulation pipe cap 7, for carrying out Vacuum Package to groove 7.
Preferably, packaged type can be packaged with welding, bonded adhesives, and the SAW device 6 in groove 7 is aligned
The detected part of encapsulation pipe cap 7 can encapsulate.
Preferably, ceramic package pipe cap can be selected in encapsulation pipe cap 7.
The utility model proposes packaging system, can make surface acoustic wave sensor integration and microminaturization, be conducive to sound
Surface wave sensor Installation And Test.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.
Above-described specific embodiment, to the purpose of this utility model, technical scheme and beneficial effects carried out into
One step is described in detail, it should be understood that being not used to limit the foregoing is merely specific embodiment of the present utility model
Determine the protection scope of the utility model, within the spirit and principle of the utility model, any modification for being made equally is replaced
It changes, improve, should be included within the scope of protection of this utility model.
Claims (7)
1. a kind of packaging system of surface acoustic wave sensor characterized by comprising PCB circuit board (1), an external circuits
(2) and SAW device (6)；Wherein, the PCB circuit board (1) includes middle layer, and fluted (7) are arranged；
The external circuits (2) are placed on the PCB circuit board (1) upper surface, and the SAW device (6) is placed in institute
It states in groove (7), middle layer and the external circuits (2) of the SAW device (6) by the PCB circuit board (1)
It is connected.
2. the packaging system of surface acoustic wave sensor according to claim 1, which is characterized in that the SAW device
It (6) include piezo-electric crystal (601), interdigital transducer (602), the first reflector (603) and the second reflector (604)；The fork
Finger transducer (602), first reflector (603) and second reflector (604) are successively from left to right deposited in described
Piezo-electric crystal (601) upper surface.
3. the packaging system of surface acoustic wave sensor according to claim 2, which is characterized in that the external circuits (2)
Include: matching network circuit (201) and antenna, for receiving and electromagnetic signals, and with the interdigital transducer (602)
Impedance matched.
4. the packaging system of surface acoustic wave sensor according to claim 3, which is characterized in that the matching network circuit
It (201) include: matching inductance L and matching capacitance C；There are two lines road, the matching electricity in the matching network circuit (201)
L series connection is felt in a wherein route, and the matching capacitance C is connected in two lines road, another line-to-ground.
5. the packaging system of surface acoustic wave sensor according to claim 1, which is characterized in that in the groove (7) four
Make turmeric processing in the PCB circuit board (1) upper surface in week.
6. the packaging system of surface acoustic wave sensor according to claim 1, which is characterized in that further include: pad (4) and
Pad (5)；The pad (4) and the pad (5) are symmetrically placed on the SAW device (6) both sides, and connect respectively
Two output ends of the SAW device (6) are connected to, the PCB circuit board (1) middle layer and the external electricity are then passed through
Road (2) conducting.
7. the packaging system of surface acoustic wave sensor according to claim 1, which is characterized in that further include: encapsulation pipe cap
(8),
The encapsulation pipe cap (8), for carrying out Vacuum Package to the groove (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821204697.4U CN208704958U (en) | 2018-07-27 | 2018-07-27 | A kind of packaging system of surface acoustic wave sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821204697.4U CN208704958U (en) | 2018-07-27 | 2018-07-27 | A kind of packaging system of surface acoustic wave sensor |
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| Publication Number | Publication Date |
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| CN208704958U true CN208704958U (en) | 2019-04-05 |
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| CN201821204697.4U Active CN208704958U (en) | 2018-07-27 | 2018-07-27 | A kind of packaging system of surface acoustic wave sensor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109060233A (en) * | 2018-07-27 | 2018-12-21 | 中国科学院声学研究所 | A kind of packaging system of surface acoustic wave sensor |
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2018
- 2018-07-27 CN CN201821204697.4U patent/CN208704958U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109060233A (en) * | 2018-07-27 | 2018-12-21 | 中国科学院声学研究所 | A kind of packaging system of surface acoustic wave sensor |
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