CN208655638U - Light-emitting diode encapsulation structure - Google Patents

Abstract

The utility model discloses a kind of light-emitting diode encapsulation structure, includes LED support, driving arm group, shell, multiple LED chips, driving chip and light transmission package.LED support includes carrying section and two bending pins for being connected in carrying section.Driving arm group includes two side stands, and each side stand includes functional section and bending pin.Shell is formed with the accommodation groove for exposing carrying section and two functional sections.Multiple bending pins are pierced by by housing side and are bent to housing bottom surface.Multiple LED chips fix and are electrically connected at carrying section.Driving chip is fixed on one of functional section and is electrically connected at another one functional section.Multiple LED chips are electrically connected in driving chip, are emitted beam with that can be driven by driving chip.Light transmission package is filled in accommodation groove, with embedding multiple LED chips and driving chip.Accordingly, light-emitting diode encapsulation structure internal structure by external drive chip without being limited and can selectively be realized that lateral direction light emission or forward direction shine.

Description

Light-emitting diode encapsulation structure

Technical field

The utility model relates to a kind of encapsulating structure more particularly to a kind of light-emitting diode encapsulation structure.

Background technique

When the inside of existing light-emitting diode encapsulation structure is configured with multiple LED chips, above-mentioned multiple LED chips need It is electrically connected at external drive chip, so as to that can be controlled by said external driving chip.Therefore, existing LED package The design of structure needs the limitation by said external driving chip.

Then, inventors believe that drawbacks described above can improve, make great efforts the utilization for concentrating on studies and cooperating the principles of science, finally It is proposed that a kind of design is reasonable and is effectively improved the utility model of drawbacks described above.

Utility model content

The utility model lies in that providing a kind of light-emitting diode encapsulation structure, existing light emitting diode can be effectively improved The issuable defect of encapsulating structure institute.

The utility model discloses a kind of light-emitting diode encapsulation structure, comprising: a LED support, include a carrying section and It is connected in two bending pins of the carrying section；One driving arm group is set in distance with the LED support and includes two A side stand；Wherein, each side stand includes a functional section, is connected in an extended segment of the functional section and is connected in One bending pin of the extended segment；One shell includes a top surface, a bottom surface and the connection top surface and the bottom surface Multiple sides, and the shell is formed with an accommodation groove from top surface recess, to expose described in the carrying section and two Functional section；Wherein, two of the LED support it is described bending pins and the driving arm group two bending pins all It is pierced by the shell by one of them described side of multiple sides and is bent and extend to the bottom surface；Multiple LED cores Piece in the accommodation groove and is fixed and is electrically connected at the carrying section；One driving chip is located in the accommodation groove, The driving chip is fixed on one of them described functional section of two functional sections and is electrically connected at routing wherein another One functional section；Wherein, multiple LED chips are respectively electrically connected at the driving chip with routing, with can be described Driving chip drives and emits beam；One light transmission package is filled in the accommodation groove so that multiple LED chips with The driving chip is embedded in the transparent encapsulant body.

Preferably, in each side stand, the functional section is connected with the extended segment constitutes a L-shape configuration, and And the extended segment is formed with a perforation at the position for corresponding to L-type construction corner, and the perforation is by the shell It is filled up.

Preferably, in each side stand, the edge common depression at the edge of the functional section and the extended segment It is formed with a U-lag, and the U-lag is filled up by the shell, so as to the part of the U-lag and fill out institute in the inner State the slot bottom that housing parts are all located at the accommodation groove.

Preferably, in each side stand, the marginal trough of the extended segment is formed with respectively for different directions Multiple notches, and multiple notches are filled up by the shell.

Preferably, the LED support it is described carrying section and each of which it is described bending pin joint inside line, it is recessed It falls into and is formed with notch in one, and each interior notch is filled up by the shell.

Preferably, it is exposed to recess on the LED support surface of the accommodation groove and is formed with multiple choked flow grooves, and Each LED chip is between two adjoining choked flow grooves in multiple choked flow grooves.

Preferably, the accommodation groove is elongated and definition has a length direction, and the shell definition is orthogonal to described Length direction and a mutually orthogonal width direction and a short transverse, and the light-emitting diode encapsulation structure is in the width The maximum width on direction is spent divided by a ratio of the maximum height in the short transverse, between 0.8~1.2.

Preferably, the shell includes multiple fins, and multiple fin positions are pierced by each bending pin The side on, and each fin from the top surface towards the bottom surface extend formed.

Preferably, the driving arm group is provided with a conductive branch between the LED support and each side stand Frame, each conducting bracket include a functional section and the bending pin for being connected in the functional section；Each conduction The functional section of bracket is exposed to the accommodation groove, and each of described light-emitting diode encapsulation structure bending pin It is pierced by the shell by one of them described side of multiple sides and is bent and extend to the bottom surface.

Preferably, the shell includes the multiple fins for being formed in its outer surface, two conducting brackets it is described Bending pin has an escape port in locating each recess toward each other, and each escape port contains the office of a fin Portion.

Preferably, the light-emitting diode encapsulation structure further comprises be embedded in the light transmission package one Zener (Zener) diode chip for backlight unit, and the Zener diode chip is fixed on one of them of two conducting brackets The functional section of the conducting bracket.

Preferably, each bending pin includes that a side view welding section and one face welding section, each described curved The side that the side view welding section of folding pin is pierced by adjacent to it, and each the described of bending pin faces weldering Section is connect adjacent to the bottom surface.

Preferably, the side view welding section of multiple bending pins is located in one first plane, and multiple described curved The welding section of facing of folding pin is located in one second plane of vertical first plane.

Preferably, the shell is formed with multiple grooves in bottom surface recess, and one end of each groove connects It passes to each side for being pierced by of bending pin, and multiple described face welding section and be set to multiple grooves It is interior.

Preferably, the underrun of the shell forms multiple grooves and constitutes spaced two F shapes Ribs, and two of the LED support face welding section between two F shape ribs, it is each described collateral The described of frame and its adjacent conducting bracket faces welding section and is set in the F shape ribs.

Preferably, the driving chip includes multiple metal gaskets, and multiple metal gaskets are respectively with the connection of a plurality of conducting wire In four functional sections and multiple LED chips.

In conclusion light-emitting diode encapsulation structure disclosed in the utility model embodiment, internal be configured with can The driving chip of multiple LED chips is driven, so that the internal structure of the light-emitting diode encapsulation structure is not necessarily to be driven by outside The limitation of dynamic chip.Furthermore the bending pin of the light-emitting diode encapsulation structure be pierced by by one of side of shell, And the bottom surface for extending to shell is bent, so that light-emitting diode encapsulation structure is selectively realized side depending on user demand accordingly It shines to luminous or forward direction.

For the feature and technology contents that can be further understood that the utility model, please refer to below in connection with the utility model Detailed description and accompanying drawings, but these illustrate only to be used to illustrate the utility model with attached drawing, rather than the protection to the utility model Range makees any limitation.

Detailed description of the invention

Fig. 1 is the stereoscopic schematic diagram of the utility model light-emitting diode encapsulation structure.

Fig. 2 is the stereoscopic schematic diagram at another visual angle Fig. 1.

Fig. 3 is schematic cross-sectional view of the Fig. 1 along hatching line III-III.

Fig. 4 is the left side plane schematic diagram of Fig. 1.

Fig. 5 is the bottom plan schematic diagram of Fig. 1.

Fig. 6 is the side plane schematic diagram of Fig. 1.

Fig. 7 is the LED support of the utility model light-emitting diode encapsulation structure and the stereoscopic schematic diagram of driving arm group.

Fig. 8 is the stereoscopic schematic diagram at another visual angle Fig. 7.

The side plane schematic diagram of bowing (omitting light transmission package) that Fig. 9 is Fig. 1.

Specific embodiment

Fig. 1 to Fig. 9 is please referred to, is the embodiments of the present invention, need to first be illustrated, the present embodiment respective figure institute The correlated measure and external form referred to is only used to specifically describe the embodiments of the present invention, practical new in order to understand this The content of type, rather than be used to limit to the protection scope of the utility model.

As shown in Figure 1 to Figure 3, the present embodiment discloses a kind of light-emitting diode encapsulation structure 100, includes a shell 1, solid Due to above-mentioned shell 1 and the LED support 2 that is set in distance and a driving arm group 3, it is set to the multiple of above-mentioned LED support 2 LED chip 4, the driving chip 5 for being set to above-mentioned driving arm group 3 and the above-mentioned multiple LED chips 4 of sealing and driving chip 5 A light transmission package 6.In addition, the light-emitting diode encapsulation structure 100 can also further include and be fixed on driving arm Group 3 and Zener (Zener) diode chip for backlight unit 7 for being embedded in light transmission package 6.It below will be respectively with regard to the present embodiment light-emitting diodes The various components construction of pipe encapsulating structure 100 is described with connection relationship.

As shown in Figures 4 to 6, the shell 1 substantially has a mutually orthogonal length direction L, one in cuboid and definition Width direction W and a height direction H.Wherein, the shell 1 includes a top surface 11, a bottom surface 12 and the above-mentioned top surface of connection 11 with multiple sides 13 of bottom surface 12, and above-mentioned multiple sides 13 are comprising there are two broad side surface 13a in this present embodiment And side 13b two narrow illustrates, but the utility model is not only restricted to this.

It further says, the shell 1 is formed with an accommodation groove 111 (such as: Fig. 3) from its top surface 11 recess, and described Accommodation groove 111 is elongated and is roughly parallel to above-mentioned length direction L；That is, the length direction L is also possible to by holding Slot 111 is set to be defined.Wherein, as shown in figure 4, the shell 1 includes to be located in one of side 13 (such as: broad side surface 13a) And the multiple fins 131 being set in distance, and each fin 131 is elongated and from the top surface of shell 1 11 towards bottom surface 12 Extension is formed, and the fin 131 of the present embodiment is that there are a distances between the bottom surface 12 of above-mentioned shell 1.Each fin 131 width in the length directionl is in preferably to be incremented by shape towards the direction of bottom surface 12 from the top surface 11 of the shell 1.

Furthermore as shown in figure 5, the shell 1 is formed with multiple grooves 121, and each groove in its bottom surface 12 recess 121 one end is connected to the side 13 for being formed with above-mentioned fin 131；That is, the multiple groove 121 is in the present embodiment In be that substantially L forms a line along its length, and two grooves 121 for being located at outside are then respectively, further to be connected to two Narrow side 13b.

And in the present embodiment, as shown in Figure 4 and Figure 5, the bottom surface 12 of the shell 1 is by forming above-mentioned multiple grooves 121 and constitute spaced two F shapes ribs 122；That is, being somebody's turn to do between above-mentioned two F shape ribs 122 Groove 121 is two broad side surface 13a for being connected to shell 1, but the utility model is not limited.Wherein, described two F shape branch The position adjacent to each other of stake rib 122 corresponds respectively to two, the outside fin 131 in the multiple fin 131 along height direction H.

As shown in Figure 7 and Figure 8, the LED support 2 is one of the forming in the present embodiment one-piece construction simultaneously includes There is a carrying section 21 and is connected in two bending pins 22 of above-mentioned carrying section 21.Wherein, the carrying section 21 it is elongated and It is parallel to length direction L, and above-mentioned two bending pin 22 is then that compartment of terrain is connected in carrying section 21, so that described two bendings The polarity having the same of pin 22.

It further says, as shown in figures 7 and 9, the carrying section 21 is embedded in shell 1 and above-mentioned carrying section 21 At least partly surface exposure is in accommodation groove 111.Wherein, 21 surface of carrying section for being exposed to the LED support 2 of accommodation groove 111 is suitable Multiple choked flow grooves 211 are formed in the slot bottom and recess that accommodation groove 111 is arranged in.And in the present embodiment, it is above-mentioned multiple The same length of choked flow groove 211 and it is parallel to the width direction W, but the utility model is not limited.

Furthermore the LED support 2, in the inside line of carrying section 21 and each of which bending 22 joint of pin, difference is recessed It falls into and is formed with notch 212 in one, and each interior notch 212 is filled up by shell 1.And in the present embodiment, the LED support 2 bend the outside left of 22 joint of pin in carrying section 21 with each of which, and recess is formed with an outer notch 213 respectively, and Each outer notch 213 is filled up by shell 1.Accordingly, the LED support 2 is by being formed with above-mentioned interior notch 212 and outer notch 213, can effectively promote the associativity between the LED support 2 and shell 1 and efficiently reduce aqueous vapor across shell 1 And it invades to light-emitting diode encapsulation structure 100.

As shown in Fig. 1, Fig. 4 and Fig. 5, two bending pins 22 of the LED support 2 by one of side 13 (such as: It is formed with the broad side surface 13a of fin 131) it is pierced by the shell 1 and bends the bottom surface 12 for extending to above-mentioned shell 1.Wherein, on The each bending pin 22 for stating LED support 2 is substantially L-shaped in the present embodiment and include a side view welding section 221 and one Face welding section 222.The side 13 that the side view welding section 221 of each bending pin 22 of LED support 2 is pierced by adjacent to it, And each bending pin 22 of LED support 2 faces welding section 222 adjacent to the bottom surface 12 of shell 1.

In more detail, it is provided with the fin 131 between two side view welding sections 221 of the LED support 2, And the outside of two side view welding sections 221 of above-mentioned LED support 2 is respectively equipped with other two fins 131.Furthermore by institute It states the groove 121 between two F shape ribs 122 and is connected to the side 13 that the bending pin 22 of above-mentioned LED support 2 is pierced by, So two of LED support 2 are faced in the groove 121 that welding section 222 is arranged between described two F shape ribs 122.

As shown in figures 7 and 9, the driving arm group 3 side stand 31 and two conducting brackets 32 comprising there are two, and And above-mentioned two side stand 31 is located at the outside of LED support 2, and one is equipped between above-mentioned LED support 2 and each side stand 31 The conducting bracket 32.Wherein, each side stand 31 includes a functional section 311, the extended segment for being connected in above-mentioned functional section 311 312 and be connected in the extended segment 312 one bending pin 313.

Need to first it illustrate, the extended segment 312 of any one side stand 31 in the present embodiment and bending pin 313 are substantially Mirror symmetry is in the extended segment of another side stand 31 312 and bends pin 313, and the functional section of described two side stands 31 311 constructions then slightly have difference, and (length of the functional section 311 of one of side stand 31 is longer, is set to for driving chip 5 Thereon；And the length of the functional section 311 of another side stand 31 is shorter, with for the connection of 5 routing of driving chip).

Further say, the extended segment 312 of described two side stands 31 be completely embedded in shell 1 and be respectively adjacent in The narrow side 13b of two of shell 1.It and is the knot for enabling the side stand 31 closely to be combined with shell 1 between strengthening It closes intensity and efficiently reduces aqueous vapor and invade across shell 1 to light-emitting diode encapsulation structure 100, the hair of the present embodiment Optical diode package structure 100 is preferably formed with following constructions in each side stand 31:

The functional section 311 of the side stand 31 is connected with extended segment 312 constitutes a L-shape configuration, and the extended segment 312 It is formed with a perforation 3121 at the position for corresponding to L-type construction corner, and the perforation 3121 is filled up by shell 1；It is described The edge of functional section 311 and the edge common depression of extended segment 312 are formed with a U-lag 3122, and 3122 quilt of the U-lag Above-mentioned shell 1 is filled up, so that the part of the U-lag 3122 and 1 part of shell filled out in the inner are all located at the accommodation groove 111 slot bottom；The marginal trough of the extended segment 312 is formed with multiple notches 3123 respectively for different directions, and on Multiple notches 3123 are stated to be filled up by the shell 1.

The functional section 311 of described two side stands 31 be then respectively from two extended segments 312 along the length direction L and that This extends, opposite to each other so that the functional section 311 of each side stand 31 is embedded in shell 1, and above-mentioned each side stand 31 Functional section 311 at least partly surface exposure in accommodation groove 111.Wherein, it is exposed to each side stand 31 of accommodation groove 111 311 surface of functional section is equivalent to the slot bottom that accommodation groove 111 is arranged in, and with the functional section 311 being arranged for driving chip 5 Length is greater than the 50% of 111 slot bottom length of accommodation groove, and 311 extending direction of functional section of above-mentioned two side stand 31 is substantially flat Row is in the carrying section 21 of LED support 2.

As shown in Fig. 1, Fig. 4 and Fig. 5, the bending pin 313 of described two side stands 31 is by one of side 13 (such as: being formed with the broad side surface 13a of fin 131) is pierced by the shell 1 and bends the bottom surface 12 for extending to shell 1.Wherein, often The extended segment 312 of a side stand 31 and bending pin 313 are substantially u-shaped in this present embodiment；That is, above-mentioned each collateral The bending pin 313 of frame 31 is substantially L-shaped and includes that a side view welding section 3131 and one faces welding section 3132.Each The side 13 that the side view welding section 3131 of the bending pin 313 of side stand 31 is pierced by adjacent to it, and each side stand 31 Bending pin 313 faces welding section 3132 adjacent to the bottom surface 12 of shell 1.

In more detail, since described two F shape ribs 122 are surrounded and two grooves 121 away from each other all connect It passes to above-mentioned side stand 31 and bends the side 13 that pin 313 is pierced by, so the welding section 3132 of facing of two side stands 31 divides Be not arranged at above-mentioned two F shape ribs 122 surround and in two grooves 121 away from each other (such as: outermost in Fig. 5 Two grooves 121).

As shown in figures 7 and 9, each conducting bracket 32 includes a functional section 321 and is connected in above-mentioned functional section 321 One bending pin 322.Wherein, the functional section 321 of each conducting bracket 32 is embedded in shell 1 and above-mentioned each conduction At least partly surface exposure of functional section 321 of bracket 32 is in accommodation groove 111.Wherein, it is exposed to the conductive branch of each of accommodation groove 111 321 surface of functional section of frame 32 is the equal of the function that the slot bottom and one of conducting bracket 32 of accommodation groove 111 is arranged in 321 recess of section is formed with a choked flow groove 3211.That is, the functional section 321 of above-mentioned conducting bracket 32 is preferably with its resistance It flows groove 3211 and divides into a routing area 3212 and a crystal bonding area 3213, but the utility model is not only restricted to this.

It further says, the functional section 321 of described two conducting brackets 32 is the carrying section 21 with LED support 2 along length Direction L forms a line, and the functional section 321 of two conducting brackets 32 is located at the two opposite sides of carrying section 21, and above-mentioned The functional section 321 of two side stands 31 is then to be arranged in another column.

As shown in Fig. 1, Fig. 4 and Fig. 5, the bending pin 322 of each conducting bracket 32 is by one of side 13 (such as: being formed with the broad side surface 13a of fin 131) is pierced by the shell 1 and bends the bottom surface 12 for extending to shell 1.Wherein, often A conducting bracket 32 is substantially u-shaped in the present embodiment；That is, the bending pin 322 of above-mentioned each conducting bracket 32 exists It is substantially L-shaped and include that a side view welding section 3221 and one faces welding section 3222 in the present embodiment.Each conducting bracket The side 13 that the side view welding section 3221 of 32 bending pin 322 is pierced by adjacent to it, and the bending of each conducting bracket 32 Pin 322 faces welding section 3222 adjacent to the bottom surface 12 of shell 1.

In more detail, either one or two of above-mentioned LED support 2 bending pin 22 and adjacent side stand 31 bend pin 313 Between be provided with the bending pin 322 of a conducting bracket 32, and the side view welding section of each conducting bracket 32 The fin 131 is provided between 3221 and the adjacent bending pin 22 of LED support 2.Wherein, above-mentioned two conducting bracket In place (such as: 3221 inner edge of side view welding section) toward each other, respectively recess has an escape port 3223 to 32 bending pin 322, and every A escape port 3223 contains the part of a fin 131.

Furthermore since described two F shape ribs 122 are surrounded and two grooves 121 adjacent to each other are all connected to It states conducting bracket 32 and bends the side 13 that pin 322 is pierced by, so the welding section 3222 of facing of two conducting brackets 32 is distinguished Above-mentioned two F shape ribs 122 are arranged to surround and in two grooves 121 adjacent to each other.

In addition, as shown in figure 8,2, two side stands 31 of above-mentioned LED support and two conducting brackets 32 are being embedded in the shell Recess is formed with a plurality of isolated groove G on body 1 and a surface towards its bottom surface 12, and every isolated groove G is in this implementation The length direction L is parallel in example and is respectively arranged at 2, two side stands 31 of above-mentioned LED support and two with multiple sections Conducting bracket 32, and multiple isolated groove G are filled up by the shell 1.Accordingly, the LED support 2 and 3 energy of driving arm group By being formed with above-mentioned multiple isolated groove G, and strengthens its bond strength between shell 1 and efficiently reduce aqueous vapor and wear It crosses above-mentioned shell 1 and invades to light-emitting diode encapsulation structure 100.

According to upper described, the LED support 2 and driving arm group 3 are closed relative to the connection between shell 1 in the present embodiment System can unite whole as follows, but the utility model is not limited.For example, the other embodiments not being painted in the utility model In, 2, two side stands 31 of the LED support and two conducting brackets 32 are also possible to members therein and realize this implementation The contained technical characteristic of example.

Specifically, as shown in Fig. 4, Fig. 5 and Fig. 9, the accommodation groove 111 of the shell 1 exposes holding for above-mentioned LED support 2 Each functional section 311,321 of section 21 and driving arm group 3 is carried, and each bending pin 22,313,322 is by multiple sides 13 One of side 13 (at substantial middle height) be pierced by the shell 1 and bend and extend to the bottom surface 12 of shell 1, according to So that light-emitting diode encapsulation structure 100 can realize lateral direction light emission or positive luminous depending on user demand and selectively.And institute The multiple fins 131 for stating shell 1 are located on the side 13 that above-mentioned each bending pin 22,313,322 is pierced by.

Wherein, the side view welding section 221,3131,3221 of each bending pin 22,313,322 is pierced by adjacent to it Side 13, and each bending pin 22,313,322 faces welding section 222,3132,3222 adjacent to bottom surface 12.On furthermore The side view welding section 221,3131,3221 for stating multiple bending pins 22,313,322 is located on one first plane P1 and stretches out Or it is flush to fin 131；And multiple bending pins 22,313,322 face welding section 222,3132,3222 be located at it is vertical described On the one second plane P2 of first plane P1 and stretch out or be flush to 1 bottom surface of shell.Accordingly, the LED package Structure 100 convenient for being welded with side view welding section 221,3131,3221, or with face welding section 222,3132,3222 into Row welding.

In addition, one end of each groove 121 is connected to the side 13 that each bending pin 22,313,322 is pierced by, and institute Multiple welding sections 222,3132,3222 of facing are stated to be respectively arranged in multiple grooves 121.Wherein, two of the LED support 2 Welding section 222 is faced between two F shape ribs 122, above-mentioned each side stand 31 and its adjacent conductive bracket 32 are just It is set in the F shape ribs 122 depending on welding section 3132,3222.

It should be noted that each bending pin 22,313,322 in the present embodiment, side view welding section 221,3131, 3221 length is preferably the same as facing the length of welding section 222,3132,3222, but the utility model is not only restricted to this.It lifts For example, in the other embodiments that the utility model is not painted, the side view welding section of each bending pin 22,313,322 221,3131,3221 length can be the 90%~110% of its length for facing welding section 222,3132,3222.

As shown in Figure 3 and Figure 9, the multiple LED chip 4 is located in the accommodation groove 111 of above-mentioned shell 1 and fixed and electricity Property is connected to the carrying section 21 of LED support 2.Wherein, each LED chip 4 is to be located at multiple choked flow grooves 211 in this present embodiment In two adjoining choked flow grooves 211 between (it is, any two adjacent LED chips 4 are with a resistance Groove 211 is flowed to separate), and each LED chip 4 is electrically connected at the carrying section 21 by conducting wire Wa.

It should be noted that multiple LED chips 4 of the present embodiment preferably can be respectively intended to issue wavelength between 620nm~ The blue ray of the red light of 630nm, the green light of 520nm~535nm and 447nm~472nm, But the utility model is not limited.

As shown in Figure 3 and Figure 9, the driving chip 5 is located in the accommodation groove 111 of above-mentioned shell 1 and is fixed on wherein one The functional section 311 of a side stand 31 and with routing be electrically connected at another one side stand 31 functional section 311 and two The functional section 321 of conducting bracket 32.It should be noted that the driving chip 5 is also electrically connected in the present embodiment with routing Its functional section 311 fixed, but the utility model is not only restricted to this.Furthermore multiple LED chips 4 are respectively electrically connected with routing It is connected to the driving chip 5, is emitted beam with that can be driven by the driving chip 5.

Further say, the driving chip 5 includes multiple metal gaskets 51, and above-mentioned multiple metal gaskets 51 respectively with Conducting wire Wa is connected to four functional sections 311,321 and multiple LED chips 4 of driving arm group 3.Wherein, correspond to driving arm Four metal gaskets 51 of four functional sections 311,321 of group 3 are preferably four angles for being located at above-mentioned driving chip 5 Other metal gaskets 51 for falling, and corresponding to multiple LED chips 4 are then positioned at the position of the neighbouring carrying section 21 of driving chip 5, accordingly Keep the routing step of the light-emitting diode encapsulation structure 100 of the present embodiment more easy and be effectively prevented from those to lead Line Wa is staggeredly or too long and derive reliability problem.

As shown in Figure 3 and Figure 9, the Zener diode chip 7 is fixed on described in one of them of two conducting brackets 32 The functional section 321 of conducting bracket 32.That is, in the functional section 321 for being formed with choked flow groove 3211, two pole of Zener Tube chip 7 is affixed to the crystal bonding area 3213 of the functional section 321, and the routing area 3212 is beaten for driving chip 5 Line connection.Furthermore the Zener diode chip 7 is electrically connected at the carrying of LED support 2 by routing in the present embodiment Section 21.

As shown in figure 3, the light transmission package 6 is filled in the accommodation groove 111 of above-mentioned shell 1, so that above-mentioned multiple LED Chip 4, driving chip 5 and Zener diode chip 7 are embedded in light transmission package 6.Wherein, the accommodation groove of the shell 1 111 be to be filled up by light transmission package 6, but the utility model is not limited in the present embodiment.

In addition, as shown in fig. 6, a maximum width W100 of the light-emitting diode encapsulation structure 100 on width direction W is removed With a ratio of the maximum height H100 in height direction H, it is preferably between 0.8~1.2.And the light emitting diode The maximum length of encapsulating structure 100 in the length directionl is at least above-mentioned maximum width W100 (or maximum height H100) Twice.Accordingly, the light-emitting diode encapsulation structure 100 of the present embodiment can regard user demand, and with its multiple side view welding section 221, it 3131,3221 is welded and fixed, Lai Shixian lateral direction light emission, or welding section 222,3132,3222 multiple is faced with its It is welded and fixed, to realize positive shine.

[technical effect of the utility model embodiment]

In conclusion light-emitting diode encapsulation structure 100 disclosed in the utility model embodiment, internal to be configured with energy Enough drive the driving chip 5 of multiple LED chips 4 so that the internal structure of the light-emitting diode encapsulation structure 100 be not necessarily to by The limitation of external drive chip.Furthermore the bending pin 22,313,322 of the light-emitting diode encapsulation structure 100 is by shell 1 one of side 13 is pierced by and bends the bottom surface 12 for extending to shell 1, enables light-emitting diode encapsulation structure 100 accordingly Lateral direction light emission or positive luminous is enough selectively realized depending on user demand.

The foregoing is merely the preferred possible embodiments of the utility model, not are used to limit to the protection model of the utility model It encloses, all equivalent changes and modifications done according to the utility model patent range should all belong to claims of the utility model Protection scope.

Claims (16)

1. a kind of light-emitting diode encapsulation structure, which is characterized in that the light-emitting diode encapsulation structure includes:

One LED support includes a carrying section and two bending pins for being connected in the carrying section；

One driving arm group is set in distance with the LED support and includes that there are two side stands；Wherein, each described collateral Frame includes a functional section, is connected in an extended segment of the functional section and is connected in a bending pin of the extended segment；

One shell, includes multiple sides of a top surface, a bottom surface and the connection top surface and the bottom surface, and the shell Body is formed with an accommodation groove from top surface recess, to expose the carrying section and two functional sections；Wherein, the LED The bending pin of two of bracket and two of the driving arm group bending pins all by multiple sides its In a side be pierced by the shell and bend extend to the bottom surface；

Multiple LED chips in the accommodation groove and fix and are electrically connected at the carrying section；

One driving chip is located in the accommodation groove, and the driving chip is fixed on one of institute of two functional sections It states functional section and functional section described in another one is electrically connected at routing；Wherein, multiple LED chips are respectively with routing It is electrically connected at the driving chip, is emitted beam with that can be driven by the driving chip；And

One light transmission package is filled in the accommodation groove, so that multiple LED chips and the driving chip are embedded in institute It states in transparent encapsulant body.

2. light-emitting diode encapsulation structure as described in claim 1, which is characterized in that described in each side stand Functional section is connected with the extended segment constitutes a L-shape configuration, and the extended segment is corresponding to L-type construction corner Position is formed with a perforation, and the perforation is filled up by the shell.

3. light-emitting diode encapsulation structure as described in claim 1, which is characterized in that described in each side stand The edge common depression of the edge of functional section and the extended segment is formed with a U-lag, and the U-lag is by the shell institute It fills up, so as to the part of the U-lag and fill out the slot bottom that the housing parts in the inner are all located at the accommodation groove.

4. light-emitting diode encapsulation structure as described in claim 1, which is characterized in that described in each side stand The marginal trough of extended segment is formed with multiple notches respectively for different directions, and multiple notches are by the shell institute It fills up.

5. light-emitting diode encapsulation structure as described in claim 1, which is characterized in that the LED support is in the carrying section With the inside line for bending pin joint described in each of which, recess is formed with notch in one, and each interior notch quilt The shell is filled up.

6. light-emitting diode encapsulation structure as described in claim 1, which is characterized in that be exposed to the described of the accommodation groove Recess is formed with multiple choked flow grooves on LED support surface, and each LED chip is in multiple choked flow grooves Two adjoining choked flow grooves between.

7. light-emitting diode encapsulation structure as described in claim 1, which is characterized in that the accommodation groove is elongated and defines There is a length direction, the shell, which defines, is orthogonal to the length direction and a mutually orthogonal width direction and a height side To, and the maximum width of the light-emitting diode encapsulation structure in the width direction is divided by the short transverse A maximum height a ratio, between 0.8~1.2.

8. light-emitting diode encapsulation structure as described in claim 1, which is characterized in that the shell includes multiple fins, And multiple fin positions are on each side for being pierced by of bending pin, and each fin is from the top surface court Extend to the bottom surface and is formed.

9. light-emitting diode encapsulation structure as described in claim 1, which is characterized in that the driving arm group is in the LED A conducting bracket is provided between bracket and each side stand, each conducting bracket includes a functional section and is connected One in the functional section bends pin；The functional section of each conducting bracket is exposed to the accommodation groove, and institute It states each of light-emitting diode encapsulation structure bending pin and institute is pierced by by one of them described side of multiple sides It states shell and bends and extend to the bottom surface.

10. light-emitting diode encapsulation structure as claimed in claim 9, which is characterized in that the shell includes to be formed in it Multiple fins of outer surface, the bending pins of two conducting brackets have an escape port in locating each recess toward each other, And each escape port contains the part of a fin.

11. light-emitting diode encapsulation structure as claimed in claim 9, which is characterized in that the light-emitting diode encapsulation structure It further comprise being embedded in the Zener diode chip of the light transmission package, and the Zener diode chip is fixed on The functional section of one of them of the two conducting brackets conducting bracket.

12. light-emitting diode encapsulation structure as claimed in claim 9, which is characterized in that each bending pin includes One side view welding section and one face welding section, what the side view welding section of each bending pin was pierced by adjacent to it The side, and each the described of bending pin faces welding section adjacent to the bottom surface.

13. light-emitting diode encapsulation structure as claimed in claim 12, which is characterized in that it is multiple it is described bending pins it is described Side view welding section is located in one first plane, and the welding section of facing of multiple bending pins is located at vertical described first In one second plane of plane.

14. light-emitting diode encapsulation structure as claimed in claim 12, which is characterized in that the shell is recessed in the bottom surface Multiple grooves are formed with, and one end of each groove is connected to the side that each bending pin is pierced by, And it faces welding section described in multiple to be set in multiple grooves.

15. light-emitting diode encapsulation structure as claimed in claim 14, which is characterized in that the underrun of the shell It forms multiple grooves and constitutes spaced two F shape ribs, and two of the LED support face welding section Between two F shape ribs, each side stand and its described of the adjacent conducting bracket face welding section It is set in the F shape ribs.

16. light-emitting diode encapsulation structure as claimed in claim 9, which is characterized in that the driving chip includes multiple Metal gasket, multiple metal gaskets are connected to four functional sections and multiple LED chips respectively with a plurality of conducting wire.