CN208644412U - A kind of fiber guides formula laser cutting device - Google Patents
A kind of fiber guides formula laser cutting device Download PDFInfo
- Publication number
- CN208644412U CN208644412U CN201821106618.6U CN201821106618U CN208644412U CN 208644412 U CN208644412 U CN 208644412U CN 201821106618 U CN201821106618 U CN 201821106618U CN 208644412 U CN208644412 U CN 208644412U
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- optical fiber
- fiber
- cutting device
- laser
- focus
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Abstract
The utility model provides a kind of fiber guides formula laser cutting device, carries out light beam separation and transmitting using optical fiber, realizes collimation and avoids loss, and in the ablation for finally realizing two focuses, is capable of increasing the thickness of the substrate of cutting；This kind cutting, can realize to the greatest extent and reduce crackle and clast, and ablation velocity gets a promotion；Lesser width of slit can be obtained, and the relative spacing of focus can be adjusted flexibly.
Description
Technical field
The utility model relates to laser machine the especially cutter device used in the laser cutting of Silicon Wafer, specifically relate to
And a kind of fiber guides formula laser cutting device.
Background technique
At present in the manufacture of semiconductor integrated circuit, the cutting of Silicon Wafer is essential process.Although in laser
Cutting field, can be realized preferably parameter in terms of width of slit and cut quality, but crystalline substance biggish for thickness
For circle substrate, cutting efficiency is more low, or even more many slowly than traditional machine cuts speed.In addition, laser
Before cutting, generally require to carry out laser beam additional alignment procedures, which further reduces cutting efficiencies.
Utility model content
Based on solving the above problems, the utility model provides a kind of fiber guides formula laser cutting device, including laser
Device and optical system；
The optical system includes spectroscope, the fiber optic splitter set gradually along the laser transmission direction of the laser
Device, guiding optical cable, optical fiber fixed plate and condenser；The guiding optical cable includes one first optical fiber and multiple second optical fiber, described
Multiple second optical fiber are around around first optical fiber, and the optical fiber splitter is inserted into one end of the guiding optical cable,
The other end is inserted into the guide hole of the optical fiber fixed plate；
The laser that the laser is emitted is split into the equally distributed laser beam of multi beam by the spectroscope；
The optical fiber splitter guides the multiple laser beam to first optical fiber and the second optical fiber, and via institute
State guide hole outgoing；
The laser beam of first fiber exit focuses to the first focal point via the condenser, and second optical fiber goes out
The laser beam penetrated focuses to the second focal point via the condenser.
Embodiment according to the present utility model, the diameter of first optical fiber are greater than the diameter of second optical fiber.
Embodiment according to the present utility model, the distance between first optical fiber and the second optical fiber are 100 μm of -1mm.
Embodiment according to the present utility model, the cutter device for cutting thickness greater than 100 microns Silicon Wafer or
Electric substrate.
Embodiment according to the present utility model, the position of first focus are located at the upper of the Silicon Wafer or electric substrate
Surface.
Embodiment according to the present utility model, second focus be located at the first focus along central light beam direction just under
Side.
Embodiment according to the present utility model, the condenser are the convex mirror of hyperbolicity.
Embodiment according to the present utility model controls first by adjusting the curvature parameters of the hyperbolicity of the convex mirror
The distance between focus and the second focus.
The advantages of the utility model, is as follows:
(1) light beam separation and transmitting are carried out using optical fiber, realize collimation and avoids loss, and realize two final
The ablation of focus is capable of increasing the thickness of the substrate of cutting；
(2) this kind is cut, and can be realized to the greatest extent and be reduced crackle and clast, and ablation velocity gets a promotion；
(3) lesser width of slit can be obtained, and the relative spacing of focus can be adjusted flexibly.
Detailed description of the invention
Fig. 1 is the schematic diagram of fiber guides formula laser cutting device；
Fig. 2 is the parfocal schematic diagram in school.
Specific embodiment
Referring to Fig. 1, the fiber guides formula laser cutting device of the utility model, including laser 1 and optical system；
The optical system includes the spectroscope 2 set gradually along the laser transmission direction of the laser 1, optical fiber point
Road device 3, guiding optical cable, optical fiber fixed plate 6 and condenser 7；The guiding optical cable includes one first optical fiber 4 and multiple second optical fiber
5, the multiple second optical fiber 5 is around around first optical fiber 4, and the optical fiber is inserted into one end of the guiding optical cable
Splitter 3, the other end are inserted into the guide hole of the optical fiber fixed plate 6；
The laser L that the laser 1 is emitted is split into the equally distributed laser beam L1 of multi beam by the spectroscope 2；
The optical fiber splitter 3, which guides the multiple laser beam L1 to first optical fiber and the second optical fiber, (to swash
Light beam L11 and L12), and be emitted via the guide hole；
The laser beam that first optical fiber 4 is emitted focuses at the first focus A via the condenser 7, second light
The laser beam of 5 outgoing of fibre focuses at the second focus B via the condenser 7.
In order to which laser can be greater than the straight of second optical fiber in center Relatively centralized, the diameter of first optical fiber
Diameter.The distance between first optical fiber and the second optical fiber are preferably adjustable, accordingly even when the case where being changed without condenser
Under, it can also adjust between the spacing of the first focus A and the second focus B, such as optional first optical fiber and the second optical fiber
Away from for 100 μm of -1mm.
The cutting harness has bifocal point structure, and depth of focus is larger, therefore the cutter device can be used in cutting thickness
Silicon Wafer or electric substrate greater than 100 microns, such as substrate 8.In use, the position of the first focus A is located at the silicon
The upper surface of wafer or electric substrate.The second focus B is located at the underface along central light beam direction of the first focus.
Embodiment according to the present utility model, the condenser 7 is the convex mirror of hyperbolicity, by adjusting the convex mirror
The curvature parameters of hyperbolicity control the distance between the first focus and the second focus.
In addition, will lead to the variation of the first focus A and the second focus B, such as Fig. 2 when having replaced different condensers 7
(a) in, the first focus A1 and the second focus B1 are focusing deviation at this time not in same vertical line, need to give condenser 7
With adjustment, so that focus becomes being that i.e. the first focus A2, focus is realized in the position of the second focus B2 at this time where Fig. 2 (b)
Rapid alignment.
Finally, it should be noted that obviously, above-described embodiment is merely examples for clearly illustrating the present invention,
And it does not limit the embodiments.For those of ordinary skill in the art, may be used also on the basis of the above description
To make other variations or changes in different ways.There is no necessity and possibility to exhaust all the enbodiments.And thus
Changes and variations that derived from still in the protection scope of the utility model among.
Claims (8)
1. a kind of fiber guides formula laser cutting device, including laser and optical system；
The optical system include the spectroscope set gradually along the laser transmission direction of the laser, optical fiber splitter,
Guiding optical cable, optical fiber fixed plate and condenser；The guiding optical cable includes one first optical fiber and multiple second optical fiber, the multiple
Second optical fiber is around around first optical fiber, and the optical fiber splitter is inserted into one end of the guiding optical cable, another
End is inserted into the guide hole of the optical fiber fixed plate；
The laser that the laser is emitted is split into the equally distributed laser beam of multi beam by the spectroscope；
The multiple laser beam is guided to first optical fiber and the second optical fiber, and led via described by the optical fiber splitter
Hole outgoing；
The laser beam of first fiber exit focuses to the first focal point via the condenser, second fiber exit
Laser beam focuses to the second focal point via the condenser.
2. fiber guides formula laser cutting device according to claim 1, which is characterized in that the diameter of first optical fiber
Greater than the diameter of second optical fiber.
3. fiber guides formula laser cutting device according to claim 2, which is characterized in that first optical fiber and second
The distance between optical fiber is 100 μm of -1mm.
4. fiber guides formula laser cutting device according to claim 1, which is characterized in that the cutter device is for cutting
Cut Silicon Wafer or electric substrate that thickness is greater than 100 microns.
5. fiber guides formula laser cutting device according to claim 4, which is characterized in that the position of first focus
Positioned at the upper surface of the Silicon Wafer or electric substrate.
6. fiber guides formula laser cutting device according to claim 5, which is characterized in that second focus is located at the
The underface along central light beam direction of one focus.
7. fiber guides formula laser cutting device according to claim 1, which is characterized in that the condenser is hyperbolicity
Convex mirror.
8. fiber guides formula laser cutting device according to claim 7, which is characterized in that by adjusting the convex mirror
The curvature parameters of hyperbolicity control the distance between the first focus and the second focus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821106618.6U CN208644412U (en) | 2018-07-13 | 2018-07-13 | A kind of fiber guides formula laser cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821106618.6U CN208644412U (en) | 2018-07-13 | 2018-07-13 | A kind of fiber guides formula laser cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208644412U true CN208644412U (en) | 2019-03-26 |
Family
ID=65784791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821106618.6U Active CN208644412U (en) | 2018-07-13 | 2018-07-13 | A kind of fiber guides formula laser cutting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208644412U (en) |
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2018
- 2018-07-13 CN CN201821106618.6U patent/CN208644412U/en active Active
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