CN208637441U - Backboard and solar components - Google Patents
Backboard and solar components Download PDFInfo
- Publication number
- CN208637441U CN208637441U CN201821020779.3U CN201821020779U CN208637441U CN 208637441 U CN208637441 U CN 208637441U CN 201821020779 U CN201821020779 U CN 201821020779U CN 208637441 U CN208637441 U CN 208637441U
- Authority
- CN
- China
- Prior art keywords
- layer
- heat
- honeycomb
- backboard
- heat dissipating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 239000012782 phase change material Substances 0.000 claims abstract description 30
- 239000002131 composite material Substances 0.000 claims abstract description 17
- 239000010410 layer Substances 0.000 claims description 160
- 239000012790 adhesive layer Substances 0.000 claims description 26
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- 239000004411 aluminium Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 description 44
- 230000008859 change Effects 0.000 description 27
- 239000012071 phase Substances 0.000 description 26
- 230000007704 transition Effects 0.000 description 16
- 239000007791 liquid phase Substances 0.000 description 15
- 239000007790 solid phase Substances 0.000 description 10
- 238000010248 power generation Methods 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 230000009466 transformation Effects 0.000 description 5
- 229910002056 binary alloy Inorganic materials 0.000 description 4
- 229920002521 macromolecule Polymers 0.000 description 4
- 239000012188 paraffin wax Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- -1 Polyethylene Terephthalate Polymers 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- NPHFFBWJNRVQNH-UHFFFAOYSA-H NN.S(=O)(=O)([O-])[O-].[Al+3].S(=O)(=O)([O-])[O-].S(=O)(=O)([O-])[O-].[Al+3] Chemical class NN.S(=O)(=O)([O-])[O-].[Al+3].S(=O)(=O)([O-])[O-].S(=O)(=O)([O-])[O-].[Al+3] NPHFFBWJNRVQNH-UHFFFAOYSA-H 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000578 graft copolymer Polymers 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 238000001192 hot extrusion Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- MFUVDXOKPBAHMC-UHFFFAOYSA-N magnesium;dinitrate;hexahydrate Chemical compound O.O.O.O.O.O.[Mg+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MFUVDXOKPBAHMC-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- RSIJVJUOQBWMIM-UHFFFAOYSA-L sodium sulfate decahydrate Chemical compound O.O.O.O.O.O.O.O.O.O.[Na+].[Na+].[O-]S([O-])(=O)=O RSIJVJUOQBWMIM-UHFFFAOYSA-L 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000005439 thermosphere Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- NJYFRQQXXXRJHK-UHFFFAOYSA-N (4-aminophenyl) thiocyanate Chemical compound NC1=CC=C(SC#N)C=C1 NJYFRQQXXXRJHK-UHFFFAOYSA-N 0.000 description 1
- KVHWFHCZKKAJTA-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol ethane Chemical compound CC.OCC(C)(CO)C KVHWFHCZKKAJTA-UHFFFAOYSA-N 0.000 description 1
- BDKLKNJTMLIAFE-UHFFFAOYSA-N 2-(3-fluorophenyl)-1,3-oxazole-4-carbaldehyde Chemical compound FC1=CC=CC(C=2OC=C(C=O)N=2)=C1 BDKLKNJTMLIAFE-UHFFFAOYSA-N 0.000 description 1
- UXFQFBNBSPQBJW-UHFFFAOYSA-N 2-amino-2-methylpropane-1,3-diol Chemical compound OCC(N)(C)CO UXFQFBNBSPQBJW-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 229920001747 Cellulose diacetate Polymers 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- 229910001051 Magnalium Inorganic materials 0.000 description 1
- KVCWSJZUKMSPLM-UHFFFAOYSA-N O.O[PH2]=O Chemical compound O.O[PH2]=O KVCWSJZUKMSPLM-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 230000009102 absorption Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- ZUDYPQRUOYEARG-UHFFFAOYSA-L barium(2+);dihydroxide;octahydrate Chemical compound O.O.O.O.O.O.O.O.[OH-].[OH-].[Ba+2] ZUDYPQRUOYEARG-UHFFFAOYSA-L 0.000 description 1
- 235000015895 biscuits Nutrition 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- YMIFCOGYMQTQBP-UHFFFAOYSA-L calcium;dichloride;hydrate Chemical class O.[Cl-].[Cl-].[Ca+2] YMIFCOGYMQTQBP-UHFFFAOYSA-L 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- DHRRIBDTHFBPNG-UHFFFAOYSA-L magnesium dichloride hexahydrate Chemical compound O.O.O.O.O.O.[Mg+2].[Cl-].[Cl-] DHRRIBDTHFBPNG-UHFFFAOYSA-L 0.000 description 1
- ZATZOOLBPDMARD-UHFFFAOYSA-N magnesium;hydrate Chemical compound O.[Mg] ZATZOOLBPDMARD-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002114 nanocomposite Substances 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- UWJJYHHHVWZFEP-UHFFFAOYSA-N pentane-1,1-diol Chemical compound CCCCC(O)O UWJJYHHHVWZFEP-UHFFFAOYSA-N 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 229940087562 sodium acetate trihydrate Drugs 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Laminated Bodies (AREA)
Abstract
This application discloses a kind of backboard and solar components.Backboard includes substrate layer and thermally conductive composite layer；The thermally conductive composite layer includes the support heat-conducting layer and heat dissipating layer being stacked, the substrate layer is stacked in the side of the thermally conductive composite layer and adjacent with the support heat-conducting layer, and the heat dissipating layer includes the phase-change material for having the honeycomb casing play of multiple honeycomb holes and being arranged in the honeycomb hole.Solar components include foreboard, solar battery and the backboard；The solar battery pressure is set on the substrate layer, and the foreboard pressure is set on the solar battery.Backboard and solar components provided by the embodiment of the present application can be effectively reduced the temperature of solar components, improve generating efficiency.
Description
Technical field
This application involves technical field of solar more particularly to a kind of backboards and solar components.
Background technique
Solar power generation is a kind of major way of utilization of new energy resources.It is most of in the practical application of solar power generation
Solar energy be not converted to electric energy, but be converted into thermal energy, increase the temperature of solar components.If radiated not in time,
It will lead to solar energy generating efficiency decline, device accelerated ageing.It is reported that liter of the output power of solar power generation with temperature
High and reduces, every 1 DEG C of the raising of temperature, the output power of solar power generation will decline 0.4% or so, cause solar components not
Maximum performance can be played, cost of electricity-generating increases.
In order to improve the generating efficiency of solar components, it is necessary to take measures to give out the heat of solar components
It goes, reduces the temperature of solar components.The heat of solar components is mainly that backboard conducts.
However, backboard in the related technology mostly uses greatly glass or single high molecular material, it is not separately provided and leads
Hot composite layer, therefore heating conduction is poor, if the thermal coefficient of PET material only has 0.22W/ (mK), thermal coefficient is smaller, because
This causes the temperature of solar components to be difficult to decrease, and causes generating efficiency low.
Utility model content
The embodiment of the present application provides a kind of backboard and solar components, to solve the above problems.
The embodiment of the present application adopts the following technical solutions:
In a first aspect, the embodiment of the present application provides a kind of backboard, including substrate layer and thermally conductive composite layer；
The thermally conductive composite layer includes the support heat-conducting layer and heat dissipating layer being stacked, and the substrate layer is stacked
The side of the thermally conductive composite layer and adjacent with the support heat-conducting layer, the heat dissipating layer includes the honeycomb with multiple honeycomb holes
Casing play and the phase-change material being set in the honeycomb hole, the honeycomb casing play have multiple honeycomb holes, the honeycomb
The opening direction in hole is consistent with the thickness direction, and the phase-change material is filled in the honeycomb hole.
Preferably, in above-mentioned backboard, the quantity of the heat dissipating layer is at least one, and the quantity of the support heat-conducting layer is extremely
It is less two, the two sides of each heat dissipating layer are adjacent with a support heat-conducting layer respectively.
Preferably, in above-mentioned backboard, the quantity at least two of the heat dissipating layer, by close to the direction of the substrate layer
To the direction far from the substrate layer, the phase transition temperature gradient of the phase-change material in the different heat dissipating layers is reduced.
Preferably, in above-mentioned backboard, the cross sectional shape of the honeycomb hole is triangle, square, diamond shape, five-pointed star
One of shape, regular hexagon are a variety of.
Preferably, in above-mentioned backboard, the honeycomb casing play is metal beehive casing play.
Preferably, in above-mentioned backboard, the honeycomb casing play is aluminum honeycomb casing play, magnesium honeycomb casing play, magnalium conjunction
One of golden honeycomb casing play is a variety of.
Preferably, in above-mentioned backboard, the support heat-conducting layer is metal plate.
Preferably, in above-mentioned backboard, the support heat-conducting layer includes aluminium sheet, steel plate, stainless steel plate, one in alloy sheets
Kind is a variety of.
Preferably, in above-mentioned backboard, between the substrate layer and the support heat-conducting layer, the support heat-conducting layer and institute
It states and is bonded by adhesive layer between heat dissipating layer.
Second aspect, the embodiment of the present application provide a kind of solar components, including foreboard, solar battery and described
Backboard；The solar battery pressure is set on the substrate layer, and the foreboard pressure is set on the solar battery.
The embodiment of the present application use at least one above-mentioned technical solution can reach it is following the utility model has the advantages that
Backboard and solar components disclosed in the embodiment of the present application quickly absorb heat from substrate layer by support heat-conducting layer
And be transferred to heat dissipating layer and absorb and store for phase-change material, so as to which the temperature of solar components is effectively reduced, improve power generation
Efficiency.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present application, constitutes part of this application, this Shen
Illustrative embodiments and their description please are not constituted an undue limitation on the present application for explaining the application.In the accompanying drawings:
Fig. 1 is the layer topology view of the first and second of backboard disclosed in the embodiment of the present application；
Fig. 2 is the layer topology view of the third backboard disclosed in the embodiment of the present application.
Description of symbols:
10- substrate layer, 120- support heat-conducting layer, 120a- first support heat-conducting layer, 120b- second support heat-conducting layer,
120c- third support heat-conducting layer, 122- heat dissipating layer, the first heat dissipating layer of 122a-, the second heat dissipating layer of 122b-, 124- adhesive layer,
The first adhesive layer of 124a-, the second adhesive layer of 124b-, 124c- third adhesive layer, the 4th adhesive layer of 124d-, 124e- the 5th are bonded
Layer.
Specific embodiment
To keep the purposes, technical schemes and advantages of the application clearer, below in conjunction with the application specific embodiment and
Technical scheme is clearly and completely described in corresponding attached drawing.Obviously, described embodiment is only the application one
Section Example, instead of all the embodiments.Based on the embodiment in the application, those of ordinary skill in the art are not doing
Every other embodiment obtained under the premise of creative work out, shall fall in the protection scope of this application.
Below in conjunction with attached drawing, the technical scheme provided by various embodiments of the present application will be described in detail.
The embodiment of the present application discloses a kind of backboard, as depicted in figs. 1 and 2, including substrate layer 10 and thermally conductive composite layer.
Substrate layer 10 is used to support solar battery and transmitting heat, and the material of substrate layer 10 can individually use glass in the present embodiment
Glass or high molecular material can also be formed by composite layer using glass and high molecular material.High molecular material can use
PET (full name in English: Polyethylene Terephthalate, Chinese: polyethylene terephthalate), can also be with
It is considered as other high molecular materials.
Thermally conductive composite layer is used to absorb heat by substrate layer 10, reduces the temperature of substrate layer 10.Thermally conductive composite layer includes
The support heat-conducting layer 120 and heat dissipating layer 122 being stacked, support heat-conducting layer 120 play structural support and transmit the work of heat
With.Support heat-conducting layer 120 usually can be using metal plate, such as aluminium sheet, steel plate, stainless steel plate, alloy sheets etc..These gold
Belong to plate, that is, structural strength with higher, while also there is good heating conduction.Support the thickness of heat-conducting layer 120 can be according to production
Heating conduction needed for product, strength of materials etc. are selected, and are usually adjusted within the scope of 0.5-2mm.Substrate layer 10 is stacked
Thermally conductive composite layer side and with support heat-conducting layer 120 it is adjacent, the heat of substrate layer 10 can quickly conduct thermally conductive to supporting
On layer 120.
Heat dissipating layer 122 is storage and the absorbing structure of heat, and heat dissipating layer 122 includes honeycomb casing play and phase-change material,
Honeycomb casing play has multiple honeycomb holes, and phase-change material is arranged in honeycomb hole.
When forming solar components, solar battery pressure is set on substrate layer 10, then foreboard pressure is set to solar energy
On battery.In solar power generation, the heat of solar battery can be transferred to substrate layer 10 in this way, then pass through support heat-conducting layer
120 are transferred to heat dissipating layer 122.When supporting heat transfer to the heat dissipating layer 122 on heat-conducting layer 120, phase-change material can be by this
A little heat absorptions are simultaneously stored by phase transformation.In this way, support heat-conducting layer 120 can constantly be inhaled from substrate layer 10
It takes heat and is transferred to phase-change material, to achieve the purpose that reduce substrate layer 10 and solar battery temperature, improve the sun
The generating efficiency of energy battery.Also, since phase-change material stores heat by phase transformation mode, environment temperature compared with
When low, phase-change material can be released these heats by phase transformation again, thus to substrate layer 10 and solar battery into
Row heating weakens influence of the low temperature environment to solar battery, prevents solar battery or substrate layer 10 due to temperature is too low
Bursting by freezing.Since phase-change material is arranged in honeycomb hole, the scope of activities of phase-change material is limited, phase can be effectively prevent
Become material leakage.
In the present embodiment, in order to quickly transmit heat, the quantity of heat dissipating layer 122 is at least one, and supports heat-conducting layer
120 quantity at least two, the two sides of each heat dissipating layer 122 are adjacent with a support heat-conducting layer 120 respectively.Usual situation
Under, the quantity of support heat-conducting layer 120 can be more than 122 one than heat dissipating layer, and support heat-conducting layer 120 forms sandwich with heat dissipating layer 122
Biscuit structure.But the present embodiment is also not excluded for the case where possessing more support heat-conducting layer 120.In these support heat-conducting layers 120 most
One of close substrate layer 10 can be used as the medium that heat is transferred to heat dissipation composite layer 12 by substrate layer 10, with heat dissipating layer 122
Adjacent support heat-conducting layer 120 can be used as the medium that heat dissipating layer 122 transmits heat, and the support farthest apart from substrate layer 10 is led
Thermosphere 120 is actually also the outermost layer of heat dissipation composite layer 12, can be used for exchanging with external world's progress heat and radiate.
As depicted in figs. 1 and 2, in the present embodiment, the quantity of heat dissipating layer 122 can only have one, can also have simultaneously
Have several.When the quantity of heat dissipating layer 122 is in two or more, the phase transition temperature of the phase-change material inside these heat dissipating layers 122
It may be the same or different.
Since phase-change material can only be absorbed when reaching phase transition temperature by phase transition process and store heat, if
Temperature, which is not up to phase transition temperature, can not then store heat, therefore in order to store more heats, preferably each heat dissipating layer 122
Using the phase-change material of different phase transition temperatures.Also, since closer to substrate layer 10, then temperature is higher, by by stating substrate layer
The phase transition temperature preferred gradient in 10 direction to the direction far from substrate layer 10, the phase-change material in different heat dissipating layers 122 reduces,
I.e. further away from substrate layer 10, the phase transition temperature of phase-change material is lower, the most advantageous for storage heat in this way, while can also add
Fast rate of temperature fall.
In the present embodiment, phase-change material can use solid-solid phase change material or solid-liquid phase change material.Wherein, solid-solid phase change
For material because being solid-state before and after deformation, mobility is poor, can simplify encapsulating structure.Specifically, solid-solid phase change material can
To include but is not limited to polyalcohols solid-solid phase change material, inorganic salts solid-solid phase change material, high score subclass solid-solid phase change material
One of or it is a variety of.
Wherein, polyalcohols solid-solid phase change material can be unitary system, such as neopentyl glycol (NPG), 2- amino 2- methyl
1,3 propylene glycol (AMP) etc..It can also be binary system, such as pentaerythrite-neopentyl glycol (PE-NPG) binary system, dihydroxy first
Base ethane-neopentyl glycol (PG-NPG) binary system, neopentyl glycol-trishydroxymethylaminomethane (NPG-TAM) binary system
Deng.Inorganic salts solid-solid phase change material can be laminated perovskite class organo-metallic compound, rhodan ammonium etc..High score subclass is solid
Solid phase change material is divided into crosslinked polymer resin class (such as cross-linked polyolefin, crosslined polyacetal) again and graft copolymerization species are (such as
Polystyrene graft copolymers, cellulose graft copolymer etc.).Wherein graft copolymerization species are by the solid-liquid to better performances
Phase-change material is blended or is chemically reacted modification, to obtain existing solid-solid phase change characteristic, and has high score subclass material mechanical
The energy-accumulating material for the features such as performance is good, easy processing forms, therefore have good development prospect.
Solid-liquid phase change material in the present embodiment can include but is not limited to inorganic hydrated salt class solid-liquid phase change material, organic
One of solid-liquid phase change material, compound solid-liquid phase change material are a variety of.Specifically, inorganic water and salt solid-liquid phase change material can
To include sodium acetate trihydrate, hypo, magnesium nitrate hexahydrate, Magnesium dichloride hexahydrate, six calcium chloride hydrates, seven
Nitric hydrate magnesium, barium hydroxide octahydrate, Disodium sulfate decahydrate, 12 hypophosphite monohydrate hydrogen sodium, 12 hydrazine aluminum sulfates and 18
One of hydrazine aluminum sulfate is a variety of.Organic solid-liquid phase change material can include but is not limited to paraffin, fatty acid, polyalcohols
One of solid-liquid phase change material is a variety of.
Compound solid-liquid phase change material includes but is not limited to macromolecule resin and solid-liquid phase change material system, wherein high score
Subtree rouge is the skeleton of compound solid-liquid phase change material, and solid-liquid phase change system is compound with macromolecule resin, is filled in high molecular material
Between gap in.It is binary or multi-element compounds combined phase-change system that solid-liquid phase change material system can include but is not limited to, low
One of congruent melting phase transformation system, nano composite phase variant system are a variety of.Although this compound solid-liquid phase change material is solid liquid phase
Deformation type, but due to the presence of macromolecule resin skeleton, solid shape can be kept in phase transition process, and leaked liquid is not present
Phenomenon, there is no need to container encapsulation.Macromolecule resin can use high density polyethylene (HDPE), polystyrene, silicon rubber or other high
One of molecule resin is a variety of.
In order to improve heat transfer efficiency, honeycomb casing play is the preferable metal beehive casing play of heating conduction, it is preferred to use aluminium
One of the highly heat-conductive materials or its modified material such as honeycomb casing play, magnesium honeycomb casing play, almag honeycomb casing play
Or a variety of made honeycomb casing plays.The cross sectional shape of honeycomb hole can be triangle, square, diamond shape, pentalpha, just
The various shapes such as hexagon, and the honeycomb hole on honeycomb casing play both can be single shape, it can also be simultaneously using a variety of
Shape.For the thickness of heat dissipating layer 122 usually within the scope of 5-30mm, specific thickness can be according to required heat dissipation effect, phase transformation material
Material supports the material of heat-conducting layer 120 and quantity, the quantity of heat dissipating layer 122 etc. to comprehensively consider.
In the present embodiment, the phase transition temperature of phase-change material is preferably within the scope of 15-50 DEG C, wherein being best with 40 DEG C.
This temperature range is suitable with the optimum working temperature of solar battery, therefore is conducive to improve the power generation effect of solar battery
Rate.When the quantity more than one of heat dissipating layer 122, the phase transition temperature of the phase-change material away from the nearest heat dissipating layer 122 of substrate layer 10
Preferably 40 DEG C or so.In order to meet this requirement, the phase-change material can using neopentyl glycol, season pentanediol, modified paraffin,
Polyethylene glycol and cellulose diacetate blending modified material etc., the phase transition temperature of these phase-change materials are 40 DEG C or so.
In the present embodiment, either substrate layer 10 and support heat-conducting layer 120, or support heat-conducting layer 120 and heat dissipating layer
122 are required to be fixedly connected.It, can be between substrate layer 10 and support heat-conducting layer 120, support heat-conducting layer in order to be connected firmly
It is carried out by adhesive layer 124 between 120 and heat dissipating layer 122 be bonded.The material of adhesive layer 124 can use EVA (ethylene-vinegar
Sour ethylene copolymer), epoxy resin, PVB (polyvinyl butyral), organosilicon or other cohesive materials.And bonding process
Hot extrusion briquetting technique can be used.In view of portability, the integral thickness of backboard is preferably not higher than 5cm.
Some back board structures in the embodiment of the present application are described below:
It from top to bottom successively include substrate layer 10, the as shown in Figure 1, backboard provided by one embodiment of the application
One adhesive layer 124a, the first support heat-conducting layer 120a, the second adhesive layer 124b, heat dissipating layer 122, third adhesive layer 124c and second
Support heat-conducting layer 120b.The material of substrate layer 10 is glass, and the material of the first adhesive layer 124a is EVA, the second adhesive layer 124b
Material with third adhesive layer 124c is epoxy resin, and the first support heat-conducting layer 120a and the second support heat-conducting layer 120b are thickness
For the aluminium sheet of 1mm, the honeycomb casing play in heat dissipating layer 120 is 3033 type aluminum honeycomb core plates of hexagon, is arranged in honeycomb hole
Phase-change material be Disodium sulfate decahydrate and borax mixture, 32 DEG C of phase transition temperature.First support heat-conducting layer 120a, second are glued
Knot layer 124b, heat dissipating layer 122, the support of third adhesive layer 124c and second heat-conducting layer 120b are made of hot extrusion briquetting technique.
Backboard provided by another embodiment of the application, the difference with one embodiment is, in honeycomb hole
The phase-change material of setting is the industrial paraffin that carbon atom number is 22, and phase transition temperature is 44.4 DEG C, latent heat of phase change 250KJ/
Kg, thermal coefficient are 15.1W/ (mK).
As shown in Fig. 2, the third backboard provided by the embodiment of the present application, from top to bottom successively includes substrate layer 10, the
One adhesive layer 124a, first support heat-conducting layer 120a, the second adhesive layer 124b, the first heat dissipating layer 122a, third adhesive layer 124c,
Second support heat-conducting layer 120b, the 4th adhesive layer 124d, the second heat dissipating layer 122b, the 5th adhesive layer 124e and third support are thermally conductive
Layer 120c.Substrate layer 10 is glass, the first adhesive layer 124a, the second adhesive layer 124b, third adhesive layer 124c, the 4th adhesive layer
124d and the 5th adhesive layer 124e is EVA, and the first support heat-conducting layer 120a, the second support heat-conducting layer 120b and third support are led
Thermosphere 120c is aluminium sheet, and the honeycomb casing play in the first heat dissipating layer 122a is 3033 type aluminum honeycomb core plates of hexagon, honeycomb hole
The phase-change material of middle setting is lauric acid, and phase transition temperature is 44 DEG C, latent heat of phase change 237KJ/kg, and thermal coefficient is
Honeycomb casing play in 0.221W/ (mK), the second heat dissipating layer 122b is 3033 type aluminum honeycomb core plates of hexagon, in honeycomb hole
The phase-change material of setting is the industrial paraffin that carbon atom number is 16, and phase transition temperature is 16.7 DEG C, latent heat of phase change 237KJ/kg,
Thermal coefficient is 15.1W/ (mK).
Backboard and solar components provided by the embodiment of the present application can be effectively reduced the temperature of solar components, improve
Generating efficiency.In addition to this also have structure simple, design is scientific and reasonable, light weight, and it is easy to install and use, it is practical to wait spies
Point.
Emphasis describes the difference between each embodiment, difference between each embodiment in the application foregoing embodiments
As long as optimization feature non-contradiction, can combine to form more preferably embodiment, it is contemplated that style of writing is succinct, then no longer superfluous at this
It states.
The above description is only an example of the present application, is not intended to limit this application.For those skilled in the art
For, various changes and changes are possible in this application.All any modifications made within the spirit and principles of the present application are equal
Replacement, improvement etc., should be included within the scope of the claims of this application.
Claims (10)
1. a kind of backboard, which is characterized in that including substrate layer and thermally conductive composite layer；
The thermally conductive composite layer includes the support heat-conducting layer and heat dissipating layer being stacked, and the substrate layer is arranged described thermally conductive
The side of composite layer and adjacent with the support heat-conducting layer, the heat dissipating layer include have the honeycomb casing play of multiple honeycomb holes with
And the phase-change material in the honeycomb hole is set.
2. backboard according to claim 1, which is characterized in that the quantity of the heat dissipating layer is at least one, the support
The quantity at least two of heat-conducting layer, the two sides of each heat dissipating layer are adjacent with a support heat-conducting layer respectively.
3. backboard according to claim 1 or 2, which is characterized in that the quantity at least two of the heat dissipating layer, by close
The direction of the substrate layer to the direction far from the substrate layer, the phase alternating temperature of the phase-change material in the different heat dissipating layers
Spending gradient reduces.
4. backboard according to claim 1 or 2, which is characterized in that the cross sectional shape of the honeycomb hole is triangle, pros
One of shape, diamond shape, pentalpha, regular hexagon are a variety of.
5. backboard according to claim 1 or 2, which is characterized in that the honeycomb casing play is metal beehive casing play.
6. backboard according to claim 5, which is characterized in that the honeycomb casing play is aluminum honeycomb casing play, magnesium honeycomb
One of casing play, almag honeycomb casing play are a variety of.
7. backboard according to claim 1 or 2, which is characterized in that the support heat-conducting layer is metal plate.
8. backboard according to claim 7, which is characterized in that the support heat-conducting layer includes aluminium sheet, steel plate, stainless steel
One of plate, alloy sheets are a variety of.
9. backboard according to claim 1 or 2, which is characterized in that between the substrate layer and the support heat-conducting layer, institute
It states Nian Jie by adhesive layer between support heat-conducting layer and the heat dissipating layer.
10. a kind of solar components, which is characterized in that including any one of foreboard, solar battery and claim 1 to 9 institute
The backboard stated；The solar battery pressure is set on the substrate layer, and the preceding board stacking pressure is set on the solar battery.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821020779.3U CN208637441U (en) | 2018-06-29 | 2018-06-29 | Backboard and solar components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821020779.3U CN208637441U (en) | 2018-06-29 | 2018-06-29 | Backboard and solar components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208637441U true CN208637441U (en) | 2019-03-22 |
Family
ID=65735993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821020779.3U Active CN208637441U (en) | 2018-06-29 | 2018-06-29 | Backboard and solar components |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208637441U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112670362A (en) * | 2020-12-30 | 2021-04-16 | 苏州度辰新材料有限公司 | Anti ultraviolet heat conduction solar backplane |
| CN113098325A (en) * | 2021-03-19 | 2021-07-09 | 北京科技大学 | Wearable thermoelectric generator with multilayer phase-change material radiator |
-
2018
- 2018-06-29 CN CN201821020779.3U patent/CN208637441U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112670362A (en) * | 2020-12-30 | 2021-04-16 | 苏州度辰新材料有限公司 | Anti ultraviolet heat conduction solar backplane |
| CN112670362B (en) * | 2020-12-30 | 2023-12-29 | 苏州度辰新材料有限公司 | Anti-ultraviolet heat-conducting solar backboard |
| CN113098325A (en) * | 2021-03-19 | 2021-07-09 | 北京科技大学 | Wearable thermoelectric generator with multilayer phase-change material radiator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Yuan et al. | Engineering the thermal conductivity of functional phase‐change materials for heat energy conversion, storage, and utilization | |
| CN208637441U (en) | Backboard and solar components | |
| CN101033890B (en) | Flat-plate solar heat collector | |
| Yu et al. | Research progress on utilization of phase change materials in photovoltaic/thermal systems: A critical review | |
| CN204011602U (en) | A kind of phase-change heat radiating device for flat battery | |
| CN101285622A (en) | Energy storage -type solar flat-board heat collector for increasing metal fin | |
| CN108428816A (en) | The high-efficiency heat-radiation dynamic cell packet of phase transformation and air-cooled combination | |
| US20170222080A1 (en) | Solar cell module, method of manufacturing the same, and photovoltaic power generation system | |
| CN105895721A (en) | Double-side solar cell module | |
| CN101285623A (en) | Solar flat-board heat collector containing high porosity rate foamed metal | |
| CN107275427B (en) | A kind of compound photovoltaic and photothermal integral component based on mental section substrate | |
| CN201050899Y (en) | Plate-type solar heat-collecting device | |
| CN201251297Y (en) | A solar flat plate collector containing high-porosity foam metal | |
| CN110906430A (en) | A solar collector and heating system for wisdom community | |
| CN206789655U (en) | A kind of power battery module | |
| CN201251296Y (en) | An energy-storage solar flat plate collector with additional metal fin | |
| CN206076251U (en) | A kind of double-sided solar battery component | |
| CN218276629U (en) | Composite solar panel | |
| CN206110604U (en) | Heating floor is moulded to glass | |
| TW202020391A (en) | Solar panel with cooling device | |
| CN209181294U (en) | Light-weighted photovoltaic and photothermal circuit board | |
| CN219393408U (en) | Photovoltaic backboard | |
| CN209088892U (en) | A kind of photovoltaic and photothermal integral component of fluid channel substrate | |
| CN217955878U (en) | Photovoltaic module | |
| CN203950820U (en) | A kind of flexible crystal silicon solar batteries assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210408 Address after: 518057 Room 201, building a, No.1 Qianwan 1st Road, Qianhai Shenzhen Hong Kong cooperation zone, Shenzhen City, Guangdong Province Patentee after: Shenzhen Zhengyue development and Construction Co.,Ltd. Address before: Room 107, building 2, Olympic Village street, Chaoyang District, Beijing Patentee before: HANERGY MOBILE ENERGY HOLDING GROUP Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210909 Address after: No.66210, 3rd floor, Pudong Free Trade Zone, Shanghai, China Patentee after: Shanghai zuqiang Energy Co.,Ltd. Address before: 518057 Room 201, building a, No.1 Qianwan 1st Road, Qianhai Shenzhen Hong Kong cooperation zone, Shenzhen City, Guangdong Province Patentee before: Shenzhen Zhengyue development and Construction Co.,Ltd. |
|
| TR01 | Transfer of patent right |