CN208633445U - A kind of heating floor - Google Patents

Abstract

The utility model discloses a kind of heating floors, including upper substrate and lower substrate, the lower surface bonds of upper substrate are fixed with heat-conducting plate, heat-conducting plate upper surface array is fixed with multiple radiating fins, heat-conducting plate lower surface is fixed with microchannel heat sink, heat-conducting plate lower surface in criss-cross shape and is divided into multiple hot zones by microchannel heat sink, hot zone is internally provided with euthermic chip, heat-conducting plate and microchannel heat sink interlocking have in the caulking groove of lower substrate, and the lower surface of lower substrate offers the metallic channel for route of arranging, it is located at immediately below euthermic chip on lower substrate and offers the threading hole being connected to metallic channel.This kind of heating floor, it is combined by multiple euthermic chips, heat passes through on heat-conducting plate and microchannel heat sink uniformly dispersing to monolith heating floor, it avoids concentrating heat build-up, when load is excessive, the deformation of radiating fin avoids hot-spot so that euthermic chip is not contacted with heat-conducting plate disengaging, the service life of heating floor is effectively ensured, improves safety.

Description

A kind of heating floor

Technical field

The utility model relates to the bottom plate field that generates heat, specially a kind of heating floor.

Background technique

Heating floor is exactly as its name suggests the floor that can be generated heat, and can provide the floor of heat to house.Heating floor is Directly carbon crystal far-infrared chip is embedded into multi-layer solid wood, by heating floor inner heat chip heating power and from down toward On be radiated the interior space, warm oneself.Heating floor has comfortable, health, health care, saves space, beautifies room, efficiently saves Can, the advantages such as thermostable is good, and operating cost is low are therefore widely used in interior decoration.But existing fever ground Plate carries out ballast weight, such as furniture on heating floor, stands for a long time since inner heat chip is monolithic construction Same position, it is easy to lead to the concentration heat build-up of heating floor, and floor is burnt to black, destruction decorative layer, wearing layer, reduction floor Service life, or even fire incident occurs.

To solve the above problems, therefore it is proposed that a kind of heating floor.

Utility model content

The technical problems to be solved in the utility model is to overcome the deficiencies of existing technologies, and provides a kind of heating floor, in order to Above-mentioned technical problem is solved, the utility model provides the following technical solution:

A kind of heating floor of the utility model, including upper substrate and lower substrate, the lower surface bonds of upper substrate, which are fixed with, to be led Hot plate, heat-conducting plate upper surface array are fixed with multiple radiating fins, and heat-conducting plate lower surface is fixed with microchannel heat sink, micro- logical Road radiator is divided into multiple hot zones, and hot zone and heat-conducting plate upper surface in criss-cross shape and by heat-conducting plate lower surface Radiating fin corresponds, and hot zone is internally provided with euthermic chip, and heat-conducting plate and microchannel heat sink interlocking have lower substrate Caulking groove in, and the lower surface of lower substrate offers the metallic channel for route of arranging, and is being located at euthermic chip just on lower substrate Lower section offers the threading hole being connected to metallic channel.

As a kind of preferred embodiment of the utility model, the spherical structure of radiating fin, and the indent of radiating fin Face center is fixed with compression bar, and the following position directly that radiating fin is corresponded on heat-conducting plate offers through-hole, and compression bar slides through Through-hole is fixedly connected with euthermic chip.

As a kind of preferred embodiment of the utility model, microchannel heat sink internal cavities are interconnected, and side The stomata of perforation is offered on wall.

As a kind of preferred embodiment of the utility model, the contact surface of heat-conducting plate and radiating fin and upper substrate it Between be equipped with insulating layer, and the upper surface of lower substrate is also equipped with insulating layer.

As a kind of preferred embodiment of the utility model, the upper surface of upper substrate is successively adhesively fixed with from bottom to up Decorative layer and wearing layer.

As a kind of preferred embodiment of the utility model, just face is fixed with bottom plate under lower substrate.

Compared with prior art, the utility model beneficial effect achieved is: being combined by multiple euthermic chips, and battle array Column arrangement, when ballast has weight on heating floor, heat is by heat-conducting plate and microchannel heat sink uniformly dispersing to whole On block heating floor, avoid concentrating heat build-up, and the radiating fin of spherical structure provides bigger support force, when load is excessive When, the deformation of radiating fin avoids hot-spot, so that fever be effectively ensured so that euthermic chip is not contacted with heat-conducting plate disengaging The service life on floor improves safety.

Detailed description of the invention

Attached drawing is used to provide a further understanding of the present invention, and constitutes part of specification, practical with this Novel embodiment is used to explain the utility model together, does not constitute limitations of the present invention.In the accompanying drawings:

Fig. 1 is a kind of general assembly cross section structure schematic diagram of heating floor of the utility model；

Fig. 2 is the partial structural diagram in Fig. 1；

Fig. 3 is a kind of heat-conducting plate surface structure top view of heating floor of the utility model；

Fig. 4 is a kind of heat-conducting plate lower surface configuration bottom view of heating floor of the utility model.

In figure: 1- upper substrate；2- lower substrate；3- wearing layer；4- decorative layer；5- heat-conducting plate；6- microchannel heat sink；61- Stomata；7- bottom plate；8- threading hole；9- euthermic chip；10- metallic channel；11- radiating fin；12- compression bar；13- through-hole.

Specific embodiment

It is illustrated below in conjunction with preferred embodiment of the attached drawing to the utility model, it should be understood that described herein excellent It selects embodiment to be only used for describing and explaining the present invention, is not used to limit the utility model.

Embodiment

As shown in Figs 1-4, a kind of heating floor, including upper substrate 1 and lower substrate 2, the lower surface bonds of upper substrate 1 are fixed There is heat-conducting plate 5,5 upper surface array of heat-conducting plate is fixed with multiple radiating fins 11, and 5 lower surface of heat-conducting plate is fixed with microchannel and dissipates Hot device 6, microchannel heat sink 6 are divided into multiple hot zones in criss-cross shape and by 5 lower surface of heat-conducting plate, and hot zone with lead The radiating fin 11 of 5 upper surface of hot plate corresponds, and hot zone is internally provided with euthermic chip 9, and heat-conducting plate 5 and microchannel dissipate The hot interlocking of device 6 has in the caulking groove of lower substrate 2, and the lower surface of lower substrate 2 offers the metallic channel 10 for route of arranging, lower base Underface on plate 2 positioned at euthermic chip 9 offers the threading hole 8 being connected to metallic channel 10, the spherical structure of radiating fin 11, And the inner concave center of radiating fin 11 is fixed with compression bar 12, and the following position directly of radiating fin 11 is corresponded on heat-conducting plate 5 Through-hole 13 is offered, compression bar 12 slides through through-hole 13 and is fixedly connected with euthermic chip 9.

In the present embodiment, multiple euthermic chips 9 are combined, and array arranges, when no-load on heating floor, heat generating core Piece 9, which is powered, to be generated heat and transfers heat to radiating fin 11 by heat-conducting plate 5, and the radiating fin 11 of dome shape increases and upper substrate 1 Contact area, upper substrate 1 and conduct radiation can be transferred heat to faster to interior, improve the thermal efficiency；When fever ground When ballast has weight on plate, the temperature at load position is increased, higher than the temperature of other no load positions, dissipating at load position Hot fin 11 conducts heat from upper substrate 1 to heat-conducting plate 5, and is transferred on microchannel heat sink 6 by heat-conducting plate 5, by The whole perforation of hot device 6 is fanned in microchannel, air themperature high pass air passing hole 61 enters microchannel heat sink 6 in the hot zone at load It is interior, and on uniformly dispersing to monolith heating floor, it avoids concentrating heat build-up；When load is excessive, deformation occurs for radiating fin 11, dissipates The deformation of hot fin 11 moves down corresponding compression bar 12, and moving down for compression bar 12 pushes euthermic chip 9, and de- with heat-conducting plate 5 From not contacting, the heat transmitting scale of construction at load between euthermic chip 9 and heat-conducting plate 5 is reduced, hot-spot, euthermic chip 9 are avoided The heat for generating heat heats the air of corresponding hot zone, and is uniformly distributed by microchannel heat sink 6 to entire heating floor On, it keeps heat dissipation uniformly, so that the service life of heating floor be effectively ensured, improves safety.

In the present embodiment, the radiating fin 11 of spherical structure is capable of providing bigger support force, improves heating floor and uses Service life, and the cavity formed between microchannel heat sink 6 and lower substrate 2 reduces the loss that heat distributes to the ground, improves The thermal efficiency.

Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention, it is not limited to this Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art For, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic It is equivalently replaced.Within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on, It should be included within the scope of protection of this utility model.

Claims (6)

1. a kind of heating floor, including upper substrate (1) and lower substrate (2), it is characterised in that: the lower surface of the upper substrate (1) It is adhesively fixed with heat-conducting plate (5), heat-conducting plate (5) upper surface array is fixed with multiple radiating fins (11), the heat-conducting plate (5) Lower surface is fixed with microchannel heat sink (6), and the microchannel heat sink (6) is in criss-cross shape and by heat-conducting plate (5) following table Face is divided into multiple hot zones, and the radiating fin (11) of hot zone and heat-conducting plate (5) upper surface corresponds, the hot zone It is internally provided with euthermic chip (9), the heat-conducting plate (5) and microchannel heat sink (6) rabbet the caulking groove for having lower substrate (2) It is interior, and the lower surface of lower substrate (2) offers the metallic channel (10) for route of arranging, and is located at fever on the lower substrate (2) The threading hole (8) being connected to metallic channel (10) is offered immediately below chip (9).

2. heating floor as described in claim 1, which is characterized in that the spherical structure of the radiating fin (11), and radiate The inner concave center of fin (11) is fixed with compression bar (12), corresponded on the heat-conducting plate (5) radiating fin (11) just under Orientation, which is set, to be offered through-hole (13), and the compression bar (12) slides through through-hole (13) and is fixedly connected with euthermic chip (9).

3. heating floor as claimed in claim 2, which is characterized in that microchannel heat sink (6) internal cavities mutually interconnect It is logical, and the stomata (61) of perforation is offered on side wall.

4. heating floor as claimed in claim 3, which is characterized in that the heat-conducting plate (5) and radiating fin (11) with it is upper Insulating layer is equipped between the contact surface of substrate (1), and the upper surface of lower substrate (2) is also equipped with insulating layer.

5. heating floor as described in claim 1, which is characterized in that the upper surface of the upper substrate (1) is from bottom to up successively It is adhesively fixed with decorative layer (4) and wearing layer (3).

6. heating floor as described in claim 1, which is characterized in that just face is fixed with bottom plate under the lower substrate (2) (7).