CN208613963U - A kind of cooling conveyer system of pcb board - Google Patents
A kind of cooling conveyer system of pcb board Download PDFInfo
- Publication number
- CN208613963U CN208613963U CN201821089691.7U CN201821089691U CN208613963U CN 208613963 U CN208613963 U CN 208613963U CN 201821089691 U CN201821089691 U CN 201821089691U CN 208613963 U CN208613963 U CN 208613963U
- Authority
- CN
- China
- Prior art keywords
- transfer tape
- tape assemble
- conveyer system
- bracket
- transport unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a kind of cooling conveyer systems of pcb board, it is characterised in that: including adjustable conveyer system and air cooling system, wherein the adjustable conveyer system includes bracket, transfer tape assemble, the transfer tape assemble is positioned on the bracket;The air cooling system includes the multiple air supply devices being positioned above the transfer tape assemble, and the multiple air supply device is along the transfer tape assemble direction of motion arranged for interval;The transfer tape assemble is divided into horizontal convey portion and inclination transport unit, and the horizontal convey portion is connected with inclination transport unit by angular adjustment disk, and adjustable angle;Described bracket one end is provided with the first adjusting support for adjusting horizontal convey portion lifting, and the other end is provided with the second adjusting support for adjusting inclination transport unit lower end lifting.The beneficial effects of the utility model include: good cooling results, effectively solve the connection problem between multiple devices, and can adjust height according to actual needs, keep its transition more stable.
Description
Technical field
The utility model relates to conveyer belt fields, and in particular to a kind of cooling conveyer system of pcb board.
Background technique
Wave-soldering refers to by the solder (terne metal) of fusing, through electrodynamic pump or electromagnetic pump jet flow at design requirement
Solder wave can also be formed by injecting nitrogen to solder pot, the printed board for being pre-loaded with component is made to pass through solder wave,
Realize component welding end or pin and the room machine of printed board pad and the solder of electrical connection.
When carrying out circuit board wave soldering, circuit board successively passes through scaling powder coating area, preheating zone, wave crest drought-hit area, temperature
Degree rises to 150 DEG C to 250 DEG C or so, can not carry out subsequent processing operation since temperature is higher, it is necessary to by the fast prompt drop of temperature
To 50 DEG C or less.But cooling device in the prior art is not applied for the continuity of automatic assembly line, and usually from wave-soldering
It is connected between production line there are height fall, needs transition transmitting device.
Summary of the invention
Place, the utility model provide a kind of cooling conveyer system of pcb board in view of the deficiency of the prior art,
Cooling after effectively solving the problems, such as pcb board welding, while solving the problems, such as that crest welder is transmitted to the transition of production line.
In order to achieve the above object, the utility model uses following technical scheme:
A kind of cooling conveyer system of pcb board, it is characterised in that: including adjustable conveyer system and air cooling system, wherein institute
Stating adjustable conveyer system includes bracket, transfer tape assemble, and the transfer tape assemble is positioned on the bracket;The air cooling system
Including the multiple air supply devices being positioned above the transfer tape assemble, and the multiple air supply device is along the transfer tape assemble
Direction of motion arranged for interval;The transfer tape assemble is divided into horizontal convey portion and inclination transport unit, the horizontal convey portion and inclines
Oblique transport unit is connected by angular adjustment disk, and adjustable angle;Described bracket one end, which is provided with, adjusts horizontal convey portion liter
First adjusting support of drop, the other end are provided with the second adjusting support for adjusting inclination transport unit lower end lifting.
Further, the decelerating motor for driving the transfer tape assemble is provided on the bracket.
Further, the multiple air supply device includes fan mounting base, fan, and the fan mounting base is set across erecting
In on the transfer tape assemble, the number of fans is two, and is juxtaposed on along the width direction of the transfer tape assemble
In the fan mounting base.
Further, the two sides of the fan mounting base are provided with wind deflector.
The beneficial effects of the utility model include: good cooling results, effectively solve the connection problem between multiple devices, and
Height can be adjusted according to actual needs, keep its transition more stable.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model.
Specific embodiment
Combined with specific embodiments below and attached drawing is further described the utility model.
A kind of as shown in Figure 11, pcb board cooling conveyer system, including by bracket 1, transfer tape assemble 3 form can
It adjusts conveyer system, form air cooling system by multiple air supply devices 2, wherein the transfer tape assemble 3 is positioned on the bracket 1;
The multiple air supply device 2 is positioned at 3 top of transfer tape assemble, and the multiple air supply device 2 is along the conveyer belt group
3 direction of motion arranged for interval of part.To adapt to there are problems that drop, the transfer tape assemble 3 divide for level between distinct device
Transport unit 31 and inclination transport unit 32, the horizontal convey portion 31 and inclination transport unit 32 are connected by angular adjustment disk 13, and
Adjustable angle.Described 1 one end of bracket, which is provided with, adjusts the first adjusting support 11 that horizontal convey portion 31 is gone up and down, and the other end is set
It is equipped with the second adjusting support 12 for adjusting inclination 32 lower end of transport unit lifting.It is possible thereby to realize between different height equipment
The effect of transition connection.
Above-mentioned transfer tape assemble passes through the decelerating motor driving being arranged on the bracket 1, and 3 speed of decelerating motor
It is adjustable, it can perfectly adapt to the transmission speed of distinct device.
Air supply device 2 includes fan mounting base 21, fan 22.The fan mounting base 21 is placed in the conveyer belt across erecting
3 top of component, 22 quantity of fan is two, and is juxtaposed on the wind along the width direction of the transfer tape assemble 3
It fans in mounting base 21.Make PCB in the way that transition is transmitted along the air supply device 2 that the transfer tape assemble direction of motion is arranged by multiple groups
It is cooled down.
The two sides of the fan mounting base 21 are provided with wind deflector 23, and its object is to reduce wind-force from fan mounting base 21
Two sides diffusion.
Technical solution provided by the utility model embodiment is described in detail above, it is used herein specifically
A example is expounded the principle and embodiment of the utility model embodiment, and the explanation of above embodiments is only applicable to help
Assistant solves the principle of the utility model embodiment;At the same time, for those skilled in the art is implemented according to the utility model
Example, there will be changes in terms of specific embodiments and scope of application, in conclusion the content of the present specification should not be construed as
Limitations of the present invention.
Claims (4)
1. a kind of cooling conveyer system of pcb board, it is characterised in that: including adjustable conveyer system and air cooling system, wherein described
Adjustable conveyer system includes bracket (1), transfer tape assemble (3), and the transfer tape assemble (3) is positioned on the bracket (1);Institute
Stating air cooling system includes being positioned at multiple air supply devices (2) above the transfer tape assemble (3), and the multiple air supply device
(2) along the transfer tape assemble (3) direction of motion arranged for interval;The transfer tape assemble (3) be divided into horizontal convey portion (31) and
It tilts transport unit (32), the horizontal convey portion (31) and inclination transport unit (32) are connected by angular adjustment disk (13), and can
To adjust the angle;Described bracket (1) one end is provided with the first adjusting support (11) for adjusting horizontal convey portion (31) lifting, another
End is provided with the second adjusting support (12) for adjusting inclination transport unit (32) lower end lifting.
2. the cooling conveyer system of a kind of pcb board according to claim 1, it is characterised in that: be provided on the bracket (1)
Drive the decelerating motor of the transfer tape assemble.
3. the cooling conveyer system of a kind of pcb board according to claim 1, it is characterised in that: the multiple air supply device (2)
It include fan mounting base (21), fan (22), the fan mounting base (21) is placed in the transfer tape assemble (3) across erecting
On, fan (22) quantity is two, and is juxtaposed on the fan peace along the width direction of the transfer tape assemble (3)
It fills on seat (21).
4. the cooling conveyer system of a kind of pcb board according to claim 3, it is characterised in that: the fan mounting base (21)
Two sides be provided with wind deflector (23).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821089691.7U CN208613963U (en) | 2018-07-10 | 2018-07-10 | A kind of cooling conveyer system of pcb board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821089691.7U CN208613963U (en) | 2018-07-10 | 2018-07-10 | A kind of cooling conveyer system of pcb board |
Publications (1)
Publication Number | Publication Date |
---|---|
CN208613963U true CN208613963U (en) | 2019-03-19 |
Family
ID=65703694
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201821089691.7U Active CN208613963U (en) | 2018-07-10 | 2018-07-10 | A kind of cooling conveyer system of pcb board |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN208613963U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109865930A (en) * | 2019-04-04 | 2019-06-11 | 四川恒诚信电子科技有限公司 | A kind of hot press with refrigerating function |
-
2018
- 2018-07-10 CN CN201821089691.7U patent/CN208613963U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109865930A (en) * | 2019-04-04 | 2019-06-11 | 四川恒诚信电子科技有限公司 | A kind of hot press with refrigerating function |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5884058B2 (en) | Soldering device | |
US9370838B2 (en) | Wave soldering nozzle system and method of wave soldering | |
CN100541750C (en) | Heater, reflow soldering apparatus, heating means and bump formation method | |
US20030201310A1 (en) | Packaging method using lead-free solder | |
CN102689071B (en) | Reflow soldering equipment | |
CN208613963U (en) | A kind of cooling conveyer system of pcb board | |
US20070254255A1 (en) | System, apparatus and methods for board cooling | |
US6431431B2 (en) | Apparatus and methods for wave soldering | |
US4390120A (en) | Soldering methods and apparatus | |
US7048173B2 (en) | Wave soldering method using lead-free solder, apparatus therefor, and wave-soldered assembly | |
CN207858045U (en) | A kind of pulse thermocompression bonder | |
CN104754880A (en) | Jet-flow welding method | |
CN208743867U (en) | A kind of Reflow Soldering convenient for adjusting with radiator structure | |
US20150014394A1 (en) | Wave soldering apparatus and nozzle thereof | |
CN209097548U (en) | A kind of cooling transmitting device | |
US20210245282A1 (en) | Jet Solder Bath and Jet Soldering Device | |
CN113941754B (en) | LED circuit board scaling powder spray set | |
EP3113587B1 (en) | Viscous fluid coating device | |
CN100475002C (en) | Printed circuit board, method of soldering electronic components, and air conditioning apparatus with printed circuit board | |
JP4332281B2 (en) | Electronic device manufacturing method and soldering apparatus | |
CN220282676U (en) | Auxiliary conveying device for connection table and connection table connecting structure | |
US20230390846A1 (en) | Jet soldering apparatus | |
CN101612686B (en) | Hidden central support system of reflow oven | |
CN201471038U (en) | Selective de-bridging device for wave-soldering | |
CN206820015U (en) | A kind of coating unit of LED bonders |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |