CN208602977U - A kind of solder paste can - Google Patents
A kind of solder paste can Download PDFInfo
- Publication number
- CN208602977U CN208602977U CN201821168886.0U CN201821168886U CN208602977U CN 208602977 U CN208602977 U CN 208602977U CN 201821168886 U CN201821168886 U CN 201821168886U CN 208602977 U CN208602977 U CN 208602977U
- Authority
- CN
- China
- Prior art keywords
- solder paste
- ontology
- hole
- bottom cover
- stopple
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a kind of solder paste cans, including solder paste can ontology and it is covered on the bottom cover of solder paste can body bottom portion, bottom cover is detachably connected with solder paste can ontology, solder paste can body bottom portion offers through-hole, sealing ring is installed on through-hole wall, bottom cover is equipped with stopple, and stopple extends in through-hole, and stopple and sealing ring are interference fitted.By above-mentioned design, the utility model structure is simple, does not influence in operation timeliness rate height and the solder paste can of tin cream quality.
Description
Technical field
The utility model relates to tin cream container technical field, in particular to a kind of solder paste can.
Background technique
Tin cream is a kind of novel welding material, is by solder powder, scaling powder and other surfactants, thixotropic agent
Etc. the paste mixture being mixed to form, it is mainly used for the welding of the electronic components such as resistance, capacitor, and contains the appearance of tin cream
Device is known as solder paste can.The operation mode of addition tin cream mainly includes two methods at present, and one is pure artificial addition, i.e. worker's handle
The lid of solder paste can is opened and is shoveled tin cream onto silk screen with scraper, this method low efficiency and easy pollution tin cream；Secondly being
It installs automatic tin cream adding device and boring device additional, is each solder paste can from tank bottom aperture, piston is from top to bottom by boring device
Walking, tin cream is expressed on silk screen from the hole held successfully, and structure is complicated for such operation mode, and the plastics scrap that aperture generates holds
It is easily mixed into tin cream, influences tin cream quality.
Utility model content
In order to overcome the drawbacks described above of the prior art, the utility model provides a kind of high in operation timeliness rate and does not influence tin
The solder paste can of cream quality.
The utility model solves technical solution used by the problems of the prior art are as follows: a kind of solder paste can, comprising: tin cream
Tank ontology and the bottom cover for being covered on the solder paste can body bottom portion, the bottom cover are detachably connected with the solder paste can ontology,
The solder paste can body bottom portion offers through-hole, and sealing ring is installed on the through-hole wall, and the bottom cover is equipped with stopple, institute
It states stopple to extend in the through-hole, and the stopple and the sealing ring are interference fitted.
As a preferred embodiment of the present invention, the bottom cover activity is connected on the solder paste can ontology.
As a preferred embodiment of the present invention, the through-hole is located at the center of the solder paste can body bottom portion.
As a preferred embodiment of the present invention, the bottom cover is connect with the solder paste can ontology by being threadedly engaged.
As a preferred embodiment of the present invention, the diameter of the through-hole is from the solder paste can ontology to gradually passing outside
Increase.
Compared with prior art, the utility model has following technical effect that
The utility model proposes a kind of solder paste can use tin cream if necessary in operation process, only need to by bottom cover from
It disassembles and takes out on solder paste can ontology, the stopple being set on bottom cover at this time can be extracted out of through-hole, be stored in solder paste can sheet
Intracorporal tin cream can flow out, and come into operation, and pollute so as to avoid to tin cream；And the setting of sealing ring and stopple with
Sealing ring interference fit, can make bottom cover when being mounted on solder paste can body bottom portion, and the completely plugged firmly through-hole of stopple energy makes solder paste can
Body interior becomes confined space, prevents tin cream contaminated or contacts and quality variation with air.In operation, it is high-efficient and
Tin cream quality is not influenced.
Detailed description of the invention
Fig. 1 is the partial sectional view of the utility model.
In figure, 1- solder paste can ontology；2- bottom cover；11- through-hole；12- sealing ring；21- stopple.
Specific embodiment
Specific embodiment of the present utility model is described further with reference to the accompanying drawing.It should be noted that
The explanation of these embodiments is used to help to understand the utility model, but does not constitute the restriction to the utility model.This
Outside, technical characteristic involved in the various embodiments of the present invention described below is as long as they do not conflict with each other
It can be combined with each other.
As shown in Figure 1, a kind of solder paste can, comprising: solder paste can ontology 1 and the bottom cover for being covered on 1 bottom of solder paste can ontology
2, bottom cover 2 is detachably connected with solder paste can ontology 1, and 1 bottom of solder paste can ontology offers through-hole 11, is installed on 11 inner wall of through-hole
Sealing ring 12, bottom cover 2 are equipped with stopple 21, and stopple 21 extends in through-hole 11, and stopple 21 and sealing ring 12 are interference fitted.
In operation process, tin cream is used if necessary, only need to bottom cover 2 be disassembled and be taken from solder paste can ontology 1
Out, the stopple 21 being set on bottom cover 2 at this time can be extracted out of through-hole 11, and the tin cream being stored in solder paste can ontology 1 can flow out,
It comes into operation, is polluted so as to avoid to tin cream；And the setting of sealing ring 12 and stopple 21 are matched with 12 interference of sealing ring
It closes, bottom cover 2 can be made when being mounted on solder paste can 1 bottom of ontology, the completely plugged firmly through-hole 11 of 21 energy of stopple makes solder paste can ontology 1
Inside becomes confined space, prevents tin cream contaminated or contacts and quality variation with air.
2 activity of bottom cover is connected on solder paste can ontology 1.
Bottom cover 2 can be movably arranged on 1 bottom of solder paste can ontology by way of clamping, and the mode of clamping can use class
Like the mode of the clamping engagement of pen cap and pen.
Through-hole 11 is located at the center of 1 bottom of solder paste can ontology.
The center that through-hole 11 is located at 1 bottom of solder paste can ontology can be mounted on solder paste can ontology 1 in order to bottom cover 2, without
The moment during installation is needed it is noted that whether stopple 21 and through-hole 11 are to it.
Bottom cover 2 is connect with solder paste can ontology 1 by being threadedly engaged.
Bottom cover 2 can be connect by way of being threadedly engaged with 1 bottom of solder paste can ontology, and solder paste can ontology is set on 1 bottom
Set external screw thread, the internal screw thread that setting matches with above-mentioned external screw thread on bottom cover 2；Or spiral shell in being arranged on 1 bottom of solder paste can ontology
Line, the external screw thread that setting matches with the internal screw thread on solder paste can ontology 1 on bottom cover 2.
The diameter of through-hole 11 is from solder paste can ontology 1 to being gradually incremented by outside.
The profile of the cross section of through-hole 11 from solder paste can ontology 1 to outer at horn-like, this structure at tower-like hole
Plug 21, which matches, can be easier to make solder paste can ontology 1 to form confined space.
The embodiments of the present invention is explained in detail in conjunction with attached drawing above, but the utility model is not limited to be retouched
The embodiment stated.For a person skilled in the art, right in the case where not departing from the utility model principle and spirit
These embodiments carry out a variety of change, modification, replacement and modification, still fall in the protection scope of the utility model.
Claims (5)
1. a kind of solder paste can, it is characterised in that: including solder paste can ontology and it is covered on the bottom cover of the solder paste can body bottom portion,
The bottom cover is detachably connected with the solder paste can ontology, and the solder paste can body bottom portion offers through-hole, the through-hole wall
On be installed with sealing ring, the bottom cover is equipped with stopple, and the stopple extends in the through-hole, and the stopple with it is described close
Seal interference fit.
2. a kind of solder paste can according to claim 1, it is characterised in that: the bottom cover activity is connected in the solder paste can sheet
On body.
3. a kind of solder paste can according to claim 1, it is characterised in that: the through-hole is located at the solder paste can body bottom portion
Center.
4. a kind of solder paste can according to claim 3, it is characterised in that: the bottom cover and the solder paste can ontology pass through spiral shell
Line is cooperatively connected.
5. a kind of solder paste can according to claim 1, it is characterised in that: the diameter of the through-hole is from the solder paste can ontology
It is interior to being gradually incremented by outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821168886.0U CN208602977U (en) | 2018-07-20 | 2018-07-20 | A kind of solder paste can |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821168886.0U CN208602977U (en) | 2018-07-20 | 2018-07-20 | A kind of solder paste can |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208602977U true CN208602977U (en) | 2019-03-15 |
Family
ID=65669803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821168886.0U Expired - Fee Related CN208602977U (en) | 2018-07-20 | 2018-07-20 | A kind of solder paste can |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208602977U (en) |
-
2018
- 2018-07-20 CN CN201821168886.0U patent/CN208602977U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190315 Termination date: 20210720 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |