CN208589750U - A kind of intelligent bus heat radiation cooling device - Google Patents
A kind of intelligent bus heat radiation cooling device Download PDFInfo
- Publication number
- CN208589750U CN208589750U CN201821016197.8U CN201821016197U CN208589750U CN 208589750 U CN208589750 U CN 208589750U CN 201821016197 U CN201821016197 U CN 201821016197U CN 208589750 U CN208589750 U CN 208589750U
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- CN
- China
- Prior art keywords
- layer
- bus
- outside
- hot channel
- silochrom
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 23
- 230000005855 radiation Effects 0.000 title claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000011889 copper foil Substances 0.000 claims abstract description 16
- 230000008676 import Effects 0.000 claims abstract description 9
- 239000011148 porous material Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 6
- 230000007547 defect Effects 0.000 abstract description 4
- 230000036413 temperature sense Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- FGRBYDKOBBBPOI-UHFFFAOYSA-N 10,10-dioxo-2-[4-(N-phenylanilino)phenyl]thioxanthen-9-one Chemical compound O=C1c2ccccc2S(=O)(=O)c2ccc(cc12)-c1ccc(cc1)N(c1ccccc1)c1ccccc1 FGRBYDKOBBBPOI-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of intelligent bus heat radiation cooling devices, including bus and hot channel, the outside of bus is equipped with PVC insulating layer, the outside of PVC insulating layer is equipped with Kiselgel A layer, the outside of Kiselgel A layer is equipped with silochrom layer, the outside of silochrom layer is equipped with copper foil layer, mounting hole is equipped at left and right sides of hot channel, heat outlet is equipped on the left of hot channel front end, cold air import is equipped on the right side of hot channel front end, heat outlet and cold air import are all connected with one end of connecting tube, the utility model has corresponding radiator structure, effectively improve the low defect of traditional type of cooling cooling efficiency, with corresponding thermal conductive shell, it can be under the premise of guaranteeing bus shell insulating properties, it effectively improves bus internal heat and is transmitted to external efficiency, greatly improve the radiating efficiency of bus, effectively Avoid in bus use process leads to problems such as kwh loss excessive because radiating not in time.
Description
Technical field
The utility model relates to Cooling Technology of Electronic Device field, specially a kind of intelligent bus heat radiation cooling device.
Background technique
Bus refers to that multiple equipment connects a shared access on it in the form of branch arranged side by side, therefore bus makes
With can carry biggish power in the process, and bus temperature rising can occur with the growth of working time in use
Process, and the raising of temperature certainly will will cause the increase of bus bar resistance, and then increase the consumption of electric energy, while prolonged high
Temperature can also cause the normal use of bus, reduce the normal service life of bus, therefore the heat dissipation of bus becomes and nowadays can not
The problem of ignorance, traditional bus type of cooling by the way of air-cooled or air-cooled, but the radiating efficiency of this mode compared with
Low, while existing bus is wrapped up using simple insulation crust, internal temperature, which is difficult to be transmitted to outside, further reduced
The radiating efficiency of bus.
We provide a kind of intelligent bus heat radiation cooling devices thus.
Utility model content
The technical problems to be solved in the utility model is to overcome existing defect, provides a kind of intelligent bus cooling
Device has corresponding radiator structure, effectively improves the low defect of traditional type of cooling cooling efficiency, has and leads accordingly
Hot shell can effectively improve bus internal heat and be transmitted to external efficiency under the premise of guaranteeing bus shell insulating properties,
The problems in background technique can effectively be solved.
To achieve the above object, the utility model provides the following technical solutions: a kind of intelligent bus heat radiation cooling device,
Including bus and hot channel, the outside of bus is equipped with PVC insulating layer, and the outside of PVC insulating layer is equipped with Kiselgel A layer, pore
The outside of layer of silica gel is equipped with silochrom layer, and the outside of silochrom layer is equipped with copper foil layer, is all provided at left and right sides of hot channel
Have a mounting hole, heat outlet be equipped on the left of hot channel front end, be equipped with cold air import on the right side of hot channel front end, heat outlet and
Cold air import is all connected with one end of connecting tube, and the other end of the connecting tube in left side is connected with compressor, the connecting tube on right side it is another
One end is connected with throttle valve, and compressor is connected with throttle valve by condenser pipe, and temperature inductor is equipped with inside hot channel, dissipates
The outside of heat pipeline is equipped with mounting plate, and mounting plate is equipped with single-chip microcontroller, and the input terminal of single-chip microcontroller is electrically connected the defeated of external power supply
Outlet, the output end of the input terminal electrical connection temperature inductor of single-chip microcontroller, the input of the output end electrical connection compressor of single-chip microcontroller
End.
As a kind of optimal technical scheme of the utility model, the thickness of PVC insulating layer is less than 0. 5 millimeters, and PVC is exhausted
Edge layer is equipped with several equally distributed heat release holes.
As a kind of optimal technical scheme of the utility model, Kiselgel A layer and silochrom layer are bonding, pore silicon
Glue-line and silochrom thickness degree are all larger than two millimeters.
As a kind of optimal technical scheme of the utility model, copper foil layer and silochrom layer are bonding, the thickness of copper foil layer
Degree is less than 0. 1 millimeters.
As a kind of optimal technical scheme of the utility model, bus sequentially passes through the left and right sides and is equipped with mounting hole, pacifies
The diameter for filling hole is less than 0. five to one millimeter of copper foil layer outer diameter.
Compared with prior art, the utility model has the beneficial effects that having corresponding radiator structure, effectively improve
The low defect of traditional type of cooling cooling efficiency has corresponding thermal conductive shell, can be before guaranteeing bus shell insulating properties
It puts, effectively improves bus internal heat and be transmitted to external efficiency, greatly improve the radiating efficiency of bus, effectively avoid
Lead to problems such as kwh loss excessive because radiating not in time in bus use process.
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model；
Fig. 2 is the utility model section structural schematic diagram.
In figure: 1 bus, 2PVC insulating layer, 3 Kiselgel A layers, 4 silochrom layers, 5 copper foil layers, 6 hot channels, 7 hot gas
Outlet, 8 cold air imports, 9 connecting tubes, 10 compressors, 11 throttle valves, 12 condenser pipes, 13 mounting plates, 14 single-chip microcontrollers, 15 temperature senses
Answer device.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
The utility model provides a kind of technical solution referring to FIG. 1-2: a kind of intelligent bus heat radiation cooling device, packet
Bus 1 and hot channel 6 are included, the outside of bus 1 is equipped with PVC insulating layer 2, and the thickness of PVC insulating layer 2 is less than 0. 5 millimeters,
PVC insulating layer 2 is equipped with several equally distributed heat release holes, and the outside of PVC insulating layer 2 is equipped with Kiselgel A layer 3, Kiselgel A
The outside of layer 3 is equipped with silochrom layer 4, and Kiselgel A layer 3 and silochrom layer 4 are bonding, Kiselgel A layer 3 and silochrom
4 thickness of layer are all larger than two millimeters, and the outside of silochrom layer 4 is equipped with copper foil layer 5, and copper foil layer 5 and silochrom layer 4 are bonding,
The thickness of copper foil layer 5 is less than 0. 1 millimeters, and the left and right sides of hot channel 6 is equipped with mounting hole, and bus 1 sequentially passes through left and right
Two sides are equipped with mounting hole, and the diameter of mounting hole is less than 0. five to one millimeter of 5 outer diameter of copper foil layer, 6 front end of hot channel left side
Equipped with heat outlet 7, it is equipped with cold air import 8 on the right side of 6 front end of hot channel, heat outlet 7 and cold air import 8 are all connected with connecting tube
9 one end, the other end of the connecting tube 9 in left side are connected with compressor 10, and the other end of the connecting tube 9 on right side is connected with throttle valve
11, compressor 10 is connected with throttle valve 11 by condenser pipe 12, and temperature inductor 15, heat-dissipating pipe are equipped with inside hot channel 6
The outside in road 6 is equipped with mounting plate 13, and mounting plate 13 is equipped with single-chip microcontroller 14, and the input terminal of single-chip microcontroller 14 is electrically connected external power supply
Output end, the output end of the input terminal electrical connection temperature inductor 15 of single-chip microcontroller 14, the output end of single-chip microcontroller 14 is electrically connected pressure
The input terminal of contracting machine 10, bus 1 start to generate heat when working, and heat caused by bus 1 passes sequentially through PVC insulating layer 2, pore silicon
Glue-line 3, silochrom layer 4, copper foil layer 5 are transmitted to inside hot channel 6, and the temperature inside hot channel 6 increases, temperature sense
Device 15 detects the temperature information inside hot channel 6, and feeds back information to single-chip microcontroller 14, and when temperature increases, single-chip microcontroller 14 is controlled
The work of compressor 10 processed cools down to hot channel 6, increases the temperature difference of bus 1 and 6 inner air of hot channel, and then improve
The radiating efficiency of bus 1.
Single-chip microcontroller 14 controls temperature inductor 15 and uses the prior art, and single-chip microcontroller 14 controls compressor 10 and uses existing skill
Art.
When in use: bus 1 starts to generate heat when working, and heat caused by bus 1 passes sequentially through PVC insulating layer 2, pore
Layer of silica gel 3, silochrom layer 4, copper foil layer 5 are transmitted to inside hot channel 6, and the temperature inside hot channel 6 increases, temperature sense
It answers device 15 to detect the temperature information inside hot channel 6, and feeds back information to single-chip microcontroller 14, when temperature increases, single-chip microcontroller 14
The control work of compressor 10 cools down to hot channel 6, increases the temperature difference of bus 1 and 6 inner air of hot channel, Jin Erti
The radiating efficiency of high bus 1.
The utility model have corresponding radiator structure, effectively improve traditional type of cooling cooling efficiency it is low lack
It falls into, there is corresponding thermal conductive shell, bus internal heat biography can be effectively improved under the premise of guaranteeing bus shell insulating properties
Transport to external efficiency.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of intelligent bus heat radiation cooling device, including bus (1) and hot channel (6), it is characterised in that: the bus
(1) outside is equipped with PVC insulating layer (2), and the outside of the PVC insulating layer (2) is equipped with Kiselgel A layer (3), the pore silicon
The outside of glue-line (3) is equipped with silochrom layer (4), and the outside of the silochrom layer (4) is equipped with copper foil layer (5), the heat dissipation
It is equipped with mounting hole at left and right sides of pipeline (6), is equipped with heat outlet (7) on the left of hot channel (6) front end, the heat dissipation
Cold air import (8) are equipped on the right side of pipeline (6) front end, the heat outlet (7) and cold air import (8) are all connected with connecting tube (9)
The other end of one end, the connecting tube (9) in left side is connected with compressor (10), and the other end of the connecting tube (9) on right side is connected with section
It flows valve (11), the compressor (10) is connected with throttle valve (11) by condenser pipe (12), is set inside the hot channel (6)
Have temperature inductor (15), the outside of the hot channel (6) is equipped with mounting plate (13), and being equipped with for the mounting plate (13) is single
Piece machine (14), the output end of the input terminal electrical connection external power supply of the single-chip microcontroller (14), the input terminal of the single-chip microcontroller (14)
It is electrically connected the output end of temperature inductor (15), the input terminal of output end electrical connection compressor (10) of the single-chip microcontroller (14).
2. a kind of intelligent bus heat radiation cooling device according to claim 1, it is characterised in that: the PVC insulating layer
(2) thickness is less than 0. 5 millimeters, and the PVC insulating layer (2) is equipped with several equally distributed heat release holes.
3. a kind of intelligent bus heat radiation cooling device according to claim 1, it is characterised in that: the Kiselgel A layer
(3) and silochrom layer (4) is bonding, and the Kiselgel A layer (3) and silochrom layer (4) thickness are all larger than two millimeters.
4. a kind of intelligent bus heat radiation cooling device according to claim 1, it is characterised in that: the copper foil layer (5)
Bonding with silochrom layer (4), the thickness of the copper foil layer (5) is less than 0. 1 millimeters.
5. a kind of intelligent bus heat radiation cooling device according to claim 1, it is characterised in that: the bus (1) according to
The secondary left and right sides that passes through is equipped with mounting hole, and the diameter of the mounting hole is less than 0. five to one millimeter of copper foil layer (5) outer diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821016197.8U CN208589750U (en) | 2018-06-29 | 2018-06-29 | A kind of intelligent bus heat radiation cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821016197.8U CN208589750U (en) | 2018-06-29 | 2018-06-29 | A kind of intelligent bus heat radiation cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208589750U true CN208589750U (en) | 2019-03-08 |
Family
ID=65538655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821016197.8U Expired - Fee Related CN208589750U (en) | 2018-06-29 | 2018-06-29 | A kind of intelligent bus heat radiation cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208589750U (en) |
-
2018
- 2018-06-29 CN CN201821016197.8U patent/CN208589750U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190308 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |