CN208562224U - A kind of release film - Google Patents
A kind of release film Download PDFInfo
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- CN208562224U CN208562224U CN201821008551.2U CN201821008551U CN208562224U CN 208562224 U CN208562224 U CN 208562224U CN 201821008551 U CN201821008551 U CN 201821008551U CN 208562224 U CN208562224 U CN 208562224U
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- Prior art keywords
- release
- layer
- release layer
- dmpa
- film
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Abstract
A kind of release film, including substrate layer and release layer, the release layer is silicone release oxidant layer, the release layer includes the first release layer and the second release layer, the lower surface of first release layer is bonded with the upper surface of substrate layer, the upper surface of first release layer is coated with DMPA layers, and DMPA layers of upper surface is bonded with the second release layer.Release layer is designed as the first release layer and the second release layer by the utility model; and DMPA layers are arranged between the first release layer and the second release layer; on the one hand guarantee release film in the die cutting process of adhesive tape or protective film without departing from, stick up out, on the other hand, when needing to remove release film; use ultraviolet light; DMPA absorbs ultraviolet radiant energy and forms free radical, to cause silicone release agent secondary response again, off-type force is reduced; it is easily peeled off, adhesive tape or protective film is avoided to damage.
Description
Technical field
The utility model relates to a kind of for protecting the membrane material of glue material, and in particular to a kind of release film.
Background technique
Release film refers to that surface has the film of separation property, after release film contacts under limited conditions with specific material
Without viscosity or slight viscosity, under normal conditions in order to increase the off-type force of film, plastic film can be done at plasma
Reason, or apply fluorine processing, or silicon mould release is applied on the surface layer of film material, such as PET, PE, OPP, allow it for it is various not
Same organic pressure sensitive adhesive can show extremely light and stable off-type force.
Conventional adhesive tape and protective film is required to use release film in product structure.It is actual in adhesive tape or protective film
In use process, release film plays protective effect to adhesive tape or protective film product, while adhesive tape or protective film also being made to be more convenient for
Processing and use.With the increasingly fining of mobile phone components, integrated, the mould-cutting precision of adhesive tape and protective film requires also more next
Higher, this requires the off-type forces of release film to want sufficiently low, while cannot have apparent removing electrostatic, is just avoided that in release film
During removing, the adhesive tape or protective film of very fine after damage cross cutting.But the off-type force of release film is too low, in die cutting process
In will lead to release film again and be detached from, stick up out, effective protection can not be played the role of to product.
Utility model content
The purpose of this utility model is to provide a kind of release films, and the release film is in cross cutting, it can be ensured that certain removing
Intensity avoids release film from being detached from, stick up out.When needing to remove, by ultraviolet irradiation, reduce off-type force, to be easily peeled off.
The technical solution adopted in the utility model is as follows:
A kind of release film, including substrate layer and release layer, the release layer are silicone release oxidant layer, the release layer packet
The first release layer and the second release layer are included, the lower surface of the first release layer is bonded with the upper surface of substrate layer, the first release layer
Upper surface is coated with DMPA layers, and DMPA layers of upper surface is bonded with the second release layer.
DMPA is the abbreviation of 651 photoinitiators, also known as the double methyl ethers of benzil, light sensitive, can be caused after illumination organic
Silicon mould release secondary response again.The present invention is arranged DMPA layers between the first release layer and the second release layer, and off-type force is higher, can
Guarantee release film in the die cutting process of adhesive tape or protective film without departing from, stick up out, when needing to remove release film, use is ultraviolet
Light irradiation, DMPA absorbs ultraviolet radiant energy and forms free radical, to cause silicone release agent secondary response again, that is, organic
Silicon mould release continues to solidify, and reduces off-type force, is easily peeled off, and adhesive tape or protective film is avoided to damage.
The lower surface of first release layer be coated with DMPA layer, add one layer DMPA layers so that generated after illumination oneself
Increased by base, is conducive to accelerate silicone release agent reaction, to achieve the purpose that reduce rapidly off-type force.
It is provided with antistatic layer between the substrate layer and the first release layer, so that release film has antistatic effect, stripping
From when will not generate absorption adhesion.
The antistatic layer is polythiophene type conductive polymer layer.
The substrate layer is pet layer.
In conclusion by adopting the above-described technical solution, the beneficial effects of the utility model are:
1. release layer is designed as the first release layer and the second release layer by the utility model, and in the first release layer and second
Between release layer be arranged DMPA layer, on the one hand guarantee release film in the die cutting process of adhesive tape or protective film without departing from, stick up out,
On the other hand, when needing to remove release film, using ultraviolet light, DMPA absorbs ultraviolet radiant energy and forms free radical,
To cause silicone release agent secondary response again, off-type force is reduced, is easily peeled off, and adhesive tape or protective film is avoided to damage；
2. the utility model is by being arranged antistatic layer between substrate layer and the first release layer, so that when release film stripping
Absorption adhesion will not be generated.
Detailed description of the invention
Fig. 1 is the utility model structure diagram.
Marked in the figure: 1- substrate layer, 2- antistatic layer, 3-DMPA layers, the first release layer of 4-, the second release layer of 5-.
Specific embodiment
All features disclosed in this specification can be with any other than mutually exclusive feature and/or step
Mode combines.
It elaborates below with reference to Fig. 1 to the utility model.
Embodiment 1
A kind of release film, including substrate layer 1 and release layer, the release layer are silicone release oxidant layer, the release layer
Including the first release layer 4 and the second release layer 5, the lower surface of the first release layer 4 is bonded with the upper surface of substrate layer 1, first from
The upper surface of type layer 4 is coated with DMPA layer 3, and the upper surface of DMPA layer 3 is bonded with the second release layer 5.
DMPA is the abbreviation of 651 photoinitiators, also known as the double methyl ethers of benzil, light sensitive, can be caused after illumination organic
Silicon mould release secondary response again.The present invention is arranged DMPA layer 3 between the first release layer 4 and the second release layer 5, off-type force compared with
It is high, it is ensured that release film in the die cutting process of adhesive tape or protective film without departing from, stick up out, when needing to remove release film, make
With ultraviolet light, DMPA absorbs ultraviolet radiant energy and forms free radical, thus cause silicone release agent secondary response again,
That is, silicone release agent continues to solidify, off-type force is reduced, be easily peeled off, and adhesive tape or protective film is avoided to damage.
Embodiment 2
Based on embodiment 1, the lower surface of the first release layer 4 is coated with DMPA layer 3, one layer of DMPA layer 3 is added, so that illumination
The free radical generated afterwards increases, and is conducive to accelerate silicone release agent reaction, to achieve the purpose that reduce rapidly off-type force.
Embodiment 3
Based on embodiment 1, be provided with antistatic layer 2 between substrate layer 1 and the first release layer 4 so that release film have it is anti-
Electrostatic efficiency, when removing, will not generate absorption adhesion.
Antistatic layer 2 is polythiophene type conductive polymer layer.
Embodiment 4
Based on the above embodiment, substrate layer 1 is pet layer.
Embodiment 5
The process conditions of the utility model production are as follows: the usage amount of crosslinking agent is according to product initial stage in silicone release agent
Corresponding addition is made in peeling force design；The quality of DMPA used in DMPA layers is the 0.5-4% of DMPA and silicone release agent gross mass,
In production process, sodium amber light is completely used, exposure is avoided to cause DMPA；When needing to tear off release film after cross cutting, in 300mJ/cm2
Ultraviolet light intensity under irradiate 4S or more, be down to release film off-type force within 10gf/25mm from 50gf/25mm or more, thus
It is easily peeled off release film.
Embodiment 6
The process conditions of the utility model production are as follows: the usage amount of crosslinking agent is according to product initial stage in silicone release agent
Corresponding addition is made in peeling force design；The quality of DMPA used in DMPA layers is the 0.5% of DMPA and silicone release agent gross mass,
In production process, sodium amber light is completely used, exposure is avoided to cause DMPA；When needing to tear off release film after cross cutting, in 300mJ/cm2
Ultraviolet light intensity under irradiate 15s, be down to release film off-type force within 10gf/25mm from 50gf/25mm or more, sheet resistance≤
1010Ω, removing electrostatic pressure is lower than 1KV, so that release film is easily peeled off, and without Electrostatic Absorption adhesion.
Embodiment 7
The process conditions of the utility model production are as follows: the usage amount of crosslinking agent is according to product initial stage in silicone release agent
Corresponding addition is made in peeling force design；The quality of DMPA used in DMPA layers is the 2% of DMPA and silicone release agent gross mass, raw
During production, sodium amber light is completely used, exposure is avoided to cause DMPA；When needing to tear off release film after cross cutting, in 300mJ/cm2's
5s is irradiated under ultraviolet light intensity, is down to release film off-type force within 10gf/25mm from 50gf/25mm or more, sheet resistance≤1010
Ω, removing electrostatic pressure is lower than 1KV, so that release film is easily peeled off, and without Electrostatic Absorption adhesion.
Embodiment 8
The process conditions of the utility model production are as follows: the usage amount of crosslinking agent is according to product initial stage in silicone release agent
Corresponding addition is made in peeling force design；The quality of DMPA used in DMPA layers is the 4% of DMPA and silicone release agent gross mass, raw
During production, sodium amber light is completely used, exposure is avoided to cause DMPA；When needing to tear off release film after cross cutting, in 300mJ/cm2's
4s is irradiated under ultraviolet light intensity, is down to release film off-type force within 10gf/25mm from 50gf/25mm or more, sheet resistance≤1010
Ω, removing electrostatic pressure is lower than 1KV, so that release film is easily peeled off, and without Electrostatic Absorption adhesion.
In the embodiments of the present invention 6, the quality of DMPA used in DMPA layers is lower, after exposing 15s, off-type force ability
It is reduced to claimed range, service efficiency is lower；In embodiment 8, the quality of DMPA is higher, and after exposing 4S, off-type force just can be reduced
To claimed range.And in embodiment 6, the quality of DMPA is moderate, exposes 5S, and service efficiency is high, while having saved DMPA's
Usage amount reduces cost.
It is as described above the embodiments of the present invention.The utility model is not limited to above embodiment, anyone
It should learn the structure change made under the enlightenment of the utility model, it is all that there is same or similar skill with the utility model
Art scheme, each falls within the protection scope of the utility model.
Claims (5)
1. a kind of release film, including substrate layer (1) and release layer, which is characterized in that the release layer is silicone release oxidant layer,
The release layer includes the first release layer (4) and the second release layer (5), lower surface and substrate layer (1) of the first release layer (4)
Upper surface fitting, the upper surface of the first release layer (4) are coated with DMPA layer (3), the upper surface of DMPA layers (3) and the second release layer
(5) it is bonded.
2. a kind of release film according to claim 1, which is characterized in that the lower surface of first release layer (4) coats
There are DMPA layers (3).
3. a kind of release film according to claim 1, which is characterized in that the substrate layer (1) and the first release layer (4) it
Between be provided with antistatic layer (2).
4. a kind of release film according to claim 3, which is characterized in that the antistatic layer (2) is polythiophene type high score
Conducting layer.
5. a kind of release film according to claim 1 or 3, which is characterized in that the substrate layer (1) is pet layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821008551.2U CN208562224U (en) | 2018-06-28 | 2018-06-28 | A kind of release film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821008551.2U CN208562224U (en) | 2018-06-28 | 2018-06-28 | A kind of release film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208562224U true CN208562224U (en) | 2019-03-01 |
Family
ID=65489317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821008551.2U Active CN208562224U (en) | 2018-06-28 | 2018-06-28 | A kind of release film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208562224U (en) |
-
2018
- 2018-06-28 CN CN201821008551.2U patent/CN208562224U/en active Active
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