CN208562148U - A kind of guiding device and cutting equipment - Google Patents
A kind of guiding device and cutting equipment Download PDFInfo
- Publication number
- CN208562148U CN208562148U CN201820867244.3U CN201820867244U CN208562148U CN 208562148 U CN208562148 U CN 208562148U CN 201820867244 U CN201820867244 U CN 201820867244U CN 208562148 U CN208562148 U CN 208562148U
- Authority
- CN
- China
- Prior art keywords
- glass
- chip
- briquetting
- guiding
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model discloses a kind of guiding device and cutting equipment, cuts to realize, plays knife moment to glass-chip without impact, while also ensuring that chip cutting is abundant.Wherein, guiding device includes: guiding briquetting, the guiding side of the guiding briquetting includes recess portion and outer surface, when the recess portion accommodates glass-chip, the surface of the glass-chip and the outer surface are in same plane, and the outer surface is for guiding the scribing wheel of glass-cutting chip to cut and rise knife.
Description
Technical field
The utility model relates to glass-chip cutting technique field, in particular to a kind of guiding device and cutting equipment.
Background technique
The glass-chip cutting equipment of existing CIGS (copper indium gallium selenide) thin film solar cell when carrying out glass-chip cutting,
It is directly contacted using diamond scribing wheel with glass-chip surface.When cutting, do not cut since glass edge, but
It is cut at the position on glass surface apart from glass edge 2-4mm, also, does not cut to glass edge and just play knife, that is, play knife
When also just play knife in the position on glass surface of the glass edge other side there are also 2-4mm.However, this will cause cutting away from
From actual glass length is less than, in subsequent Slicing procedure since cutting is insufficient, and CIGS glass-chip glass is after heated
Deformation, surface stress increase, and are easy to appear fragment failure.
Utility model content
The utility model provides a kind of guiding device and cutting equipment for glass-chip cutting, to avoid cutting
When break bar directly contacted with glass edge in the case where, it is ensured that glass-chip cutting is abundant.
The utility model provides a kind of guiding device for glass-chip cutting, comprising:
It is oriented to briquetting, the guiding side of the guiding briquetting includes recess portion and outer surface, when the recess portion accommodates glass-chip
When, the surface of the glass-chip and the outer surface are in same plane, and the outer surface is for guiding glass-cutting chip
Scribing wheel cuts and rises knife.
Optionally, the guiding briquetting includes at least three sub- briquettings that arrangement is put, wherein accommodates the glass-chip
The sub- briquetting at edge include the recess portion and the outer surface, the bottom surface of the surface of minor briquetting and the recess portion is in same
One plane.
Optionally, it is 75 materials below that the material of the guiding briquetting, which includes shore hardness,.
Optionally, the material of the guiding briquetting includes nylon material.
The utility model also provides a kind of cutting equipment, comprising:
It is oriented to briquetting, the guiding side of the guiding briquetting includes recess portion and outer surface, when the recess portion accommodates the glass
When chip, the surface of the glass-chip and the outer surface are in same plane, and the outer surface is for guiding glass-cutting core
The scribing wheel of piece cuts and rises knife；
Scribing wheel, for cutting and rising knife in the outer surface of the guiding briquetting, to the described recessed of the guiding briquetting
The glass-chip that portion accommodates is cut.
Optionally, the guiding briquetting includes at least three sub- briquettings that arrangement is put, wherein accommodates the glass-chip
The sub- briquetting at edge include the recess portion and the outer surface, the bottom surface of the surface of minor briquetting and the recess portion is in same
One plane.
Optionally, it is 75 materials below that the material of the guiding briquetting, which includes shore hardness,.
Optionally, the guiding briquetting includes that briquetting is oriented to made of nylon material.
The technical solution that the embodiments of the present invention provide can include the following benefits:
In the present embodiment, glass-cutting chip is assisted using including the guiding briquetting of recess portion and outer surface, is oriented to briquetting
When recess portion accommodates glass-chip, the outer surface of the surface of glass-chip and briquetting maintains an equal level, and scribing wheel is from guiding briquetting at this time
Outer surface starts to cut, realize from briquetting to glass-chip smooth transition contact and glass-chip to briquetting steady mistake
Contact is crossed, so that cutting, playing knife moment to glass-chip without impact, while also avoiding cutting, rising the blind area of knife, it is ensured that chip
Sufficiently, i.e. cutting actual range is greater than glass length for cutting, and it is abnormal to avoid the fragment as caused by cutting is insufficient.
Other features and advantages of the utility model will illustrate in the following description, also, partly from specification
In become apparent, or understood and implementing the utility model.The purpose of this utility model and other advantages can pass through
Structure specifically indicated in the written description, claims, and drawings is achieved and obtained.
Below by drawings and examples, the technical solution of the utility model is described in further detail.
Detailed description of the invention
Attached drawing is used to provide a further understanding of the present invention, and constitutes part of specification, practical with this
Novel embodiment is used to explain the utility model together, does not constitute limitations of the present invention.In the accompanying drawings:
Fig. 1 is the schematic diagram of glass-chip cutting in the related technology；
Fig. 2 is the schematic diagram of the guiding device for glass-chip cutting in an embodiment of the present invention；
Fig. 3 is the schematic diagram of the guiding device for glass-chip cutting in an embodiment of the present invention；
Fig. 4 is the schematic diagram of the guiding device for glass-chip cutting in an embodiment of the present invention；
Fig. 5 is the schematic diagram of the guiding device for glass-chip cutting in an embodiment of the present invention；
Fig. 6 is the schematic diagram of the guiding device for glass-chip cutting in an embodiment of the present invention；
Fig. 7 is the schematic diagram of the guiding device for glass-chip cutting in an embodiment of the present invention；
Fig. 8 is the schematic diagram of the cutting equipment in an embodiment of the present invention；
Fig. 9 is the schematic diagram of the cutting equipment in an embodiment of the present invention.
Specific embodiment
It is illustrated below in conjunction with preferred embodiment of the attached drawing to the utility model, it should be understood that described herein excellent
It selects embodiment to be only used for describing and explaining the present invention, is not used to limit the utility model.
The glass-chip cutting equipment of current CIGS thin film solar cell is when carrying out glass-chip cutting, using golden steel
Stone scribing wheel is directly contacted with chip surface.As shown in Figure 1, the upper surface of glass-chip 101 is pushed down by briquetting 102, cutting
Break bar is cut from the lower surface position A of glass-chip 102, and position A is usually on glass-chip, and apart from glass-chip
Edge 2-4mm, then scribing wheel is cut upwards, to the right, then at the edge for the other side for not reaching glass-chip also
Position B at rise knife, the position of edge 2-4mm of the position A usually on glass-chip apart from glass-chip.This make cutting away from
It is less than actual glass length from (i.e. with a distance from A to B), cuts insufficient.It is insufficient due to cutting in subsequent Slicing procedure, and
CIGS glass-chip glass deforms after heated, and surface stress increases, and is easy to appear fragment failure.
To solve the above problems, the utility model provide it is a kind of for assisting the guiding device of glass-cutting chip, can
In the case where directly contact with the break bar when avoiding cutting and glass edge, it is ensured that glass-chip cutting is abundant.
Fig. 2 is the main view for the guiding device that an embodiment of the present invention provides.Referring to fig. 2, leading in the present embodiment
It include guiding briquetting 200 to device, the guiding side of guiding briquetting 200 includes recess portion 201 and outer surface 202, when recess portion 201 accommodates
When glass-chip, the surface and outer surface 202 of glass-chip are in same plane, and outer surface 202 is for guiding glass-cutting chip
Scribing wheel cut and rise knife.
The recess portion 201 for being illustrated in figure 3 guiding briquetting 200 accommodates the schematic diagram of glass-chip 301.Recess portion 201 includes bottom
Face and side wall, when the recess portion 201 for being oriented to briquetting 200 accommodates glass-chip 301, the corresponding end face of glass-chip 301 is supported
The bottom surface of recess portion 201 and side wall, the outer surface of the guiding side on surface and guiding briquetting that glass-chip 301 exposes in recess portion
202 in same plane.Scribing wheel for glass-cutting chip cuts (i.e. A ') and is risen on the outer surface 202 of guiding briquetting
Knife (i.e. B ').
In guiding device provided in this embodiment, glass-cutting is assisted using including the guiding briquetting of recess portion and outer surface
Chip, when guiding briquetting recess portion accommodates glass-chip, the outer surface of the surface of glass-chip and briquetting maintains an equal level, and break bar is from leading at this time
Start to cut to the outer surface of briquetting, realizes smooth transition contact from briquetting to glass-chip and glass-chip to briquetting
Smooth transition contact so that cutting, playing knife moment to glass-chip without impact, while also avoiding cutting, rise the blind area of knife,
Ensure that chip cutting is abundant, i.e. cutting actual range is greater than glass length, and it is different to avoid the fragment as caused by cutting is insufficient
Often.
In an embodiment of the utility model, guiding briquetting is constituted by arranging at least three sub- briquettings put, wherein
The sub- briquetting for accommodating the edge of glass-chip includes recess portion, and the surface of minor briquetting and the inner bottom surface of recess portion are in same flat
Face.Therefore, the length (increasing or decreasing intermediate sub- briquetting) of guiding briquetting can be adjusted according to the length of glass-chip, with
And the sub- briquetting at both ends is adjusted according to the thickness of glass-chip.Which increase the flexibilities of guiding briquetting used.
As shown in figure 4, in one embodiment, guiding briquetting 400 includes four sub- briquettings, wherein accommodates glass-chip
The sub- briquetting 401 at edge includes recess portion 403, and the surface 405 of minor briquetting 402 and the bottom surface of recess portion 403 are in same plane.
It is illustrated in figure 5 the main view of the sub- briquetting 401 in Fig. 4, is illustrated in figure 6 the right view of sub- briquetting shown in fig. 5
Figure, is illustrated in figure 7 the bottom view of sub- briquetting shown in fig. 5.Referring to Fig. 5, Fig. 6 and Fig. 7, the guiding side of sub- briquetting 401 includes
Recess portion 403 and outer surface 404, when recess portion 403 accommodates glass-chip, the surface of outer surface 404 and glass-chip is same flat
Face, outer surface 404 is for guiding the scribing wheel of glass-cutting chip to cut and rise knife.
In an embodiment of the utility model, it is 75 materials below that the material for being oriented to briquetting, which includes shore hardness,.?
When scribing wheel is cut since glass-chip side, the guiding briquetting with this hardness can be from the phase of glass-chip
Pair the other side support glass-chip, remain stationary glass-chip, also, due to guiding briquetting be not high rigidity, because
When this can protect glass-chip and is directed to briquetting and supports, the surface supported will not be directed to briquetting abrasion.For example, guiding pressure
The material of block may include nylon material.
The utility model also provides a kind of cutting equipment, as shown in Figure 8, comprising:
It is oriented to briquetting 801, the guiding side of guiding briquetting 801 includes recess portion 802 and outer surface 803, when recess portion 802 accommodates glass
When glass chip 804, the surface and outer surface 803 of glass-chip 804 are in same plane, and outer surface 803 is for guiding glass-cutting
The scribing wheel 805 of chip cuts and rises knife；
Scribing wheel 805, for cutting and rising knife in the outer surface 803 of guiding briquetting 801, to the recessed of guiding briquetting 801
The glass-chip 804 that portion 802 accommodates is cut.
In one embodiment, as shown in figure 9, guiding briquetting 801 include arrangement put at least three sub- briquettings 901,
902, wherein the sub- briquetting 901 for accommodating the edge of glass-chip 804 includes recess portion 802 and outer surface 803, minor briquetting 902
Surface and the bottom surface of recess portion 802 be in same plane.
In one embodiment, it is 75 materials below that the material for being oriented to briquetting, which includes shore hardness,.
In one embodiment, guiding briquetting includes that briquetting is oriented to made of nylon material.
In the present embodiment, glass-cutting core is assisted using including the guiding briquetting of recess portion and outer surface in cutting equipment
Piece, when guiding briquetting recess portion accommodates glass-chip, the outer surface of the surface of glass-chip and briquetting maintains an equal level, at this time scribing wheel from
The outer surface of guiding briquetting starts to cut, and realizes smooth transition contact from briquetting to glass-chip and glass-chip to pressure
The smooth transition of block contacts, so that cutting, playing knife moment to glass-chip without impact, while also avoiding cutting, playing the blind of knife
Area, it is ensured that chip cutting is abundant, i.e., cutting actual range be greater than glass length, avoid as cut it is insufficient caused by fragment
It is abnormal.
It should be understood by those skilled in the art that, the embodiments of the present invention can provide as method, system or computer
Program product.Therefore, the utility model can be used complete hardware embodiment, complete software embodiment or combine software and hardware
The form of the embodiment of aspect.
Obviously, it is practical without departing from this can to carry out various modification and variations to the utility model by those skilled in the art
Novel spirit and scope.If in this way, these modifications and variations of the present invention belong to the utility model claims and
Within the scope of its equivalent technologies, then the utility model is also intended to include these modifications and variations.
Claims (8)
1. a kind of guiding device, for assisting glass-cutting chip characterized by comprising
It is oriented to briquetting, the guiding side of the guiding briquetting includes recess portion and outer surface, when the recess portion accommodates glass-chip, institute
In same plane, the outer surface is used to guide the cutter of glass-cutting chip on the surface and the outer surface for stating glass-chip
Wheel cuts and rises knife.
2. guiding device according to claim 1, which is characterized in that the guiding briquetting includes at least three that arrangement is put
A sub- briquetting, wherein the sub- briquetting for accommodating the edge of the glass-chip includes the recess portion and the outer surface, minor pressure
The surface of block and the bottom surface of the recess portion are in same plane.
3. guiding device according to claim 1 or 2, which is characterized in that the material of the guiding briquetting includes that shore is hard
Degree is 75 materials below.
4. guiding device according to claim 3, which is characterized in that the material of the guiding briquetting includes nylon material.
5. a kind of cutting equipment characterized by comprising
It is oriented to briquetting, the guiding side of the guiding briquetting includes recess portion and outer surface, when the recess portion accommodates glass-chip, institute
In same plane, the outer surface is used to guide the cutter of glass-cutting chip on the surface and the outer surface for stating glass-chip
Wheel cuts and rises knife；
Scribing wheel accommodates the recess portion of the guiding briquetting for cutting and rising knife in the outer surface of the guiding briquetting
Glass-chip is cut.
6. cutting equipment according to claim 5, which is characterized in that
The guiding briquetting includes at least three sub- briquettings that arrangement is put, wherein accommodates the son at the edge of the glass-chip
Briquetting includes the recess portion and the outer surface, and the surface of minor briquetting and the bottom surface of the recess portion are in same plane.
7. cutting equipment according to claim 5 or 6, which is characterized in that the material of the guiding briquetting includes that shore is hard
Degree is 75 materials below.
8. cutting equipment according to claim 7, which is characterized in that the guiding briquetting includes leading made of nylon material
To briquetting.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820867244.3U CN208562148U (en) | 2018-06-05 | 2018-06-05 | A kind of guiding device and cutting equipment |
| PCT/CN2018/107406 WO2019232986A1 (en) | 2018-06-05 | 2018-09-25 | Guide apparatus and cutting device |
| JP2018003995U JP3219484U (en) | 2018-06-05 | 2018-10-17 | Guide device and cutting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820867244.3U CN208562148U (en) | 2018-06-05 | 2018-06-05 | A kind of guiding device and cutting equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208562148U true CN208562148U (en) | 2019-03-01 |
Family
ID=64899656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820867244.3U Active CN208562148U (en) | 2018-06-05 | 2018-06-05 | A kind of guiding device and cutting equipment |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3219484U (en) |
| CN (1) | CN208562148U (en) |
| WO (1) | WO2019232986A1 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002252187A (en) * | 2001-02-27 | 2002-09-06 | Mitsubishi Electric Corp | Cutter for semiconductor wafer, and method of cutting semiconductor wafer using the same |
| CN203225245U (en) * | 2013-05-06 | 2013-10-02 | 金杰 | High-quality wafer ring |
| CN205473337U (en) * | 2016-03-29 | 2016-08-17 | 江西鹏飞机电制造有限公司 | Energy -conserving high -efficient full -automatic dark processing lines of high strength cell -phone glass |
-
2018
- 2018-06-05 CN CN201820867244.3U patent/CN208562148U/en active Active
- 2018-09-25 WO PCT/CN2018/107406 patent/WO2019232986A1/en active Application Filing
- 2018-10-17 JP JP2018003995U patent/JP3219484U/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019232986A1 (en) | 2019-12-12 |
| JP3219484U (en) | 2018-12-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 100176 Beijing Daxing District Beijing economic and Technological Development Zone Rongchang East Street 7 hospital 6 Building 3001 room. Patentee after: Beijing Dingrong Photovoltaic Technology Co.,Ltd. Address before: 100176 Beijing Daxing District Beijing economic and Technological Development Zone Rongchang East Street 7 hospital 6 Building 3001 room. Patentee before: BEIJING APOLLO DING RONG SOLAR TECHNOLOGY Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210331 Address after: Room 201, Building A, 1 Qianwan Road, Qianhai Shenzhen-Hong Kong Cooperation Zone, Shenzhen, Guangdong Province Patentee after: Shenzhen Zhengyue development and Construction Co.,Ltd. Address before: 100176 Beijing Daxing District Beijing economic and Technological Development Zone Rongchang East Street 7 hospital 6 Building 3001 room. Patentee before: Beijing Dingrong Photovoltaic Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210902 Address after: No.66210, 3rd floor, Pudong Free Trade Zone, Shanghai, China Patentee after: Shanghai zuqiang Energy Co.,Ltd. Address before: Room 201, Building A, 1 Qianwan Road, Qianhai Shenzhen-Hong Kong Cooperation Zone, Shenzhen, Guangdong Province Patentee before: Shenzhen Zhengyue development and Construction Co.,Ltd. |
|
| TR01 | Transfer of patent right |