CN208547768U - Wavelength convert module and projection arrangement - Google Patents
Wavelength convert module and projection arrangement Download PDFInfo
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- CN208547768U CN208547768U CN201821064497.3U CN201821064497U CN208547768U CN 208547768 U CN208547768 U CN 208547768U CN 201821064497 U CN201821064497 U CN 201821064497U CN 208547768 U CN208547768 U CN 208547768U
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Abstract
A kind of wavelength convert module and projection arrangement.Wavelength convert module includes a substrate and a wavelength conversion layer.Wavelength conversion layer is located on substrate, and has multiple first holes.Wavelength conversion layer fills up glue material including a wavelength conversion material, one first bond material and one first.Wavelength conversion material intersperses among in the first bond material.First fills up glue material for filling up at least partly multiple first holes.Projection arrangement includes above-mentioned wavelength convert module, an excitation light source, a light valve and a projection lens.The wavelength convert module of the utility model has good transfer efficiency and reliability.
Description
Technical field
The utility model relates to a kind of optical module and the Optical devices comprising above-mentioned optical component, and especially
About a kind of wavelength convert module and projection arrangement.
Background technique
Recently with light emitting diode (light-emitting diode, LED) and laser diode (laser diode) etc.
Projection arrangement based on solid state light emitter occupies a tiny space on the market gradually.Since laser diode has greater than about 20%
Luminous efficiency in order to break through the light source limitation of light emitting diode, therefore has developed gradually with excitation light source excitated fluorescent powder and has produced
Pure color light source required by raw projector.
It is however generally that the processing procedure of existing fluorescent powder wheel is by fluorescent powder or reflecting material mixing silica gel
(Silicone) it is coated on the substrate of fluorescent powder wheel and respectively constitutes wavelength conversion layer or the reflecting layer of fluorescent powder wheel, but silica gel
But there is the problems such as characteristic and deterioration of non-refractory, therefore when laser light long-time excitated fluorescent powder wheel, silica gel can not resistance to height
Temperature and easily lead to deterioration or scaling loss, will affect the luminous efficiency and reliability of such fluorescent powder wheel.On the other hand, there is another kind
The processing procedure of fluorescent powder wheel is to replace silica gel mixed fluorescent powder or reflection with inorganic glue material (such as: glass cement or ceramic material)
Material and constitute fluorescent powder wheel.There is preferable thermal conductivity and heat resistance with the fluorescent powder wheel that this processing procedure is formed, however it is such glimmering
Light powder wheel has some bonding agents, dispersing agent, additive etc. and evaporate into air, just during sintering or curing molding
Hole is generated in wavelength conversion layer or reflecting layer.The presence meetings of these holes so that the transfer efficiency of wavelength conversion layer be deteriorated with
And the heat-conducting effect in wavelength conversion layer or reflecting layer is deteriorated, and then influence reliability and the service life of fluorescent powder wheel.
" background technique " is partially used only to help to understand the content of the present invention, therefore is taken off in " background technique " part
The content of dew may include some known technologies without constituting road known to those skilled in the art.In " background technique " part institute
The content of exposure does not represent the content or the utility model one or more embodiment problem to be solved, practical at this
It has been readily known to those persons skilled in the art or has recognized before novel application.
Utility model content
The utility model provides a kind of wavelength convert module, has good transfer efficiency and reliability.
The utility model provides a kind of projection arrangement, has good optical quality and reliability.
The other objects and advantages of the utility model can be obtained from the technical characteristic disclosed by the utility model into one
The understanding of step.
It is to propose one kind up to one of above-mentioned or part or all of purpose or other purposes, an embodiment of the utility model
Wavelength convert module.Wavelength convert module includes a substrate and a wavelength conversion layer.Wavelength conversion layer is located on substrate, and has
There are multiple first holes.Wavelength conversion layer fills up glue material including a wavelength conversion material, one first bond material and one first.
Wavelength conversion material intersperses among in the first bond material.First fills up glue material for filling up at least partly multiple first holes.
It is to propose one kind up to one of above-mentioned or part or all of purpose or other purposes, an embodiment of the utility model
Projection arrangement.Projection arrangement includes above-mentioned wavelength convert module, an excitation light source, a light valve and a projection lens.Excitation
For light source for issuing an excitation beam, wherein excitation beam is transferred to wavelength convert module, and converts via wavelength convert module
For an illuminating bundle.Light valve is located on the transmission path of illuminating bundle and for illuminating bundle to be converted into an image strip.It throws
Shadow camera lens is located on the transmission path of image strip and is suitable for image strip being converted into a projected light beam.
Based on above-mentioned, the embodiments of the present invention at least have effects that following one of advantage or.It is practical new at this
In the embodiment of type, wavelength convert module is selected by the material that the first bond material and first fill up glue material, and can promote wave
Thermal conductivity, heat resistance and the reliability of long conversion module.Also, wavelength convert module also can be by filled up in hole
One fills up glue material, and wavelength conversion layer is made to keep good transfer efficiency.In addition, used above-mentioned wavelength convert module and
Therefore projection arrangement can also have good reliability and transfer efficiency.
In order to make the above-mentioned features and advantages of the utility model more obvious and understandable, special embodiment below, and cooperate attached drawing
It is described in detail below.
Detailed description of the invention
Figure 1A is a kind of schematic cross-sectional view of wavelength convert module of an embodiment of the present invention.
Figure 1B is the top view of the wavelength convert module of Figure 1A.
Fig. 2 to Figure 12 is a kind of schematic cross-sectional view of wavelength convert module of various embodiments of the utility model.
Figure 13 A is a kind of production flow diagram of wavelength convert module of an embodiment of the present invention.
Figure 13 B is a kind of flow chart of wavelength conversion layer fabrication steps of Figure 13 A.
Figure 14 A is the production flow diagram of another wavelength convert module of an embodiment of the present invention.
Figure 14 B is a kind of flow chart of reflecting layer fabrication steps of Figure 14 A.
Figure 15 is a kind of configuration diagram of projection arrangement of an embodiment of the present invention.
Figure 16 is the configuration diagram of another projection arrangement of an embodiment of the present invention.
Specific embodiment
In relation to addressing other technologies content, feature and effect before the utility model, in following cooperation with reference to one of attached drawing
In the detailed description of preferred embodiment, can clearly it present.The direction term being previously mentioned in following embodiment, such as: upper,
Under, it is left and right, front or rear etc., be only the direction with reference to attached drawing.Therefore, the direction term used is for illustrating not to be used to limit
The utility model processed.
Figure 1A is a kind of schematic cross-sectional view of wavelength convert module of an embodiment of the present invention.Figure 1B is the wave of Figure 1A
The top view of long conversion module.Figure 1A and Figure 1B are please referred to, the wavelength convert module 100A of the present embodiment has an at least wavelength
Conversion light school district WR and a light are by area TR, and wavelength convert module 100A includes a substrate 110 and a wavelength conversion layer
120.Specifically, as shown in Figure 1A, in the present embodiment, wavelength conversion layer 120 is located on substrate 110, and a corresponding wavelength
Conversion light school district WR and be arranged.In the present embodiment, the material of substrate 110 can have good thermal conductivity for aluminium or aluminium nitride etc.
With the material of heat resistance.
More specifically, as shown in Figure 1A, in the present embodiment, wavelength conversion layer 120 has multiple first hole CA1,
And glue material FM1 is filled up including a wavelength conversion material WM, one first bond material BM1 and one first.Wavelength conversion material WM
It intersperses among in the first bond material BM1.First fills up glue material FM1 for filling up at least partly multiple first hole CA1.
For example, in the present embodiment, wavelength conversion material WM is, for example, fluorescent powder, and the first bond material BM1 is nothing
Machine glueing material, material may include the materials such as silica, silicates, phosphoric acid salt or nanometer grade silica, and the
One bond material BM1 has good thermal conductivity.In this way, the wavelength conversion layer 120 formed whereby can have good thermal conductivity,
Heat resistance and reliability, and biggish laser energy can be born.
Specifically, when due to forming the process of wavelength conversion layer 120 by such first bond material BM1, first
Hole CA1 can also be generated in wavelength conversion layer 120 therewith, and be located in wavelength conversion layer 120, therefore must fill up using first
Glue material FM1 is filled up.Specifically, as shown in Figure 1A, in the present embodiment, first, which fills up glue material FM1, is located at wavelength conversion layer 120
In, and a part of these first holes CA1 has been filled up, and can reduce in wavelength conversion layer 120 shared by first hole CA1
Volume ratio.For example, in the present embodiment, multiple holes that glue material FM1 is filled up are not filled up by first and accounts for wavelength conversion layer
120 percent by volume can then be reduced to 3% or less.It should be noted that numberical range herein is all only as illustrating it
With being not intended to limit the utility model.
For example, in the present embodiment, first glue material FM1 is filled up as inorganic glue material.In this way, turning reducing wavelength
While changing volume ratio shared by the first hole CA1 in layer 120, it can also possess good thermal conductivity and heat resistance simultaneously,
And biggish laser energy can be born.Also, it in the present embodiment, also can be according to processing procedure or product demand, accordingly to select
One fills up the material of glue material FM1 and the first bond material BM1.For example, in the present embodiment, first fill up glue material FM1's
Material selects identical material or different materials from the compatibility on the visual processing procedure of material and component of the first bond material BM1
Matter to reduce volume ratio shared by the first hole CA1 in wavelength conversion layer 120 to the greatest extent, and forms comparatively dense knot
Structure, to increase the reliability of wavelength convert module.
On the other hand, as shown in Figure 1A, in the present embodiment, wavelength convert module further includes a reflecting layer 130, is located at base
Between plate 110 and wavelength conversion layer 120.Specifically, as shown in Figure 1A, reflecting layer 130 has multiple second hole CA2, and
Glue material FM2 is filled up including a scattering material RM, one second bond material BM2 and one second.Scattering material RM uniformly dispersing
In the second bond material BM2, and second fills up glue material FM2 for filling up at least partly multiple second hole CA2.
For example, in the present embodiment, the second bond material BM2 is also inorganic glue material, and material may include two
The materials such as silica, silicates, phosphoric acid salt or nanometer grade silica, and there is good thermal conductivity.In addition, scattering material
The material for expecting RM can be titanium dioxide (TiO2), silica (SiO2), aluminium oxide (Al2O3), boron nitride (BN), zirconium dioxide
(ZrO2) etc..In this way, the reflecting layer 130 formed whereby can have good thermal conductivity, heat resistance and reliability, and can hold
By biggish laser energy.
However, due to the process for forming reflecting layer 130 by such second bond material BM2 mixing scattering material RM
When, the second hole CA2 can also be generated therewith, therefore must be filled up glue material FM2 using second and be filled up.Specifically, as shown in Figure 1A,
In the present embodiment, it second fills up glue material FM2 and has filled up a part of these second holes CA2, and can reduce in reflecting layer 130
In volume ratio shared by the second hole CA2.For example, in the present embodiment, glue material FM2 is not filled up by second fill up more
The percent by volume that a hole accounts for reflecting layer 130 can also be reduced to 3% or less.It should be noted that numberical range herein is all only
It is used, is not intended to limit the utility model as illustrating.
For example, in the present embodiment, second glue material FM2 is filled up as inorganic glue material.In this way, reducing reflecting layer
While volume ratio shared by the second hole CA2 in 130, it can also possess good thermal conductivity and heat resistance simultaneously, and energy
Bear biggish even laser energy.Also, it in the present embodiment, also can be according to processing procedure or product demand, accordingly to select second to fill out
The material of glue material FM2 and the second bond material BM2.For example, in the present embodiment, the second material for filling up glue material FM2
Identical material or different materials are selected from the compatibility on the visual processing procedure of material and component of the second bond material BM2,
To reduce volume ratio shared by the second hole CA2 in reflecting layer 130 to the greatest extent, and comparatively dense structure is formed, to increase
Add the reliability of wavelength convert module.
In addition, as shown in Figure 1A, in the present embodiment, wavelength convert module also optionally includes a heat-conducting glue layer
140, between reflecting layer 130 and substrate 110.Solidification temperature during the processing procedure for forming reflecting layer 130 is greater than 300 DEG C
When, then the production in reflecting layer 130 can be first carried out, then reflecting layer 130 is attached on substrate 110 by heat-conducting glue layer 140.This
Outside, although the heat-conducting glue layer 140 of the present embodiment is with, to illustrate, the utility model is not between reflecting layer 130 and substrate 110
It is confined to this.In other examples, if the solidification temperature during the processing procedure of formation wavelength conversion layer 120 is also greater than 300
DEG C when, can also advanced row wavelength conversion layer 120 production, then by another heat-conducting glue layer (not being painted) by wavelength conversion layer 120
It is attached on reflecting layer 130, this heat-conducting glue layer then can be between wavelength conversion layer 120 and reflecting layer 130, and is light transmission
Material, other details can refer to the explanation of the embodiment of Fig. 5 B, and it will not be described here.
In this way, wavelength convert module 100A fills up glue material by the first bond material BM1, the second bond material BM2, first
FM1 and second fills up the material selection of glue material FM2, and can promote the thermal conductivity of wavelength convert module 100A, heat resistance and can
By degree.Also, wavelength convert module 100A also can fill up glue material FM1 by first filled up in the first hole CA1, and make
Wavelength conversion layer 120 keeps good transfer efficiency.
Fig. 2 is a kind of schematic cross-sectional view of wavelength convert module of the utility model.Referring to figure 2., the wavelength of Fig. 2 turns
It is similar with the wavelength convert module 100A of Figure 1A to change the mold block 100B, and difference is as described below.In the present embodiment, wavelength convert mould
It is organic glueing material that the first of block 100B, which fills up glue material FM1, and second to fill up glue material FM2 also be organic glueing material.Citing
For, first to fill up glue material FM1 and second to fill up the material of glue material FM2 can be silica gel.In this way, consolidating due to organic glueing material
Content is larger, can fill up more manifold hole after hardening, thus reduces the first hole CA1 in wavelength conversion layer 120
And volume ratio shared by the second hole CA2 in reflecting layer 130, and more fine and close structure is formed, and can increase wave
The structural strength and reliability of long conversion module, and optimize the transfer efficiency of wavelength convert module.
Also, wavelength convert module also can by select the material of the first bond material BM1 and the second bond material BM2 for
Inorganic glue material, and the thermal conductivity, heat resistance and reliability of wavelength convert module can be promoted, and reach and wavelength above-mentioned
The similar effect of conversion module, just it will not go into details herein.
Fig. 3 is a kind of schematic cross-sectional view of wavelength convert module of the utility model.The wavelength convert module 100C of Fig. 3 with
The wavelength convert module 100A of Figure 1A is similar, and difference is as described below.In the present embodiment, the first of wavelength convert module 100C
Filling up glue material FM1 is organic glueing material, and second fills up glue material FM2 as inorganic glue material.In this way, by the first padding gum
Material FM1 is that the material of organic glueing material selects, then can be reduced body shared by the first hole CA1 in wavelength conversion layer 120
Product ratio, and more fine and close structure is formed, and can increase the structural strength and reliability of wavelength convert module, and optimize
The transfer efficiency of wavelength convert module.
Also, the material that glue material FM2 is inorganic glue material is filled up by second to select, then can reduce reflecting layer 130
In the second hole CA2 shared by volume ratio while, can also possess good thermal conductivity and heat resistance simultaneously, and can bear
Biggish laser energy.Also, it in the present embodiment, also can be according to processing procedure or product demand, accordingly to select the second padding gum
The material of material FM2 and the second bond material BM2, to body shared by the second hole CA2 of the energy minimization in reflecting layer 130
Product ratio, to optimize the reliability of wavelength convert module.
Also, wavelength convert module also can by select the material of the first bond material BM1 and the second bond material BM2 for
Inorganic glue material, and the thermal conductivity, heat resistance and reliability of wavelength convert module can be promoted, and reach and wavelength above-mentioned
The similar effect of conversion module, just it will not go into details herein.
Fig. 4 is a kind of schematic cross-sectional view of wavelength convert module of the utility model.The wavelength convert module 100D of Fig. 4 with
The wavelength convert module 100A of Figure 1A is similar, and difference is as described below.In the present embodiment, the first of wavelength convert module 100D
Filling up glue material FM1 is inorganic glue material, and second fills up glue material FM2 as organic glueing material.In this way, reducing wavelength conversion layer
While volume ratio shared by the first hole CA1 in 120, due to first fill up glue material FM1 be with good heat-conductivity with
The inorganic glue material of heat resistance, therefore can also possess good thermal conductivity and heat resistance simultaneously, and biggish laser can be born
Energy.Also, it in the present embodiment, also can be according to processing procedure or product demand, accordingly to select first to fill up glue material FM1 and first
The material of bond material BM1, to reduce volume ratio shared by the first hole CA1 in wavelength conversion layer 120 to the greatest extent, and shape
At comparatively dense structure, to increase the reliability of wavelength convert module.
Also, the material that glue material FM2 is organic glueing material is filled up by second to select, then can be reduced in reflecting layer 130
In the second hole CA2 shared by volume ratio, and form more fine and close structure, and can increase the structure of wavelength convert module
Intensity and reliability, and optimize the transfer efficiency of wavelength convert module.
Also, wavelength convert module also can by select the material of the first bond material BM1 and the second bond material BM2 for
Inorganic glue material, and the thermal conductivity, heat resistance and reliability of wavelength convert module can be promoted, and reach and wavelength above-mentioned
The similar effect of conversion module, just it will not go into details herein.
Fig. 5 A is a kind of schematic cross-sectional view of wavelength convert module of the utility model.The wavelength convert module 200A of Fig. 5 A
It is similar with the wavelength convert module 100A of Figure 1A, and difference is as described below.In the present embodiment, reflecting layer 230 is substrate 110
The metal layer for having protective layer or dielectric substance layer is coated on surface, material can be silver or aluminium.Due to the thickness pole in reflecting layer 230
It is thin, therefore there is good thermal conductivity and heat resistance, and bigger laser energy can be born, and wavelength convert module can be promoted
Thermal conductivity, heat resistance and reliability.Therefore, the reflecting layer 230 of wavelength convert module 200A does not need configuration scattering material, fills out
Glue material etc..
Also, wavelength convert module 200A also can fill up glue material FM1 and first by the first of selection wavelength conversion layer 120
The material of bond material BM1 is inorganic glue material, and can promote the thermal conductivity of wavelength convert module, heat resistance and reliable
Degree, and reach with effect as wavelength convert module class above-mentioned, herein just it will not go into details.
Fig. 5 B is a kind of schematic cross-sectional view of wavelength convert module of the utility model.The wavelength convert module 200B of Fig. 5 B
It is similar with the wavelength convert module 200A of Fig. 5 A, and difference is as described below.In the present embodiment, wavelength convert module is led including one
Hot glue layer 240, between reflecting layer 230 and wavelength conversion layer 120.For example, in the present embodiment, when formation wavelength turns
When the solidification temperature changed during the processing procedure of layer 120 is also greater than 300 DEG C, can advanced row wavelength conversion layer 120 production, then by
Wavelength conversion layer 120 is attached on reflecting layer 230 by heat-conducting glue layer 240.In this way, which heat-conducting glue layer 240 can then be located at wavelength
Between conversion layer 120 and reflecting layer 230, and the material of heat-conducting glue layer 240 may be selected to be light-transmitting materials, and make via wavelength convert
The commutating optical beam generated in layer 120 can penetrate heat-conducting glue layer 240, and after being reflected by reflecting layer 230, by wavelength conversion layer 120
Light-emitting surface goes out light.
In the present embodiment, wavelength convert module 200B also can fill up glue material FM1 by selection first and be combined material with first
The material for expecting BM1 is inorganic glue material, and can promote the thermal conductivity, heat resistance and reliability of wavelength convert module, and is reached
To with effect as wavelength convert module class above-mentioned, herein just it will not go into details.
Fig. 6 is a kind of schematic cross-sectional view of wavelength convert module of the utility model.The wavelength convert module 200C of Fig. 6 with
The wavelength convert module 200A of Fig. 5 A is similar, and difference is as described below.In the present embodiment, the first of wavelength convert module 200C
Filling up glue material FM1 is organic glueing material.It is selected in this way, filling up the material that glue material FM1 is organic glueing material by first, then
It can be reduced volume ratio shared by the first hole CA1 in wavelength conversion layer 120, and form more fine and close structure, and energy
Increase the structural strength and reliability of wavelength convert module, and optimizes the transfer efficiency of wavelength convert module.
Also, wavelength convert module 200C also can by select the material of the first bond material BM1 for inorganic glue material,
And the thermal conductivity, heat resistance and reliability of wavelength convert module can be promoted, and reach similar with wavelength convert module above-mentioned
Effect, herein just it will not go into details.
Fig. 7 and Fig. 8 is a kind of schematic cross-sectional view of wavelength convert module of the utility model.The wavelength convert module of Fig. 7
The wavelength convert module 200A of wavelength convert module 200E and Fig. 5 of 200D, Fig. 8 are similar, and difference is as described below.In this implementation
In example, wavelength convert module 200D, wavelength convert module 200E at least partly first fill up glue material FM1 and are combined material with first
Expect that BM1 is different.
Specifically, as illustrated in figs. 7 and 8, wavelength conversion layer 120 has a first surface 121 and one relative to each other
Second surface 122, wherein first surface 121 is towards substrate 110.The first hole CA1 in wavelength conversion layer 120 includes multiple tables
Face hole CAS and multiple center hole CAC, multiple surface hole defect CAS adjacent to first surface 121 and second surface 122,
Center hole CAC is not adjacent with second surface 122 with first surface 121 relative to multiple surface hole defect CAS, i.e. center hole
CAC is interspersed among in wavelength conversion layer 120 adjacent to the surface hole defect CAS of first surface 121 and adjacent to the table of second surface 122
Between the CAS of face hole.Also, as illustrated in figs. 7 and 8, first to fill up glue material FM1 include for filling up multiple surface hole defect CAS
A surface fill up glue material FMS and fill up glue material FMC with the center for filling up multiple center hole CAC.
In these embodiments, it is optionally unlike material that surface, which fills up glue material FMS and fills up glue material FMC with center,.
Specifically, surface fill up glue material FMS be inorganic glue material and organic glueing material first, and center fill up glue material FMC
For the another of inorganic glue material and organic glueing material.For example, in the example of figure 7, surface fills up glue material FMS and is
Inorganic glue material, and it is organic glueing material that glue material FMC is filled up at center.In the embodiment in fig. 8, glue material FMS is filled up on surface
For organic glueing material, and it is inorganic glue material that glue material FMC is filled up at center.
It whereby, can be according to processing procedure or product demand, accordingly to select the different location being located in wavelength conversion layer 120
The first material for filling up glue material FM1.For example, due to filling up in the processing procedure of glue material FM1 filling up first, it may be desirable to consider
Such as: the factors of particle diameter, contact surface property and molecular hydrophylic, therefore surface fill up the material of glue material FMS with
The compatibility that center is filled up on the visual processing procedure of material and component of glue material FMC select can it is most effective infiltration or filling the first hole
The material of hole CA1 may be selected to be inorganic glue material sometimes, and may be selected to be organic glueing material sometimes, to reduce to the greatest extent
Volume ratio shared by the first hole CA1 in wavelength conversion layer 120, and structure the finest and close is formed, to optimize wavelength
The reliability of conversion module, and optimize the transfer efficiency of wavelength convert module.
Also, wavelength convert module also can be by the material of the first bond material BM1 be selected as inorganic glue material, and can
Thermal conductivity, heat resistance and the reliability of wavelength convert module are promoted, and is reached and effect as wavelength convert module class above-mentioned
Fruit, just it will not go into details herein.
Fig. 9 is a kind of schematic cross-sectional view of wavelength convert module of the utility model.The wavelength convert module 300A of Fig. 9 with
The wavelength convert module 200B of wavelength convert module 100A or Fig. 5 B of Figure 1A is similar, and difference is as described below.In this implementation
In example, wavelength convert module 300A does not include reflecting layer 130 or reflecting layer 230, and substrate 110 is transparent material.Citing and
Speech, the material of substrate 110 can be glass.In addition, also visual demand is formed selectively heat-conducting glue layer to wavelength convert module 300A
240, heat-conducting glue layer 240 is between substrate 110 and wavelength conversion layer 120.Other details about heat-conducting glue layer 240 can refer to
The explanation of the embodiment of Fig. 5 B, it will not be described here.
In this way, wavelength convert module 300A is formed as a penetration wavelength convert module, and make via wavelength convert
The commutating optical beam generated in layer 120 can sequentially penetrate heat-conducting glue layer 240 and substrate 110.Also, due to wavelength convert module
300A also can be inorganic glue material by the first material for filling up glue material FM1 and the first bond material BM1 is selected, and can be promoted
Thermal conductivity, heat resistance and the reliability of wavelength convert module, and reach with effect as wavelength convert module class above-mentioned,
Just it will not go into details for this.
Figure 10 to Figure 12 is a kind of schematic cross-sectional view of wavelength convert module of various embodiments of the utility model.Figure 10 extremely schemes
12 wavelength convert module 300B, wavelength convert module 300C and wavelength convert module 300D respectively with the wavelength convert of Fig. 2
The wavelength convert module 200E of wavelength convert the module 200D and Fig. 8 of module 100B, Fig. 7 are similar, and difference is as described below.?
In the present embodiment, wavelength convert module 300B, wavelength convert module 300C and wavelength convert module 300D neither include reflection
Layer 130 or reflecting layer 230, and substrate 110 is transparent material.In addition, wavelength convert module 300B, wavelength convert module 300C with
And also visual demand chooses whether to form heat-conducting glue layer 240 wavelength convert module 300D, heat-conducting glue layer 240 is located at the substrate
Between 110 and the wavelength conversion layer 120.Other details about heat-conducting glue layer 240 can refer to the explanation of the embodiment of Fig. 5 B,
It will not be described here.
In this way, wavelength convert module 300B, wavelength convert module 300C and wavelength convert module 300D are formed as
The wavelength convert module of penetration.Also, due to wavelength convert module 300B, wavelength convert module 300C and wavelength convert mould
The material that block 300D also can fill up glue material FM1 and the first bond material BM1 by first selects, and can promote wavelength convert module
Thermal conductivity, heat resistance and reliability, and respectively reach and wavelength convert module 100B above-mentioned, wavelength convert module 200D
And the effect that wavelength convert module 200E is similar, just it will not go into details herein.
Collocation Figure 13 A to Figure 14 B is directed to the production of wavelength convert module 100A to wavelength convert module 200E below
Process is further explained.
Figure 13 A is a kind of production flow diagram of wavelength convert module of an embodiment of the present invention.Figure 13 B is Figure 13 A
A kind of wavelength conversion layer fabrication steps flow chart.Figure 13 A is please referred to, firstly, executing step S110, provides a substrate
110.Then, step S120 is executed, forms a wavelength conversion layer 120 on substrate 110, and wavelength conversion layer 120 is by a wave
Long conversion layer fabrication steps are formed.
For example, as shown in Figure 13 B, wavelength conversion layer fabrication steps may include the following steps S121, S122, S123,
S124.Firstly, executing step S121, a wavelength conversion material WM and one first bond material BM1 are provided, wherein wavelength convert material
Material WM is interspersed among in the first bond material BM1.Then, step S122 is executed, wavelength convert material is solidified with one first solidification temperature
Expect WM and the first bond material BM1, formation multiple first hole CA1, plurality of first hole CA1 are in interspersing among the first combination
In material BM1.Then, execute step S123, provide one first fill up glue material FM1 and make first fill up glue material FM1 be filled in
In the multiple first hole CA1 of small part.For example, it fills up first and fills up method of the glue material FM1 in the first hole CA1 and include
The processing procedures such as immersion, high-pressure injection, high pressure pressure or vacuum degassing.In this way, first fills up glue material FM1 and will can penetrate into the of part
In one hole CA1.Then, step S124 is executed, glue material FM1 is filled up with one second solidification temperature solidification first, to form wavelength
Conversion layer 120.
It is worth noting that, when the first solidification temperature in step S122 or the second solidification temperature in step S124 are greater than
It, can be first by wavelength conversion layer fabrication steps (i.e. execution step S121 to step S124) formation wavelength conversion layer 120 at 300 DEG C
Afterwards, then by heat-conducting glue layer 240 by wavelength conversion layer 120 it is attached on substrate 110.In this way, similar Fig. 9 to Figure 10 can be formed
Wavelength convert module 300A and wavelength convert module 300B structure.
On the other hand, when the first solidification temperature in step S122 or the second solidification temperature in step S124 are not more than
At 300 DEG C, then it may be selected directly in carrying out wavelength conversion layer fabrication steps, and the offer wavelength in step S121 on substrate 110
The method of transition material WM and the first bond material BM1 include coating wavelength conversion material WM and the first bond material BM1 in base
On plate 110.For example, it after wavelength conversion material WM and the first bond material BM1 being formed mixture, is coated in base
On plate 110, and the processing procedure of step S122 to step S124 is continued to execute, in this way, the wavelength of similar Figure 11 to Figure 12 can be formed
The structure of conversion module 300C and wavelength convert module 300D.
Figure 14 A is the production flow diagram of another wavelength convert module of an embodiment of the present invention.Figure 14 B is figure
A kind of flow chart of reflecting layer fabrication steps of 14A.The production process of the wavelength convert module of Figure 14 A and the wavelength of Figure 13 A turn
The production process for changing the mold block is similar, and difference is as described below.In the present embodiment, the step for forming wavelength conversion layer 120 is being executed
Before rapid S120, step S130 can be first carried out, and forms a reflecting layer 130 or reflecting layer 230 on substrate, wherein reflecting layer
130 or reflecting layer 230 between substrate 110 and wavelength conversion layer 120.
For example, forming reflecting layer 230 in the method on substrate 110 includes being coated with a reflecting material on substrate 110
Or plated film is reflected on substrate 110 in formation one.In this way, the wavelength convert module 200A of similar Fig. 5 A can be formed to Fig. 8's
The structure of wavelength convert module 200E.Or also can be as shown in Figure 14B, the wave of Figure 1A is formed by a reflecting layer fabrication steps
Reflecting layer 130 in the wavelength convert module 100D of long conversion module 100A to Fig. 4.
For example, as shown in Figure 14B, reflecting layer fabrication steps may include the following steps S131, S132, S133,
S134.Firstly, executing step S131, a scattering material RM and one second bond material BM2 are provided, wherein scattering material RM is uniform
It intersperses among in the second bond material BM2.Then, step S132 is executed, scattering material RM and the second bond material BM2, shape are solidified
At multiple second hole CA2, plurality of second hole CA2 is interspersed among in the second bond material BM2.Then, step is executed
S133 provides one second and fills up glue material FM2, and makes second to fill up glue material FM2 and be filled at least partly multiple second hole CA2
In.For example, filling up second and filling up method of the glue material FM2 in the second hole CA2 includes that immersion, high-pressure injection, high pressure are applied
The processing procedures such as pressure or vacuum degassing.Then, step S134 is executed, glue material FM2 is filled up in solidification second, to form reflecting layer.
It is worth noting that, when the solidification temperature in step S132 or step S134 be greater than 300 DEG C when, also can first by
Reflecting layer fabrication steps (after i.e. execution step S131 to step S134) forms reflecting layer 130, then will by a heat-conducting glue layer 140
Reflecting layer 130 is attached on substrate 100.In this way, the wavelength convert module 100A to Fig. 4 of similar Figure 1A can be formed to wave
The structure of long conversion module 100D.
On the other hand, when the solidification temperature in step S132 or step S134 is not more than 300 DEG C, reflecting layer 130 also may be used
It selects in directly being formed on substrate 110.Offer one scattering material RM and one second bond material BM2 in step S131 at this time
Method may include in the mixture for being coated with wavelength conversion material WM and the first bond material BM1 on substrate.And then it continues to execute
The processing procedure of step S132 to step S134.In this way, the wavelength convert module 100A of similar Figure 1A to Fig. 4 can be formed to wavelength
Conversion module 100D does not but include the structure of heat-conducting glue layer 140.In addition, this is connected to always formation reflecting layer 130 on substrate 110
Processing procedure cost of manufacture it is more cheap, therefore be conducive to volume production and commercial competition.
In this way, the wavelength convert module 100A to wavelength convert module 300D of earlier figures 1A to Figure 12 can be formed.At this
In a little embodiments, wavelength convert module 100A is formed by wavelength convert mould by the processing procedure that glue material FM1 is filled up in addition first
Block 300D can make wavelength convert module 100A to wavelength convert module 300D all have good reliability and transfer efficiency.
Figure 15 is a kind of configuration diagram of projection arrangement of an embodiment of the present invention.Figure 1A please be respectively refer to figure
8 and Figure 15, projection arrangement 400 include an excitation light source 410, a spectrophotometric unit 420, a wavelength convert module 100 above-mentioned
It (is wavelength convert module 100A, 100B, 100C, 100D, 200A, 200B, 200C, 200D and the 200E of Figure 1A into Fig. 8
Any one), a light valve 450 and a projection lens 460.In the present embodiment, wavelength convert module 100A, 100B, 100C,
The structure of 100D, 200A, 200B, 200C, 200D and 200E are described in detail above, and just it will not go into details herein.In the present embodiment
In, light valve 450 is, for example, a digital micromirror elements (digital micro-mirror device, DMD) or a silicon substrate liquid
Crystal panel (liquid-crystal-on-silicon panel, LCOS panel).However, in other embodiments, light valve
450 can also be penetration liquid crystal display panel or other light beam modulators.
As shown in figure 15, in the present embodiment, excitation light source 410 is for issuing an excitation beam 50.In the present embodiment
In, excitation light source 410 is laser light source, and excitation beam 50 is blue excitation light beam.For example, excitation light source 410 can wrap
Multiple blue laser diodes (not being painted) for lining up array are included, but the utility model is not limited to this.
Specifically, as shown in figure 15, in the present embodiment, spectrophotometric unit 420 is configured at the transmitting road of excitation beam 50
On diameter, and between excitation light source 410 and wavelength convert module 100.It is worn specifically, spectrophotometric unit 420 can be part
Saturating part reflecting element, recombination dichroic elements, polarization beam splitter or other various elements that light beam can be separated.For example, exist
In the present embodiment, spectrophotometric unit 420 can for example allow blue light beam to penetrate, and to other colors (such as red, green, yellow)
Light beam provides reflex.That is, spectrophotometric unit 420 can allow the excitation beam 50 of blue to penetrate, in this way, excite
Light beam 50 can penetrate spectrophotometric unit 420 and be incident to wavelength convert module 100.
For example, as shown in Figure 1A, Figure 1B and Figure 15, wavelength convert module 100 is located at the transmitting road of excitation beam 50
On diameter, and an at least light wavelength conversion school district WR for wavelength convert module 100 is used to excitation beam 50 being converted at least one turn
Light beam 60 is changed, the light of wavelength convert module 100 is suitable for passing through excitation beam 50 being transferred to subsequent light transmitting by area TR
Module LT, then it is passed back to spectrophotometric unit 420.Furthermore wavelength convert module 100 further includes one first actuator (not being painted), is suitable for
Area TR and an at least light wavelength conversion school district WR is passed light through to enter in different time in the range of exposures of excitation beam 50,
And the excitation beam 50 is selectively made to pass through or be converted into an at least commutating optical beam 60.Later, as shown in figure 15, wave is come from
The excitation beam 50 of long conversion module 100 and an at least commutating optical beam 60 can then be led to spectrophotometric unit 420, and be reflected onto
In subsequent filtration module 430.
For example, as shown in figure 15, projection arrangement 400 further includes a filtration module 430, and filtration module 430, which is located at, to swash
On the transmission path of luminous beam 50 and commutating optical beam 60, and there is optical filtering optics area (not being painted) and transparent area (not being painted).Filter
Optical module 430 further includes one second actuator (not being painted), suitable for keeping optical filtering optics area (not being painted) corresponding in different time
Ground enters in the range of exposures of commutating optical beam 60, to be respectively formed red beam and green beam.On the other hand, filtration module
430 transparent area (not being painted) also can accordingly enter in the range of exposures of excitation beam 50 in different time, to form indigo plant
Color beam.In this way, excitation beam 50 and commutating optical beam 60 can be made according to sequentially illumination light of the formation with a variety of different colours
Beam 70.
On the other hand, as shown in figure 15, in the present embodiment, projection arrangement 400 further includes a light uniformization element 440,
Light uniformization element 440 is located on the transmission path of illuminating bundle 70.In the present embodiment, light uniformization element 440 includes one
Integration rod (Integration Rod), but the utility model is not limited to this.More specifically, as shown in figure 15, when from filter
When the illuminating bundle 70 of optical module 430 is transferred to light uniformization element 440, light uniformization element 440 can make illuminating bundle 70 equal
It homogenizes, and it is made to be transferred to light valve 450.
Then, as shown in figure 15, light valve 450 is located on the transmission path of illuminating bundle 70, and is used for illuminating bundle 70
It is converted into an image strip 80.Projection lens 460 is located on the transmission path of image strip 80 and for by 80 turn of image strip
It changes a projected light beam 90 into, projected light beam 90 is projected on a screen (not being painted), to form image frame.Due to illumination
After light beam 70 is focused on light valve 450, light valve 450 sequentially transmits the image strip 80 that illuminating bundle 70 is converted into different colours
To projection lens 460, therefore, the projected light beam 90 projected via projection lens 460 is formed by image frame just can be at
For colour picture.
In this way, which projection arrangement 400 is by using the wavelength convert with good reliability and transfer efficiency
Module 100 (is wavelength convert module 100A, 100B, 100C, 100D, 200A, 200B, 200C, the 200D of Figure 1A into Fig. 8
With 200E any one), also can therefore have good reliability and transfer efficiency.
In the foregoing embodiments, though projection arrangement 400 with comprising reflective wavelength convert module 100A, 100B, 100C,
Any one of 100D, 200A, 200B, 200C, 200D and 200E are to illustrate, but the utility model is not limited to this.In others
In embodiment, wavelength convert module also can be penetration wavelength convert module, and any person with usual knowledge in their respective areas exists
Referring to after the utility model, when change appropriate can be made to its optical path, precisely because it still should belong in the scope of the utility model.With
Under will separately lift section Example be used as explanation.
Figure 16 is the configuration diagram of another projection arrangement of an embodiment of the present invention.Please refer to Figure 16, this reality
The projection arrangement 500 for applying example is similar with the projection arrangement 400 of Figure 15, and the difference of the two is as described below.In the present embodiment, it throws
Image device 500 using wavelength convert module 300 (be wavelength convert module 300A, 300B of the Fig. 9 into Figure 12,300C,
Any one of 300D), without the structure in reflecting layer, and substrate is transparent material.That is, wavelength convert module
300 be penetration wavelength convert module, and is used to that excitation beam 50 to be made to penetrate.
Specifically, as shown in figure 16, in the present embodiment, swashing when the light of wavelength convert module 300 is entered by area TR
When the range of exposures of luminous beam 50, excitation beam 50 penetrates wavelength conversion module 300.On the other hand, in the present embodiment, when extremely
When a few wavelength-converting region WR enters the range of exposures of excitation beam 50, excitation beam 50 is turned by an at least wavelength-converting region WM
It is changed to an at least commutating optical beam 60, and at least a commutating optical beam 60 penetrates wavelength conversion module 300.Later, wavelength convert is come from
At least a commutating optical beam 60 and the excitation beam 50 of module 300 can be then directed in filtration module 430.Filtration module 430 is divided again
Excitation beam 50 and an at least commutating optical beam 60 red beam and green beam and blue light beam are not respectively formed, and whereby
Illuminating bundle 70 and image strip 80 after formation.
In this way, which projection arrangement 500 is by using the wavelength convert with good reliability and transfer efficiency
Therefore module 300 (being any one of wavelength convert module 300A, 300B, 300C, the 300D of Fig. 9 into Figure 12), also can be
With good reliability and transfer efficiency.
In conclusion the embodiments of the present invention at least have effects that following one of advantage or.It is practical new at this
In the embodiment of type, wavelength convert module is selected by the material that the first bond material and first fill up glue material, and can promote wave
Thermal conductivity, heat resistance and the reliability of long conversion module.Also, wavelength convert module also can be by filled up in hole
One fills up glue material, and wavelength conversion layer is made to keep good transfer efficiency.In addition, used above-mentioned wavelength convert module and
Therefore projection arrangement can also have good reliability and transfer efficiency.The wavelength convert mould of the embodiments of the present invention
The forming method of block is formed by wavelength convert module by the processing procedure that glue material is filled up in addition first, and wavelength convert module can be made to have
There are good reliability and transfer efficiency.
Only as described above, the only preferred embodiment of the utility model, when the utility model cannot be limited with this
The range of implementation, i.e., all simple equivalence changes made according to the utility model claims book and utility model content with repair
Change, all still belongs in the range that the utility model patent covers.In addition any embodiment or claim of the utility model are not necessary to
Reach the disclosed whole purpose of the utility model or advantage or feature.In addition, abstract and topic are intended merely to auxiliary patent text
Part search is used, and not is used to limit the interest field of the utility model.In addition, referred in this specification or claims
The terms such as " first ", " second " are not only to name the title or the different embodiments of difference or range of element (element)
For the quantitative upper limit of restriction element or lower limit.
Description of symbols:
50: excitation beam
60: commutating optical beam
70: illuminating bundle
80: image strip
90: projected light beam
100、100A、100B、100C、100D、200A、200B、200C、200D、 200E、300、300A、300B、300C、
300D: wavelength convert module
110: substrate
120: wavelength conversion layer
121: first surface
122: second surface
130,230: reflecting layer
140,240: heat-conducting glue layer
400,500: projection arrangement
410: excitation light source
420: spectrophotometric unit
430: filtration module
440: light uniformization element
450: light valve
460: projection lens
BM1: the first bond material
BM2: the second bond material
CA1: the first hole
CA2: the second hole
CAC: center hole
CAS: surface hole defect
FM1: the first fills up glue material
FM2: the second fills up glue material
FMC: glue material is filled up at center
FMS: glue material is filled up on surface
LT: light transmission module
RM: scattering material
TR: light passes through area
WM: wavelength conversion material
WR: light wavelength conversion school district.
Claims (15)
1. a kind of wavelength convert module characterized by comprising substrate and wavelength conversion layer；The wavelength conversion layer is located at
On the substrate, and there are multiple first holes, and include: wavelength conversion material, the first bond material and the first padding gum
Material；Wherein,
The wavelength conversion material intersperses among in first bond material；And
Described first fills up glue material for filling up at least partly the multiple first hole.
2. wavelength convert module as described in claim 1, which is characterized in that do not filled up described in glue material fills up by described first
The percent by volume that multiple holes account for the wavelength conversion layer is 3% or less.
3. wavelength convert module as described in claim 1, which is characterized in that further include reflecting layer, be located at the substrate and institute
It states between wavelength conversion layer.
4. wavelength convert module as claimed in claim 3, which is characterized in that the reflecting layer has multiple second holes, and
Include:
Scattering material；
Second bond material, wherein the scattering material is dispersed evenly in second bond material；And
Second fills up glue material, for filling up at least partly the multiple second hole.
5. wavelength convert module as claimed in claim 4, which is characterized in that described second fills up glue material as inorganic glue material
Material.
6. wavelength convert module as claimed in claim 4, which is characterized in that described second fills up glue material as organic glued material
Material.
7. wavelength convert module as claimed in claim 3, which is characterized in that further include heat-conducting glue layer, be located at the reflecting layer
Between the substrate.
8. wavelength convert module as described in claim 1, which is characterized in that at least partly described first fill up glue material with it is described
First bond material is different.
9. wavelength convert module as claimed in claim 8, which is characterized in that the wavelength conversion layer has relative to each other the
One surface and second surface, first hole include multiple surface hole defects and multiple center holes, the multiple surface holes
Hole adjacent to the first surface and the second surface, the center hole relative to the multiple surface hole defect not with it is described
First surface is adjacent with the second surface, and described first to fill up glue material include the surface for filling up the multiple surface hole defect
It fills up glue material and fills up glue material with the center for filling up the multiple center hole, and glue material and the center are filled up in the surface
Fill up glue material difference.
10. wavelength convert module as claimed in claim 9, which is characterized in that it is inorganic glue material that glue material is filled up on the surface
Material and organic glueing material first, and to fill up glue material be the another of inorganic glue material and organic glueing material at the center.
11. wavelength convert module as described in claim 1, which is characterized in that first bond material is inorganic glue material
Material.
12. wavelength convert module as claimed in claim 11, which is characterized in that described first fills up glue material as inorganic glue material
Material.
13. wavelength convert module as claimed in claim 11, which is characterized in that described first fills up glue material as organic glued material
Material.
14. wavelength convert module as described in claim 1, which is characterized in that further include heat-conducting glue layer, be located at the substrate with
Between the wavelength conversion layer.
15. a kind of projection arrangement characterized by comprising
Wavelength convert module as described in claim 1；
Excitation light source, for issuing excitation beam, wherein the excitation beam is transferred to the wavelength convert module, and via institute
It states wavelength convert module and is converted to illuminating bundle；
Light valve, on the transmission path of the illuminating bundle and for the illuminating bundle to be converted into image strip；And
Projection lens, on the transmission path of the image strip and for the image strip to be converted into projected light beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821064497.3U CN208547768U (en) | 2018-07-06 | 2018-07-06 | Wavelength convert module and projection arrangement |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821064497.3U CN208547768U (en) | 2018-07-06 | 2018-07-06 | Wavelength convert module and projection arrangement |
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| CN208547768U true CN208547768U (en) | 2019-02-26 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112748565A (en) * | 2019-10-30 | 2021-05-04 | 中强光电股份有限公司 | Wavelength conversion element, projection device and manufacturing method of wavelength conversion element |
| CN114442409A (en) * | 2020-10-30 | 2022-05-06 | 中强光电股份有限公司 | Wavelength conversion module and projection device |
| US11327391B2 (en) | 2020-05-08 | 2022-05-10 | Coretronic Corporation | Wavelength conversion device and projection device |
-
2018
- 2018-07-06 CN CN201821064497.3U patent/CN208547768U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112748565A (en) * | 2019-10-30 | 2021-05-04 | 中强光电股份有限公司 | Wavelength conversion element, projection device and manufacturing method of wavelength conversion element |
| CN112748565B (en) * | 2019-10-30 | 2024-01-23 | 中强光电股份有限公司 | Wavelength conversion element, projection device, and method for manufacturing wavelength conversion element |
| US11327391B2 (en) | 2020-05-08 | 2022-05-10 | Coretronic Corporation | Wavelength conversion device and projection device |
| CN114442409A (en) * | 2020-10-30 | 2022-05-06 | 中强光电股份有限公司 | Wavelength conversion module and projection device |
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