CN208538805U - A kind of wafer annealing device - Google Patents
A kind of wafer annealing device Download PDFInfo
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- CN208538805U CN208538805U CN201820939051.4U CN201820939051U CN208538805U CN 208538805 U CN208538805 U CN 208538805U CN 201820939051 U CN201820939051 U CN 201820939051U CN 208538805 U CN208538805 U CN 208538805U
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- wafer
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- oil
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- absorbing sheets
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Abstract
The utility model discloses a kind of wafer annealing devices, belong to semiconductor equipment tooling technical field.It includes heating chamber (11) and exhaust system, wafer (20) is placed in heating chamber (11), exhaust system is arranged at the top of heating chamber (11), including being vented cavity (13), gas vent (15), exhaust port (17), the exhaust cavity (13) and heating chamber (11) constitute confined space, it further include oil-Absorbing Sheets/film (40), oil-Absorbing Sheets/the film (40) is laid on the lower section of exhaust cavity (13), is fixed by connector and the bottom of exhaust cavity (13).The device can be solved the problems, such as effectively because the drop glue of greasy dirt caused by volatile matter, time saving and energy saving cost-saving improves productivity.
Description
Technical field
The utility model relates to a kind of wafer annealing devices, and there are the heat of greasy dirt drop glue at top especially in operation process
The top structure of processing unit belongs to semiconductor equipment tooling technical field.
Background technique
In the photolithography process of semiconductor devices manufacture, the heat treatment of wafer is extremely important processing step.One
As for, on wafer be coated with photoresist after, exposure technology complete after and developing process complete after, be both needed to using hot plate
Wafer is heat-treated, heat treatment can film thickness to photoresist and final critical size have a huge impact.In wafer
Heat treatment process in, since there are a large amount of solvent, solvent can be evaporated in baking process, at the top of hot plate in photoresist
Exhaust system is detached to the main exhaust system of factory service.But due to top exhaust system normally open, top is normal temperature state, baking
In can generate a large amount of volatile matter in a short time, the volatile matter of solvent is at 100 DEG C or so, when volatile matter encounters top room temperature top
It will be condensed after plate, exhaust system can not will volatilize object and instantaneously all take away, and condensation water, which reaches, drips glue at greasy dirt after constant weight
Product surface will be dropped to, causes to stain.Meanwhile it is higher for the cleaning frequency of equipment, when producing at full capacity, every 2 days or
Top will be cleaned within 3 days, it is time-consuming and laborious, it is unfavorable for the raising of productivity.
Summary of the invention
The purpose of the utility model is to overcome the deficiencies at the top of above-mentioned hot plate, and providing one kind prevents greasy dirt drop glue stain from producing
Product, the wafer annealing device that the top cleaning frequency is effectively reduced.
Purpose of the utility model is realized as follows:
The utility model provides a kind of wafer annealing device comprising heating chamber and exhaust system, wafer are placed
In heating chamber, the top of heating chamber, including exhaust cavity, gas vent I, exhaust port is arranged in exhaust system, described
It is vented cavity and heating chamber constitutes confined space, further include oil-Absorbing Sheets/film, the oil-Absorbing Sheets/film is laid on exhaust cavity
Lower section is fixed by the bottom of connector and exhaust cavity.
Optionally, the connector is screw I, and the screw I is arranged in except the vertical space of wafer, will be inhaled upwards
Oilpaper/film and the bottom of exhaust cavity are fixed.
Optionally, the connector is upper magnetic stripe and lower magnetic stripe, and the upper magnetic stripe is set to the crystalline substance of the lower section of exhaust cavity
Except round vertical space, and the bottom for being vented cavity is fixed on narrow profile and screw II, the lower magnetic stripe pushes down suction upwards
Oilpaper/film.
Further, the lower magnetic stripe is wrapped up with oil-Absorbing Sheets/film, pushes down oil-Absorbing Sheets/film upwards.
The utility model additionally provides a kind of wafer annealing device, including lower heating chamber, upper cover and exhaust system, institute
The top that upper cover is set to lower heating chamber is stated, constitutes confined space with lower heating chamber, wafer is placed in heating chamber, is arranged
The center of upper cover, including gas vent II and exhaust pipe is arranged in wind system, further includes oil-Absorbing Sheets/film, greasy dirt drop glue resistance
Baffle and support frame, support frame as described above are set to the left and right two side walls of upper cover, and the greasy dirt drop glue barrier plate is shelved on support
On frame, the oil-Absorbing Sheets/film is laid on the lower section of greasy dirt drop glue barrier plate, and it is solid to drip glue barrier plate by connector and greasy dirt
It is fixed.
Optionally, support frame as described above is sliding rail.
Optionally, support frame as described above is several convex blocks.
Optionally, the connector is screw III, and the screw III is arranged in except the vertical space of wafer.
Optionally, the connector is upper magnetic stripe and lower magnetic stripe, and the upper magnetic stripe is set to the upper of greasy dirt drop glue barrier plate
Except the vertical space of the wafer of side, the lower magnetic stripe pushes down oil-Absorbing Sheets/film upwards.
Further, the lower magnetic stripe is wrapped up with oil-Absorbing Sheets/film, pushes down oil-Absorbing Sheets/film upwards.
Beneficial effect
The utility model adds oil-Absorbing Sheets/film below the top of wafer annealing device, can effectively solve because waving
It sends out greasy dirt caused by object and drips glue problem, it is only necessary to replace oil-Absorbing Sheets/film or make simple wiping, no longer need to carry out complicated cleaning
Work greatly reduces top and cleans the frequency, and time saving and energy saving cost-saving improves productivity.
Detailed description of the invention
Fig. 1 is a kind of schematic diagram of wafer annealing device embodiment one of the utility model；
Fig. 2 is the schematic diagram of the deformation of Fig. 1；
Fig. 3 is a kind of schematic diagram of wafer annealing device embodiment two of the utility model；
Fig. 4 is the schematic diagram of the deformation of Fig. 3；
Wherein:
Heating chamber 11
It is vented cavity 13
Gas vent I 15
Exhaust port 17
Wafer 20
Greasy dirt drips glue 30
Oil-Absorbing Sheets/film 40
Screw I 43
Screw II 442
Screw III 49
Lower heating chamber 18
Upper cover 12
Gas vent II 19
Support frame 47
Drip glue barrier plate 72.
Specific embodiment
In order to elaborate Spirit Essence of the invention, help those skilled in the art are practical, are fully understood by the present invention
Complete technical solution, the technical solution of the utility model is described in detail below in conjunction with embodiment and attached drawing.
Embodiment one
Wafer annealing device includes heating chamber 11 and exhaust system.Heating chamber 11 is the flat cylinder of upper opening
Body or square tube body offer door on a side wall, the opening when wafer is admitted to or sends out cavity, carry out in technical process
When remain turned-off.The side wall and door of heating chamber 11 all use double-layer stainless steel material, accompany between two layers of stainless steel plate
Asbestos.
Hot plate 10 is not directly contacted with wafer 20, and wafer 20 is placed on support rod 14, mainly passes through heat radiation mode pair
Wafer is heated.The top of heating chamber 11, including exhaust cavity 13, gas vent I 15, exhaust port is arranged in exhaust system
17.Exhaust cavity 13 can be moved left and right with respect to heating chamber 11, and pass in and out heating chamber 11 by sliding rail 16, be guaranteed heated
The air-tightness of device in journey.The lower section of exhaust cavity 13 is arranged in gas vent I 15, and general rounded opening is connected to heating chamber
The inside of room 11 allows the gas in heating chamber 11 to enter in exhaust cavity 13 by gas vent I 15, connects eventually by exhaust
Mouth 17 is connected to the exhaust systems discharge of factory service.
Several layers oil-Absorbing Sheets/film 40, oil-Absorbing Sheets/film 40 are laid in the top of heating chamber 11, the lower section of exhaust cavity 13
It is fixed on by screw I 43 on the stainless steel plate of exhaust cavity 13.Due to can equally agglomerate greasy dirt drop glue, screw I on screw I 43
43 are necessarily placed at except the vertical space of wafer, as shown in Figure 1.
Alternatively, oil-Absorbing Sheets/film 40 is fixed on the lower section of exhaust cavity 13 by magnetic stripe, upper magnetic stripe 44 is with narrow 441 He of profile
Screw II 442 is fixed on the stainless steel plate of exhaust cavity 13, and lower magnetic stripe 45 is wrapped up with single layer oil-Absorbing Sheets/film 47, is pushed down upwards
Oil-Absorbing Sheets/film 40.Or magnetic stripe can be set to except the vertical space of wafer of the lower section of exhaust cavity 13, such as Fig. 2 institute
Show.
Oil-Absorbing Sheets/film 40 has very strong adsorption capacity to oil smoke, in use, greasy dirt drop glue 30 is inhaled by oil-Absorbing Sheets/film 40
Receive and lock will not be dropped in oilpaper/film 40 lower section wafer on, flue gas from gas vent I 15 be discharged, can effectively solve because
Glue problem is dripped for greasy dirt caused by volatile matter.When oil-Absorbing Sheets/film 40 is saturated, when glossy color is presented, oil suction that it is more renewed
Paper/film 40, oil suction film have a safety feature, and it is very convenient to replace.
Embodiment two
Wafer annealing device includes lower heating chamber 18, upper cover 12 and exhaust system.Lower heating chamber 18 is upper opening
Flat square tube body, offer door on a side wall, the opening when wafer is admitted to or sends out cavity, in technical process
It is remained turned-off when progress.Upper cover 12 is set to the top of lower heating chamber 18, constitutes confined space with lower heating chamber 18.Upper cover
12 and each side wall and door of lower heating chamber 18 all use double-layer stainless steel material, accompany stone between two layers of stainless steel plate
Cotton.
Hot plate 10 is not directly contacted with wafer 20, and wafer 20 is placed on support rod 14, mainly passes through heat radiation mode pair
Wafer is heated.
The center of upper cover 12, including gas vent II 19 and exhaust pipe is arranged in exhaust system.Gas vent II 19 is general
Rounded opening, connection upper cover 12 and lower heating chamber 18 constitute the inside of confined space, and gas is allowed to pass through gas vent II
19 are ultimately connected to the exhaust system discharge of factory service into exhaust pipe.
In the left and right sides wall of upper cover 12, support frame 47 is set, support frame 47 be welding or screw it is fixed several are convex
Block is also possible to sliding rail.One greasy dirt drop glue barrier plate 72 is shelved on support frame 47, and size is greater than the size of wafer 20.Oil
There are gaps I between dirt drop glue barrier plate 72 and the side wall of upper cover 12.Greasy dirt drop glue barrier plate 72 be it is movable, can pull out or
Push-in, convenient for taking out and cleaning.Generally, the material of greasy dirt drop glue barrier plate 72 is stainless steel plate.Greasy dirt drips glue barrier plate 72
Lower section be laid with several layers oil-Absorbing Sheets/film 40, oil-Absorbing Sheets/film 40 by screw III 49 be fixed on greasy dirt drip glue barrier plate 72.By
In can equally agglomerate greasy dirt drop glue on screw III 49, screw III 49 is necessarily placed at except the vertical space of wafer, such as Fig. 3 institute
Show.
Alternatively, oil-Absorbing Sheets/film 40 is fixed on the lower section that greasy dirt drips glue barrier plate 72 by magnetic stripe, it can be by upper 44 He of magnetic stripe
Lower magnetic stripe 45 is set to except the vertical space of wafer.Or lower magnetic stripe 45 single layer oil-Absorbing Sheets/film package, with closing magnetic stripe 44
It can be set in any desired place, push down oil-Absorbing Sheets/film 40 upwards, as shown in Figure 4.
In use, a part of greasy dirt drop glue 30 drips the gap I of glue barrier plate 72 and upper cover 12 along air-flow by greasy dirt
It rises, condenses in the upper surface of greasy dirt drop glue barrier plate 72, cleaning agent is dipped in by using non-dust cloth and carries out simple wiping, this part oil
Dirt drop glue 30 is cleanable finish.Oil-Absorbing Sheets/film 40 has very strong adsorption capacity to oil smoke, and greasy dirt drips another part of glue 30
Being absorbed and being lockked by oil-Absorbing Sheets/film 40 will not be dropped on the wafer of lower section in oilpaper/film 40, and flue gas passes through gas vent II 19
Discharge can be solved the problems, such as effectively because of the drop glue of greasy dirt caused by volatile matter.When oil-Absorbing Sheets/film 40 is saturated, glossy color is presented
When, oil-Absorbing Sheets/film 40 that it is more renewed, oil suction film has a safety feature, and it is very convenient to replace.
Above-described specific embodiment, to the purpose of this utility model, technical scheme and beneficial effects carried out into
It is described in detail to one step, it should be understood that being not used to the foregoing is merely specific embodiment of the present utility model
Limit the protection scope of the utility model.Oilpaper/film fixed form of above-described embodiment is suitble to other to generate greasy dirt drop glue
Device or equipment, if exhaust system is set to the wafer annealing device of side, it is all the spirit and principles of the utility model it
Any modification, equivalent substitution, improvement and etc. that are interior, being done, should be included within the scope of protection of this utility model.
Claims (10)
1. a kind of wafer annealing device comprising heating chamber (11) and exhaust system, wafer (20) are placed on heating chamber
(11) in, exhaust system setting is at the top of heating chamber (11), including exhaust cavity (13), gas vent I (15), exhaust port
(17), the exhaust cavity (13) and heating chamber (11) constitute confined space,
It is characterized in that, further including oil-Absorbing Sheets/film (40), the oil-Absorbing Sheets/film (40) is laid on the lower section of exhaust cavity (13),
It is fixed by connector and the bottom of exhaust cavity (13).
2. wafer annealing device according to claim 1, which is characterized in that the connector is screw I (41), described
Screw I (41) is arranged except the vertical space of wafer (20), upwards by the bottom of oil-Absorbing Sheets/film (40) and exhaust cavity (13)
Portion is fixed.
3. wafer annealing device according to claim 1, which is characterized in that the connector be upper magnetic stripe (44) and under
Magnetic stripe (45), the upper magnetic stripe (44) are set to except the vertical space of the wafer of the lower section of exhaust cavity (13), and with narrow button
Item (441) and screw II (442) are fixed on the bottom of exhaust cavity (13), and the lower magnetic stripe (45) pushes down oil-Absorbing Sheets/film upwards
(40).
4. wafer annealing device according to claim 3, which is characterized in that the lower magnetic stripe (45) uses oil-Absorbing Sheets/film
Package, pushes down oil-Absorbing Sheets/film (40) upwards.
5. a kind of wafer annealing device, including lower heating chamber (18), upper cover (12) and exhaust system, the upper cover (12) set
It is placed in the top of lower heating chamber (18), constitutes confined space with lower heating chamber (18), wafer (20) is placed on heating chamber
(11) in, exhaust system is arranged in the center of upper cover (12), including gas vent II (19) and exhaust pipe,
It is characterized in that, further including oil-Absorbing Sheets/film (40), greasy dirt drop glue barrier plate (72) and support frame (47), the support
Frame (47) is set to the left and right two side walls of upper cover (12), and greasy dirt drop glue barrier plate (72) is shelved on support frame (47),
Oil-Absorbing Sheets/the film (40) is laid on the lower section of greasy dirt drop glue barrier plate (72), drips glue barrier plate by connector and greasy dirt
(72) fixed.
6. wafer annealing device according to claim 5, which is characterized in that support frame as described above (47) is sliding rail.
7. wafer annealing device according to claim 5, which is characterized in that support frame as described above (47) is that several are convex
Block.
8. wafer annealing device according to any one of claims 5 to 7, which is characterized in that the connector is spiral shell
III (49) are followed closely, the screw III (49) is arranged except the vertical space of wafer (20).
9. wafer annealing device according to any one of claims 5 to 7, which is characterized in that the connector is upper
Magnetic stripe (44) and lower magnetic stripe (45), the upper magnetic stripe (44) are set to the vertical of the wafer of the top of greasy dirt drop glue barrier plate (72)
Except space, the lower magnetic stripe (45) pushes down oil-Absorbing Sheets/film (40) upwards.
10. wafer annealing device according to claim 9, which is characterized in that the lower magnetic stripe (45) uses oil-Absorbing Sheets/film
Package, pushes down oil-Absorbing Sheets/film (40) upwards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820939051.4U CN208538805U (en) | 2018-06-19 | 2018-06-19 | A kind of wafer annealing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820939051.4U CN208538805U (en) | 2018-06-19 | 2018-06-19 | A kind of wafer annealing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208538805U true CN208538805U (en) | 2019-02-22 |
Family
ID=65390774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820939051.4U Active CN208538805U (en) | 2018-06-19 | 2018-06-19 | A kind of wafer annealing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208538805U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113937038A (en) * | 2021-11-12 | 2022-01-14 | 芯达半导体设备(苏州)有限公司 | Heat treatment unit exhaust system |
-
2018
- 2018-06-19 CN CN201820939051.4U patent/CN208538805U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113937038A (en) * | 2021-11-12 | 2022-01-14 | 芯达半导体设备(苏州)有限公司 | Heat treatment unit exhaust system |
| CN113937038B (en) * | 2021-11-12 | 2022-09-02 | 芯达半导体设备(苏州)有限公司 | Heat treatment unit exhaust system |
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