CN208531242U - A kind of packing box of silicon wafer - Google Patents

Abstract

The utility model discloses a kind of packing box of silicon wafer; the packing box is for packing silicon wafer; packing box includes the box body of foamed plastics material, the box cover for the foamed plastics material being adapted to the box body, the protective layer in the packing box; the box body is separated into several accommodating chambers by the protective layer, and the accommodating chamber is used to accommodate multiple silicon wafers of fitting.Packing box provided by the utility model is easy to user's opening, and is convenient for the transport of silicon wafer.

Description

A kind of packing box of silicon wafer

Technical field

The utility model relates to box technology field more particularly to a kind of packing boxes of silicon wafer.

Background technique

Currently, the utilization technology of the positive accelerated development renewable energy in countries in the world, it is desirable to change state by renewable energy The energy resource structure of family, maintains long-range sustainable development.In renewable resource, most potential new energy --- solar energy with Its exclusive advantage and become people pay attention to focus.

Since solar battery commercialization, crystalline silicon is just widely used as solar cell material, in photovoltaic In industry supply chain, crystalline silicon material, silicon ingot and silicon wafer are the bases of entire industrial chain.

When silicon wafer dispatches from the factory, need to pack it, then transported.In the prior art, L-type papery is generallyd use Packing box packs silicon wafer, as shown in Figure 1.

L-type paper package box 101 as shown in Figure 1 has 3 faces, and internal packed article is as shown in Fig. 2, and one Or multiple (such as 100) silicon wafers 102 are clipped among two layers of Black Sea silk floss 103, provide protection, such as Fig. 3 after packaging by Black Sea silk floss 103 It is shown, outermost layer can plastic packaging (being not shown in Fig. 3), and add label paper 104.Fig. 1~3 be not drawn to show packing box and by Packing material, and the part unrelated with this case is understood has been left out.

Silicon wafer is packed using the prior art of such as Fig. 1~3, user be easy to cause die crack when sealing off, and wraps to sealing off The gimmick of dress is more demanding, and almost only has Black Sea silk floss that can provide protection for silicon wafer, therefore be also unfavorable for transporting.

Summary of the invention

The utility model provides a kind of packing box of silicon wafer, easy to break when sealing off to solve prior art silicon wafer, Also the problem of being unfavorable for transport.

The utility model provides a kind of packing box of silicon wafer, for packing silicon wafer；

The packing box include: the box body of foamed plastics material, the foamed plastics material being adapted to the box body box cover, Protective layer in the packing box；

The box body is separated into several accommodating chambers by the protective layer, and the accommodating chamber is used to accommodate multiple silicon of fitting Piece.

The utility model use at least one above-mentioned technical solution can reach it is following the utility model has the advantages that

The box cover packaging silicon wafer that the utility model uses the box body of foamed plastics and is adapted to therewith, user need to only open the lid Silicon wafer is taken out from box body, does not easily cause the fragmentation of silicon wafer, and the protection of the packing box of foamed plastics and its inside Layer can provide protection to silicon wafer, to ensure that silicon wafer is also hardly damaged in transport.

Detailed description of the invention

Attached drawing described herein is used to provide to further understand this specification, forms part of this specification, The illustrative embodiments and their description of this specification do not constitute the improper restriction to this specification for explaining this specification. In the accompanying drawings:

Fig. 1 is L-type paper package box in the prior art；

Fig. 2 is the packed article being packaged in L-type paper package box packaging in the prior art；

Fig. 3 is in the prior art by the schematic diagram after L-type paper package box packaging；

Fig. 4 is the perspective view of the packing box of silicon wafer provided by the embodiment of the utility model；

Fig. 5 is the box body top view of the packing box of silicon wafer provided by the embodiment of the utility model；

Fig. 6 is the box body top view provided by the embodiment of the utility model with rib；

Fig. 7 is the box body top view provided by the embodiment of the utility model without rib.

Specific embodiment

Fig. 4 is the packing box perspective view of silicon wafer provided by the embodiment of the utility model, the box body including foamed plastics material 401, the protective layer 4011 in the box cover 402, box body 401 of foamed plastics material.Box cover 402 is adapted to box body 401.Box cover 402 It is combined with box body 401 and may make up closed packing box, inner space is for accommodating silicon wafer 403.

Fig. 5 is the box body top view of the packing box of silicon wafer provided by the embodiment of the utility model, and protective layer 4011 can have Have multiple, box body is separated into several accommodating chambers 4012 by protective layer 4011, and accommodating chamber 4012 is for accommodating silicon wafer 403.Each appearance The silicon wafer that room is accommodated of receiving can be multiple silicon wafers 403 to fit together.

The packing box of silicon wafer provided by the utility model has abandoned traditional packaging structure using L-type carton, using foam The packaging structure of plastics and protective layer makes silicon wafer be easy to seal off and transport.

In order to further user is convenient for take out silicon wafer 403 out of packing box, on the inner wall of box body described in the utility model There can also be the rib 4013 of multiple protrusions, as shown in Figure 6.The rib 4013 of these protrusions can be located at opposite two of box body 401 On a inner wall.

Can be identical per adjacent the distance between two ribs 4013, specifically can be pre-determined distance, this it is default away from From the thickness that for example can be the silicon wafer 4013 that n fit closely, n for example can be 50.Certainly, per two adjacent ribs 4013 The distance between be also possible to it is different.

Silicon wafer 403 (being not shown in Fig. 6) can be contained in the space between two adjacent ribs 4013, and perpendicular to box body Wall where 401 bottom surface and rib 4013.The protective layer 4011 also is located in the space, can be specifically located at described The bottom surface of the edge in space, the protective layer 4011 and the box body 401, the rib 4013 are surrounded for accommodating silicon The space of piece 403, that is, each space is an accommodating chamber 4012.It can also add between each accommodating chamber 4012 Packing, such as sponge.

Further, the junction of two adjacent inner walls of the box body 401 has at least one rib 4013, for making The silicon wafer 403 for closing on inner wall will not fit on inner wall, further facilitate user and take out silicon wafer 403 from box body.Alternatively, can also Silicon wafer 403 is not accommodated so as to be close in several (such as can be 1) spaces of inner wall, can achieve same effect yet Fruit.

In the utility model embodiment, the protective layer 4011 may include the protective layer of papery, specifically can wrap Include dust-free paper and/or hardboard.Dust-free paper and/or hardboard perpendicular to box body 401 bottom surface, and perpendicular to the two of box body 401 A opposite inner wall.For example, dust-free paper and/or hardboard are perpendicular to in rib 4013 when box body 401 has rib 4013 Wall.When box body 401 does not have rib 4013, dust-free paper and/or hardboard are perpendicular to the biggish two opposite inner walls of area.

As shown in fig. 7, box body 401 does not have rib, the space of box body 401 can be separated by dust-free paper and/or hardboard and shape At each accommodating chamber 4012.The volume of each accommodating chamber 4012 may be the same or different, and each accommodating chamber holds identical quantity Fitting multiple silicon wafers, multiple silicon wafers of the fitting of different number can also be accommodated.

In each accommodating chamber 4012, multiple silicon wafers being bonded that the side of dust-free paper can be accommodated with accommodating chamber 4012 are outermost The surface of the silicon wafer of side is bonded, and the other side of dust-free paper can be bonded with the side of hardboard, the other side of hardboard and another appearance Receive room 4012 dust-free paper fitting, and so on.

Certainly, the hardboard between accommodating chamber 4012 it is not necessary to, hardboard can be only located at outermost accommodating chamber Edge is bonded with the inner wall of box body 401.

In packing box without rib as shown in Figure 7, the inner wall of box body 401 can also have recessed portion 4014.The recess Portion 4014 extends upwardly to the edge at the top of inner wall along the direction of the bottom surface perpendicular to box body 401, makes outermost accommodating chamber The top of the silicon wafer 403 accommodated in 4012 is not bonded with the top of the inner wall of neighbouring box body 401, to facilitate user from packaging Silicon wafer 403 (being not shown in Fig. 7) is taken out in box.The shape of recessed portion 4014 described in the utility model can be arbitrary shape Shape, as long as the upper of the top of the silicon wafer 403 accommodated in outermost accommodating chamber 4012 and the inner wall of neighbouring box body 401 can be made Portion is not bonded.

It should be noted that each component of packing box is not according to actual ratio in Fig. 4~7 of the offer of the utility model It shows, the component unrelated with packing box provided by the utility model is understood has been omitted from.

The foregoing is merely one or more embodiments of this specification, are not limited to this specification.For For those skilled in the art, one or more embodiments of this specification can have various modifications and variations.It is all in this explanation Any modification, equivalent replacement, improvement and so within the spirit and principle of one or more embodiments of book, should be included in Within the scope of the claims of this specification.

Claims (10)

1. a kind of packing box of silicon wafer, which is characterized in that for packing silicon wafer；

The packing box includes: the box cover, described of the box body of foamed plastics material, the foamed plastics material being adapted to the box body Protective layer in packing box；

The box body is separated into several accommodating chambers by the protective layer, and the accommodating chamber is used to accommodate multiple silicon wafers of fitting.

2. packing box as described in claim 1, which is characterized in that with the rib of multiple protrusions on the inner wall of the box body；

Bottom surface of the rib perpendicular to the box body.

3. packing box as claimed in claim 2, which is characterized in that the distance between two adjacent ribs are pre-determined distance.

4. packing box as claimed in claim 2, which is characterized in that the rib is located at opposite two inner wall of the box body On.

5. packing box as claimed in claim 2, which is characterized in that the junction of the two neighboring inner wall of box body has at least One rib.

6. the packing box as described in claim 2~4 is any, which is characterized in that the silicon wafer be contained in two adjacent ribs it Between space.

7. packing box as described in claim 1, which is characterized in that the protective layer includes papery protective layer；

The papery protective layer includes dust-free paper and/or hardboard, and the dust-free paper and/or hardboard are perpendicular to the box body Bottom surface.

8. packing box as claimed in claim 7, which is characterized in that the volume of each accommodating chamber is identical, each appearance Receive room accommodate identical quantity fitting multiple silicon wafers, the dust-free paper is bonded with the surface of at least one silicon wafer.

9. packing box as claimed in claim 7, which is characterized in that the hardboard is bonded with the inner wall of the box body.

10. packing box as described in claim 1, which is characterized in that the inner wall of the box body has recessed portion, the recessed portion Direction along the bottom surface perpendicular to the box body extends upwardly to inner wall top edge.