CN208529621U - It is a kind of for producing the mold of heat radiating type key of notebook computer panel enclosure - Google Patents
It is a kind of for producing the mold of heat radiating type key of notebook computer panel enclosure Download PDFInfo
- Publication number
- CN208529621U CN208529621U CN201821141497.9U CN201821141497U CN208529621U CN 208529621 U CN208529621 U CN 208529621U CN 201821141497 U CN201821141497 U CN 201821141497U CN 208529621 U CN208529621 U CN 208529621U
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- Prior art keywords
- plate
- key
- mold
- notebook computer
- producing
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Links
- 238000001816 cooling Methods 0.000 claims abstract description 18
- 238000003825 pressing Methods 0.000 claims description 24
- 239000007787 solid Substances 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 239000003507 refrigerant Substances 0.000 claims description 9
- 238000005057 refrigeration Methods 0.000 claims description 6
- 238000009792 diffusion process Methods 0.000 claims description 5
- 238000001746 injection moulding Methods 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000013011 mating Effects 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 16
- 239000003292 glue Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 210000004556 brain Anatomy 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 235000013372 meat Nutrition 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 210000005239 tubule Anatomy 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model provides a kind of for producing the mold of heat radiating type key of notebook computer panel enclosure, it is used to produce the key of notebook computer panel that key has liquid cooling pipe row, and heelpiece template and quickly cooling module are set in a mold, there is pit in cooling procedure in the back side that type chamber former boss can be effectively prevented in the two mating reaction, has good equal production effects.
Description
Technical field
The utility model relates to a kind of injection molds, and in particular to one kind is for producing heat radiating type key of notebook computer face
The mold of plate shell.
Background technique
Laptop (NoteBook Computer, referred to as are as follows: NoteBook), also known as notes type, portable or above-knee electricity
Brain (English: Laptop Computer, can letter be Laptop), be a kind of small-sized, PC for being easily carried.Notebook
The weight of computer is usually 1-3 kilograms heavy.Its development trend is that volume is smaller and smaller, and weight is more and more lighter, and function is increasingly
It is powerful.As Netbook, that is, the net book being commonly called as.Laptop is its Portable belt with the main distinction of PC.
As computer performance is continuously increased, computer heat radiation performance is also constantly reinforced.Laptop radiating amount greatly there is also
One major issue is exactly that temperature is high above keyboard, seriously affects usage experience.Presently preferred heat sink conception is liquid circulation
Heat dissipation, circulating line, which is arranged in key panel, becomes the effective scheme to solve the above problems.
Therefore it needs a kind of for producing the mold of heat radiating type key of notebook computer panel enclosure.
Utility model content
Above-mentioned to solve the problems, such as, the purpose of this utility model is to provide one kind for producing heat radiating type notebook
The mold of Computer key panel enclosure, be used to produce key have liquid cooling pipe row key of notebook computer panel, and
Heelpiece template and quickly cooling module are set in mold, and the back side that type chamber former boss can be effectively prevented in the two mating reaction exists
Occur pit in cooling procedure, there are good equal production effects.
To achieve the above purpose, the technical solution of the present invention is:
It is a kind of for producing the mold of heat radiating type key of notebook computer panel enclosure, which is characterized in that including moving template,
If core fixing plate, cushion block, backing plate, impression bolster, gate plate, intermediate plate, solid plate and baked core, the moving template, type
Core fixed plate, cushion block, backing plate, impression bolster, gate plate, intermediate plate and solid plate are set gradually from the bottom to top, the type chamber
Fixed plate lower inside is equipped with heelpiece template, the heelpiece template and gate plate and impression bolster forms panel type chamber, described
Sprue bush is equipped in the middle part of solid plate, face sprue bush is equipped with bulb sprue puller, the panel type chamber back segment in the middle part of the gate plate
Middle part is equipped with key zone, and mouse pad area is equipped in the middle part of the panel type chamber leading portion, and mouse pad area two sides are equipped with pressing device area, institute
Stating pressing device area is the disc to raise upward, and the every row in key zone is distributed with pipeline card, the panel type chamber range inside four
It is distributed with connector week, the connector is cylindrical, and the core package includes pressing device type core, the pressing device type core pass-through core
Fixed plate, cushion block, backing plate, heelpiece template, the pressing device type core bottom is fixed on moving template, top is protruded into panel type chamber,
The pressing device type core shaped upper part and pressing device area form fit, heelpiece template top are equipped with key type core, the key type
Core and key zone and mouse pad area cooperate, and the gate plate bottom is equipped with pipe clamp former and connection former, the pipe clamp former with
The cooperation of pipeline card, the connection former and connector cooperate, and the heelpiece template is equipped with speed in connector and pipe clamp corresponding position
Cold module.In use, glue injection equipment is docked with sprue bush, injecting glue is carried out, is cooled down after injecting glue, is being carried out a point mould, taking
Material operation.It is formed by key panel and is equipped with pipeline card below key zone, pipe row can isolate notebook electricity after assembling
The chip region and key zone of brain, to reduce the temperature above key zone in use.
As a further improvement of the foregoing solution, the pipeline card is in U shape, and the pipeline Ka Shangbuaoxianchu is in
Four/three-arc shape.The pressing of liquid cooling pipeline directly can be caught in pipeline card by the design, easy for installation, low in cost.
As a further improvement of the foregoing solution, the quickly cooling module includes thermally conductive patch, heat conducting pipe, refrigerant and refrigeration cycle
Equipment, the thermally conductive patch are connect with refrigeration cycle apparatus cold end by heat conducting pipe and thermally conductive patch are full of refrigerant shape with heat conducting pipe
At refrigerant circulation.Connector and pipeline card position are locally T-shaped in type chamber, and glue is more, and connector and pipeline card end
Heat dissipation is very fast, and in routine techniques, connector and pipeline card top are equipped with exhaust pipe and glue pipeline under normal circumstances, and connect
Glue pipeline is unable to complete glue after fitting and pipeline card end are cooling, and the glue of lower section is shunk upwards can generate pit, this is recessed
Hole is in the front of key panel.After using quickly cooling structure, key panel front first cools down under quickly cooling structure function, avoids
There is pit, while melten gel can flow down and fill up in the glue pipe of cooling meat upper back, to keep key panel shape more flat
It is suitable.
As a further improvement of the foregoing solution, the thermally conductive patch includes that conducting copper plate and capillary are arranged, the capillary
Row is layed in the conducting copper plate back side, and the thermally conductive patch insertion is mounted on inside heelpiece template, and the conducting copper plate is upward.Copper sheet tool
There is good heating conduction, the good equal heat-conducting effect in part can be played by being combined with capillary row.
As a further improvement of the foregoing solution, the thermally conductive patch is surrounded by heat insulating strip.The setting can prevent quickly cooling
The diffusion of structure cooling capacity large area blocks melten gel flowing.
As a further improvement of the foregoing solution, it is equipped with groove at the top of the gate plate, the groove and intermediate plate and pours
Muzzle forms injection molding diffusion chamber.The setting can make the injection of injection moulding process melten gel more uniform.
As a further improvement of the foregoing solution, the sprue bush is surrounded by pulling hook, and the pulling hook bottom is equipped with
Gib head, the pulling hook passes through solid plate and intermediate plate protrudes into bottom portion of groove.The setting can assist draft, avoid draft process
In directly contact key panel ontology.
Detailed description of the invention
Fig. 1 is one kind provided by the utility model embodiment for producing heat radiating type key of notebook computer panel enclosure
Mold structure diagram.
Fig. 2 is one kind provided by the utility model embodiment for producing heat radiating type key of notebook computer panel enclosure
Mold panel cavity layout structural schematic diagram.
Fig. 3 is one kind provided by the utility model embodiment for producing heat radiating type key of notebook computer panel enclosure
Mold pipeline card partial structural diagram.
Fig. 4 is one kind provided by the utility model embodiment for producing heat radiating type key of notebook computer panel enclosure
Mold connector partial structural diagram.
Wherein:
1, moving template;2, core fixing plate;3, cushion block;4, backing plate;5, impression bolster;6, gate plate;7, intermediate plate;8,
Solid plate;9, pressing device type core;10, heelpiece template;11, panel type chamber;12, sprue bush;13, bulb sprue puller;14, key zone;
15, mouse pad area;16, pressing device area;17, pipeline card;18, connector;19, conducting copper plate;20, capillary is arranged;21, heat insulating strip;
22, it is molded diffusion chamber;23, pulling hook.
Specific embodiment
Below with reference to the specific effect of design, specific structure and generation that embodiment and attached drawing create the utility model
Fruit carries out clear, complete description, adequately to understand purpose, feature and the effect of the utility model creation.The utility model
Every technical characteristic of creation, can be with combination of interactions under the premise of not conflicting conflict.
It is a kind of for producing the mold of heat radiating type key of notebook computer panel enclosure referring to Fig. 1-4, which is characterized in that
Including moving template 1, core fixing plate 2, cushion block 3, backing plate 4, impression bolster 5, gate plate 6, intermediate plate 7, solid plate 8 and several
Type core, the moving template 1, core fixing plate 2, cushion block 3, backing plate 4, impression bolster 5, gate plate 6, intermediate plate 7 and solid plate 8
It sets gradually from the bottom to top, 5 lower inside of impression bolster is equipped with heelpiece template 10, the heelpiece template 10 and gate plate
6 and impression bolster 5 form panel type chamber 11, sprue bush 12, the 6 middle part face of gate plate are equipped in the middle part of the solid plate 8
Sprue bush 12 is equipped with bulb sprue puller 13, is equipped with key zone 14 in the middle part of 11 back segment of panel type chamber, before the panel type chamber 11
Section middle part is equipped with mouse pad area 15, and 15 two sides of mouse pad area are equipped with pressing device area 16, and the pressing device area 16 raises upward
Disc, the every row in the key zone 14 are distributed with pipeline card 17, and the 11 range inside circumference of panel type chamber is distributed with connection
Part 18, the connector 18 is cylindrical, and the core package includes pressing device type core 9, the pressing device type core 9 pass through core fixing plate 2,
Cushion block 3, backing plate 4, heelpiece template 10,9 bottom of pressing device type core is fixed on moving template 1, top is protruded into panel type chamber 11,
9 shaped upper part of pressing device type core and 16 form fit of pressing device area, 10 top of heelpiece template is equipped with key type core, described to press
Bond type core and key zone 14 and mouse pad area 15 cooperate, and 6 bottom of gate plate is equipped with pipe clamp former and connection former, the pipe
Card former and pipeline card 17 cooperate, and the connection former and connector 18 cooperate, and the heelpiece template 10 is in connector 18 and pipe
Card corresponding position is equipped with quickly cooling module.
As a further improvement of the foregoing solution, the pipeline card 17 is in U shape, 17 upper recess of pipeline card
Place is in four/three-arc shape.
As a further improvement of the foregoing solution, the quickly cooling module includes thermally conductive patch, heat conducting pipe, refrigerant and refrigeration cycle
Equipment, the thermally conductive patch are connect with refrigeration cycle apparatus cold end by heat conducting pipe and thermally conductive patch are full of refrigerant shape with heat conducting pipe
At refrigerant circulation.
As a further improvement of the foregoing solution, the thermally conductive patch includes conducting copper plate 19 and capillary row 20, the hair
Tubule row 20 is layed in 19 back side of conducting copper plate, and the thermally conductive patch insertion is mounted on inside heelpiece template 10, the conducting copper plate
19 upwards.
As a further improvement of the foregoing solution, the thermally conductive patch is surrounded by heat insulating strip 21.
As a further improvement of the foregoing solution, be equipped with groove at the top of the gate plate 6, the groove and intermediate plate 7 and
Sprue bush 12 forms injection molding diffusion chamber 22.
As a further improvement of the foregoing solution, the sprue bush 12 is surrounded by pulling hook 23,23 bottom of pulling hook
Portion is equipped with gib head, and the pulling hook 23 passes through solid plate 8 and intermediate plate 7 protrudes into bottom portion of groove.
It should be noted that above embodiments are merely intended for describing the technical solutions of the present application, but not for limiting the present application.Although ginseng
The utility model is described in detail according to preferred embodiment, those skilled in the art should understand that, it can be to reality
It is modified or replaced equivalently with novel technical solution, it, should all without departing from the range of technical solutions of the utility model
Cover in the scope of the claims of the utility model.
Claims (7)
1. a kind of for producing the mold of heat radiating type key of notebook computer panel enclosure, which is characterized in that including moving template
(1), core fixing plate (2), cushion block (3), backing plate (4), impression bolster (5), gate plate (6), intermediate plate (7), solid plate (8)
And if baked core, the moving template (1), core fixing plate (2), cushion block (3), backing plate (4), impression bolster (5), gate plate
(6), intermediate plate (7) and solid plate (8) are set gradually from the bottom to top, and impression bolster (5) lower inside is equipped with heelpiece mould
Plate (10), the heelpiece template (10) and gate plate (6) and impression bolster (5) form panel type chamber (11), the solid plate
(8) middle part is equipped with sprue bush (12), and face sprue bush (12) is equipped with bulb sprue puller (13) in the middle part of the gate plate (6), described
Key zone (14) are equipped in the middle part of panel type chamber (11) back segment, are equipped with mouse pad area (15) in the middle part of panel type chamber (11) leading portion,
Mouse pad area (15) two sides are equipped with pressing device area (16), and the pressing device area (16) is the disc to raise upward, the key zone
(14) every row is distributed with pipeline card (17), and panel type chamber (11) the range inside circumference is distributed with connector (18), institute
It is cylindrical to state connector (18), the core package includes pressing device type core (9), and the pressing device type core (9) passes through core fixing plate
(2), cushion block (3), backing plate (4), heelpiece template (10), pressing device type core (9) bottom is fixed on moving template (1), top is stretched
Enter in panel type chamber (11), pressing device type core (9) shaped upper part and pressing device area (16) form fit, the heelpiece template (10)
Top is equipped with key type core, and the key type core and key zone (14) and mouse pad area (15) cooperate, gate plate (6) bottom
Equipped with pipe clamp former and connection former, the pipe clamp former and pipeline card (17) cooperate, the connection former and connector (18)
Cooperation, the heelpiece template (10) are equipped with quickly cooling module in connector (18) and pipe clamp corresponding position.
2. it is according to claim 1 a kind of for producing the mold of heat radiating type key of notebook computer panel enclosure, it is special
Sign is that the pipeline card (17) is in U shape, is in four/three-arc shape at pipeline card (17) upper recess.
3. it is according to claim 1 a kind of for producing the mold of heat radiating type key of notebook computer panel enclosure, it is special
Sign is that the quickly cooling module includes thermally conductive patch, heat conducting pipe, refrigerant and refrigeration cycle apparatus, and the thermally conductive patch passes through heat conducting pipe
It is connect with refrigeration cycle apparatus cold end and thermally conductive patch is formed into refrigerant circulation full of refrigerant with heat conducting pipe.
4. it is according to claim 3 a kind of for producing the mold of heat radiating type key of notebook computer panel enclosure, it is special
Sign is that the thermally conductive patch includes conducting copper plate (19) and capillary row (20), and the capillary row (20) is layed in conduction copper
Plate (19) back side, the thermally conductive patch insertion are mounted on heelpiece template (10) inside, and the conducting copper plate (19) is upward.
5. it is according to claim 3 a kind of for producing the mold of heat radiating type key of notebook computer panel enclosure, it is special
Sign is that the thermally conductive patch is surrounded by heat insulating strip (21).
6. it is according to claim 1 a kind of for producing the mold of heat radiating type key of notebook computer panel enclosure, it is special
Sign is, groove is equipped at the top of the gate plate (6), and the groove and intermediate plate (7) and sprue bush (12) form injection molding diffusion
Chamber (22).
7. it is according to claim 6 a kind of for producing the mold of heat radiating type key of notebook computer panel enclosure, it is special
Sign is that the sprue bush (12) is surrounded by pulling hook (23), and pulling hook (23) bottom is equipped with gib head, the pulling hook
(23) solid plate (8) are passed through and intermediate plate (7) protrudes into bottom portion of groove.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201821141497.9U CN208529621U (en) | 2018-07-18 | 2018-07-18 | It is a kind of for producing the mold of heat radiating type key of notebook computer panel enclosure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201821141497.9U CN208529621U (en) | 2018-07-18 | 2018-07-18 | It is a kind of for producing the mold of heat radiating type key of notebook computer panel enclosure |
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Publication Number | Publication Date |
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CN208529621U true CN208529621U (en) | 2019-02-22 |
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CN201821141497.9U Expired - Fee Related CN208529621U (en) | 2018-07-18 | 2018-07-18 | It is a kind of for producing the mold of heat radiating type key of notebook computer panel enclosure |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108819114A (en) * | 2018-07-18 | 2018-11-16 | 太仓市众翔精密五金有限公司 | A kind of production has the mold of radiator structure key of notebook computer panel |
CN110587928A (en) * | 2019-10-18 | 2019-12-20 | 泰逸电子(昆山)有限公司 | Notebook shell injection mold |
-
2018
- 2018-07-18 CN CN201821141497.9U patent/CN208529621U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108819114A (en) * | 2018-07-18 | 2018-11-16 | 太仓市众翔精密五金有限公司 | A kind of production has the mold of radiator structure key of notebook computer panel |
CN110587928A (en) * | 2019-10-18 | 2019-12-20 | 泰逸电子(昆山)有限公司 | Notebook shell injection mold |
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190222 |
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CF01 | Termination of patent right due to non-payment of annual fee |