CN208528736U - A kind of wafer lapping machine - Google Patents
A kind of wafer lapping machine Download PDFInfo
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- CN208528736U CN208528736U CN201821227842.0U CN201821227842U CN208528736U CN 208528736 U CN208528736 U CN 208528736U CN 201821227842 U CN201821227842 U CN 201821227842U CN 208528736 U CN208528736 U CN 208528736U
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- millstone
- upper millstone
- dust
- lapping machine
- wafer lapping
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Abstract
The utility model discloses a kind of wafer lapping machines, including workbench, the lower millstone device being rotatably arranged on workbench, the telescope motor that fixed frame on the table is fixedly installed and is arranged at the top of fixed frame, the push-pull rod of the telescope motor extends fixed frame top plate vertically downward；It further include dust exhaust apparatus and right above lower millstone device and the upper millstone device that connect with push-pull rod, the upper millstone device includes upper millstone and is arranged in the pressure buffer mechanism for being used to provide reaction force to reduce upper millstone to element pressure at the top of upper millstone；The upper millstone is provided with air suction opening close to edge, is provided with dust absorption nozzle on the air suction opening；The dust exhaust apparatus is connected to dust absorption nozzle.It is excessive for solving prior art upper millstone pressure, it is easy to cause the technical problem that workpiece is cracked；And the technical issues of solving the dust meeting aggravating working environment that grinding generates, influencing staff's health.
Description
Technical field
The utility model belongs to mechanical equipment technical field, and in particular to a kind of wafer lapping machine.
Background technique
Existing wafer lapping machine causes upper millstone to be applied to the pressure on element excessive due to upper millstone weight weight, can when process
Element is cracked, causes passing rate of processing low, does not manufacture ideal element.When due to grinding, element surface has certain recessed
The presence of convexity is also easy to crack sharp corner, influences qualification rate when upper millstone is pressed on the wedge angle of protrusion.In order to
This technical problem is solved, the prior art mitigates the weight of upper millstone using the method that upper millstone thickness is thinned, but uses
This method is still unreasonable, can seriously affect the service life of upper millstone.
In addition, wafer lapping machine can generate dust when working, the dust is thinner, is easy to deteriorate work with air-flow disperse in workshop
Make environmental quality, while dust can influence staff's health by staff's suction body.
Utility model content
The purpose of this utility model is that: a kind of wafer lapping machine is provided, by the way that new structural upper millstone device and suction is arranged
Dirt device, solution prior art upper millstone pressure is excessive, is easy to cause the technical problem that workpiece is cracked；And solve grinding
The technical issues of dust of generation understands aggravating working environment, influences staff's health.
The technical solution adopted in the utility model is as follows:
A kind of wafer lapping machine including workbench, the lower millstone device being rotatably arranged on workbench, is fixed at workbench
On fixed frame and the telescope motor that is arranged at the top of fixed frame, the push-pull rod of the telescope motor extend vertically downward solid
Determine frame top plate；It further include dust exhaust apparatus and right above lower millstone device and the upper millstone device that is connect with push-pull rod, it is described
Upper millstone device includes upper millstone and is arranged at the top of upper millstone for providing reaction force to reduce upper millstone to element pressure
Pressure buffer mechanism；The upper millstone is provided with air suction opening close to edge, is provided with dust absorption nozzle on the air suction opening；It is described
Dust exhaust apparatus is connected to dust absorption nozzle.Reaction force is provided by pressure buffer mechanism when wafer lapping machine described in this programme works, on
The gravity of mill can be offset by pressure buffer mechanism section, so that the pressure that element is subject to reduces, element sharp corner be avoided to occur
Crackle, it is excessive to solve prior art upper millstone pressure, is easy to cause the technical problem that workpiece is cracked；It is provided with and inhales simultaneously
Dirt device carries out absorption processing to the dust generated during grinding, avoids dust with air-flow disperse in workshop, deteriorate work
Environmental quality influences staff's health, solves the prior art without dust collection mechanism, leads to Dust Dispersion shadow in process
Working environment is rung, the technical issues of being detrimental to health.
Further, the pressure buffer mechanism includes connection frame, connector sleeve and Buffer Unit；The connection frame bottom end is living
Dynamic to be connected at the top of upper millstone, connection frame top is flexibly connected with connector sleeve bottom end；The connector sleeve is internally provided with connection bottom
The cavity in portion；The Buffer Unit setting is in the cavity.
Further, the Buffer Unit includes pull rod, spring and link block；The link block is fixedly connected on pull rod bottom
End；Extend at the top of connector sleeve on the pull rod top；The spring surrounds pull rod inside it, and spring one end and connector sleeve
Cavity roof connection, the other end connect with link block.
Further, the dust exhaust apparatus includes being connected with each other suction box and exhaust fan；The suction box is soft by air inlet
Pipe is connected to dust absorption nozzle.
Further, upper space and down space two spaces, the partition bottom are divided by a partition inside the suction box
Portion is provided with the communicating pipe for being connected to upper and lower two spaces, is provided with dust settling pocket on the communicating pipe.
Further, air induction hose is connected to upper space, and exhaust fan is connected to down space.
Further, the upper millstone top center is vertically installed with fixed link, is detachably provided in the fixed link
The weight of multiple and different heavyweights.
Further, the lower millstone device includes rotary electric machine, lower millstone and planetary plate；The rotary electric machine setting
In workbench and the rotation axis of rotary electric machine is fixedly connected with lower millstone bottom；The planetary plate is rotatably set by bearing block
It sets at the top of lower millstone and there are gaps between planetary plate lower surface and lower millstone upper surface；Annular space is set on the planetary plate
It is equipped with multiple grinding holes.
Further, it is provided with retaining ring on the lower millstone edge, prevents dust from spilling from the edge of lower millstone.
In conclusion by adopting the above-described technical solution, the beneficial effects of the utility model are:
1. wafer lapping machine described in this programme is provided with pressure buffer mechanism, for providing reaction force to subtract on upper millstone
Small upper millstone is to element pressure；The gravity of upper millstone can be offset by pressure buffer mechanism section when work, so that element was subject to
Pressure reduces, and avoids element sharp corner cracked, and it is excessive to solve prior art upper millstone pressure, and workpiece is easy to cause to occur
The technical issues of crackle.
2. wafer lapping machine described in this programme, is provided with dust exhaust apparatus, absorption processing is carried out to the dust generated during grinding,
Avoid dust with air-flow disperse in workshop, aggravating working environment quality influences staff's health, solves the prior art
Without dust collection mechanism, Dust Dispersion in process is caused to influence working environment, the technical issues of being detrimental to health.
3. wafer lapping machine described in this programme is provided with exacerbation mechanism on upper millstone, during the grinding process, with milling time
It lengthens, the wedge angle of protrusion is smoothed, and element tends to be smooth, and the weight for applying different weight grade can be selected to mention according to the actual situation
Height grinding efficiency.
4. wafer lapping machine described in this programme, lower millstone lower millstone is provided with retaining ring on edge, prevents side of the dust from lower millstone
Edge spills, and dust suction is more thorough.
5. wafer lapping machine described in this programme, the suction box of dust exhaust apparatus is interior to be provided with dust settling pocket, the air warp containing dust
Dust settling pocket will be just emitted into atmosphere after dust-filtering, while purifying working space, will not pollute atmosphere.
6. wafer lapping machine described in this programme, structure is simple, it is easily fabricated, installation and removal, it is practical, it is easy to spread and
It uses.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of upper millstone device described in the utility model embodiment 1；
Fig. 2 is the structural schematic diagram of the upper millstone device of the utility model embodiment 2 and 3；
Fig. 3 is the structural schematic diagram of wafer lapping machine described in the utility model embodiment 4；
Fig. 4 is the structural schematic diagram of the lower millstone device of wafer lapping machine described in the utility model embodiment 4.
In the figure, it is marked as 1- upper millstone, 2- pressure buffer mechanism, 3- fixed link, 4- weight, 5- air suction opening, 6- dust suction
Mouth, 7- workbench, 8- lower millstone device, 9- dust exhaust apparatus, 10- fixed frame, 11- telescope motor, 12- bearing block, 21- connection
Frame, 22- connector sleeve, 23- Buffer Unit, 81- rotary electric machine, 82- lower millstone, 83- planetary plate, 91- suction box, 92- exhaust fan,
93- partition, 94- communicating pipe, 95- dust settling pocket, 96- air induction hose, 211- connecting rod, 212- rake, the vertical portion 213-, 231-
Link block, 232- spring, 233- pull rod, 821- retaining ring, 831- are ground hole.
Specific embodiment
All features disclosed in this specification can be with any other than mutually exclusive feature and/or step
Mode combines.
It elaborates with reference to the accompanying drawing to the utility model.
Embodiment 1
It please refers to shown in Fig. 1, a kind of upper millstone device for wafer lapping machine, including upper millstone 1, connection frame 21, connector sleeve
22 and Buffer Unit 23.
The connection frame 21 is made of at least three connecting rods 211, and every described 211 one end of connecting rod is evenly and at intervals
It is fixedly connected on 1 top of upper millstone, the other end is flexibly connected with 22 bottom end of connector sleeve by bolt.In particular, the connection
Bar 211 includes the rake 212 of integrated setting and vertical portion 213, the angle between rake 212 and vertical portion 213 are 120
~135 °, 212 end of rake is fixedly connected on 1 top of upper millstone close to edge, 213 end of vertical portion and 22 bottom of connector sleeve
End is flexibly connected.Using the connection frame 21 of the structure setting, so that a wider space is surrounded between connection frame 21, in order to
Weight 4 is placed on upper millstone 1.
The connector sleeve 22 is internally provided with cavity, and the cavity is connected to 22 bottom of connector sleeve；22 top of connector sleeve
It is provided centrally with connecting hole, the connecting hole is connected to cavity.The Buffer Unit 23 is arranged in the cavity of connector sleeve 22.
The Buffer Unit 23 includes pull rod 233, spring 232 and link block 231；The link block 231 is fixedly connected on
233 bottom end of pull rod, 233 top of pull rod pass through connecting hole and extend the top of connector sleeve 22, when use convenient for and other devices
Connection.The spring 232 surrounds pull rod 233 inside it, and 232 one end of spring is connect with the roof of the cavity of connector sleeve 22,
The other end is connect with link block 231.
Upper millstone device described in this programme, by being provided with pressure buffer mechanism 2 at the top of upper millstone 1, to upper millstone 1
Gravity buffered, to mitigate upper millstone 1 to the pressure of element, workpiece is cracked when preventing processing.
Upper millstone device described in this programme improves grinding effect to the pressure of element by reducing upper millstone 1, most
Important one the reason is that since surface has certain camber to element before the milling so that the stress that locally bears of element compared with
Greatly, thus cause grinding when be easy to appear crackle.For example, when grinding zone-melted silicon single crystal piece, due to rib bud, so that silicon wafer
There is the wedge angle of a protrusion on surface, during the grinding process, will be cracked in sharp corner when wedge angle is by stress is increased.
Upper millstone device described in this programme, its working principle is that: it is installed on wafer lapping machine when use, in natural shape
Under state, when upper millstone 1 is pressed in element surface, the pressure that element is subject to is equal to the gravity of upper millstone 1, but is provided with pressure buffer
After structure, the gravity of upper millstone 1 can be by 2 partial offset of pressure buffer mechanism, so that the pressure that element is subject to reduces, element adds
Work efficiency fruit is more satisfactory, and cracked probability substantially reduces, and improves the qualification rate of workpiece, especially more crisp to material
Element, grinding effect improve the most significant.
Embodiment 2
Shown in referring to figure 2., upper millstone device described in embodiment 1 passes through pressure buffer mechanism 2 when grinding beginning
Reduce the pressure born of element surface, solve element surface be easy there are camber it is cracked in the sharp corner of protrusion
The technical issues of.But as milling time lengthens, the wedge angle of protrusion is smoothed, and element tends to be smooth, if pressure is too small, grinding
It needs to consume more times, will affect working efficiency.Therefore, the present embodiment is further improved on the basis of embodiment 1, tool
Structural reform into are as follows: exacerbation mechanism is provided at the top of grinding；The exacerbation mechanism includes fixed link 3 and multiple weights 4；It is described solid
Fixed pole 3 is vertically fixed on 1 top center of upper millstone, and through-hole is provided at the center of weight 4, and the weight 4 passes through through-hole
It is set in fixed link 3.The weight 4 is set as different weight grade, and in process of lapping, selection applies not according to the actual situation
Weight 4 with heavyweight improves grinding efficiency.
Embodiment 3
Shown in referring to figure 2., upper millstone 1 can generate dust during grinding to element, since dust is thinner, hold
Easily with air-flow disperse in workshop, aggravating working environment quality, while dust can influence work people by staff's suction body
Member's health.Therefore for the ease of installing dust collection mechanism on grinder, this city embodiment is on the basis of embodiment 2 into one
Step is improved, specific to improve are as follows: to be provided with air suction opening 5, the suction between wherein 1 junction of two connecting rods 211 and upper millstone
Dust absorption nozzle 6 is provided on dirt hole 5.In particular, the dust absorption nozzle 6 is made of stainless steel material, and one end is close by sealing ring
Envelope is connected in air suction opening 5.In use, the air inlet pipe of dust collection mechanism is directly connect with dust absorption nozzle 6, it is simple to operate.
Embodiment 4
Referring to figure 3. and shown in Fig. 4, a kind of wafer lapping machine, including workbench 7, fixed frame 10, telescope motor 11, dust suction dress
Set upper millstone device described in 9, lower millstone device 8 and above embodiments.
The lower millstone device 8 includes rotary electric machine 81, lower millstone 82 and planetary plate 83, and the rotary electric machine 81 is arranged
In workbench 7, and the rotation axis of rotary electric machine 81 is extended 7 top of workbench and is fixedly connected with 82 bottom of lower millstone, institute
It states planetary plate 83 and 82 top of lower millstone, and table on 83 lower surface of planetary plate and lower millstone 82 is rotatably provided in by bearing block 12
There are gaps between face.Annular space is provided with multiple grinding holes 831 on the planetary plate 83.
On the table 7,10 top of fixed frame is provided with telescope motor 11, described flexible for the fixed setting of fixed frame 10
The push-pull rod 233 of motor 11 extends 10 top plate of fixed frame vertically downward, and the pull rod 233 of the lower millstone device 8 passes through shaft coupling
Device is connect with the push-pull rod 233 of telescope motor 11, and lower millstone device 8 is located at the surface of planetary plate 83.
The dust exhaust apparatus 9 includes suction box 91 and exhaust fan 92, is divided into inside the suction box 91 by a partition 93
Space and down space two spaces, 93 bottom of partition are provided with the communicating pipe 94 for being connected to upper and lower two spaces, the connection
Dust settling pocket 95 is provided on pipe 94.Air inlet is provided on the outer wall in the upper space, it is soft to be connected with air inlet on the air inlet
Pipe 96,96 other end of air induction hose are connect with the dust absorption nozzle 6 of upper millstone device.It is provided with out on the outer wall of the down space
Port, the gas outlet are connected to exhaust fan 92.
Dust spills from the edge of lower millstone 82 in order to prevent, is provided with retaining ring 821 on 82 edge of lower millstone.
Telescope motor 11 used in the present embodiment is built by Wenzhou City and is produced along Electrical Appliances Co., Ltd, model " JS-
TGZ-U1 ", the maximum thrust and maximum pull that can be born are 80 kilograms.
The working principle of wafer lapping machine described in this programme are as follows: when work, element is placed in grinding hole 831, is then opened
Dynamic telescope motor 11, the push-pull rod 233 of telescope motor 11 push down on lower millstone device 8, make the lower millstone 82 of lower millstone device 8
Element crests are pressed in, do not apply weight 4 at this time；Lower millstone 82 is under the action of pressure buffer mechanism 2, so that lower millstone 82 is right
The pressure of element reduces, and guarantees that the sharp corner of protrusion is not in crackle when being ground；Then start rotary electric machine 81, under drive
Mill 82 rotates, so that element is ground between upper millstone 1 and lower millstone 82, the dust for grinding generation is blocked by retaining ring 821,
Dust settling pocket 95 is sucked by dust exhaust apparatus 9 simultaneously；As milling time lengthens, the wedge angle of protrusion is smoothed, and element tends to be smooth, this
When can apply weight 4 in the fixed link 3 at the top of upper millstone 1, increase upper millstone 1 to the pressure of element, shorten the grinding time,
Improve grinding efficiency.
The above are the main feature of this programme and its advantages, It should be understood by those skilled in the art that this programme is not
It is restricted to the described embodiments, the above embodiments and description only describe the principles of this programme, are not departing from this
Under the premise of scheme spirit and scope, this programme be will also have various changes and improvements, these changes and improvements both fall within requirement and protect
In the scope of the invention of shield, this programme is claimed range and is defined by the appending claims and its equivalent thereof.
In the description of the present invention, it should also be noted that, unless otherwise clearly defined and limited, term " is set
Set ", " installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, be also possible to dismantling connection, or
It is integrally connected；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, intermediate media's letter can also be passed through
It is situated between and is connected, can be the connection inside two elements.It for the ordinary skill in the art, can be as the case may be
Understand the concrete meaning of above-mentioned term in the present invention.
Claims (9)
1. a kind of wafer lapping machine, including workbench (7), the lower millstone device (8) being rotatably arranged on workbench (7), fixed setting
In the fixed frame (10) on workbench (7) and the telescope motor (11) being arranged at the top of fixed frame (10), the telescope motor
(11) push-pull rod (233) extends fixed frame (10) top plate vertically downward, it is characterised in that: further include dust exhaust apparatus (9) and
The upper millstone device connecting right above lower millstone device (8) and with push-pull rod (233), the upper millstone device includes upper mill
Disk (1) and setting are used to provide reaction force to reduce upper millstone (1) to the pressure buffer of element pressure at the top of upper millstone (1)
Mechanism (2)；The upper millstone (1) is provided with air suction opening (5) close to edge, is provided with dust absorption nozzle on the air suction opening (5)
(6)；The dust exhaust apparatus (9) is connected to dust absorption nozzle (6).
2. a kind of wafer lapping machine according to claim 1, it is characterised in that: the pressure buffer mechanism (2) includes connection frame
(21), connector sleeve (22) and Buffer Unit (23)；Connection frame (21) bottom end is movably connected at the top of upper millstone (1), connection
Frame (21) top is flexibly connected with connector sleeve (22) bottom end；The connector sleeve (22) is internally provided with the cavity of connection bottom；Institute
State Buffer Unit (23) setting in the cavity.
3. a kind of wafer lapping machine according to claim 2, it is characterised in that: the Buffer Unit (23) include pull rod (233),
Spring (232) and link block (231)；The link block (231) is fixedly connected on pull rod (233) bottom end；Pull rod (233) top
Extend at the top of connector sleeve (22) at end；The spring (232) by pull rod (233) surround inside it, and spring (232) one end with
The roof of the cavity of connector sleeve (22) connects, and the other end is connect with link block (231).
4. a kind of wafer lapping machine according to claim 1, it is characterised in that: the dust exhaust apparatus (9) includes being connected with each other to inhale
Dirt case (91) and exhaust fan (92)；The suction box (91) is connected to by air induction hose (96) with dust absorption nozzle (6).
5. a kind of wafer lapping machine according to claim 4, it is characterised in that: the suction box (91) is internal by a partition (93)
It is divided into space and down space two spaces, partition (93) bottom is provided with the communicating pipe for being connected to upper and lower two spaces
(94), dust settling pocket (95) are provided on the communicating pipe (94).
6. a kind of wafer lapping machine according to claim 5, it is characterised in that: air induction hose (96) is connected to upper space, exhausting
Machine (92) is connected to down space.
7. a kind of wafer lapping machine according to claim 1, it is characterised in that: upper millstone (1) top center is vertically arranged
Have fixed link (3), the weight (4) of multiple and different heavyweights is detachably provided on the fixed link (3).
8. a kind of wafer lapping machine according to claim 1, it is characterised in that: the lower millstone device (8) includes rotary electric machine
(81), lower millstone (82) and planetary plate (83)；The rotary electric machine (81) is arranged in workbench (7) and rotary electric machine (81)
Rotation axis be fixedly connected with lower millstone (82) bottom；The planetary plate (83) is rotatably provided in lower mill by bearing block (12)
At the top of disk (82) and there are gaps between planetary plate (83) lower surface and lower millstone (82) upper surface；Ring on the planetary plate (83)
Shape is arranged at intervals with multiple grinding holes (831).
9. a kind of wafer lapping machine according to claim 8, it is characterised in that: be provided with retaining ring on lower millstone (82) edge
(821)。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821227842.0U CN208528736U (en) | 2018-08-01 | 2018-08-01 | A kind of wafer lapping machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821227842.0U CN208528736U (en) | 2018-08-01 | 2018-08-01 | A kind of wafer lapping machine |
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| Publication Number | Publication Date |
|---|---|
| CN208528736U true CN208528736U (en) | 2019-02-22 |
Family
ID=65386398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821227842.0U Active CN208528736U (en) | 2018-08-01 | 2018-08-01 | A kind of wafer lapping machine |
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| Country | Link |
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| CN (1) | CN208528736U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109719595A (en) * | 2019-03-05 | 2019-05-07 | 王子东 | A kind of use for laboratory physics grinding device |
| CN117900980A (en) * | 2024-03-19 | 2024-04-19 | 福建省银象电器有限公司 | Polishing device for end face of water pump housing |
-
2018
- 2018-08-01 CN CN201821227842.0U patent/CN208528736U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109719595A (en) * | 2019-03-05 | 2019-05-07 | 王子东 | A kind of use for laboratory physics grinding device |
| CN117900980A (en) * | 2024-03-19 | 2024-04-19 | 福建省银象电器有限公司 | Polishing device for end face of water pump housing |
| CN117900980B (en) * | 2024-03-19 | 2024-06-04 | 福建省银象电器有限公司 | Polishing device for end face of water pump housing |
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