CN208514754U - A kind of ceramic cutting equipment of automation - Google Patents
A kind of ceramic cutting equipment of automation Download PDFInfo
- Publication number
- CN208514754U CN208514754U CN201820396885.5U CN201820396885U CN208514754U CN 208514754 U CN208514754 U CN 208514754U CN 201820396885 U CN201820396885 U CN 201820396885U CN 208514754 U CN208514754 U CN 208514754U
- Authority
- CN
- China
- Prior art keywords
- cylinder
- cutting equipment
- slideway
- automation
- pressing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
This application provides a kind of ceramic cutting equipments of automation, the cutting equipment includes mounting rack, the first cylinder being mounted on the mounting rack, second cylinder, third cylinder, the cutter moved along the y axis under the driving of the third cylinder, the pressing plate moved along the y axis under first cylinder and the driving of the second cylinder, a slideway for running through pressing plate upper and lower surface is provided on the pressing plate, the slideway is extended along the x axis, the third cylinder is slidably disposed on the mounting rack along X-axis, the slideway is located at the underface of the cutter, the slideway can pass through for the cutter.A kind of automation ceramics cutting equipment of the application, ceramic wafer is pushed down by pressing plate, is then cut, ceramic wafer can be made not to be subjected to displacement during cutting, prevent ceramic wafer from rupturing, improve the cutting efficiency of cutting equipment.
Description
Technical field
This application involves a kind of ceramic cutting equipments of automation.
Background technique
In the prior art, automating ceramic cutting equipment is usually to be cut ceramics with cutting blade, in the mistake of cutting
Cheng Zhong, the ceramic wafer cut may be subjected to displacement, and cause the phenomenon of cutting inaccuracy, also result in ceramic wafer rupture, sternly
Cutting efficiency is affected again.
Utility model content
The application technical problems to be solved are to provide a kind of ceramic cutting equipment of automation.
In order to solve the above-mentioned technical problem, this application provides a kind of ceramic cutting equipment of automation, the cutting is set
It is standby including mounting rack, the first cylinder being mounted on the mounting rack, the second cylinder, third cylinder, in the third vapour
The cutter that move along the y axis under the driving of cylinder move along the y axis under first cylinder and the driving of the second cylinder
Pressing plate, a slideway for running through pressing plate upper and lower surface is provided on the pressing plate, the slideway extends along the x axis to be set
It sets, the third cylinder is slidably disposed on the mounting rack along X-axis, and the slideway is located at the cutter
Underface, the slideway can pass through for the cutter.
Preferably, first cylinder and the second cylinder are fixed on the mounting rack, the third cylinder position
Between first cylinder and the second cylinder.
Preferably, be provided with the first spring between first cylinder and the pressing plate, second cylinder with
Second spring is provided between the pressing plate.
Preferably, the cutter are circular cutter blade, and the cutting equipment further includes described for driving
The first driving device of cutter rotation.
Preferably, a sliding rail being extended along the x axis, the third cylinder edge are provided on the mounting rack
The sliding rail slides setting.
Preferably, the cutting equipment further includes the second driving device for driving the third cylinder.
Preferably, it is provided with the first mounting portion for installing the first spring on the pressing plate and is used to that the second bullet to be installed
Second mounting portion of spring, the slideway is between first mounting portion and the second mounting portion.
Preferably, the sliding rail is located at the surface of the slideway, and the both ends of the sliding rail are in Y direction
Projection be located at the slideway both ends between.
A kind of automation ceramics cutting equipment of the application, ceramic wafer is pushed down, then cut by pressing plate, can
It is subjected to displacement ceramic wafer not during cutting, prevents ceramic wafer from rupturing, improve the cutting efficiency of cutting equipment.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram for automating ceramic cutting equipment；
Fig. 2 is the structural schematic diagram of pressing plate.
Wherein: 1, mounting rack；2, pressing plate；21, slideway；22, the first mounting portion；23, the second mounting portion；31, the first cylinder；
32, the second cylinder；33, third cylinder；41, the first spring；42, second spring；5, cutter.
Specific embodiment
The application is described further in the following with reference to the drawings and specific embodiments, so that those skilled in the art can be with
It more fully understands the application and can be practiced, but illustrated embodiment is not as the restriction to the application.
As shown, the cutting equipment includes mounting rack this application provides a kind of automation ceramic cutting equipment
1, be mounted on the first cylinder 31 on the mounting rack 1, the second cylinder 32, third cylinder 33, in the third cylinder 33
Driving under move along the y axis cutter 5, first cylinder 31 and the second cylinder 32 driving under along the y axis
Mobile pressing plate 2 is provided with a slideway 21 for running through 2 upper and lower surface of pressing plate on the pressing plate 2, and the slideway 21 is along X-axis
Direction is extended, and the third cylinder 33 is slidably disposed on the mounting rack 1 along X-axis, the slideway 21
Positioned at the underface of the cutter 5, the slideway 21 can pass through for the cutter 5.First cylinder
31 and second cylinder 32 be fixed on the mounting rack 1, the third cylinder 33 is located at first cylinder 31 and the
Between two cylinders 32.The first spring 41, second cylinder are provided between first cylinder 31 and the pressing plate 2
Second spring 42 is provided between 32 and the pressing plate 2.The cutter 5 are round cutter 5, the cutting
Equipment further includes the first driving device for driving the cutter 5 to rotate.One is provided with along X on the mounting rack 1
The extended sliding rail of axis direction, the third cylinder 33 slide setting along the sliding rail.The cutting equipment also wraps
Include the second driving device for driving the third cylinder 33.It is provided on the pressing plate 2 for installing the first spring
41 the first mounting portion 22 and the second mounting portion 23 for installing second spring 42, the slideway 21 are located at described the
Between one mounting portion 22 and the second mounting portion 23.The sliding rail is located at the surface of the slideway 21, and the sliding rail
Both ends Y direction projection be located at the slideway 21 both ends between.
A kind of automation ceramics cutting equipment of the application, ceramic wafer is pushed down, then cut by pressing plate 2, energy
It is subjected to displacement ceramic wafer not during cutting, prevents ceramic wafer from rupturing, improve the cutting efficiency of cutting equipment.
Y direction is up and down direction shown in FIG. 1 in the application, and X-direction is left and right directions shown in FIG. 1.
Embodiment described above is only the preferred embodiment lifted to absolutely prove the application, the protection model of the application
It encloses without being limited thereto.Those skilled in the art made equivalent substitute or transformation on the basis of the application, in the application
Protection scope within.The protection scope of the application is subject to claims.
Claims (8)
1. a kind of ceramic cutting equipment of automation, which is characterized in that the cutting equipment include mounting rack, be mounted on it is described
The first cylinder, the second cylinder, third cylinder on mounting rack move along the y axis under the driving of the third cylinder
Cutter, the pressing plate that moves along the y axis under first cylinder and the driving of the second cylinder are provided on the pressing plate
One runs through the slideway of pressing plate upper and lower surface, and the slideway is extended along the x axis, and the third cylinder can be slided along X-axis
Dynamic is arranged on the mounting rack, and the slideway is located at the underface of the cutter, and the slideway can be for
The cutter pass through.
2. the ceramic cutting equipment of a kind of automation as described in claim 1, which is characterized in that first cylinder and second
Cylinder is fixed on the mounting rack, and the third cylinder is between first cylinder and the second cylinder.
3. a kind of automation ceramics cutting equipment as claimed in claim 2, which is characterized in that first cylinder with it is described
Pressing plate between be provided with the first spring, be provided with second spring between second cylinder and the pressing plate.
4. the ceramic cutting equipment of a kind of automation as claimed in claim 3, which is characterized in that the cutter are cut for circle
Cutting blade, the cutting equipment further include the first driving device for driving the cutter to rotate.
5. the ceramic cutting equipment of a kind of automation as claimed in claim 4, which is characterized in that be provided on the mounting rack
One sliding rail being extended along the x axis, the third cylinder slide setting along the sliding rail.
6. a kind of automation ceramics cutting equipment as claimed in claim 5, which is characterized in that the cutting equipment further includes
For driving the second driving device of the third cylinder.
7. the ceramic cutting equipment of a kind of automation as claimed in claim 6, which is characterized in that be arranged on the pressing plate useful
In the first mounting portion and the second mounting portion for installing second spring of installing the first spring, the slideway is located at described
Between first mounting portion and the second mounting portion.
8. the ceramic cutting equipment of a kind of automation as claimed in claim 7, which is characterized in that the sliding rail is located at described
The surface of slideway, and the both ends of the sliding rail are located between the both ends of the slideway in the projection of Y direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820396885.5U CN208514754U (en) | 2018-03-22 | 2018-03-22 | A kind of ceramic cutting equipment of automation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820396885.5U CN208514754U (en) | 2018-03-22 | 2018-03-22 | A kind of ceramic cutting equipment of automation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208514754U true CN208514754U (en) | 2019-02-19 |
Family
ID=65341571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820396885.5U Active CN208514754U (en) | 2018-03-22 | 2018-03-22 | A kind of ceramic cutting equipment of automation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208514754U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108247871A (en) * | 2018-03-22 | 2018-07-06 | 苏州伊而雅精密部件有限公司 | A kind of ceramic cutting equipment of automation |
-
2018
- 2018-03-22 CN CN201820396885.5U patent/CN208514754U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108247871A (en) * | 2018-03-22 | 2018-07-06 | 苏州伊而雅精密部件有限公司 | A kind of ceramic cutting equipment of automation |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204602990U (en) | A kind of hole punched device of sheet metal component | |
| CN205733795U (en) | A kind of steel plate stamping aperture apparatus | |
| CN203317153U (en) | Diamond tool grinding machine | |
| CN208514754U (en) | A kind of ceramic cutting equipment of automation | |
| CN205853114U (en) | Cutting tool | |
| CN205852945U (en) | Traffic allowance film cutting device | |
| CN205519930U (en) | Hardware cutting clamping mechanism | |
| CN106736571B (en) | Guide rail sawing hole punched device | |
| CN204818998U (en) | Automobile engine piston rod grinding device | |
| CN208712635U (en) | Two-way simultaneous punching apparatus | |
| CN203185020U (en) | Self-adaptive double-hole locating device | |
| CN108247871A (en) | A kind of ceramic cutting equipment of automation | |
| CN204639431U (en) | A kind of laser assembly solder machine positioning device | |
| CN102554956A (en) | Cutting tool for butt joint grooves of sealing glue tapes or glue sticks | |
| CN204800716U (en) | Reliable cutting device of centre gripping | |
| CN208529445U (en) | A kind of device for ceramic cutting | |
| CN203900867U (en) | All-in-one machine for motor casing machining | |
| CN208468755U (en) | A kind of ceramic wafer cutting machine | |
| CN202556486U (en) | Sealing strip punching die | |
| CN204277080U (en) | A kind of precisely cutoff device | |
| CN205319041U (en) | Capacitor case processing and device of collecting | |
| CN203245399U (en) | Multifunctional drilling equipment | |
| CN103084900A (en) | Device for adaptively positioning two holes | |
| CN205038402U (en) | Objective table that microscope was used | |
| CN104097096B (en) | A kind of Multifunctional edge rod support |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: 215000 First Floor of Building No. 4, 828 Fuyuan Road, Chengyang Street, Xiangcheng Economic and Technological Development Zone, Suzhou City, Jiangsu Province Patentee after: Suzhou Yi Ya precision parts Co., Ltd. Address before: 215000 Diamond Road, Weitang Town, Xiangcheng District, Suzhou City, Jiangsu Province, 1988 Patentee before: Suzhou Yi Ya precision parts Co., Ltd. |
|
| CP02 | Change in the address of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220615 Address after: 215000 No. 777, Fujia Road, Jiangling street, Wujiang District, Suzhou City, Jiangsu Province Patentee after: Suzhou Gaoxin Zhongke Semiconductor Co.,Ltd. Address before: 215000 1st floor, building 4, 828 Fuyuan Road, Chengyang street, Xiangcheng economic and Technological Development Zone, Suzhou City, Jiangsu Province Patentee before: SUZHOU ELEGANT & RIGOROUS FINE ASSEMBLY Co.,Ltd. |
|
| TR01 | Transfer of patent right |